CN102786725B - 无味的半导体封装模具用清模和润模双功能材料 - Google Patents
无味的半导体封装模具用清模和润模双功能材料 Download PDFInfo
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- CN102786725B CN102786725B CN201210280108.1A CN201210280108A CN102786725B CN 102786725 B CN102786725 B CN 102786725B CN 201210280108 A CN201210280108 A CN 201210280108A CN 102786725 B CN102786725 B CN 102786725B
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CN201210280108.1A CN102786725B (zh) | 2012-08-07 | 2012-08-07 | 无味的半导体封装模具用清模和润模双功能材料 |
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CN102786725A CN102786725A (zh) | 2012-11-21 |
CN102786725B true CN102786725B (zh) | 2014-03-19 |
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Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103817836B (zh) * | 2014-02-18 | 2016-04-06 | 成都先进功率半导体股份有限公司 | 一种半导体模具清模方法 |
CN104059586A (zh) * | 2014-07-17 | 2014-09-24 | 李倩楠 | 一种电阻率可变导电胶 |
CN104059585A (zh) * | 2014-07-17 | 2014-09-24 | 李倩楠 | 一种耐超低温电阻率可变导电胶及其制备、使用方法 |
CN104262797B (zh) * | 2014-09-19 | 2016-08-17 | 无锡晶睿光电新材料有限公司 | 一种未硫化橡胶组合物 |
CN104804241A (zh) * | 2015-04-29 | 2015-07-29 | 海太半导体(无锡)有限公司 | 一种半导体高粘膜注塑清洁材料 |
CN107011553A (zh) * | 2017-05-04 | 2017-08-04 | 天津德高化成新材料股份有限公司 | 一种橡胶制品模具用在线免拆装洗模材料及其制备方法 |
CN107805393A (zh) * | 2017-11-06 | 2018-03-16 | 张永宏 | 静电吸附膜生产用模具的表面材料 |
CN109337134A (zh) * | 2018-10-19 | 2019-02-15 | 深圳市硕立特科技有限公司 | 不含钠离子及无腐蚀性的清模胶条及该胶条加工方法 |
CN110016159B (zh) * | 2019-04-04 | 2021-01-08 | 上海厉炼吉实业有限公司 | 一种高分子聚合物用自洁剂及其制备方法 |
CN110845772A (zh) * | 2019-11-22 | 2020-02-28 | 深圳市硕立特科技有限公司 | 不含钠离子的润模胶条及该润模胶条制作工艺 |
CN112574516A (zh) * | 2020-10-26 | 2021-03-30 | 西安科悦电子材料有限公司 | 一种有清模功能的纳米增强玻纤复合材料 |
CN114058127A (zh) * | 2021-11-30 | 2022-02-18 | 苏州赛伍应用技术股份有限公司 | 一种清润膜胶条及其制备方法和用途 |
CN114044985A (zh) * | 2021-12-06 | 2022-02-15 | 江苏海洋大学 | 一种半导体封装模具改性纳米硅纤维增强清模胶 |
CN114292435A (zh) * | 2022-02-18 | 2022-04-08 | 天津德高化成新材料股份有限公司 | 一种半导体封装模具用润模海绵的制备方法 |
CN114633408B (zh) * | 2022-05-23 | 2022-10-11 | 天津德高化成新材料股份有限公司 | 一种半导体封装模具用发泡润模胶及其制备方法 |
CN117183165B (zh) * | 2023-11-07 | 2024-02-23 | 天津德高化成新材料股份有限公司 | 一种半导体封装模具用清模喷雾及其制备与使用方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0687539B1 (en) * | 1994-06-15 | 1999-02-17 | Bridgestone Corporation | Rubber composition for cleaning mold, and method for cleaning mold |
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JP2002137232A (ja) * | 2000-11-06 | 2002-05-14 | Nok Corp | 金型洗浄用ゴム組成物 |
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0687539B1 (en) * | 1994-06-15 | 1999-02-17 | Bridgestone Corporation | Rubber composition for cleaning mold, and method for cleaning mold |
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JP2002-137232A 2002.05.14 |
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Owner name: TIANJIN DEGAO HUACHENG NEW MATERIAL CO., LTD. Free format text: FORMER NAME: TIANJIN DEGAO CHEMICAL ELECTRONIC MATERIALS CO., LTD. |
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Address after: 300451, Tianjin Binhai New Area, Tanggu new North Road, 4668, innovation and Innovation Park, No. 13 workshop Patentee after: TECORE SYNCHEM, INC. Address before: 300451, Binhai New Area, Tanggu new North Road, 4668, innovation and entrepreneurship Park, 31-A-,, B Patentee before: Tianjin Degao Huacheng Electronic Material Co., Ltd. |
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Denomination of invention: Tasteless double-functional material for cleaning and lubricating semiconductor packaging mold Effective date of registration: 20190521 Granted publication date: 20140319 Pledgee: Tianjin Zhongguancun Science and Technology Financing Guarantee Co., Ltd. Pledgor: TECORE SYNCHEM, INC. Registration number: 2019120000017 |
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Date of cancellation: 20200811 Granted publication date: 20140319 Pledgee: Tianjin Zhongguancun Science and Technology Financing Guarantee Co.,Ltd. Pledgor: Tianjin Degao Chemicals New Materials Co.,Ltd. Registration number: 2019120000017 |