CN102797020A - Preparation method of electrolytic copper foil with thick specification and low peak value - Google Patents
Preparation method of electrolytic copper foil with thick specification and low peak value Download PDFInfo
- Publication number
- CN102797020A CN102797020A CN2011101340651A CN201110134065A CN102797020A CN 102797020 A CN102797020 A CN 102797020A CN 2011101340651 A CN2011101340651 A CN 2011101340651A CN 201110134065 A CN201110134065 A CN 201110134065A CN 102797020 A CN102797020 A CN 102797020A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- sulfuric acid
- electrolyte
- content
- low peak
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrolytic Production Of Metals (AREA)
Abstract
The invention relates to a preparation method of an electrolytic copper foil with thick specification and low peak value. The preparation method comprises the following steps of: generating electrolyte under the condition of heating by adopting high-purity electrolytic copper (with copper content higher than or equal to 99.95%) and sulfuric acid (with sulfuric acid content higher than or equal to 98.0%) as raw materials, enabling the copper content in the electrolyte to be 70-100g/L, the sulfuric acid content to be 110-160g/L, the chloride ion content to be 2-5mg/L, and the temperature to be 45-65 DEG C, adding additive thiourea into the electrolyte, with the additive flow of 200-1000ml/min, finally controlling the electrolyte flow to be 45-60m3/h to enable the electrolyte to flow into an electrolytic cell, and carrying out electrodeposition under the condition that the current density is 6000-10000A/m2 to generate the electrolytic copper foil with thick specification and low peak value. The electrodeposition for the selected raw materials and the electrolyte and the additive with reasonable concentration is conducted under the condition of high current density to generate the copper foil with thick specification and low peak value, and the production efficiency is improved.
Description
Technical field
The present invention relates to a kind of electrolytic copper foil of thick specification low peak, and the preparation method of this electrolytic copper foil, the electrolytic copper foil field belonged to.
Background technology
Higher to general thick specification Copper Foil peak value, be easy to generate the shedding phenomenon, can only use low current density production during production, production efficiency is lower.
Summary of the invention
The objective of the invention is: a kind of electrolytic copper foil of thick specification low peak, and the preparation method of this electrolytic copper foil.
Technical scheme of the present invention: through the electrolytic solution of selected starting material of the present invention and reasonable concentration thereof, and, under high current densities, carry out galvanic deposit and realize through adding suitable additive, specific as follows:
Adopt high purity electrolytic copper (copper content>=99.95%) and sulfuric acid (sulfuric acid content>=98.0%) as starting material, and under heating condition, generate electrolytic solution, make copper content 70～100g/L in the electrolytic solution; Sulfuric acid content 110～160g/L; Chloride ion content 2～5mg/L, 45～65 ℃ of temperature, and in electrolytic solution, add the additive thiocarbamide; And additive flow is 200mL/min～1000mL/min, at last flow of electrolyte is controlled at 45～60m
3/ h flows into electrolyzer, with current density 6000～10000A/m
2Carry out galvanic deposit under the condition, generate thick specification low peak electrolytic copper foil.
Through the electrolytic solution of selected starting material of the present invention and reasonable concentration thereof, and, under high current densities, carry out galvanic deposit, generate thick specification low peak Copper Foil, improved production efficiency through adding suitable additive.
Embodiment:
Embodiment 1:70 μ low peak electrolytic copper foil; Adopt high purity electrolytic copper (copper content>=99.95%) and sulfuric acid (sulfuric acid content>=98.0%) as starting material, and under heating condition, generate electrolytic solution, copper content is controlled at 70～100g/L in the electrolytic solution; Sulfuric acid content is controlled at 110～160g/L; Chloride ion content is controlled at 2～5mg/L, and temperature is controlled at 45～65 ℃, and in electrolytic solution, adds the additive thiocarbamide; And additive flow is 200mL/min～1000mL/min, at last flow of electrolyte is controlled at 45～60m
3/ h flows into electrolyzer, uses current density 6500A/m
2Carry out galvanic deposit under the condition, generate 70 μ electrolytic copper foils, this electrolytic copper foil hair side peak value Rz≤8 μ m.
Embodiment 2:105 μ low peak electrolytic copper foil; Adopt high purity electrolytic copper (copper content>=99.95%) and sulfuric acid (sulfuric acid content>=98.0%) as starting material, and under heating condition, generate electrolytic solution, copper content is controlled at 70～100g/L in the electrolytic solution; Sulfuric acid content is controlled at 110～160g/L; Chloride ion content is controlled at≤2～5mg/L, and temperature is controlled at 45～65 ℃, and in electrolytic solution, adds the additive thiocarbamide; And additive flow is 200mL/min～1000mL/min, at last flow of electrolyte is controlled at 45～60m
3/ h flows into electrolyzer, uses current density 8000A/m
2Carry out galvanic deposit under the condition, generate 105 μ electrolytic copper foils, this electrolytic copper foil hair side peak value Rz≤10 μ m.
Embodiment 3:70 μ low peak electrolytic copper foil; Adopt high purity electrolytic copper (copper content>=99.95%) and sulfuric acid (sulfuric acid content>=98.0%) as starting material, and under heating condition, generate electrolytic solution, copper content is controlled at 70～100g/L in the electrolytic solution; Sulfuric acid content is controlled at 110～160g/L; Chloride ion content is controlled at 2～5mg/L, and temperature is controlled at 45～65 ℃, and in electrolytic solution, adds the additive thiocarbamide; And additive flow is 200mL/min～1000mL/min, at last flow of electrolyte is controlled at 45～60m
3/ h flows into electrolyzer, uses current density 8000A/m
2Carry out galvanic deposit under the condition, generate 70 μ electrolytic copper foils, this electrolytic copper foil hair side peak value Rz≤8 μ m.
Embodiment 4:105 μ low peak electrolytic copper foil; Adopt high purity electrolytic copper (copper content>=99.95%) and sulfuric acid (sulfuric acid content>=98.0%) as starting material, and under heating condition, generate electrolytic solution, copper content is controlled at 70～100g/L in the electrolytic solution; Sulfuric acid content is controlled at 110～160g/L; Chloride ion content is controlled at≤2～5mg/L, and temperature is controlled at 45～65 ℃, and in electrolytic solution, adds the additive thiocarbamide; And additive flow is 200mL/min～1000mL/min, at last flow of electrolyte is controlled at 45～60m
3/ h flows into electrolyzer, uses current density 8500A/m
2Carry out galvanic deposit under the condition, generate 105 μ electrolytic copper foils, this electrolytic copper foil hair side peak value Rz≤10 μ m.
Claims (2)
1. the preparation method of the electrolytic copper foil of a thick specification low peak is characterized in that described preparation employing copper content>=99.95% the high purity oxygen free copper bar and the battery sulfuric acid of sulfuric acid content>=92.0% as starting material, and under heating condition, generates electrolytic solution; Copper content 70～100g/L in the electrolytic solution, sulfuric acid content 110～160g/L, chloride ion content 2～5mg/L, the parameter that temperature is 45～65 ℃ cooperates, and in electrolytic solution, adds suitable additive, and making flow of electrolyte is 45～60m
3/ h, the additive that this electrolytic solution adds is a thiocarbamide, additive flow is 200mL/min～1000mL/min.
2. the preparation method of the electrolytic copper foil of a kind of thick specification low peak according to claim 1, it is characterized in that described preparing method's electrolysis after, also to carry out galvanic deposit, galvanic deposit is at current density 6000～10000A/m
2Carry out under the condition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101340651A CN102797020A (en) | 2011-05-23 | 2011-05-23 | Preparation method of electrolytic copper foil with thick specification and low peak value |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101340651A CN102797020A (en) | 2011-05-23 | 2011-05-23 | Preparation method of electrolytic copper foil with thick specification and low peak value |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102797020A true CN102797020A (en) | 2012-11-28 |
Family
ID=47196310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101340651A Pending CN102797020A (en) | 2011-05-23 | 2011-05-23 | Preparation method of electrolytic copper foil with thick specification and low peak value |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102797020A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103060859A (en) * | 2012-12-27 | 2013-04-24 | 东强（连州）铜箔有限公司 | An additive for improving the peak shape of the rough surface of rough foil, and a production process for electrolytic copper foil |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1053818A (en) * | 1989-09-13 | 1991-08-14 | 古尔德有限公司 | The processing method and the electrolytic solution that are used for the controlled paillon foil of printed circuit board (PCB) and its character and produce this paillon foil |
| US5171417A (en) * | 1989-09-13 | 1992-12-15 | Gould Inc. | Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same |
| CN1103903A (en) * | 1993-05-28 | 1995-06-21 | 古尔德电子有限公司 | Electrodeposited copper foil and process for makin gasame using electrolyte solutions having controlled additions of chloride ions and organic additives |
| CN101067210A (en) * | 2007-01-26 | 2007-11-07 | 湖北中科铜箔科技有限公司 | Electrolytic copper foil with low-contour and high property and producing method thereof |
-
2011
- 2011-05-23 CN CN2011101340651A patent/CN102797020A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1053818A (en) * | 1989-09-13 | 1991-08-14 | 古尔德有限公司 | The processing method and the electrolytic solution that are used for the controlled paillon foil of printed circuit board (PCB) and its character and produce this paillon foil |
| US5171417A (en) * | 1989-09-13 | 1992-12-15 | Gould Inc. | Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same |
| CN1103903A (en) * | 1993-05-28 | 1995-06-21 | 古尔德电子有限公司 | Electrodeposited copper foil and process for makin gasame using electrolyte solutions having controlled additions of chloride ions and organic additives |
| CN101067210A (en) * | 2007-01-26 | 2007-11-07 | 湖北中科铜箔科技有限公司 | Electrolytic copper foil with low-contour and high property and producing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 李俊等: "电解铜箔添加剂研究进展", 《化学研究》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103060859A (en) * | 2012-12-27 | 2013-04-24 | 东强（连州）铜箔有限公司 | An additive for improving the peak shape of the rough surface of rough foil, and a production process for electrolytic copper foil |
| CN103060859B (en) * | 2012-12-27 | 2015-04-22 | 建滔（连州）铜箔有限公司 | An additive for improving the peak shape of the rough surface of rough foil, and a production process for electrolytic copper foil |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101613864B (en) | Method for preparing magnesium-rare earth alloy by fused salt electrolysis process | |
| CN101994128A (en) | Method for preparing Al-Ti alloy or plated Al-Ti alloy by low-temperature electrolytic deposition of ionic liquid | |
| MX2018002787A (en) | Optimized ore processing using molten salts for leaching and thermal energy source. | |
| CN106283103B (en) | A kind of preparation method of electron level stannous methanesulfonate | |
| CN105886767A (en) | Recycling method for copper indium gallium selenide (CIGS) waste | |
| PH12015501706A1 (en) | Electro-deposited copper foil, method of surface-treated copper foil manufactured by using electro-deposited copper foil | |
| CN101280437A (en) | Preparation of magnesium-lanthanum-praseodymium-cerium intermediate alloy | |
| CN105037203A (en) | Preparation method of 1,3,6-hexanetricarbonitrile | |
| CN103887078A (en) | Preparation method for ruthenium-oxide-based electrode material | |
| CN103060842B (en) | A kind of method preparing electrodeposited cobalt under big flow | |
| CA3212097A1 (en) | Iron conversion system and applications | |
| CN103898552B (en) | The synthetic purification quick electrolysis liquid of a kind of diamond | |
| CN101343750A (en) | Application of sulphuric acid hydrogen imidazole ion liquid in electrolytical refined copper | |
| CN103320822A (en) | Method for electroplating titanium on surface of metal | |
| CN102797020A (en) | Preparation method of electrolytic copper foil with thick specification and low peak value | |
| CN102839394A (en) | Method for rapidly preparing tree-like nano-iron with multi-level structure | |
| CN108163873A (en) | A kind of method that lithium hydroxide is extracted in the lithium waste residue from phosphoric acid | |
| CN104862730B (en) | A kind of method that electrolysis with ion-exchange film prepares potassium permanganate | |
| CN101560677A (en) | Method for preparing solution of tin methane sulfonate | |
| CN104372380A (en) | Low-temperature fused salt method for preparing high-purity chromium | |
| CN104532293B (en) | The method of purifying nickel and nickel purifying plant in chemical nickel plating waste solution | |
| CN110306052A (en) | A kind of metal lithium simple substance and the preparation method and application thereof | |
| CN104878410B (en) | Electrolytic aluminum anode scrap crust material comprehensive reutilization method | |
| CN105088273A (en) | Method for recovering nickel and iron from nickel sulfate-ferrous sulfate acidic mixed solution through electrodeposition | |
| CN106929875B (en) | A method of ferrate is prepared based on carbon plate plating iron |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Lin Jiabao Inventor before: Huang Wenrong Inventor before: Guo Wei Inventor before: Wu Weian |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: HUANG WENRONG GUO WEI WU WEIAN TO: LIN JIABAO |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121128 |