CN102760822A - Light-emitting diode encapsulation structure and manufacturing method thereof - Google Patents
Light-emitting diode encapsulation structure and manufacturing method thereof Download PDFInfo
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- CN102760822A CN102760822A CN201110106765XA CN201110106765A CN102760822A CN 102760822 A CN102760822 A CN 102760822A CN 201110106765X A CN201110106765X A CN 201110106765XA CN 201110106765 A CN201110106765 A CN 201110106765A CN 102760822 A CN102760822 A CN 102760822A
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Abstract
The invention relates to a light-emitting diode encapsulation structure, which comprises an encapsulation base, wherein an accommodating cup is formed on the base, and a first electrode and a second electrode are respectively exposed at the bottom of the accommodating cup. The light-emitting diode encapsulation structure also comprises an encapsulation body module arranged in the accommodation cup and a transparent encapsulation layer filled in the accommodation cup and covering the encapsulation body module. The encapsulation body module comprises a substrate, a light-emitting diode chip arranged on the substrate and a phosphor powder layer enclosing the light-emitting diode chip. The substrate is provided with a first conducting layer and a second conducting layer, wherein the light-emitting diode chip is electrically connected with the first conducting layer and the second conducting layer; and the first conducting layer and the second conducting layer are respectively electrically connected with a first electrode and a second electrode of the encapsulation base. The light-emitting diode encapsulation structure provided by the invention has the beneficial effect that the consumption of phosphor powder can be reduced, compared with the traditional encapsulation structure in which a light-emitting diode chip is arranged in an accommodating cup and then the accommodating cup is filled with fluorescent material. The invention also provides a manufacturing method of the light-emitting diode encapsulation structure.
Description
Technical field
The present invention relates to a kind of package structure for LED and manufacturing approach thereof.
Background technology
After existing LED package processing procedure normally is arranged on light-emitting diode chip for backlight unit on the pedestal; Modes such as utilization injection are injected reflector with liquid encapsulating material; Fill full entire emission cup and covering luminousing diode chip, the liquid encapsulating material that then is heating and curing is to form encapsulated layer.Yet,, the fluorescent material in the encapsulating material that is filled in it is used too much because the reflector space is excessive; But the fluorescent material that can be excited in the reflector is limited; Thereby can cause the fluorescent material waste, cause cost to improve, in addition; Too much fluorescent material also can cover light-emitting diode chip for backlight unit, causes luminous efficiency low.
Summary of the invention
In view of this, be necessary to provide a kind of and can save package structure for LED and the manufacturing approach thereof that fluorescent material uses.
A kind of package structure for LED, it comprises an encapsulation base, forms a ccontaining cup on the said encapsulation base, this ccontaining bottom of the cup does not expose has first electrode and second electrode.Said package structure for LED comprises that also one is arranged on the packaging body module in the ccontaining cup and is filled in the ccontaining cup and covers the transparent encapsulated layer of this packaging body module.Said packaging body module comprises substrate, be arranged on the light-emitting diode chip for backlight unit on the substrate and coat the phosphor powder layer of light-emitting diode chip for backlight unit.This substrate has first conductive layer and second conductive layer, and this light-emitting diode chip for backlight unit and first conductive layer and second conductive layer electrically connect, said first conductive layer and second conductive layer respectively with encapsulation base on first electrode and second electrode electrically connect.
A kind of manufacturing approach of package structure for LED, it comprises following step:
Step 1 provides a substrate, and this substrate has a plurality of conductive layers;
Step 2 is arranged on a plurality of light-emitting diode chip for backlight unit on the substrate, these a plurality of light-emitting diode chip for backlight unit respectively with substrate on a plurality of conductive layers electrically connect;
Step 3 utilizes phosphor powder layer to coat a plurality of light-emitting diode chip for backlight unit;
Step 4, cutting substrate forms a plurality of packaging body modules, and each packaging body module comprises a light-emitting diode chip for backlight unit and two conductive layers that electrically connect with light-emitting diode chip for backlight unit;
Step 5; One encapsulation base is provided, forms a ccontaining cup on this encapsulation base, this ccontaining bottom of the cup does not expose has first electrode and second electrode; Packaging body module after the cutting is arranged in the ccontaining cup, and its two conductive layers electrically connect with first electrode and second electrode respectively;
Step 6 is filled transparent encapsulated layer in the ccontaining cup of encapsulation base, form a package structure for LED.
The independent earlier packaging body module of making of above-mentioned package structure for LED and manufacturing approach; To have then has the packaging body of light-emitting diode chip for backlight unit and phosphor powder layer module to be arranged in the ccontaining cup of encapsulation base again; With respect to traditional method for packing that in whole ccontaining cup, fills up fluorescent material after in ccontaining cup, light-emitting diode chip for backlight unit being set, can save fluorescent material and use.
Description of drawings
Fig. 1 is the package structure for LED sketch map in the first embodiment of the invention.
Fig. 2 is the manufacturing approach flow chart of the package structure for LED in the first embodiment of the invention.
Fig. 3 is the package structure for LED sketch map in the second embodiment of the invention.
Fig. 4 is the manufacturing approach flow chart of the package structure for LED in the second embodiment of the invention.
The main element symbol description
| Package structure for |
10、20 |
| |
100 |
| |
110 |
| The |
120 |
| |
130 |
| |
140 |
| |
150 |
| The |
200、400 |
| |
210、410 |
| First |
211、412 |
| |
212、411 |
| Second |
213、413 |
| Light-emitting diode chip for |
220 |
| |
230 |
| Transparent encapsulated |
300 |
| |
420 |
Following embodiment will combine above-mentioned accompanying drawing to further specify the present invention.
Embodiment
To combine accompanying drawing below, the present invention will be done further detailed description.
Execution mode one
See also Fig. 1, the transparent encapsulated layer 300 that a kind of package structure for LED 10 that first embodiment of the invention provides comprises encapsulation base 100, is arranged on the packaging body module 200 on the encapsulation base 100 and coats this packaging body module 200.
Said encapsulation base 100 comprises end face 110 and bottom surface 120, from end face 110 along the bottom surface 120 directions offer and form a ccontaining cup 130.The light field that this ccontaining cup 130 is used to that the accommodation space of packaging body module 200 and transparent encapsulated layer 300 is provided and sets package structure for LED 10; The inner surface of ccontaining cup 130 is the inclined plane; This inclined plane also radially slopes inwardly to the extension of bottom surface 120 directions from end face 110; Make whole ccontaining cup 130 wide at the top and narrow at the bottom, be a funnel-form.Preferably, the inner surface of ccontaining cup 130 also is coated with reflectorized material.Also be provided with first electrode 140 and second electrode 150 of space in the said encapsulation base 100; One end of this first electrode 140 and second electrode 150 is exposed to the bottom of ccontaining cup 130 respectively; Be used for being connected with packaging body module 200; The other end extends to respectively outside encapsulation base 100 both sides, is used for being connected with external circuit.
The phosphor powder layer 230 that said packaging body module 200 comprises substrate 210, is arranged on the light-emitting diode chip for backlight unit 220 on the substrate 210 and coats this light-emitting diode chip for backlight unit 220.Said substrate 210 is made up of first conductive layer 211, insulating barrier 212 and second conductive layer 213.This first conductive layer 211 and second conductive layer 213 extend to the bottom surface of substrate 210 from the end face of substrate 210.This insulating barrier 212 connects first conductive layer 211 and second conductive layer 213.In this execution mode, insulating barrier 312 can be macromolecular material, pottery or plastic material and constitutes, and first conductive layer 211 and second conductive layer 213 are processed for metal material.Light-emitting diode chip for backlight unit 220 covers crystalline substance and is arranged on the substrate 210, electrically connects with first conductive layer 211 and second conductive layer 213.The surface of phosphor powder layer 230 covered substrates 210 and light-emitting diode chip for backlight unit 220, its thickness are slightly greater than the thickness of light-emitting diode chip for backlight unit 220.Phosphor powder layer 230 is to have the sealing of fluorescent material resin to process by mixing, and this fluorescent material can be selected from one or more the combination in yttrium-aluminium-garnet, terbium yttrium-aluminium-garnet and the silicate.
Said packaging body module 200 is arranged in the ccontaining cup 130 of encapsulation base 100, and it on first conductive layer 211 and second conductive layer 213 utilize welding perhaps the eutectic mode respectively with encapsulation base 100 on first electrode 140 and 150 electric connections of second electrode.When packaging body module 200 is arranged in the ccontaining cup 130 of encapsulation base 100; Because ccontaining relatively glass 130 of the size of packaging body module 200 is less; The inner surface of the sidewall of said phosphor powder layer 230 and ccontaining cup 130 separates certain distance, and 230 of phosphor powder layers are coated on the near zone of light-emitting diode chip for backlight unit 220 of the bottom of ccontaining cup 130.
Said transparent encapsulated layer 300 is a sealing resin, and it is filled in the ccontaining cup 130 of encapsulation base 100 and coats packaging body module 200, is used for influences such as protection packaging phantom group 200 dust, aqueous vapor.
See also Fig. 2, the manufacturing approach of a kind of package structure for LED that first embodiment of the invention provides, it comprises following step:
Step 1 provides a substrate 210, and this substrate 210 has a plurality of conductive layer 210a, connects through insulating barrier 210b between these a plurality of conductive layer 210a, and these a plurality of conductive layer 210a extend to the bottom surface of substrate 210 from the end face of substrate 210.In this execution mode, insulating barrier 210b can be macromolecular material, pottery or plastic material and constitutes, and conductive layer 210a is processed by metal material.
Step 2 is covered crystalline substance respectively with a plurality of light-emitting diode chip for backlight unit 220 and is arranged on the substrate 210, these a plurality of light-emitting diode chip for backlight unit 220 respectively with substrate 210 on a plurality of conductive layer 210a electrically connect.
Step 3 is with phosphor powder layer 230 covered substrates, 210 whole surfaces and an a plurality of light-emitting diode chip for backlight unit 220.Phosphor powder layer 230 is to have the sealing of fluorescent material resin to process by mixing, and said fluorescent material can be selected from one or more the combination in yttrium-aluminium-garnet, terbium yttrium-aluminium-garnet and the silicate.
Step 4; Cutting substrate 210; Form a plurality of packaging body modules 200 respectively, wherein each packaging body module 200 comprises the phosphor powder layer 230 of a light-emitting diode chip for backlight unit 220, two conductive layer 210a that electrically connect with this light-emitting diode chip for backlight unit 220 respectively and covering luminousing diode chip 220.
Step 5; One encapsulation base 100 is provided; Offer on this encapsulation base 100 and form a ccontaining cup 130; Also be provided with first electrode 140 and second electrode 150 of space in the encapsulation base 100, an end of this first electrode 140 and second electrode 150 is exposed to the bottom of ccontaining cup 130 respectively, and the other end extends to respectively outside the encapsulation encapsulation base 100; Packaging body module 200 after the cutting is arranged in the ccontaining cup 130, and its two conductive layer 210a utilize welding or eutectic mode to electrically connect with first electrode 140 and second electrode 150 respectively.The inner surface of ccontaining cup 130 is the inclined plane, and this inclined plane to the bottom surface direction and radially slope inwardly, makes whole ccontaining cup 130 wide at the top and narrow at the bottom from end face, is a funnel-form.Preferably, the inner surface of ccontaining cup 130 also is coated with reflectorized material.
Step 6 is filled transparent encapsulated layer 300 in the ccontaining cup 130 of encapsulation base 100, form a package structure for LED 10.
The above-mentioned package structure for LED 10 and the manufacturing approach of package structure for LED 10 are the independent earlier packaging body modules 200 of making; Light-emitting diode chip for backlight unit 220 and phosphor powder layer 230 are arranged on the substrate 210, and the substrate 210 that will be loaded with light-emitting diode chip for backlight unit 220 and phosphor powder layer 230 then is arranged in the ccontaining cup 130 of encapsulation base 100 again.When packaging body module 200 is arranged in the ccontaining cup 130; Phosphor powder layer 230 just is coated on the near zone of light-emitting diode chip for backlight unit 220 of the bottom of ccontaining cup 130; Its thickness is slightly greater than the thickness of light-emitting diode chip for backlight unit 220; Therefore, with respect to traditional encapsulating structure that in whole ccontaining cup 130, fills up fluorescent material, can save fluorescent material and use.In addition; Through with a plurality of light-emitting diode chip for backlight unit 220 and the mode that is divided into a plurality of packaging body modules 200 after a phosphor powder layer 230 combines again; Avoided needing in the prior art to inject phosphor powder layer separately in each LED package respectively, aspect processing procedure, simplified more.
Execution mode two
See also Fig. 3, the difference of a kind of package structure for LED 20 that second embodiment of the invention provides and the package structure for LED 10 of first execution mode is: the substrate 410 of packaging body module 400 comprises that an insulating barrier 411 and space are formed on first conductive layer 412 and second conductive layer 413 on this insulating barrier 411.Light-emitting diode chip for backlight unit 220 covers crystalline substance and is arranged on the substrate 410, electrically connects with first conductive layer 412 and second conductive layer 413.Phosphor powder layer 230 forms the surface of substrates 410, coats light-emitting diode chip for backlight unit 220, and first conductive layer 412 and second conductive layer 413 expose from the two ends of phosphor powder layer 230 respectively.The insulating barrier 411 of packaging body module 400 adopts modes such as welding or bonding to be fixed on the bottom surface of the ccontaining cup 130 of encapsulation base 100, and first conductive layer 412 and second conductive layer 413 are connected with first electrode 140 and second electrode 150 on the encapsulation base 100 through plain conductor 420 respectively.
See also Fig. 4, the manufacturing approach of a kind of package structure for LED that second embodiment of the invention provides, it comprises following step:
Step 1 provides a substrate 410, and this substrate 410 comprises an insulating barrier 410a and the conductive layer 410b that is formed on a plurality of spaces on this insulating barrier 410a.
Step 2 is covered crystalline substance respectively with a plurality of light-emitting diode chip for backlight unit 220 and is arranged on the substrate 410, these a plurality of light-emitting diode chip for backlight unit 220 respectively with substrate 410 on a plurality of conductive layer 410a electrically connect.
Step 3 utilizes phosphor powder layer 230 to cover each light-emitting diode chip for backlight unit 220, and space between the phosphor powder layer 230 is exposed the end of conductive layer 410a.Phosphor powder layer 230 is to have the sealing of fluorescent material resin to process by mixing, and said fluorescent material can be selected from one or more the combination in yttrium-aluminium-garnet, terbium yttrium-aluminium-garnet and the silicate.
Step 4; Cutting substrate 410; Form a plurality of packaging body modules 400, two the conductive layer 410b that each packaging body module 400 comprises a light-emitting diode chip for backlight unit 220, electrically connect with light-emitting diode chip for backlight unit 220 and the phosphor powder layer 230 of covering luminousing diode chip 220.
Step 5; One encapsulation base 100 is provided; Offer on this encapsulation base 100 and form a ccontaining cup 130; Also be provided with first electrode 140 and second electrode 150 of space in the encapsulation base 100, an end of this first electrode 140 and second electrode 150 is exposed to the bottom of ccontaining cup 130 respectively, and the other end extends to respectively outside the encapsulation encapsulation base 100; Packaging body module 400 after the cutting is arranged in the ccontaining cup 130, and the insulating barrier 410a of packaging body module 400 adopts modes such as welding or bonding to be fixed on the bottom surface of ccontaining cup 130.The inner surface of ccontaining cup 130 is the inclined plane, and this inclined plane to the bottom surface direction and radially slope inwardly, makes whole ccontaining cup 130 wide at the top and narrow at the bottom from end face, is a funnel-form.Preferably, the inner surface of ccontaining cup 130 also is coated with reflectorized material.
Step 6, utilize plain conductor 420 with two conductive layer 410b respectively with encapsulation base 100 on first electrode 140 and second electrode 150 be connected.
Step 7 is filled transparent encapsulated layer 300 in the ccontaining cup 130 of encapsulation base 100, form a package structure for LED 20.
Compared to prior art; The independent earlier packaging body module of making of package structure for LED of the present invention and manufacturing approach; To have then has the packaging body of light-emitting diode chip for backlight unit and phosphor powder layer module to be arranged in the ccontaining cup of encapsulation base again; With respect to traditional method for packing that in whole ccontaining cup, fills up fluorescent material after in ccontaining cup, light-emitting diode chip for backlight unit being set, can save fluorescent material and use.
It is understandable that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (8)
1. package structure for LED; It comprises an encapsulation base; Form a ccontaining cup on the said encapsulation base; This ccontaining bottom of the cup does not expose has first electrode and second electrode; It is characterized in that: said package structure for LED comprises that also one is arranged on the packaging body module in the ccontaining cup and is filled in the ccontaining cup and covers the transparent encapsulated layer of this packaging body module, and said packaging body module comprises substrate, be arranged on the light-emitting diode chip for backlight unit on the substrate and coat the phosphor powder layer of light-emitting diode chip for backlight unit, and this substrate has first conductive layer and second conductive layer; This light-emitting diode chip for backlight unit and first conductive layer and second conductive layer electrically connect, said first conductive layer and second conductive layer respectively with encapsulation base on first electrode and second electrode electrically connect.
2. package structure for LED as claimed in claim 1; It is characterized in that: said encapsulation base comprises end face and bottom surface; Said ccontaining cup from end face along the bottom surface direction offer; The inner surface of ccontaining cup is the inclined plane, and this inclined plane tilts to the extension of bottom surface direction and to the light-emitting diode chip for backlight unit direction from end face.
3. package structure for LED as claimed in claim 1 is characterized in that: the inner surface of said ccontaining cup is coated with reflectorized material.
4. package structure for LED as claimed in claim 1; It is characterized in that: first conductive layer of the substrate of said packaging body module is connected by insulating barrier insulation with second conductive layer; Said first conductive layer and second conductive layer extend to the bottom surface of substrate from the end face of substrate, said first conductive layer and second conductive layer utilization welding or eutectic mode respectively with encapsulation base on first electrode and second electrode electrically connect.
5. package structure for LED as claimed in claim 1; It is characterized in that: first conductive layer of the substrate of said packaging body module and the second conductive layer space are formed on the insulating barrier; Said insulating barrier adopts welding or bonding mode to be fixed on the bottom surface of the ccontaining cup of encapsulation base, and said first conductive layer and second conductive layer are connected with first electrode and second electrode on the encapsulation base through plain conductor respectively.
6. the manufacturing approach of a package structure for LED, it comprises following step:
Step 1 provides a substrate, and this substrate has a plurality of conductive layers;
Step 2 is arranged on a plurality of light-emitting diode chip for backlight unit on the substrate, these a plurality of light-emitting diode chip for backlight unit respectively with substrate on a plurality of conductive layers electrically connect;
Step 3 utilizes phosphor powder layer to coat a plurality of light-emitting diode chip for backlight unit;
Step 4, cutting substrate forms a plurality of packaging body modules, and each packaging body module comprises a light-emitting diode chip for backlight unit and two conductive layers that electrically connect with light-emitting diode chip for backlight unit;
Step 5; One encapsulation base is provided, forms a ccontaining cup on this encapsulation base, this ccontaining bottom of the cup does not expose has first electrode and second electrode; Packaging body module after the cutting is arranged in the ccontaining cup, and its two conductive layers electrically connect with first electrode and second electrode respectively;
Step 6 is filled transparent encapsulated layer in the ccontaining cup of encapsulation base, form a package structure for LED.
7. the manufacturing approach of package structure for LED as claimed in claim 6; It is characterized in that: connect through insulating barrier between these a plurality of conductive layers; A plurality of conductive layers extend to the bottom surface of substrate from the end face of substrate, and the conductive layer utilization welding of the packaging body module after the cutting or eutectic mode electrically connect with first electrode and second electrode of encapsulation base respectively.
8. the manufacturing approach of package structure for LED as claimed in claim 6; Said substrate comprises an insulating barrier; These a plurality of conductive layers are formed on this insulating barrier spaced reciprocally; The insulating barrier of the packaging body module after the cutting adopts welding or bonding mode to be fixed on the bottom surface of ccontaining cup, and conductive layer is connected with first electrode and second electrode on the encapsulation base through plain conductor.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110106765.XA CN102760822B (en) | 2011-04-27 | 2011-04-27 | Light-emitting diode encapsulation structure and manufacturing method thereof |
| TW100114957A TWI479699B (en) | 2011-04-27 | 2011-04-28 | Method for manufacturing led package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110106765.XA CN102760822B (en) | 2011-04-27 | 2011-04-27 | Light-emitting diode encapsulation structure and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102760822A true CN102760822A (en) | 2012-10-31 |
| CN102760822B CN102760822B (en) | 2015-02-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110106765.XA Expired - Fee Related CN102760822B (en) | 2011-04-27 | 2011-04-27 | Light-emitting diode encapsulation structure and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102760822B (en) |
| TW (1) | TWI479699B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104078556A (en) * | 2013-03-28 | 2014-10-01 | 展晶科技(深圳)有限公司 | Manufacturing method of light emitting diode packaging structures |
| CN105594003A (en) * | 2013-10-08 | 2016-05-18 | 奥斯兰姆奥普托半导体有限责任公司 | Optoelectronic component and method for securing same |
| CN113964260A (en) * | 2021-10-09 | 2022-01-21 | 深圳市美丽微半导体有限公司 | Energy-saving and efficient diode packaging method and diode |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150325748A1 (en) | 2014-05-07 | 2015-11-12 | Genesis Photonics Inc. | Light emitting device |
| US9997676B2 (en) | 2014-05-14 | 2018-06-12 | Genesis Photonics Inc. | Light emitting device and manufacturing method thereof |
| TWI641285B (en) | 2014-07-14 | 2018-11-11 | 新世紀光電股份有限公司 | Light emitting module and method for manufacturing light emitting unit |
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2011
- 2011-04-27 CN CN201110106765.XA patent/CN102760822B/en not_active Expired - Fee Related
- 2011-04-28 TW TW100114957A patent/TWI479699B/en not_active IP Right Cessation
Patent Citations (5)
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| KR20060095271A (en) * | 2005-02-28 | 2006-08-31 | 삼성전기주식회사 | Method of producing wavelength-converted light emitting diode package |
| KR20080020393A (en) * | 2006-08-31 | 2008-03-05 | 주식회사 하이닉스반도체 | Multi chip package |
| CN101572284A (en) * | 2008-04-29 | 2009-11-04 | 北京宇极科技发展有限公司 | Semiconductor light-emitting device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104078556A (en) * | 2013-03-28 | 2014-10-01 | 展晶科技(深圳)有限公司 | Manufacturing method of light emitting diode packaging structures |
| CN104078556B (en) * | 2013-03-28 | 2017-03-01 | 展晶科技(深圳)有限公司 | The manufacture method of package structure for LED |
| CN105594003A (en) * | 2013-10-08 | 2016-05-18 | 奥斯兰姆奥普托半导体有限责任公司 | Optoelectronic component and method for securing same |
| CN105594003B (en) * | 2013-10-08 | 2019-06-14 | 奥斯兰姆奥普托半导体有限责任公司 | Photoelectric subassembly and method for fastening the photoelectric subassembly |
| CN113964260A (en) * | 2021-10-09 | 2022-01-21 | 深圳市美丽微半导体有限公司 | Energy-saving and efficient diode packaging method and diode |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102760822B (en) | 2015-02-04 |
| TW201244178A (en) | 2012-11-01 |
| TWI479699B (en) | 2015-04-01 |
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Granted publication date: 20150204 Termination date: 20200427 |