CN102737979B - Slicing device and slicing method - Google Patents
Slicing device and slicing method Download PDFInfo
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- CN102737979B CN102737979B CN201210079285.3A CN201210079285A CN102737979B CN 102737979 B CN102737979 B CN 102737979B CN 201210079285 A CN201210079285 A CN 201210079285A CN 102737979 B CN102737979 B CN 102737979B
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Abstract
The invention relates to a sliding device and a slicing method. The slicing device divides a substrate with a plurality of chip regions formed via predetermined dividing lines along the predetermined dividing lines. The slicing device comprises: a first abutting portion abutted against one surface of the substrate; a second abutting portion opposite to the first abutting portion and abutted against the other surface of the substrate; a blade applying bending stress upon the predetermined dividing lines of the substrate clamped by the first abutting portion and the second abutting portion to perform cutting, and the other ends of the chip zones clamped by the first abutting portion and the second abutting portion, and with one ends already divided are cut by the blade.
Description
Technical field
The present invention relates to slicing device and the dicing method of a kind of dividing semiconductor substrate etc.
Background technology
Patent documentation 1 discloses the slicing device of a kind of existing, dividing semiconductor substrate etc.Fig. 7 be exaggerated this slicing device blade near side cutaway view.At the lower surface of substrate 10, by diamond blade etc. grid-like be formed with line as segmentation preset lines 10a.Thus, multiple chip area is formed at substrate 10.In addition, for convenience of description, in the figure 7, segmentation preset lines 10a is depicted from the lower surface of substrate 10 to upper surface.
Diaphragm 12 is attached at the lower surface of substrate 10.Adhesive film 11 is attached at the upper surface of substrate 10.Adhesive film 11 is puted up and is arranged on circular holding frame (not shown).The board holder 2 keeping substrate 10 is formed by adhesive film 11, diaphragm 12 and holding frame.
The blade 3 extended along the direction vertical with paper is provided with at slicing device 1.Further, the supporting part 4 of mounting board holder 2 is provided with at slicing device 1.Supporting part 4 has regulation space in the below of blade 3 and configures.
Board holder 2 is positioned on supporting part 4 in downside by diaphragm 12.Then, as shown by arrow A, blade 3 is made from the top of adhesive film 11 by being pressed in the segmentation preset lines 10a of substrate 10.So blade 3 applies bending stress along arrow A direction on segmentation preset lines 10a, thus, substrate 10 is cut off along segmentation preset lines 10a.Implement this cut-out operation in order along all segmentation preset lines 10a, form each chip from the chip area segmentation of substrate 10.
Now, if load board holder 2 on supporting part 4, then due to the warpage of substrate 10, can produce between board holder 2 and supporting part 4 and float.If produce this to float, be then difficult to blade 3 is accurately aligned on segmentation preset lines 10a.Therefore, spray air by the upper direction substrate 10 from substrate 10, prevent floating between board holder 2 and supporting part 4.
Patent documentation 1:(Japan) JP 2007-55197 publication
But sprayed by air merely and prevent floating between board holder 2 and supporting part 4, the area utilization of substrate and the rate of finished products of chip separation can reduce.Below, be specifically described.In the figure 7, cut off splitting on preset lines 10a by blade 3 between chip area C3 and chip area C4.Chip area C1 and chip area C2 is not yet cut-off.On segmentation preset lines 10a between chip area C2 and chip area C3, blade 3 will decline as shown by arrow A and will cut off.That is, one end (chip area C4 side) of chip area C3 is split, and the other end (chip area C2 side) will be cut off.In addition, double dot dash line 71 is by the center of blade 3 and the imaginary line on the segmentation preset lines 10a that will cut off.
So, the segmentation preset lines 10a of the other end of the chip area C3 that blade 3 has been split along arrow A direction to one end applies bending stress.Now, the air sprayed from top can resist the bending stress that blade 3 applies, and the power of the end side that pressing has been split can diminish, and therefore, this end side can be floated from supporting part 4.Thus, because segmentation precision reduces, need to expand segmentation surplus, the problem that the area utilization that there is substrate 10 reduces.In addition, due to floating from supporting part 4, crackle or the burr of cut-off chip can increase., there is the problem that rate of finished products reduces in its result.
Summary of the invention
The object of the invention is to, a kind of slicing device and the dicing method that can improve area utilization and rate of finished products are provided.
In order to achieve the above object, the invention provides a kind of slicing device, the substrate being formed with multiple chip area by segmentation preset lines is split along described segmentation preset lines by it, and it is characterized in that, comprising: the first abutting part, it abuts with the one side of described substrate; Second abutting part, it is relative with the first abutting part, and abuts with the another side of described substrate; Blade, it applies bending stress and cuts off in the described segmentation preset lines of the described substrate clamped by the first abutting part and the second abutting part, by described blade to be clamped by the first abutting part and the second abutting part and the other end of described chip area that one end has been split cuts off.
According to said structure, blade applies bending stress in the segmentation preset lines of substrate, thus is divided into each chip.Now, the first abutting part and the second abutting part abut with substrate and clamp substrate.So the first abutting part and the second abutting part clamp the chip area split one end, are cut off the other end of this chip area by blade.
In the slicing device of said structure of the present invention, preferably, multiple first abutting part and the second abutting part are set respectively, are clamped the described chip area of the both sides of the described segmentation preset lines cut off by described blade by the first abutting part and the second abutting part.According to this structure, substrate is clamped by multiple first abutting part and the second abutting part.The chip area of the both sides of the segmentation preset lines utilizing the first abutting part and the clamping of the second abutting part to be cut off by blade.
In the slicing device of said structure of the present invention, preferably, relative to described substrate, first abutting part is configured in the same side of described blade, second abutting part is configured in the opposition side of described blade, the center of described blade and the distance of the second abutting part in the direction with described substrate-parallel are that the center of described blade and the first abutting part are below the distance in the direction with described substrate-parallel.
In the slicing device of said structure of the present invention, preferably, the face relative with described blade of the first abutting part be with more close to described blade then more close to the inclined plane that the mode of described substrate-side tilts.
In the slicing device of said structure of the present invention, preferably, the length of the first abutting part on the direction parallel with the length direction of described blade is below the length of the second abutting part on the direction parallel with the length direction of described blade.
In the slicing device of said structure of the present invention, preferably, the opposition side of the first abutting part and described blade face and and the bearing surface of described substrate between bight be formed as curved surface.
In the slicing device of said structure of the present invention, preferably, the width of the first abutting part and the second abutting part is more than the width of described chip area.
In the slicing device of said structure of the present invention, preferably, relative to described substrate, multiple described blade is arranged in order in opposition side, utilizes the described chip area that the first abutting part and the clamping of the second abutting part are cut off by the described blade being configured in one end.
In the slicing device of said structure of the present invention, preferably, there are three described blades, relative to described substrate, first abutting part is configured in the same side of the described blade at two ends, and the second abutting part is configured in the same side of the described blade of central authorities, the center of the blade of described central authorities is also less than the twice of the width of described chip area with the distance of the second abutting part in the direction with described substrate-parallel.
In the slicing device of said structure of the present invention, preferably, have image pickup part, it is arranged on the opposition side of described blade relative to described substrate, and described segmentation preset lines is made a video recording, the first abutting part or the second abutting part that are configured in the same side of described blade are formed by transparent material.
In the slicing device of said structure of the present invention, preferably, have Lighting Division, it is configured in the same side of described blade relative to described substrate, and throws light on to described substrate.
In the slicing device of said structure of the present invention, preferably, the first abutting part or the second abutting part that are configured in the same side of described blade carry out leaded light to illumination light.
In the slicing device of said structure of the present invention, preferably, there is image pickup part, it is configured in the opposition side of described blade relative to described substrate, and described segmentation preset lines is made a video recording, the first abutting part or the second abutting part that are configured in the same side of described blade are formed by self-luminescent material.
The invention provides a kind of dicing method, the substrate being formed with multiple chip area by segmentation preset lines is split along described segmentation preset lines by it, it is characterized in that, first abutting part is abutted with the one side of described substrate, and the second abutting part is abutted with another side, clamped the described chip area split one end by the first abutting part and the second abutting part, and in the described segmentation preset lines of the other end, apply bending stress by blade, cut off the described other end.
In the dicing method of said structure of the present invention, the bore of preferred described substrate is more than 4 inches.
According to the present invention, to be clamped by the first abutting part and the second abutting part and the other end of chip area split of one end owing to being cut off by blade, prevent floating of end side, improve segmentation precision.Therefore, segmentation surplus reduces, and the area utilization of substrate improves.Further, by preventing from floating, crackle or the burr of the chip of cut-out can be reduced, improving the rate of finished products of chip.
Accompanying drawing explanation
Fig. 1 is the side cutaway view of the slicing device of first embodiment of the invention.
Fig. 2 is the upward view of the board holder of the slicing device of first embodiment of the invention.
Fig. 3 is the profile of the X-X line along Fig. 2.
Fig. 4 is the side cutaway view after amplifying near the slicing device blade to first embodiment of the invention.
Fig. 5 is the side cutaway view after amplifying near the blade to the slicing device of second embodiment of the invention.
Fig. 6 is the side cutaway view after amplifying near the blade to the slicing device of third embodiment of the invention.
Fig. 7 is the side cutaway view after amplifying near the blade to existing slicing device.
Embodiment
Below, with reference to accompanying drawing, first embodiment of the invention is described.For convenience of description, same-sign is used to represent the part identical with the conventional example shown in above-mentioned Fig. 7.Fig. 1 is the side cutaway view representing slicing device 1.
Slicing device 1 is equipped with the angle steel 25 of L-shaped at the rear portion of base station 22.Base station 22 is provided with two erecting beds 21,21.Supporting part 4 (the second abutting part) is installed on the top of each erecting bed 21.At fore-and-aft direction, there is ground, regulation space 23 and two supporting parts 4,4 are set.Supporting part 4 contacts with the lower surface of the diaphragm 12 of board holder 2.The length (length in the direction vertical with the paper of Fig. 1) of the left and right directions of supporting part 4, although be longer than the diameter of substrate 10, is the length of the movement not hindering holding frame fixed part 6 described later.Further, the width (length in the direction parallel with the left and right directions of Fig. 1) of the fore-and-aft direction of supporting part 4 is not for hindering the size of the movement of holding frame fixed part 6 yet.
The blade 3 applying bending stress to substrate 10 is arranged on above the central portion in space 23, and can be moved along the vertical direction by the blade movable axis 3a supported by angle steel 25.Blade 3 has the gap of regulation and configures above supporting part 4.Board holder 2 described later is had in this gap configuration.In addition, the length direction of blade 3 becomes left and right directions (direction vertical with the paper of Fig. 1).Further, the same length of the length of supporting part 4 and the length direction of blade 3.
Holding frame fixed part 6 is overlooked and is formed as ring-type, and holds board holder 2 and be fixed on slicing device 1.By rotating mechanism (not shown), holding frame fixed part 6 can be in rotary moving in horizontal plane.Further, by movable mechanism (not shown), holding frame fixed part 6 can move along the longitudinal direction.Thus, board holder 2 is moved, the adjustment (aligning) making blade 3 consistent with segmentation preset lines 10a can be carried out.
In the front and back of blade 3, press section 5 (the first abutting part) relative with supporting part 4 respectively can be elevated by the press section movable axis 5a supported by angle steel 25.Press section 5 abuts with board holder 2, thus clamps substrate 10 by press section 5 and supporting part 4.More than the diameter that the length (length in the direction parallel with the length direction of blade 3) of press section 5 is substrate 10 and be supporting part 4 length (length in the direction parallel with the length direction of blade 3) below.Thus, can not only reliably clamp substrate 10, and the movement of holding frame fixed part 6 can not be hindered.In addition, press section 5 width (length in the direction orthogonal with the length direction of blade 3) for more than the width of chip area and be supporting part 4 width (length in the direction orthogonal with the length direction of blade 3) below.Thereby, it is possible to do not hinder the movement of holding frame fixed part 6 and clamp substrate 10.
The face relative with blade 3 of press section 5 be with more close to 3, blade more close to the inclined plane 5b (Fig. 4 reference) that the mode of substrate 10 side tilts.Thereby, it is possible to prevent the interference between blade 3.Further, press section 5 and blade 3 opposition side face and and the bearing surface of substrate 10 between bight be formed as curved surface 5c (Fig. 4 reference).Thus, under the state that press section 5 is connected to board holder 2 during mobile board holder 2, being involved in of adhesive film 11 can be prevented.In addition, press section 5 is formed by the material transparent relative to luminous ray of quartz etc.Thus, that be irradiated to press section 5, that Lighting Division 8 described later sends illumination light or natural daylight pressed portion 5 can not block and easily be directed to image pickup part 7 described later.
Above board holder 2, along the longitudinal direction blade 3 is provided with Lighting Division 8.Lighting Division 8 is supported on angle steel 25 by support material 8a, throws light on to the front end of blade 3 and substrate 10.At Lighting Division 8, the length direction along blade 3 is disposed with multiple light-emitting diode (not shown).
Image pickup part 7 is configured with in the below in space 23.The segmentation preset lines 10a of image pickup part 7 to the substrate 10 thrown light on by Lighting Division 8 makes a video recording.The data of shooting are used for aforesaid adjustment (aligning).In addition, as image pickup part 7, such as CCD (charge coupled device, charge coupled cell) video camera can be used.
Fig. 2 is the upward view of the board holder 2 of slicing device 1.Fig. 3 is the profile of the X-X line along Fig. 2.Board holder 2 is configured with substrate 10 in the holding frame 13 of ring-type, and by cover and the adhesive film 11 being attached to the one side of holding frame 13 carrys out adhesive base plate 10.Thus, adhesive film 11 and holding frame 13 is clamped by holding frame fixed part 6.Diaphragm 12 is attached at the another side of substrate 10.Adhesive film 11 is formed by the synthetic resin etc. with retractility that polyvinyl chloride or polyolefin etc. are transparent, in bonding plane coating acrylic-based adhesives.Diaphragm 12 is formed as overlooking roughly square shape by transparent resins such as polyethylene.
In addition, the material of adhesive film 11 is not particularly limited, polyethylene etc. also can be used not have the material of retractility.Further, bonding agent also can use the material beyond acrylic compounds.Such as, the bonding agents such as rubber-like, silicones class, polyvingl ether can also be used.But as in the present embodiment, at the below of board holder 2 configuration image pickup part 7, and when making light from the top transmission of board holder 2, the material of preferred adhesive film 11 is transparent materials.
In addition, the material of diaphragm 12 is not particularly limited, such as, also can uses the material such as polypropylene, polystyrene.Further, although not shown, but also can omit diaphragm 12, the lower surface of substrate 10 is directly contacted with the upper surface of supporting part 4.
Substrate 10 is made up of such as semiconductor substrate, the nitride semiconductor layer of lamination on sapphire substrate configures transparency electrode or p-type and n-type electrode, forms the elements such as LED (Light Emitting Diode, light-emitting diode).Now, adhesive film 11 is attached to the element forming surface of such as substrate 10, and diaphragm 12 is attached to the back side of substrate 10.
Substrate 10, before attaching adhesive film 11 and diaphragm 12, uses laser processing device (not shown) from sapphire substrate face side direction substrate 10 internal irradiation laser.Thus, the modified layer as segmentation preset lines 10a is formed grid-like, forms multiple chip area at substrate 10.With this modified layer for starting point, substrate 10 is split, manufacture each chip.In addition, in figure 3, for convenience of description, segmentation preset lines 10a is depicted from the lower surface of substrate 10 to upper surface.In addition, particular determination is not had to the method forming segmentation preset lines 10a, such as, as segmentation preset lines 10a, the method such as diamond dicing saw or slicer also can be used to form marking groove etc.
Below the action of slicing device 1 is described.As shown in Figure 1, utilize holding frame fixed part 6 to clamp the holding frame 13 of board holder 2, thus, board holder 2 is fixed on slicing device 1.Now, the diaphragm 12 of board holder 2 contacts with the upper surface of supporting part 4.In this state, according to the actuating signal that control part (not shown) sends, Lighting Division 8 is worked.The front end of blade 3 is not only irradiated from the illumination light of Lighting Division 8 injection, and through adhesive film 11, substrate 10 and diaphragm 12.
According to the actuating signal that control part sends, press section 5 is declined by press section movable axis 5a.So, clamp board holder 2 by press section 5 and supporting part 4.Thus, prevent floating between board holder 2 and supporting part 4, correct the warpage of substrate 10.
Then, the segmentation preset lines 10a of image pickup part 7 pairs of substrates 10 makes a video recording.According to the view data photographed, by image processing apparatus (not shown), computed segmentation preset lines 10a relative to the displacement (side-play amount) of the front end of blade 3 as numeric data.
According to this numeric data, from control part travel mechanism and rotating mechanism output action signal forwards, backwards.So holding frame fixed part 6 action, board holder 2 moves to make displacement vanishing.Thus, split preset lines 10a and move to the position corresponding with the front end of blade 3.That is, the length direction adjusting to blade 3 is positioned at directly over segmentation preset lines 10a.
In addition, the view data that image pickup part 7 is taken is presented at display part (not shown) from control part image.Thus, user easily can confirm displacement (side-play amount).
As mentioned above, after the adjustment having carried out making displacement (side-play amount) vanishing, from control part to blade driving shaft 3a output action signal.So blade 3 drops on segmentation preset lines 10a, and applies bending stress.Thus, substrate 10 is cut off along segmentation preset lines 10a.
Afterwards, make board holder 2 (direction orthogonal with the length direction of blade 3) movement along the longitudinal direction by movable mechanism, on next one segmentation preset lines 10a, carry out same cut-out by blade 3.Repetition is carried out to this, the segmentation end of job on the segmentation preset lines 10a arranged along the longitudinal direction.
After end, board holder 2 is made to carry out 90 degree of rotations on supporting part 4 by rotating mechanism.Then, along segmentation preset lines 10a, order carries out segmentation operation as described above.Thus, the substrate 10 being formed with multiple chip area divided grid-likely, and be cut open as each chip.
Fig. 4 is the side cutaway view around the blade 3 of the slicing device 1 being exaggerated Fig. 1.Between press section 5 and supporting part 4, be provided with board holder 2, carry out the segmentation operation to substrate 10 by blade 3.Two press sections 5,5 abut with the upper surface of board holder 2, and have regulation and mutually relatively configure spatially.This space is set to when blade 3 drops on segmentation preset lines 10a, and the size do not interfered with each other between press section 5.Further, two supporting parts 4,4 abut with the lower surface of board holder 2, and have regulation space 23 and mutually relatively configure.This space 23 is set to the size of the segmentation not hindering blade 3 pairs of substrates 10.
Chip area C4 is cut off on segmentation preset lines 10a by blade 3.Chip area C1 and chip area are not yet cut-off.On segmentation preset lines 10a between chip area C2 and chip area C3, blade 3 will as arrow A decline and cut off.That is, one end (chip area C4 side) of chip area C3 is split, and the other end (chip area C2 side) will be cut off by blade 3.In addition, in the diagram, for convenience of description, describe there is segmentation preset lines 10a from the lower surface of substrate 10 to upper surface.In addition, the imaginary line on double dot dash line 41 center that is through blade 3 and the segmentation preset lines 10a that will cut off.
When pressing pushing broach 3 along segmentation preset lines 10a as shown by arrow A, as compared to the chip area C2 that chip area C1 connects, the chip area C3 separated with chip area C4 is easy to float from supporting part 4.But chip area C3 is clamped by press section 5 and supporting part 4.Thus, when being cut off chip area C3 and chip area C2 by blade 3, chip area C3 can be suppressed to float from supporting part 4.Therefore, it is possible to improve area utilization and rate of finished products.
And chip area C2 is also clamped by press section 5 and supporting part 4.That is, chip area C2, C3 of the both sides of the segmentation preset lines 10a of blade 3 cut-out are clamped by press section 5 and supporting part 4.Thus, owing to further suppress floating from supporting part 4, segmentation precision improves further, can reduce further to split surplus.Therefore, the area utilization of substrate 10 is further increased.Further, owing to further suppress floating from supporting part 4, crackle or the burr of cut-off chip are further reduced.Its result, rate of finished products improves further.In addition, when splitting, adjust the position of press section 5 in advance to make the center of blade 3 and the press section 5 distance D3 in the direction parallel with substrate 10 less than the width D 1 of chip area.
In the diagram, under the state of warpage of having corrected substrate 10, between board holder 2 and supporting part 4, small gap is formed sometimes.Even if in this case, when blade 3 is separated from substrate 10, press section 5 also abuts with substrate 10, and when blade 3 applies bending stress to substrate 10, supporting part 4 abuts with substrate 10.In addition, because above-mentioned gap is small, chip area also only floats minutely.Therefore, in this case, also area utilization and rate of finished products can be improved as described above.
The center of blade 3 is less at the distance D3 in the direction parallel with substrate 10 with press section 5 than the center of blade 3 with the distance D2 of supporting part 4 in the direction parallel with substrate 10.Thus, the chip area just being applied bending stress by blade 3 is reliably supported by supporting part 4.Therefore, because segmentation precision improves further, can reduce further to split surplus, improve the area utilization of substrate 10 further.Further, owing to suppressing floating from supporting part 4 further, crackle or the burr of cut-off chip are reduced further.Its result, rate of finished products improves further.Even if at the center of blade 3 with the distance D2 of supporting part 4 in the direction parallel with substrate 10 be the center of blade 3 with press section 5 when below the distance D3 in the direction parallel with substrate 10, also can realize above-mentioned effect.
Further, the width L2 of the press section 5 and width L1 of supporting part 4 is larger than the width D 1 of chip area.Thereby, it is possible to reliably clamp chip area by press section 5 and supporting part 4.Even if when the width L1 of the width L2 of press section 5 and supporting part 4 is width D more than 1 of chip area, also above-mentioned effect can be realized.
In the present embodiment, be provided with two supporting parts 4 and press section 5 in the both sides of blade 3 respectively, but, press section 5 and the supporting part 4 of more than three also can be set respectively.Thus, area utilization and rate of finished products can not only be improved, and the warpage of substrate 10 can be corrected further.
According to the present embodiment, utilize blade 3 to cut off to be clamped and the other end of the chip area of one end segmentation end by press section 5 (the first abutting part) and supporting part 4 (the second abutting part).Thus, owing to inhibit floating from supporting part 4, can segmentation precision be improved, and reduce segmentation surplus.Therefore, the area utilization of substrate 10 improves.Further, owing to inhibit floating from supporting part 4, crackle or the burr of the chip be cut off are reduced.Therefore, rate of finished products improves.
Further, multiple press section 5 and supporting part 4 are set respectively, are clamped the chip area of both sides that cut off by blade 3, segmentation preset lines 10a by press section 5 and supporting part 4.Thus, owing to suppressing floating from supporting part 4 further, segmentation precision can be improved further, and reduce segmentation surplus further.Therefore, the area utilization of substrate 10 is improved further.Further, owing to suppressing floating from supporting part 4 further, crackle or the burr of cut-off chip are reduced further.Its result, rate of finished products improves further.Further, because press section 5 is printing opacities, therefore, it is possible to easily aim at.In addition, when natural daylight can be used, Lighting Division 8 can be omitted.
Below, the second execution mode is described.Present embodiment omits the press section 5 of the top of the chip area C2 in the first execution mode, only above chip area C3, configures press section 5, and this point is different from the first execution mode.Other parts are identical with the first execution mode.Fig. 5 is the side cutaway view around the blade 3 of the slicing device 1 being exaggerated present embodiment.Double dot dash line 51 is by the imaginary line on the center of blade 3 and the segmentation preset lines 10a that will cut off.
In the present embodiment, chip area C3 is clamped by press section 5 (the first abutting part) and supporting part 4 (the second abutting part).Thus, the effect identical with the first execution mode is played.Further, owing to only arranging a press section 5, the manufacturing cost of slicing device 1 can not only be cut down, and slicing device 1 can be made to simplify.And the illumination light of Lighting Division 8 from chip area C2 side through board holder 2, and can incide image pickup part 7 through space 23.Thus, press section 5 not necessarily needs to be formed by translucent material.Therefore, the choice of press section 5 material expands.
In the present embodiment, also the center of preferred blade 3 is the center of blade 3 and the distance D3 below of press section 5 in the direction parallel with substrate 10 with the distance D2 of supporting part 4 in the direction parallel with substrate 10.Further, the width L2 of preferred the press section 5 and width L1 of supporting part 4 is the width D more than 1 of chip area.
Below, the 3rd execution mode is described.Fig. 6 is the side cutaway view around the blade 3 of the slicing device 1 being exaggerated present embodiment.In the present embodiment, be provided with the blade 3 of three the first execution modes, relative to substrate 10, above-mentioned three blades 3 are arranged in opposition side in order.Supporting part 4 (the first abutting part) abuts with the lower surface of board holder 2.Further, press section 5 (the second abutting part) abuts with the upper surface of board holder 2.Image pickup part 7 also can be arranged on the below of substrate 10 relative to the blade 3 of the top of substrate 10, also can be arranged on the top of substrate 10 relative to the blade 3 of the below of substrate 10.Double dot dash line 61,62,63 is by the imaginary line on the center of each blade 3 and each segmentation preset lines 10a that will cut off.Other parts are identical with the first execution mode.
The face relative with blade 3 of supporting part 4 become with more close to 3, blade more close to the inclined plane 4b that the mode of substrate 10 side tilts.Thereby, it is possible to prevent the interference between blade 3.Further, supporting part 4 and blade 3 opposition side face and and the bearing surface of substrate 10 between bight form curved surface 4c.Thus, when board holder 2 being moved under the state that supporting part 4 is connected to board holder 2, being involved in of diaphragm 12 can be prevented.Further, supporting part 4 is formed the material that luminous ray is transparent by quartz etc.Thus, illumination light or the natural daylight of what Lighting Division 8 sent be irradiated to supporting part 4 can not be blocked by supporting part 4, and can by the image pickup part 7 that easily leads.
Chip area C6 is cut off on segmentation preset lines 10a by blade 3.Chip area C1 and chip area C2 is not yet cut-off.Further, as arrow B, shown in A, C, blade 3 will close to and be breaking on the segmentation preset lines 10a between chip area C2 and chip area C3, between chip area C3 and chip area C4 and between chip area C4 and chip area C5.The chip area C5 cut off by the blade 3 being arranged on one end is clamped by press section 5 and supporting part 4.Thus, owing to suppressing floating from press section 5, therefore, it is possible to improve segmentation precision, and reduce segmentation surplus.Therefore, the area utilization of substrate 10 improves.Further, the crackle of cut-off chip or burr reduce.Its result, rate of finished products improves.
But chip area C3, C4 do not have pressed portion 5 and supporting part 4 to clamp.Therefore, as shown by arrow A, when declining at blade 3 and cut off between chip area C3 and chip area C4 along segmentation preset lines 10a, one end (chip area C2 side) of chip area C3 and one end (chip area C5 side) of chip area C4 are easy to float from supporting part 4.But the chip area C2 adjoined with chip area C3 and the chip area C5 adjacent with chip area C4 is clamped by supporting part 4 and press section 5.Therefore, compared with conventional example, decrease floating of substrate 10.
According to the present embodiment, the effect identical with first, second execution mode is played.Further, owing to being provided with multiple blade 3, by making multiple blade 3 be connected to board holder 2 and apply bending stress simultaneously, multiple chip area can once be split.Therefore, it is possible to realize the rapid of segmentation operation.
And, there are three blades, relative to substrate 10, supporting part 4 (the first abutting part) is configured in the same side of the blade 3 at two ends, press section 5 (the second abutting part) is configured in the same side of the blade 3 of central authorities, the center of the blade 3 of central authorities is also less than the twice of the width D 1 of chip area with the distance D3 of press section 5 in the direction parallel with substrate 10.Thus, floating of chip area can not only be reduced, and can once reliably be cut off three places by blade 3.
In above-mentioned 1st to the 3rd execution mode, describe and board holder 2 be positioned in horizontal direction, blade 3 from above and below apply the structure of bending stress, but, also can be that board holder 2 is positioned in vertical direction, blade 3 applies the structure of bending stress from side.
And, as substrate 10, use is formed with LED (Light Emitting Diode, light-emitting diode) etc. the substrate of element be that example is illustrated, but, also can be the substrate being formed with the semiconductor element regions such as multiple laser diodes or MEMS (Micro Electro Mechanical Systems, MEMS (micro electro mechanical system)) region etc. grid-likely.In addition, also can be split the sapphire substrate of difficulty especially or gallium nitride base board, SiC substrate etc., for the substrate of semiconductor.In addition, also can be the light emitting element storing base plate for packaging of pottery or glass etc.If the bore of substrate 10 is more than 4 inches, just more chip can be manufactured by a substrate, therefore preferably.Owing to clamping substrate 10 by press section 5 and supporting part 4, therefore, even bore is the substrate of more than 4 inches, also reliably can correct warpage, and area utilization and rate of finished products can be improved.
Although not shown, but relative to substrate 10, also Lighting Division 8 can be configured in the same side of image pickup part 7.Thus, even light is difficult to the substrate of transmission, segmentation preset lines 10a also reliably can be taken.But illumination light can be reflected by substrate 10 or diaphragm 12 thus be difficult to shooting sometimes, therefore, as in the present embodiment, preferably relative to substrate 10, Lighting Division 8 is configured in the opposition side of image pickup part 7.
In first, second execution mode, the face relative with blade 3 of press section 5 become with more close to 3, blade more close to the inclined plane 5b that the mode of substrate 10 side tilts, but to be not limited thereto.The face relative with blade 3 of press section 5 also can be the plane vertical with substrate 10.So just be easy to process press section 5.But, from the angle of the interference prevented between blade 3, preferred angled face 5b.The supporting part 4 of the 3rd execution mode is also identical.
The face relative with blade 3 of press section 5 and and the bearing surface of substrate 10 between bight also can be formed as curved surface.Thereby, it is possible to prevent being involved in of adhesive film 11.Now, relative with blade 3 curved surface does not abut with substrate 10.Therefore, the width that the width L2 of aforesaid press section 5 becomes press section 5 deducts the width of this curved face part.Further, the center of blade 3 becomes the center of blade 3 and the distance of substrate 10 bearing surface in the direction parallel with substrate 10 of press section 5 with press section 5 at the distance D3 in the direction parallel with substrate 10.The supporting part 4 of the 3rd execution mode is also identical.
Press section 5 is formed by the material with light transmission.Thus, light transmission press section 5 be directed to image pickup part 7.Now, Lighting Division 8 can be omitted.Further, also Lighting Division 8 can be configured in the side of press section 5, make emergent light incide press section 5, guide-lighting and illumination light is penetrated by press section 5.Further, press section 5 also can be formed by self-luminescent material.This makes it possible to omit Lighting Division 8.As self-luminescent material, such as, organic EL (Electro Luminescence, electroluminescence) material can be used.High molecular organic EL can be manufactured by following laminated structure, namely, ITO (the Indium Tin Oxide of anode is used at glass substrate, tin indium oxide) electrode, use PEDOT (poly (ethylenedioxy) thiophene, Polyglycolic acid fibre) at hole injection layer, use PPV (p-phenylene vinylene) at luminescent layer, use magnesium silver alloy at electrode.Use known printing technology just can prepare luminescent layer flexibly at glass, plastics etc., therefore, the design freedom with the press section 5 of self-luminosity improves.
The present invention can be used in slicing device and the dicing method of dividing semiconductor substrate etc.
Claims (13)
1. a slicing device, the substrate being formed with multiple chip area by segmentation preset lines is split along described segmentation preset lines by it, it is characterized in that,
Comprise: the first abutting part, it abuts with the one side of described substrate; Second abutting part, it is relative with the first abutting part, and abuts with the another side of described substrate; Blade, it applies bending stress and cuts off in the described segmentation preset lines of the described substrate clamped by the first abutting part and the second abutting part,
Relative to described substrate, first abutting part is configured in the same side of described blade, second abutting part is configured in the opposition side of described blade, the center of described blade and the distance of the second abutting part in the direction with described substrate-parallel are that the center of described blade and the first abutting part are below the distance in the direction with described substrate-parallel
By described blade to be clamped by the first abutting part and the second abutting part and the other end of described chip area that one end has been split cuts off.
2. slicing device according to claim 1, is characterized in that,
Multiple first abutting part and the second abutting part are set respectively, are clamped the described chip area of the both sides of the described segmentation preset lines cut off by described blade by the first abutting part and the second abutting part.
3. slicing device according to claim 1 and 2, is characterized in that,
The face relative with described blade of the first abutting part be with more close to described blade then more close to the inclined plane that the mode of described substrate-side tilts.
4. slicing device according to claim 1 and 2, is characterized in that,
The length of the first abutting part on the direction parallel with the length direction of described blade is below the length of the second abutting part on the direction parallel with the length direction of described blade.
5. slicing device according to claim 1 and 2, is characterized in that,
The face of the opposition side of the first abutting part and described blade and and the bearing surface of described substrate between bight be formed as curved surface.
6. slicing device according to claim 1 and 2, is characterized in that,
The width of the first abutting part and the second abutting part is more than the width of described chip area.
7. a slicing device, the substrate being formed with multiple chip area by segmentation preset lines is split along described segmentation preset lines by it, it is characterized in that,
Comprise: the first abutting part, it abuts with the one side of described substrate; Second abutting part, it is relative with the first abutting part, and abuts with the another side of described substrate; Three blades, it applies bending stress and cuts off in the described segmentation preset lines of the described substrate clamped by the first abutting part and the second abutting part,
Relative to described substrate, three described blades are arranged in order in opposition side,
Relative to described substrate, first abutting part is configured in the same side of the described blade at two ends, and the second abutting part is configured in the same side of the described blade of central authorities, the center of the blade of described central authorities is also less than the twice of the width of described chip area with the distance of the second abutting part in the direction with described substrate-parallel
Utilize the described chip area that the first abutting part and the clamping of the second abutting part are cut off by the described blade being configured in one end.
8. slicing device according to claim 1 and 2, is characterized in that,
Have image pickup part, it is arranged on the opposition side of described blade relative to described substrate, and makes a video recording to described segmentation preset lines, and the first abutting part or the second abutting part that are configured in the same side of described blade are formed by transparent material.
9. slicing device according to claim 8, is characterized in that,
Have Lighting Division, it is configured in the same side of described blade relative to described substrate, and throws light on to described substrate.
10. slicing device according to claim 9, is characterized in that,
The first abutting part or the second abutting part that are configured in the same side of described blade carry out leaded light to illumination light.
11. slicing devices according to claim 1 and 2, is characterized in that,
Have image pickup part, it is configured in the opposition side of described blade relative to described substrate, and makes a video recording to described segmentation preset lines, and the first abutting part or the second abutting part that are configured in the same side of described blade are formed by self-luminescent material.
12. 1 kinds of dicing methods, the substrate being formed with multiple chip area by segmentation preset lines is split along described segmentation preset lines by it, it is characterized in that,
First abutting part is abutted with the one side of described substrate, and the second abutting part is abutted with another side, the described chip area split one end is clamped by the first abutting part and the second abutting part, and in the described segmentation preset lines of the other end, apply bending stress by blade, cut off the described other end
Relative to described substrate, first abutting part is configured in the same side of described blade, second abutting part is configured in the opposition side of described blade, the center of described blade and the distance of the second abutting part in the direction with described substrate-parallel are that the center of described blade and the first abutting part are below the distance in the direction with described substrate-parallel.
13. dicing methods according to claim 12, is characterized in that,
The bore of described substrate is more than 4 inches.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011087403A JP5824231B2 (en) | 2011-04-11 | 2011-04-11 | Braking device |
| JP2011-087403 | 2011-04-11 |
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| Publication Number | Publication Date |
|---|---|
| CN102737979A CN102737979A (en) | 2012-10-17 |
| CN102737979B true CN102737979B (en) | 2014-12-31 |
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| CN201210079285.3A Expired - Fee Related CN102737979B (en) | 2011-04-11 | 2012-03-23 | Slicing device and slicing method |
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| JP6539487B2 (en) * | 2015-04-27 | 2019-07-03 | 株式会社ディスコ | Apparatus for dividing plate-like object, processing apparatus and method for dividing plate-like object |
| JP7020660B2 (en) * | 2016-11-29 | 2022-02-16 | 三星ダイヤモンド工業株式会社 | Brittle material Substrate fragmentation method and fragmentation device |
| TWI627042B (en) * | 2017-01-19 | 2018-06-21 | All Ring Tech Co Ltd | Wafer cutting device |
| CN112992720B (en) * | 2020-07-22 | 2022-04-29 | 重庆康佳光电技术研究院有限公司 | Method and system for transferring huge amount of micro light emitting diode chips |
| JP7274760B2 (en) * | 2020-12-18 | 2023-05-17 | 三星ダイヤモンド工業株式会社 | board breaking device |
| CN114083703B (en) * | 2021-09-30 | 2024-03-29 | 华灿光电（浙江）有限公司 | Splitting device and method for improving chip splitting yield |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010087424A1 (en) * | 2009-01-30 | 2010-08-05 | 三星ダイヤモンド工業株式会社 | Substrate breaking apparatus |
| CN101898390A (en) * | 2009-05-29 | 2010-12-01 | 三星钻石工业股份有限公司 | Break-up device and method for dividing |
-
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010087424A1 (en) * | 2009-01-30 | 2010-08-05 | 三星ダイヤモンド工業株式会社 | Substrate breaking apparatus |
| CN101898390A (en) * | 2009-05-29 | 2010-12-01 | 三星钻石工业股份有限公司 | Break-up device and method for dividing |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012222198A (en) | 2012-11-12 |
| CN102737979A (en) | 2012-10-17 |
| JP5824231B2 (en) | 2015-11-25 |
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