CN102769466A - Analog-to-digital conversion method and device - Google Patents
Analog-to-digital conversion method and device Download PDFInfo
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- CN102769466A CN102769466A CN2012102274717A CN201210227471A CN102769466A CN 102769466 A CN102769466 A CN 102769466A CN 2012102274717 A CN2012102274717 A CN 2012102274717A CN 201210227471 A CN201210227471 A CN 201210227471A CN 102769466 A CN102769466 A CN 102769466A
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Abstract
The invention discloses an analog-to-digital conversion method and device. The method comprises the following steps: obtaining a correction coefficient of an analog-to-digital conversion chip; reading the digital voltage value of the converted analog voltage when the analog voltage is input into the chip; and calculating new digital voltage value and outputting according to the correct coefficient and the digital voltage value of the converted analog voltage. The method and device provided by the invention improve the analog-to-digital conversion precision.
Description
Technical field
The present invention relates to the electronic circuit technology field, particularly a kind of analog-to-digital method and device.
Background technology
Along with development of science and technology, people step into digital Age gradually.Wherein the conversion accuracy for the modulus conversion chip of digital appliances is one of its important performance index, and the reference voltage in the modulus conversion chip generally adopts inner reference voltage level.
Because the difference of modulus conversion chip manufacture craft and components and parts causes the fluctuation of its reference voltage level bigger, so cause analog-to-digital precision lower, needs improvement badly.
Summary of the invention
Main purpose of the present invention is to provide a kind of analog-to-digital method, is intended to improve analog-to-digital precision.
In order to realize goal of the invention, the present invention provides a kind of analog-to-digital method, may further comprise the steps:
Obtain the correction coefficient of modulus conversion chip;
When said modulus conversion chip input analog voltage, read the digital voltage value after the said aanalogvoltage conversion;
Calculate and export new digital voltage value according to the digital voltage value of said correction coefficient after to the conversion of said aanalogvoltage.
Preferably, said correction coefficient comprises the reference voltage correction coefficient, and said reference voltage correction coefficient obtains through following detection method:
When said modulus conversion chip input standard analog voltage, read the digital voltage value after the said standard analog voltage transitions;
The reference voltage that presets according to said modulus conversion chip calculates acquisition and the corresponding digital voltage value of the said reference voltage that presets with said standard analog voltage;
Calculate the reference voltage correction coefficient that obtains said modulus conversion chip according to digital voltage value after the said standard analog voltage transitions and the corresponding digital voltage value of the said reference voltage that presets, and store said reference voltage correction coefficient.
Preferably, said correction coefficient also comprises temperature correction facotor, and the said correction coefficient of obtaining modulus conversion chip also comprises afterwards:
Obtain the current temperature value of said modulus conversion chip in real time;
Detected temperatures value when obtaining the reference voltage correction coefficient that detects modulus conversion chip;
Saidly calculate and export new digital voltage value step according to the digital voltage value of said correction coefficient after and be specially the conversion of said aanalogvoltage:
Calculate according to the current temperature value of said reference voltage correction coefficient, said temperature correction facotor, said modulus conversion chip and the said detected temperatures value digital voltage value after to said aanalogvoltage conversion and to obtain new digital voltage value, and export this new digital voltage value.
Preferably, said temperature correction facotor obtains through following detection method:
When said modulus conversion chip input standard analog voltage; And when the temperature of said modulus conversion chip is first threshold; Read first digital voltage value after said normal voltage is changed, and calculate acquisition corresponding reference correction coefficient according to said first digital voltage value;
When said modulus conversion chip input standard analog voltage; And when the temperature of said modulus conversion chip is second threshold value; Read second digital voltage value after said normal voltage is changed, and calculate acquisition corresponding reference correction coefficient according to said second digital voltage value;
According to said first threshold, calculate the temperature correction facotor that obtains said modulus conversion chip with said first threshold corresponding reference correction index, said second threshold value and with the said second threshold value corresponding reference correction index.
The present invention also provides a kind of analog-to-digital device, comprising:
Acquisition module is used to obtain the correction coefficient of modulus conversion chip;
Read module is used for when said modulus conversion chip input analog voltage, reads the digital voltage value after the said aanalogvoltage conversion;
Processing module is used for calculating and export new digital voltage value according to the digital voltage value of said correction coefficient after to the conversion of said aanalogvoltage.
Preferably, said correction coefficient comprises the reference voltage correction coefficient, and said analog-to-digital device also comprises:
Said read module also is used for when said modulus conversion chip input standard analog voltage, reads the digital voltage value after the said standard analog voltage transitions;
Detection module comprises;
First computing unit, the reference voltage that is used for presetting according to said modulus conversion chip calculates with said standard analog voltage and obtains and the corresponding digital voltage value of the said reference voltage that presets;
Second computing unit; Be used for calculating the reference voltage correction coefficient that obtains said modulus conversion chip, and store said reference voltage correction coefficient according to digital voltage value after the said standard analog voltage transitions and the corresponding digital voltage value of the said reference voltage that presets.
Preferably, said correction coefficient also comprises temperature correction facotor, and said analog-digital commutator also comprises:
The temperature acquisition module is used for obtaining in real time the current temperature value of said modulus conversion chip; And the detected temperatures value when obtaining the reference voltage correction coefficient that detects modulus conversion chip;
Said processing module; Specifically be used for calculating and obtain new digital voltage value, and export this new digital voltage value according to the current temperature value of said reference voltage correction coefficient, said temperature correction facotor, said modulus conversion chip and the said detected temperatures value digital voltage value after to said aanalogvoltage conversion.
Preferably; Said read module; Also be used for when said modulus conversion chip input standard analog voltage; And when the temperature of said modulus conversion chip is first threshold, read first digital voltage value after said normal voltage is changed, and calculate acquisition corresponding reference correction coefficient according to said first digital voltage value; When said modulus conversion chip input standard analog voltage; And when the temperature of said modulus conversion chip is second threshold value; Read second digital voltage value after said normal voltage is changed, and calculate acquisition corresponding reference correction coefficient according to said second digital voltage value;
Said second computing unit also is used for according to said first threshold, reaches the temperature correction facotor that calculates the said modulus conversion chip of acquisition with the said second threshold value corresponding reference correction index with said first threshold corresponding reference correction index, said second threshold value.
The present invention is through obtaining the correction coefficient of modulus conversion chip, and proofreaies and correct according to the digital voltage value of this correction coefficient after to the aanalogvoltage conversion of input.Therefore improved analog-to-digital precision.
Description of drawings
Fig. 1 is the structural representation of analog-to-digital method first embodiment of the present invention;
Fig. 2 is for detecting the schematic flow sheet of the reference voltage correction coefficient of modulus conversion chip among analog-to-digital method first embodiment of the present invention;
Fig. 3 is the structural representation of analog-to-digital method second embodiment of the present invention;
Fig. 4 is for detecting the temperature correction facotor schematic flow sheet of modulus conversion chip among analog-to-digital method second embodiment of the present invention;
Fig. 5 is the structural representation of analog-to-digital device first embodiment of the present invention;
Fig. 6 is the structural representation of analog-to-digital device second embodiment of the present invention;
Fig. 7 is the structural representation of detection module among Fig. 6;
The realization of the object of the invention, functional characteristics and advantage will combine embodiment, further specify with reference to accompanying drawing.
Embodiment
To be example with the smart mobile phone below, specify the present invention.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
With reference to Fig. 1, Fig. 1 is the structural representation of analog-to-digital method first embodiment of the present invention.The analog-to-digital method that present embodiment provides may further comprise the steps:
Step S10 obtains the correction coefficient of modulus conversion chip;
For example, at first need detect the correction coefficient of modulus conversion chip, then this correction coefficient is stored in the memory cell in this modulus conversion chip, when using next time, obtain this correction coefficient in the memory cell of this chip and get final product.
Step S20 when above-mentioned modulus conversion chip input analog voltage, reads the digital voltage value after the aanalogvoltage conversion;
When the user in use, analog signal is from the input of the input of this modulus conversion chip, is that benchmark convert a digital voltage value with the voltage of analog signal with the actual reference voltage of inside by this modulus conversion chip, and reads this digital voltage value.
Step S30 calculates and exports new digital voltage value according to above-mentioned correction coefficient to the digital voltage value after the aanalogvoltage conversion.
After this modulus conversion chip reads above-mentioned digital voltage value, can above-mentioned correction coefficient and the digital voltage value that reads be calculated new digital voltage value, and export this new digital voltage value.
The present invention is through obtaining the correction coefficient of modulus conversion chip, and proofreaies and correct according to the digital voltage value of this correction coefficient after to the aanalogvoltage conversion of input.Therefore improved analog-to-digital precision.
Particularly, above-mentioned correction coefficient comprises the reference voltage correction coefficient.With reference to Fig. 2, Fig. 2 is for detecting the schematic flow sheet of the reference voltage correction coefficient of modulus conversion chip among analog-to-digital method first embodiment of the present invention.In the present embodiment, the reference voltage correction coefficient that detects modulus conversion chip may further comprise the steps:
Step S101 when modulus conversion chip input standard analog voltage, reads the digital voltage value after the standard analog voltage transitions;
Step S102, the reference voltage that presets according to above-mentioned modulus conversion chip calculates the acquisition digital voltage value corresponding with the reference voltage that presets with above-mentioned standard analog voltage;
Step S103 calculates the reference voltage correction coefficient that obtains modulus conversion chip according to digital voltage value after the above-mentioned standard analog voltage transitions and the corresponding digital voltage value of the above-mentioned reference voltage that presets, and stores this reference voltage correction coefficient.
In the present embodiment, detect the reference voltage correction coefficient of modulus conversion chip, the aanalogvoltage that for example can adopt an extraneous standard is as reference voltage, and the input of this reference voltage from this modulus conversion chip inputed to the modulus conversion chip; Read the pairing digital voltage value of this reference voltage that with the reference voltage of inside this reference voltage conversion is acquired through modulus conversion chip; And the reference voltage that presets according to this modulus conversion chip calculates and obtains the digital voltage value that this reference voltage is changed with the reference voltage that presets; Calculate to obtain the digital voltage value that this reference voltage that presets changes and the ratio of the pairing digital voltage value of reference voltage at last, promptly above-mentioned reference voltage correction coefficient, and this reference voltage correction coefficient is stored to the storage area of modulus conversion chip.
For example be the standard direct voltage voltage as a reference of 5V with a reference voltage; The reference voltage that presets is 2V, i.e. the reference voltage that modulus conversion chip expection reaches is that 2V is U0 as the corresponding digital voltage value of input voltage calculating acquisition, and this U0 is reference voltage 2V and the ratio of reference voltage 5V, the i.e. U0=0.4 that presets.The actual reference voltage of above-mentioned modulus conversion chip be 1V as input voltage, change the back resulting digital voltage value be U1, this U1 is the ratio of actual reference voltage 1V and reference voltage 5V, i.e. U1=0.2.Can obtain K=0.5 this moment according to reference voltage correction coefficient K=U0/U1.
When the user adopts above-mentioned modulus conversion chip; And adopt that to preset reference voltage be that 2V (actual reference voltage is 1V) as the analog-to-digital conversion reference voltage, imports the direct voltage of a 0.5V, the digital voltage value U2 that obtains after the conversion; This U2 is 0.5; Carry out the reference voltage treatment for correcting, the new digital voltage value U that this reference voltage treatment for correcting obtains is the product of digital voltage value U2 and reference voltage correction coefficient K, i.e. U=0.25.At this moment, handling the digital voltage value of exporting the back through this modulus conversion chip is 0.25.
The method that should be noted that the foregoing description calculating reference voltage correction coefficient K can be calculated according to actual needs, does not do further qualification at this.As preferably, with reference voltage 5V voltage as a reference, the reference voltage of modulus conversion chip is calculated as input voltage in the present embodiment.
Further, with reference to Fig. 3, Fig. 3 is the structural representation of analog-to-digital method second embodiment of the present invention.Based on the foregoing description, in the present embodiment, above-mentioned correction coefficient also comprises temperature correction facotor, and last step S10 is specially reference voltage correction coefficient and the temperature correction facotor that obtains modulus conversion chip, after execution in step S10, also comprises:
Step S40 obtains the current temperature value of modulus conversion chip in real time;
Step S50, the detected temperatures value when obtaining the reference voltage correction coefficient that detects modulus conversion chip;
Above-mentioned steps S30 is specially: calculate according to the current temperature value of above-mentioned reference voltage correction coefficient, temperature correction facotor, modulus conversion chip and the above-mentioned detected temperatures value digital voltage value after to above-mentioned aanalogvoltage conversion and obtain new digital voltage value, and export this new digital voltage value.
In the present embodiment, can at first detect the temperature correction facotor of this modulus conversion chip, and the detected temperatures value when obtaining the reference voltage correction coefficient that detects modulus conversion chip, then this temperature coefficient is stored in the modulus conversion chip.When the user uses, an analog signal is inputed in this modulus conversion chip, and read the digital voltage value that obtains through after the modulus conversion chip conversion, and adopt a temperature sensor to obtain and obtain the current ambient temperature of modulus conversion chip in real time; According to the current ambient temperature of modulus conversion chip, detected temperatures value, stored temperature correction facotor and reference voltage correction coefficient this digital voltage value is calculated new digital voltage value, and export this new digital voltage value.In the present embodiment, through the digital voltage value after the conversion is carried out treatment for correcting, when having reduced the modulus conversion chip conversion simultaneously, reference voltage and temperature have further improved analog-to-digital precision to the influence of conversion accuracy.
Should be noted that in the present embodiment, can at first detect the pairing reference voltage correction coefficient of each temperature value, and be stored in this modulus conversion chip.Then when the user in use, read the digital voltage value of Current Temperatures corresponding reference correction index after in the modulus conversion chip through detected current temperature value and carry out treatment for correcting conversion.As preferably; Present embodiment; At first detect the temperature correction facotor of this modulus conversion chip; Calculate the reference voltage correction coefficient that obtains Current Temperatures according to this temperature correction facotor, and the digital voltage value after changing is carried out the reference voltage treatment for correcting, thereby improve the conversion accuracy of this modulus conversion chip according to this reference voltage correction coefficient.
With reference to Fig. 4, Fig. 4 is for detecting the temperature correction facotor schematic flow sheet of modulus conversion chip among analog-to-digital method second embodiment of the present invention.The temperature correction facotor that detects modulus conversion chip in the present embodiment comprises:
Step S601, when modulus conversion chip input normal voltage, and the temperature of modulus conversion chip is when being first threshold, reads first digital voltage value after the above-mentioned normal voltage conversion, and calculates according to this first digital voltage value and to obtain the corresponding reference correction coefficient;
Step S602, when modulus conversion chip input normal voltage, and the temperature of modulus conversion chip is when being second threshold value, reads second digital voltage value after the above-mentioned normal voltage conversion, and calculates according to this second digital voltage value and to obtain the corresponding reference correction coefficient;
Step S603 is according to above-mentioned first threshold, calculate the temperature correction facotor that obtains modulus conversion chip with this first threshold corresponding reference correction index, second threshold value and with this second threshold value corresponding reference correction index.
In the present embodiment, detect the temperature correction facotor of modulus conversion chip, the aanalogvoltage that for example can adopt an extraneous standard is as reference voltage, and the input of this reference voltage from this modulus conversion chip inputed to the modulus conversion chip; Read through modulus conversion chip and this reference voltage is changed the pairing digital voltage value of this reference voltage of acquisition with the reference voltage of inside; Adopt a temperature sensor to obtain the current temperature value of modulus conversion chip simultaneously; And definition temperature value at this moment is above-mentioned first threshold; The digital voltage value that obtain this moment is first digital voltage value, and calculates acquisition corresponding reference correction index according to this first digital voltage value.When temperature value changes; When reaching second threshold value like temperature value when modulus conversion chip; Read said reference voltage at this moment through second digital voltage value after this modulus conversion chip conversion, and calculate acquisition corresponding reference correction index according to this second digital voltage value.At last according to this first threshold, calculate the temperature correction facotor that obtains this modulus conversion chip with this first threshold corresponding reference correction index, second threshold value and with this second threshold value corresponding reference correction index.
For example be the standard direct voltage voltage as a reference of 5V with a reference voltage; Prefabricated reference voltage is 2V, and promptly the actual reference voltage that reaches of modulus conversion chip is that 2V is as input voltage.If first threshold T1 is 25 when spending, the first digital voltage value U3 is 0.2, the reference correction coefficient K1=0.5 that obtain this moment; If the second threshold value T2 is 26 when spending, the second digital voltage value U4 is 0.3, the reference correction coefficient K2=0.75 that obtain this moment.Then said temperature correction coefficient K3=(K2-K1)/(T2-T1), i.e. K3=0.25.
When the user adopts above-mentioned modulus conversion chip, and adopt that to preset reference voltage be that 2V (actual reference voltage is 1V) as the analog-to-digital conversion reference voltage, imports the direct voltage of a 0.5V.The temperature T 3 of modulus conversion chip of this moment is 27 when spending, and the digital voltage value U5 that obtains after the conversion is 0.25, calculates according to reference voltage correction coefficient K6=K1+K3* (T3-T1) and obtains reference voltage correction coefficient K6=1 under the Current Temperatures; K6=1 carries out the reference voltage treatment for correcting to digital voltage value U5 according to this reference voltage correction coefficient, and the new digital voltage value U that this reference voltage treatment for correcting obtains is the product of digital voltage value U5 and reference voltage correction coefficient K, i.e. U=0.25.At this moment, handling the digital voltage value of exporting the back through this modulus conversion chip is 0.25.
The present invention also provides a kind of analog-to-digital device, is used to realize said method.In conjunction with extremely shown in Figure 7 with reference to Fig. 5, Fig. 5 is the structural representation of analog-to-digital device first embodiment of the present invention, and Fig. 6 is the structural representation of analog-to-digital device second embodiment of the present invention, and Fig. 7 is the structural representation of detection module among Fig. 6.The analog-to-digital device that present embodiment provides comprises:
For example; At first detect the correction coefficient of modulus conversion chip; Then this reference voltage correction coefficient is stored in the memory cell in this modulus conversion chip, when using next time, obtains this correction coefficient by acquisition module 100 in the memory cell of this chip and get final product.
Read module 200 is used for when above-mentioned modulus conversion chip input analog voltage, reads the digital voltage value after the aanalogvoltage conversion;
When the user in use; Analog signal is from the input input of this modulus conversion chip; Is that benchmark convert a digital voltage value with the voltage of analog signal with the actual reference voltage of inside by this modulus conversion chip, and reads this digital voltage value through read module 200.
After read module 200 reads above-mentioned digital voltage value; The digital voltage value that correction coefficient that can above-mentioned acquisition module 100 be detected by processing module 300 and read module 200 read calculates new digital voltage value, and exports this new digital voltage value.
The present invention obtains correction coefficient through acquisition module 100, and read module 200 reads the digital voltage value after the aanalogvoltage conversion, and is proofreaied and correct according to the digital voltage value of this correction coefficient after to the aanalogvoltage conversion of input by processing module 300.Therefore improved analog-to-digital precision.
Particularly, above-mentioned correction coefficient comprises the reference voltage correction coefficient.The analog-to-digital device that present embodiment provides also comprises:
Above-mentioned read module 200 also is used for when modulus conversion chip input standard analog voltage, reads the digital voltage value after the standard analog voltage transitions;
In the present embodiment; Detect the reference voltage correction coefficient of modulus conversion chip by detection module 400; The aanalogvoltage that for example can adopt an extraneous standard is as reference voltage, and the input of this reference voltage from this modulus conversion chip inputed to the modulus conversion chip; Read the pairing digital voltage value of this reference voltage that with the reference voltage of inside this reference voltage conversion is acquired through modulus conversion chip through read module 200; And calculate by the reference voltage that first computing unit 401 presets according to this modulus conversion chip and to obtain the digital voltage value that this reference voltage is changed with the reference voltage that presets; Calculate through second computing unit 402 at last and obtain the digital voltage value that these reference voltages that preset change and the ratio of the pairing digital voltage value of reference voltage; Be above-mentioned reference voltage correction coefficient, and this reference voltage correction coefficient is stored to the storage area of modulus conversion chip.
For example be the standard direct voltage voltage as a reference of 5V with a reference voltage; The reference voltage that presets is 2V, i.e. the reference voltage that modulus conversion chip expection reaches is that 2V is U0 as the corresponding digital voltage value of input voltage calculating acquisition, and this U0 is reference voltage 2V and the ratio of reference voltage 5V, the i.e. U0=0.4 that presets.The actual reference voltage of above-mentioned modulus conversion chip be 1V as input voltage, change the back resulting digital voltage value be U1, this U1 is the ratio of actual reference voltage 1V and reference voltage 5V, i.e. U1=0.2.Can obtain K=0.5 this moment according to reference voltage correction coefficient K=U0/U1.
When the user adopts above-mentioned modulus conversion chip; And adopt that to preset reference voltage be that 2V (actual reference voltage is 1V) as the analog-to-digital conversion reference voltage, imports the direct voltage of a 0.5V, the digital voltage value U2 that obtains after the conversion; This U2 is 0.5; Carry out the reference voltage treatment for correcting, the new digital voltage value U that this reference voltage treatment for correcting obtains is the product of digital voltage value U2 and reference voltage correction coefficient K, i.e. U=0.25.At this moment, handling the digital voltage value of exporting the back through this modulus conversion chip is 0.25.
The method that should be noted that the foregoing description calculating reference voltage correction coefficient K can be calculated according to actual needs, does not do further qualification at this.As preferably, with reference voltage 5V voltage as a reference, the reference voltage of modulus conversion chip is calculated as input voltage in the present embodiment.
Further, above-mentioned correction coefficient also comprises temperature correction facotor, and above-mentioned analog-to-digital device also comprises:
Temperature acquisition module 500 is used for obtaining in real time the current temperature value of modulus conversion chip; And the detected temperatures value when obtaining the reference voltage correction coefficient that detects modulus conversion chip;
Above-mentioned processing module 300; Specifically be used for calculating and obtain new digital voltage value, and export this new digital voltage value according to the current temperature value of above-mentioned reference voltage correction coefficient, temperature correction facotor, modulus conversion chip and the detected temperatures value digital voltage value after to the aanalogvoltage conversion.
In the present embodiment, can at first detect the temperature correction facotor of this modulus conversion chip, this temperature correction facotor is stored in the memory cell in this modulus conversion chip, when using next time, by this temperature correction facotor of acquisition module 100 lake regions.Detected temperatures value when obtaining the reference voltage correction coefficient that detects modulus conversion chip through temperature acquisition module 500 (like temperature sensor) is stored to this temperature coefficient in the modulus conversion chip then.When the user uses, an analog signal is inputed in this modulus conversion chip, read the digital voltage value that obtains through after the modulus conversion chip conversion, and export this digital voltage value to above-mentioned processing module 300 by read module 200; Temperature acquisition module 400 obtains the current ambient temperature of modulus conversion chip in real time, and exports current ambient temperature to above-mentioned processing module 300.Above-mentioned processing module 300 calculates new digital voltage value according to the current ambient temperature of modulus conversion chip, detected temperatures value, stored temperature correction facotor and reference voltage correction coefficient to this digital voltage value, and exports this new digital voltage value.In the present embodiment, through the digital voltage value after the conversion is carried out treatment for correcting, when having reduced the modulus conversion chip conversion simultaneously, reference voltage and temperature have further improved analog-to-digital precision to the influence of conversion accuracy.
Should be noted that in the present embodiment, can at first detect the pairing reference voltage correction coefficient of each temperature value, and be stored in this modulus conversion chip.Then when the user in use, read the digital voltage value of Current Temperatures corresponding reference correction index after in the modulus conversion chip through detected current temperature value and carry out treatment for correcting conversion.As preferably; Present embodiment; At first detect the temperature correction facotor of this modulus conversion chip; Calculate the reference voltage correction coefficient that obtains Current Temperatures according to this temperature correction facotor, and the digital voltage value after changing is carried out the reference voltage treatment for correcting, thereby improve the conversion accuracy of this modulus conversion chip according to this reference voltage correction coefficient.
Particularly; Above-mentioned read module 200 also is used for when modulus conversion chip input standard analog voltage, and the temperature of modulus conversion chip is when being first threshold; Read first digital voltage value after normal voltage is changed, and calculate acquisition corresponding reference correction coefficient according to this first digital voltage value; When modulus conversion chip input standard analog voltage, and the temperature of modulus conversion chip is when being second threshold value, reads second digital voltage value after the normal voltage conversion, and calculates according to this second digital voltage value and to obtain the corresponding reference correction coefficient;
In the present embodiment, detect the temperature correction facotor of modulus conversion chips by detection module 400, the aanalogvoltage that for example can adopt an extraneous standard is as reference voltage, and the input of this reference voltage from this modulus conversion chip inputed to the modulus conversion chip; Read with the reference voltage of inside this reference voltage to be changed by read module 200 and obtain the pairing digital voltage value of this reference voltage through modulus conversion chip; Obtain the current temperature value of modulus conversion chip through temperature acquisition module 500 simultaneously; And definition temperature value at this moment is above-mentioned first threshold; At this moment; The digital voltage value that read module 200 reads is first digital voltage value, and calculates acquisition corresponding reference correction index according to this first digital voltage value.When temperature value changes; When reaching second threshold value like the temperature value that gets access to modulus conversion chip when temperature acquisition module 500; Read said reference voltage at this moment through second digital voltage value after this modulus conversion chip conversion by read module 200, and calculate acquisition corresponding reference correction index according to this second digital voltage value.Second computing unit 402 reaches with this second threshold value corresponding reference correction index according to this first threshold, with this first threshold corresponding reference correction index, second threshold value and calculates the temperature correction facotor that obtains this modulus conversion chip.
For example be the standard direct voltage voltage as a reference of 5V with a reference voltage; Prefabricated reference voltage is 2V, and promptly the actual reference voltage that reaches of modulus conversion chip is that 2V is as input voltage.If first threshold T1 is 25 when spending, the first digital voltage value U3 is 0.2, the reference correction coefficient K1=0.5 that obtain this moment; If the second threshold value T2 is 26 when spending, the second digital voltage value U4 is 0.3, the reference correction coefficient K2=0.75 that obtain this moment.Then said temperature correction coefficient K3=(K2-K1)/(T2-T1), i.e. K3=0.25.
When the user adopts above-mentioned modulus conversion chip, and adopt that to preset reference voltage be that 2V (actual reference voltage is 1V) as the analog-to-digital conversion reference voltage, imports the direct voltage of a 0.5V.The temperature T 3 of modulus conversion chip of this moment is 27 when spending, and the digital voltage value U5 that obtains after the conversion is 0.25, calculates according to reference voltage correction coefficient K6=K1+K3* (T3-T1) and obtains reference voltage correction coefficient K6=1 under the Current Temperatures; K6=1 carries out the reference voltage treatment for correcting to digital voltage value U5 according to this reference voltage correction coefficient, and the new digital voltage value U that this reference voltage treatment for correcting obtains is the product of digital voltage value U5 and reference voltage correction coefficient K, i.e. U=0.25.At this moment, handling the digital voltage value of exporting the back through this modulus conversion chip is 0.25.
More than be merely the preferred embodiments of the present invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (8)
1. an analog-to-digital method is characterized in that, may further comprise the steps:
Obtain the correction coefficient of modulus conversion chip;
When said modulus conversion chip input analog voltage, read the digital voltage value after the said aanalogvoltage conversion;
Calculate and export new digital voltage value according to the digital voltage value of said correction coefficient after to the conversion of said aanalogvoltage.
2. analog-to-digital method as claimed in claim 1 is characterized in that said correction coefficient comprises the reference voltage correction coefficient, and said reference voltage correction coefficient obtains through following detection method:
When said modulus conversion chip input standard analog voltage, read the digital voltage value after the said standard analog voltage transitions;
The reference voltage that presets according to said modulus conversion chip calculates acquisition and the corresponding digital voltage value of the said reference voltage that presets with said standard analog voltage;
Calculate the reference voltage correction coefficient that obtains said modulus conversion chip according to digital voltage value after the said standard analog voltage transitions and the corresponding digital voltage value of the said reference voltage that presets, and store said reference voltage correction coefficient.
3. analog-to-digital method as claimed in claim 2 is characterized in that said correction coefficient also comprises temperature correction facotor, and the said correction coefficient of obtaining modulus conversion chip also comprises afterwards:
Obtain the current temperature value of said modulus conversion chip in real time;
Detected temperatures value when obtaining the reference voltage correction coefficient that detects modulus conversion chip;
Saidly calculate and export new digital voltage value step according to the digital voltage value of said correction coefficient after and be specially the conversion of said aanalogvoltage:
Calculate according to the current temperature value of said reference voltage correction coefficient, said temperature correction facotor, said modulus conversion chip and the said detected temperatures value digital voltage value after to said aanalogvoltage conversion and to obtain new digital voltage value, and export this new digital voltage value.
4. analog-to-digital method as claimed in claim 3 is characterized in that, said temperature correction facotor obtains through following detection method:
When said modulus conversion chip input standard analog voltage; And when the temperature of said modulus conversion chip is first threshold; Read first digital voltage value after said normal voltage is changed, and calculate acquisition corresponding reference correction coefficient according to said first digital voltage value;
When said modulus conversion chip input standard analog voltage; And when the temperature of said modulus conversion chip is second threshold value; Read second digital voltage value after said normal voltage is changed, and calculate acquisition corresponding reference correction coefficient according to said second digital voltage value;
According to said first threshold, calculate the temperature correction facotor that obtains said modulus conversion chip with said first threshold corresponding reference correction index, said second threshold value and with the said second threshold value corresponding reference correction index.
5. an analog-to-digital device is characterized in that, comprising:
Acquisition module is used to obtain the correction coefficient of modulus conversion chip;
Read module is used for when said modulus conversion chip input analog voltage, reads the digital voltage value after the said aanalogvoltage conversion;
Processing module is used for calculating and export new digital voltage value according to the digital voltage value of said correction coefficient after to the conversion of said aanalogvoltage.
6. analog-to-digital device as claimed in claim 5 is characterized in that said correction coefficient comprises the reference voltage correction coefficient, and said analog-to-digital device also comprises:
Said read module also is used for when said modulus conversion chip input standard analog voltage, reads the digital voltage value after the said standard analog voltage transitions;
Detection module comprises;
First computing unit, the reference voltage that is used for presetting according to said modulus conversion chip calculates with said standard analog voltage and obtains and the corresponding digital voltage value of the said reference voltage that presets;
Second computing unit; Be used for calculating the reference voltage correction coefficient that obtains said modulus conversion chip, and store said reference voltage correction coefficient according to digital voltage value after the said standard analog voltage transitions and the corresponding digital voltage value of the said reference voltage that presets.
7. analog-to-digital device as claimed in claim 6 is characterized in that said correction coefficient also comprises temperature correction facotor, and said analog-digital commutator also comprises:
The temperature acquisition module is used for obtaining in real time the current temperature value of said modulus conversion chip; And the detected temperatures value when obtaining the reference voltage correction coefficient that detects modulus conversion chip;
Said processing module; Specifically be used for calculating and obtain new digital voltage value, and export this new digital voltage value according to the current temperature value of said reference voltage correction coefficient, said temperature correction facotor, said modulus conversion chip and the said detected temperatures value digital voltage value after to said aanalogvoltage conversion.
8. analog-to-digital device as claimed in claim 7; It is characterized in that; Said read module also is used for when said modulus conversion chip input standard analog voltage, and the temperature of said modulus conversion chip is when being first threshold; Read first digital voltage value after said normal voltage is changed, and calculate acquisition corresponding reference correction coefficient according to said first digital voltage value; When said modulus conversion chip input standard analog voltage; And when the temperature of said modulus conversion chip is second threshold value; Read second digital voltage value after said normal voltage is changed, and calculate acquisition corresponding reference correction coefficient according to said second digital voltage value;
Said second computing unit also is used for according to said first threshold, reaches the temperature correction facotor that calculates the said modulus conversion chip of acquisition with the said second threshold value corresponding reference correction index with said first threshold corresponding reference correction index, said second threshold value.
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| WO2015131348A1 (en) * | 2014-03-05 | 2015-09-11 | 深圳市欣锐特科技有限公司 | Method and apparatus for calibrating internal reference voltage of integrated circuit chip |
| CN106405264A (en) * | 2016-05-16 | 2017-02-15 | 希格玛电气(珠海)有限公司 | Automatic terminal DTU test device |
| CN111010180A (en) * | 2019-12-19 | 2020-04-14 | 珠海纳睿达科技有限公司 | Analog-to-digital converter calibration system and method |
| CN111221371A (en) * | 2020-01-03 | 2020-06-02 | 深圳市汇川技术股份有限公司 | Analog voltage output method, system, device, and computer-readable storage medium |
| CN111819796A (en) * | 2020-04-01 | 2020-10-23 | 深圳市汇顶科技股份有限公司 | Analog-to-digital conversion method, device, chip, electronic equipment and storage medium |
| CN113055014A (en) * | 2021-03-11 | 2021-06-29 | 深圳市航顺芯片技术研发有限公司 | Analog-digital conversion method, analog-digital converter and micro-control system |
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| WO2015131348A1 (en) * | 2014-03-05 | 2015-09-11 | 深圳市欣锐特科技有限公司 | Method and apparatus for calibrating internal reference voltage of integrated circuit chip |
| CN106405264A (en) * | 2016-05-16 | 2017-02-15 | 希格玛电气(珠海)有限公司 | Automatic terminal DTU test device |
| CN111010180A (en) * | 2019-12-19 | 2020-04-14 | 珠海纳睿达科技有限公司 | Analog-to-digital converter calibration system and method |
| CN111221371A (en) * | 2020-01-03 | 2020-06-02 | 深圳市汇川技术股份有限公司 | Analog voltage output method, system, device, and computer-readable storage medium |
| CN111819796A (en) * | 2020-04-01 | 2020-10-23 | 深圳市汇顶科技股份有限公司 | Analog-to-digital conversion method, device, chip, electronic equipment and storage medium |
| WO2021196088A1 (en) * | 2020-04-01 | 2021-10-07 | 深圳市汇顶科技股份有限公司 | Analog-to-digital conversion method, apparatus, and chip, electronic device, and storage medium |
| CN111819796B (en) * | 2020-04-01 | 2021-10-22 | 深圳市汇顶科技股份有限公司 | Analog-to-digital conversion method, device, chip, electronic equipment and storage medium |
| CN113055014A (en) * | 2021-03-11 | 2021-06-29 | 深圳市航顺芯片技术研发有限公司 | Analog-digital conversion method, analog-digital converter and micro-control system |
| CN113055014B (en) * | 2021-03-11 | 2022-04-22 | 深圳市航顺芯片技术研发有限公司 | Analog-digital conversion method, analog-digital converter and micro-control system |
| CN113364461A (en) * | 2021-06-24 | 2021-09-07 | 苏州磐启微电子有限公司 | Analog-to-digital conversion calibration method and system for chip to be tested |
| CN113364461B (en) * | 2021-06-24 | 2024-05-03 | 苏州磐启微电子有限公司 | Analog-to-digital conversion calibration method and system for chip to be tested |
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