CN102773609A - Device and method for pulse laser etching of two-side copper film on organic glass - Google Patents
Device and method for pulse laser etching of two-side copper film on organic glass Download PDFInfo
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- CN102773609A CN102773609A CN2012101858449A CN201210185844A CN102773609A CN 102773609 A CN102773609 A CN 102773609A CN 2012101858449 A CN2012101858449 A CN 2012101858449A CN 201210185844 A CN201210185844 A CN 201210185844A CN 102773609 A CN102773609 A CN 102773609A
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Abstract
The invention relates to a device for the pulse laser etching of a two-side copper film on organic glass, comprising pulse laser etching equipment, wherein the pulse laser etching equipment comprises a laser device (1), an optical gate (2), a 1/2 wave plate (3), a glan prism (4), a beam expanding lens (5), a total-reflection lens (6), a lens vibrating system (7) and a telecentric field lens (8); the laser sent by the laser device (1) is emitted into the beam expanding lens (5) through the optical gate (2), the 1/2 wave plate (3) and the glan prism (4) sequentially to coaxially expand the beam of the laser; the beam-expanded and collimated laser obtained by the beam expanding lens (5) reaches the total-reflection lens (6); the laser reflected by the total-reflection lens (6) is emitted into the lens vibrating system (7); and the laser emitted out of the lens vibrating system (7) is focused onto the organic glass of a workpiece (12) to be machined through the telecentric field lens (8). The device for the pulse laser etching of the two-side copper film on the organic glass of the invention is simple to machine, high in efficiency and free from materials consumption.
Description
Technical field
The present invention relates to the device and method of the organic two-sided copper film on glass of a kind of pulse laser etching, belong near field optic, electronic touch designing technique and laser micro-machining technology field.
Background technology
Mostly traditional touch screen conductive material base material is PET and GLASS, and this type of base material majority is external imported material, and delivery cycle is long and cost is higher, and more limitation is arranged; Moreover existing touch-screen field can't reduce the final thickness of touch-screen product so all for the single face etch process carries out, and has restricted touch-screen to thin direction developing progress; If use with lucite and can be easy to find suitable material at home as the manufacture craft of substrate, and relative low price, manufacturing process is comparatively simple, and the cost and the material cost of equipment had greatly improved; Adding the two-sided technology of processing, can the touch-screen product thickness be reduced about 1mm again, is a new breakthrough on the touch-screen field;
But the copper film layer circuit realizes that width the most carefully can only reach 80um on the traditional wet quarter touch-screen, and yields is lower, and linear inhomogeneous, it is comparatively loaded down with trivial details to change the different batches product, need clean contaminated environment with chemical medicinal liquid; The net tension value that stretches tight is less, and finished-product material wearability, chemical proofing are relatively poor, is prone to aging embrittlement.Need more consumptive material in this mode of printing complex procedures, the production, producing line needs more manpower to safeguard that limitation is bigger.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, provide that processing is simple, efficient is high and need not the device and method of the organic two-sided copper film on glass of a kind of pulse laser etching of consumptive material.
The objective of the invention is to realize like this: the device of the organic two-sided copper film on glass of a kind of pulse laser etching; Said device includes laser ablation equipment; Said laser ablation equipment includes laser instrument, optical gate, 1/2 wave plate, Glan prism, beam expanding lens, the eyeglass that is all-trans, galvanometer system and psychological field mirror far away; The laser that said laser instrument sends is injected beam expanding lens successively light beam is carried out coaxial expansion bundle behind optical gate, 1/2 wave plate and Glan prism; Laser behind the beam expanding lens beam-expanding collimation arrives the eyeglass that is all-trans; Laser after the eyeglass reflection of being all-trans is injected galvanometer system, and the laser that penetrates galvanometer system is on focusing on as to be processed lucite behind the psychological field mirror far away.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the present invention, said laser instrument is the high-frequency short-pulse laser.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the present invention, said device includes height-gauge, and height-gauge is arranged on the galvanometer system.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the present invention, said height-gauge is contactless height-gauge.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the present invention, said laser instrument, galvanometer system and height-gauge all link to each other with industrial computer through communication system.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the present invention, said lucite as to be processed is fixed through clamping cylinder, and the top of the copper film layer of said lucite as to be processed is provided with a CCD contraposition observing system.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the present invention, the both sides, top of the copper film layer of said lucite as to be processed are respectively arranged with dust-precipitating system and scavenger system.
The method of the organic two-sided copper film layer on glass of a kind of pulse laser etching of the present invention, this method includes following steps:
The laser that step 1, laser instrument send behind the beam expanding lens collimator and extender, focuses on through galvanometer system and the psychological field mirror far away with less focal length behind 1/2 wave plate and Glan prism more again, makes focal beam spot at 5um～20um;
Step 4: when laser carries out etching according to design configuration, open the dust-precipitating system and the scavenger system that are arranged at as the both sides, top of the copper film of to be processed lucite simultaneously, guarantee that the dust that etching produces all sucks in the dust-precipitating system.
In the etching, said laser instrument is M
2<1.5 high-frequency pulse laser, said beam expanding lens is the beam expanding lens of 2X-20X, the specification of said psychological field mirror far away is F30 ~ F250.
Compared with prior art, the invention has the beneficial effects as follows:
The present invention is through using high-frequency short-pulse laser as lasing light emitter; The two-sided copper film of lucite in the different touch-screen products is carried out laser-induced thermal etching; Make the lucite copper film reach the purpose that erosion removes in the effect gasified of high-frequency short pulse solid state laser; The etching of accomplishing these conductive film materials through the mobile splicing and the etching of small breadth galvanometer of high accuracy platform; Wherein contactless height-gauge is calibrated the stability that has guaranteed laser-induced thermal etching work distance constantly, and the dust of generation processes touch-screen electronic product pollution-free, that linearity is stable, function is intact through special scavenger system and big flow laying dust system control of dust.
Description of drawings
Fig. 1 is the structural representation of the device of the organic two-sided copper film on glass of a kind of pulse laser etching of the present invention.
Wherein:
Laser instrument 1, optical gate 2,1/2 wave plate 3, Glan prism 4, beam expanding lens 5, the eyeglass 6 that is all-trans, galvanometer system 7, psychological field mirror 8 far away, CCD contraposition observing system 9, dust-precipitating system 10, scavenger system 11, to be processed 12, clamp cylinder 13, industrial computer 14, communication system 15, height-gauge 16.
The specific embodiment
Referring to Fig. 1, the present invention relates to the device of the organic two-sided copper film on glass of a kind of pulse laser etching, the object of said apparatus and method processing is for being the conductive material of the two-sided copper plating film of substrate with the lucite; Two bundle laser focus on respectively on the copper film of the upper and lower surface that the two-sided copper film of lucite leads, and carry out laser-induced thermal etching simultaneously; Said device includes two cover laser ablation equipment; Said laser ablation equipment all includes laser instrument 1, optical gate 2,1/2 wave plate 3, Glan prism 4, beam expanding lens 5, the eyeglass 6 that is all-trans, galvanometer system 7 and psychological field mirror 8 far away; The laser that said laser instrument 1 sends is through optical gate 2 gauge tap light; Specifically can control the opening and closing of optical gate 2 by the software control induced signal, thereby realize the external control laser switch of laser instrument 1, behind the optical gate 2 control laser beams through 1/2 wave plate 3; Regulate 1/2 wave plate and cooperate Glan prism 4 can realize that 0%～100% scope internal power is adjustable, very big facility is provided the selection of laser power; Carry out coaxial expansion bundle through 5 pairs of light beams of beam expanding lens then, improve the angle of divergence of beam propagation on the one hand, thereby reach the purpose of beam path alignment; In addition on the one hand, laser beams coaxial is expanded bundle, make that focusing back hot spot and depth of focus are littler, thereby realize the purpose of laser stabilization etching; Light beam arrives the eyeglass 6 that is all-trans behind beam expanding lens 5 beam-expanding collimations, makes laser all reflex to galvanometer system 7 and is cooperating psychological field mirror 8 far away can control laser accurately to focus on the copper film on the lucite, make its etch effect better stable; And the laser that two cover laser ablation equipment penetrate focuses on respectively on two copper films up and down as to be processed 12 lucite;
Laser instrument 1 carries out data communication with galvanometer system 7 through communication systems 15 and industrial computer 14, specifically can realize scanning patter is converted into data signal, and drive motors transforms figure is then needing on to be processed 12 of etching; To be processed 12 simultaneously clamped cylinder 13 fixed; Measure through contactless height-gauge 16; Measurement data is fed back to the control system, thereby the control system can handle the adjustment focal length to data, guarantees that effectively focus is all the time on the copper film of lucite upper surface; Target is taken and grasped to location mark through CCD observing system 9 will import, control processing then.At this moment, scavenger system 11 is started working with dust-precipitating system 10 simultaneously, makes process stable; After a unit was accomplished in high-frequency short-pulse laser etching, platform moved next unit, and high-frequency short-pulse laser begins processing again; So repeatedly, finally realize the etching of whole machining process breadth.
The lithographic method of the organic two-sided copper film layer on glass of a kind of pulse laser etching of the present invention, this method includes following steps:
The laser that step 1, laser instrument 1 send behind beam expanding lens 5 collimator and extenders, focuses on through galvanometer system 7 and the psychological field mirror far away with less focal length 8 behind 1/2 wave plate 3 and Glan prism 4 more again, makes focal beam spot at 5um～20um;
Step 4: when laser carries out etching according to design configuration, open the dust-precipitating system 10 and scavenger system 11 that are arranged at as the both sides, top of the copper film of to be processed 12 lucite simultaneously, guarantee that the dust that etching produces all sucks in the dust-precipitating system 10;
The removal of lucite copper film need be carried out under less depth of focus when carrying out etching, so we adopt M
2<1.5 (M
2The beam quality factor of expression laser instrument) high-frequency pulse laser cooperates 2X-20X (2X-20X representes that the multiplication factor of beam expanding lens is 2 ~ 20) to expand bundle, adds the psychological field mirror far away of F30 ~ F250 and processes the etch copper rete.
Claims (10)
1. the device of the organic two-sided copper film on glass of pulse laser etching; It is characterized in that: said device includes laser ablation equipment; Said laser ablation equipment includes laser instrument (1), optical gate (2), 1/2 wave plate (3), Glan prism (4), beam expanding lens (5), the eyeglass that is all-trans (6), galvanometer system (7) and psychological field mirror (8) far away; The laser that said laser instrument (1) sends is injected beam expanding lens (5) successively light beam is carried out coaxial expansion bundle behind optical gate (2), 1/2 wave plate (3) and Glan prism (4); Laser behind beam expanding lens (5) beam-expanding collimation arrives the eyeglass (6) that is all-trans; Laser after the eyeglass that is all-trans (6) reflection is injected galvanometer system (7), and the laser that penetrates galvanometer system (7) focuses on the lucite as to be processed (12) behind psychological field mirror (8) far away.
2. the device of the organic two-sided copper film on glass of a kind of according to claim 1 pulse laser etching is characterized in that: said laser instrument (1) is the high-frequency short-pulse laser.
3. the device of the organic two-sided copper film on glass of a kind of according to claim 1 pulse laser etching is characterized in that: said device includes height-gauge (16), and height-gauge (16) is arranged on the galvanometer system (7).
4. like the device of the organic two-sided copper film on glass of the said a kind of pulse laser etching of claim 3, it is characterized in that: said height-gauge (16) is contactless height-gauge.
5. like the device of claim 1 or the organic two-sided copper film on glass of 2 or 3 said a kind of pulse laser etchings, it is characterized in that: said laser instrument (1), galvanometer system (7) and height-gauge (16) all link to each other with industrial computer (14) through communication system (15).
6. like the device of the organic two-sided copper film on glass of the said a kind of pulse laser etching of claim 5; It is characterized in that: said lucite as to be processed (12) is fixed through clamping cylinder (13), and the top of the copper film layer of said lucite as to be processed (12) is provided with a CCD contraposition observing system (9).
7. like the device of the organic two-sided copper film on glass of the said a kind of pulse laser etching of claim 6, it is characterized in that: the both sides, top of the copper film layer of said lucite as to be processed (12) are respectively arranged with dust-precipitating system (10) and scavenger system (11).
8. the method for the organic two-sided copper film layer on glass of pulse laser etching, it is characterized in that: said method adopts the device of the organic two-sided copper film on glass of a kind of pulse laser etching as claimed in claim 6, and this method includes following steps:
The laser that step 1, laser instrument (1) send is behind 1/2 wave plate (3) and Glan prism (4); Again behind beam expanding lens (5) collimator and extender; Focus on through galvanometer system (7) and psychological field mirror far away (8) with less focal length again, make focal beam spot at 5um～20um;
Step 2, the wall that lucite is led are fixed on the clamping cylinder (13); Cooperating height-gauge (16) to measure in real time; Measurement data is fed back to industrial computer (14); Industrial computer (14) thus can to data handle the adjustment focal length, guarantee that effectively focus focuses on the copper film of lucite upper and lower surfaces all the time;
Step 3, carry out CCD location; Utilization has the CCD contraposition observing system (9) that CCD grabs the target function automatically; Only need in software, to set up for the first time template; The figure that imports sample target position in bitmap layer target position and the platform coordinate is provided with one by one is corresponding, and follow-up same batch products is directly grabbed target automatically can accomplish the location.
9. like the method for the organic two-sided copper film on glass of the said a kind of pulse laser etching of claim 8; It is characterized in that: said method also includes step 4: when laser carries out etching according to design configuration; Open the dust-precipitating system (10) and the scavenger system (11) that are arranged at as the both sides, top of the copper film of the lucite of to be processed (12) simultaneously, guarantee that the dust that etching produces all sucks in the dust-precipitating system (10).
10. like the method for the organic two-sided copper film on glass of the said a kind of pulse laser etching of claim 8, it is characterized in that: said laser instrument (1) is M
2<1.5 high-frequency pulse laser, said beam expanding lens (5) is the beam expanding lens of 2X-20X, the specification of said psychological field mirror far away (8) is F30 ~ F250.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101858449A CN102773609A (en) | 2012-06-07 | 2012-06-07 | Device and method for pulse laser etching of two-side copper film on organic glass |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101858449A CN102773609A (en) | 2012-06-07 | 2012-06-07 | Device and method for pulse laser etching of two-side copper film on organic glass |
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| CN102773609A true CN102773609A (en) | 2012-11-14 |
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| CN2012101858449A Pending CN102773609A (en) | 2012-06-07 | 2012-06-07 | Device and method for pulse laser etching of two-side copper film on organic glass |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105313481A (en) * | 2015-11-23 | 2016-02-10 | 深圳英诺激光科技有限公司 | Transparent material laser-inducing wet process colorful marking device and method |
| CN106275670A (en) * | 2015-06-24 | 2017-01-04 | 大族激光科技产业集团股份有限公司 | A kind of device utilizing laser technology that heat-shrink tube is marked |
| CN107234342A (en) * | 2017-07-12 | 2017-10-10 | 温州大学激光与光电智能制造研究院 | A kind of laser induced plasma direct write deposition method and apparatus |
| CN110167711A (en) * | 2017-01-16 | 2019-08-23 | 黑拉有限责任两合公司 | For manufacturing the method and apparatus left a blank in the coating of the transparent component of lighting device |
| CN111360398A (en) * | 2018-12-26 | 2020-07-03 | 大族激光科技产业集团股份有限公司 | Processing device and method for removing protective layer by laser |
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| CN202667929U (en) * | 2012-06-07 | 2013-01-16 | 江阴德力激光设备有限公司 | Device of double-faced copper film on pulse-laser-etched organic glass |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106275670A (en) * | 2015-06-24 | 2017-01-04 | 大族激光科技产业集团股份有限公司 | A kind of device utilizing laser technology that heat-shrink tube is marked |
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| CN110167711A (en) * | 2017-01-16 | 2019-08-23 | 黑拉有限责任两合公司 | For manufacturing the method and apparatus left a blank in the coating of the transparent component of lighting device |
| CN107234342A (en) * | 2017-07-12 | 2017-10-10 | 温州大学激光与光电智能制造研究院 | A kind of laser induced plasma direct write deposition method and apparatus |
| CN111360398A (en) * | 2018-12-26 | 2020-07-03 | 大族激光科技产业集团股份有限公司 | Processing device and method for removing protective layer by laser |
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Application publication date: 20121114 |