CN102769074A - 基于竖直微气孔的Si与GaInAs低温键合方法 - Google Patents
基于竖直微气孔的Si与GaInAs低温键合方法 Download PDFInfo
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- CN102769074A CN102769074A CN201210280493XA CN201210280493A CN102769074A CN 102769074 A CN102769074 A CN 102769074A CN 201210280493X A CN201210280493X A CN 201210280493XA CN 201210280493 A CN201210280493 A CN 201210280493A CN 102769074 A CN102769074 A CN 102769074A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
清洗步骤 | 溶液 | 时间(Min) | 温度(℃) | 超声频率(KHz) |
1 | 去离子水 | 5 | 27 | 700~1000 |
2 | SC1 | 5 | 80 | 700~1000 |
3 | 去离子水 | 5 | 27 | 700~1000 |
4 | SC2 | 5 | 80 | 700~1000 |
5 | 去离子水 | 5 | 27 | 700~1000 |
6 | SC3 | 5 | 80 | 700~1000 |
7 | 去离子水 | 5 | 27 | 700~1000 |
8 | DHF溶液 | 5 | 27 | 700~1000 |
9 | 去离子水 | 5 | 27 | 700~1000 |
10 | N2气吹干 | 2 | 27 | 700~1000 |
清洗步骤 | 溶液 | 时间(Min) | 温度(℃) | 频率(KHz) |
1 | 去离子水 | 5 | 27 | 700~1000 |
2 | 丙酮液 | 5 | 80 | 700~1000 |
3 | 去离子水 | 5 | 27 | 700~1000 |
4 | 异丙醇液 | 5 | 80 | 700~1000 |
5 | 去离子水 | 5 | 27 | 700~1000 |
6 | N2气吹干 | 2 | 27 | 700~1000 |
清洗步骤 | 溶液 | 时间(Min) | 温度(℃) | 频率(KHz) |
1 | 去离子水 | 5 | 27 | 700~1000 |
2 | SC1 | 5 | 80 | 700~1000 |
3 | 去离子水 | 5 | 27 | 700~1000 |
4 | 丙酮液 | 5 | 80 | 700~1000 |
5 | 去离子水 | 5 | 27 | 700~1000 |
6 | 异丙醇液 | 5 | 27 | 700~1000 |
7 | 去离子水 | 5 | 27 | 700~1000 |
8 | N2气吹干 | 2 | 27 | 700~1000 |
清洗步骤 | 溶液 | 时间(Min) | 温度(℃) | 超声频率(KHz) |
1 | 去离子水 | 5 | 27 | 800 |
2 | SC1 | 5 | 80 | 800 |
3 | 去离子水 | 5 | 27 | 800 |
4 | SC2 | 5 | 80 | 800 |
5 | 去离子水 | 5 | 27 | 800 |
6 | SC3 | 5 | 80 | 800 |
7 | 去离子水 | 5 | 27 | 800 |
8 | DHF溶液 | 5 | 27 | 800 |
9 | 去离子水 | 5 | 27 | 800 |
10 | N2吹干 | 2 | 27 | 800 |
清洗步骤 | 溶液 | 时间(Min) | 温度(℃) | 频率(KHz) |
1 | 去离子水 | 5 | 27 | 800 |
2 | 丙酮液 | 5 | 80 | 800 |
3 | 去离子水 | 5 | 27 | 800 |
4 | 异丙醇液 | 5 | 80 | 800 |
5 | 去离子水 | 5 | 27 | 800 |
6 | N2气吹干 | 2 | 27 | 800 |
清洗步骤 | 溶液 | 时间(Min) | 温度(℃) | 频率(KHz) |
1 | 去离子水 | 5 | 27 | 800 |
2 | SC1 | 5 | 80 | 800 |
3 | 去离子水 | 5 | 27 | 800 |
4 | 丙酮液 | 5 | 80 | 800 |
5 | 去离子水 | 5 | 27 | 800 |
6 | 异丙醇液 | 5 | 27 | 800 |
7 | 去离子水 | 5 | 27 | 800 |
8 | N2气吹干 | 2 | 27 | 800 |
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210280493.XA CN102769074B (zh) | 2012-08-08 | 2012-08-08 | 基于竖直微气孔的Si与GaInAs低温键合方法 |
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CN201210280493.XA CN102769074B (zh) | 2012-08-08 | 2012-08-08 | 基于竖直微气孔的Si与GaInAs低温键合方法 |
Publications (2)
Publication Number | Publication Date |
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CN102769074A true CN102769074A (zh) | 2012-11-07 |
CN102769074B CN102769074B (zh) | 2014-11-05 |
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CN201210280493.XA Active CN102769074B (zh) | 2012-08-08 | 2012-08-08 | 基于竖直微气孔的Si与GaInAs低温键合方法 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103186036A (zh) * | 2013-04-08 | 2013-07-03 | 常州同泰光电有限公司 | 一种简易清洗掩膜的方法 |
CN104229724A (zh) * | 2013-06-09 | 2014-12-24 | 中国科学院物理研究所 | 一种制备自封闭纳米通道的方法 |
CN104576308A (zh) * | 2013-10-10 | 2015-04-29 | 有研新材料股份有限公司 | 一种外延片的清洗和封装方法 |
CN106409650A (zh) * | 2015-08-03 | 2017-02-15 | 沈阳硅基科技有限公司 | 一种硅片直接键合方法 |
CN110391131A (zh) * | 2018-04-23 | 2019-10-29 | 中国科学院上海微***与信息技术研究所 | 异质薄膜复合结构及其制备方法 |
CN110634797A (zh) * | 2019-09-30 | 2019-12-31 | 闽南师范大学 | 一种图形化划道消除Ge/Si键合界面气泡的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US5966622A (en) * | 1997-10-08 | 1999-10-12 | Lucent Technologies Inc. | Process for bonding crystalline substrates with different crystal lattices |
CN1996551A (zh) * | 2005-12-28 | 2007-07-11 | 中国科学院半导体研究所 | 晶片直接键合过程中实验参数的优化方法 |
CN101677057A (zh) * | 2008-09-17 | 2010-03-24 | 中国科学院半导体研究所 | 低温晶片键合的方法 |
CN102487024A (zh) * | 2010-12-06 | 2012-06-06 | 中国科学院微电子研究所 | 采用三维排气孔装置的soi/iii-v整片晶片键合方法 |
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2012
- 2012-08-08 CN CN201210280493.XA patent/CN102769074B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5966622A (en) * | 1997-10-08 | 1999-10-12 | Lucent Technologies Inc. | Process for bonding crystalline substrates with different crystal lattices |
CN1996551A (zh) * | 2005-12-28 | 2007-07-11 | 中国科学院半导体研究所 | 晶片直接键合过程中实验参数的优化方法 |
CN101677057A (zh) * | 2008-09-17 | 2010-03-24 | 中国科学院半导体研究所 | 低温晶片键合的方法 |
CN102487024A (zh) * | 2010-12-06 | 2012-06-06 | 中国科学院微电子研究所 | 采用三维排气孔装置的soi/iii-v整片晶片键合方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103186036A (zh) * | 2013-04-08 | 2013-07-03 | 常州同泰光电有限公司 | 一种简易清洗掩膜的方法 |
CN104229724A (zh) * | 2013-06-09 | 2014-12-24 | 中国科学院物理研究所 | 一种制备自封闭纳米通道的方法 |
CN104229724B (zh) * | 2013-06-09 | 2016-04-13 | 中国科学院物理研究所 | 一种制备自封闭纳米通道的方法 |
CN104576308A (zh) * | 2013-10-10 | 2015-04-29 | 有研新材料股份有限公司 | 一种外延片的清洗和封装方法 |
CN104576308B (zh) * | 2013-10-10 | 2017-03-29 | 有研半导体材料有限公司 | 一种外延片的清洗和封装方法 |
CN106409650A (zh) * | 2015-08-03 | 2017-02-15 | 沈阳硅基科技有限公司 | 一种硅片直接键合方法 |
CN110391131A (zh) * | 2018-04-23 | 2019-10-29 | 中国科学院上海微***与信息技术研究所 | 异质薄膜复合结构及其制备方法 |
CN110634797A (zh) * | 2019-09-30 | 2019-12-31 | 闽南师范大学 | 一种图形化划道消除Ge/Si键合界面气泡的方法 |
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CN102769074B (zh) | 2014-11-05 |
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Effective date of registration: 20190528 Address after: 300384 Tianjin Binhai New Area Huayuan Industrial Zone (Outside Rim) No. 6 Solar Cell and Controller Workshop, Haitai Huake 7th Road, Second Floor Co-patentee after: The 18th Research Institute of China Electronics Technology Group Corporation Patentee after: TIANJIN LANTIAN SOLAR TECH Co.,Ltd. Co-patentee after: China Electric Power Shenzhen Group Co.,Ltd. Address before: 300384 No. 15, Sidao, Haitai Development, Huayuan Industrial Park, Xiqing District, Tianjin Co-patentee before: The 18th Research Institute of China Electronics Technology Group Corporation Patentee before: TIANJIN LANTIAN SOLAR TECH Co.,Ltd. |
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Address after: 300384 Tianjin Binhai New Area Huayuan Industrial Zone (Outside Rim) No. 6 Solar Cell and Controller Workshop, Haitai Huake 7th Road, Second Floor Patentee after: TIANJIN LANTIAN SOLAR TECH Co.,Ltd. Patentee after: The 18th Research Institute of China Electronics Technology Group Corporation Patentee after: CETC Blue Sky Technology Co.,Ltd. Address before: 300384 Tianjin Binhai New Area Huayuan Industrial Zone (Outside Rim) No. 6 Solar Cell and Controller Workshop, Haitai Huake 7th Road, Second Floor Patentee before: TIANJIN LANTIAN SOLAR TECH Co.,Ltd. Patentee before: The 18th Research Institute of China Electronics Technology Group Corporation Patentee before: CETC Energy Co.,Ltd. Address after: 300384 Tianjin Binhai New Area Huayuan Industrial Zone (Outside Rim) No. 6 Solar Cell and Controller Workshop, Haitai Huake 7th Road, Second Floor Patentee after: TIANJIN LANTIAN SOLAR TECH Co.,Ltd. Patentee after: The 18th Research Institute of China Electronics Technology Group Corporation Patentee after: CETC Energy Co.,Ltd. Address before: 300384 Tianjin Binhai New Area Huayuan Industrial Zone (Outside Rim) No. 6 Solar Cell and Controller Workshop, Haitai Huake 7th Road, Second Floor Patentee before: TIANJIN LANTIAN SOLAR TECH Co.,Ltd. Patentee before: The 18th Research Institute of China Electronics Technology Group Corporation Patentee before: China Electric Power Shenzhen Group Co.,Ltd. |