CN102734860A - Heating system of data center double-fluid heat management - Google Patents
Heating system of data center double-fluid heat management Download PDFInfo
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- CN102734860A CN102734860A CN2011100905344A CN201110090534A CN102734860A CN 102734860 A CN102734860 A CN 102734860A CN 2011100905344 A CN2011100905344 A CN 2011100905344A CN 201110090534 A CN201110090534 A CN 201110090534A CN 102734860 A CN102734860 A CN 102734860A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention relates to a heating system for double-fluid thermal management of a data center, which comprises: the liquid metal heat dissipation device comprises a liquid metal heat dissipation device, a water storage tank, a heating system and a connecting pipeline for communicating the water tank with the heating system; the liquid metal heat dissipation device comprises: the heat conducting flat sheet is directly contacted with the surface of the CPU, the transmission pipeline provided with the driving pump, the finned radiator arranged in the water storage tank, the hollow flow channel in the heat conducting flat sheet, the channel in the driving pump and the hollow flow channel in the radiating base of the finned radiator are communicated, and flowing liquid metal is filled in the hollow flow channel. The heating system for the double-fluid heat management of the data center utilizes the liquid metal as the primary heat exchange fluid and the water as the secondary heat exchange fluid, so that the heating system is low in energy consumption, large in cooling, low in noise, high in reliability, high in energy efficiency, convenient to install and maintain, and has large-scale popularization and application values.
Description
Technical field
The invention belongs to the heating system of thermal management; Be particularly related to the heating system of a kind of data center two-fluid heat management, promptly adopt liquid metal the heat of the heat generating components bulk storage of data center server and other computers to be gathered and is sent to the heating system of data center's two-fluid heat management of heating system.
Background technology
Got into since 21 century, along with the information system application and development with popularize, the market scale of global data center keeps the situation that grows at top speed always.The expansion of this scale will cause the growth of energy consumption, and a large amount of uses of various high integration server (like 1U rack server, blade server) impel its power density constantly to rise.At present, the energy consumption of separate unit server cabinet rises to more than ten kilowatts from thousands of watts of eighties of last century.According to estimates, at present the energy consumption cost of data center accounts for 50% of total operating cost, nearly wherein has 50% to be consumed by cooling device.The power consumption that air-conditioning system produced in the data center machine room has accounted for about 37% of the required total power consumption of data center machine room.Estimate that according to global authority survey institute Gartner the electric power at 50% available data center and cooling capacity will be difficult to satisfy the demand of high-density equipment.Therefore; Following for setting up " the green data " center " is of equal importance, how when guaranteeing the components and parts reliability service, to improve cooling effectiveness, reduces cooling cost and become one of problem that the personnel of data center's operation in recent years pay close attention to the most with reducing server energy consumption to reduce the cooling device energy consumption.
No matter be the newdata center, still to the expansion or the renewal at legacy data center, its heat management all faces new challenges.One of them is " recirculation " effect, and the hot-air of promptly discharging from the rack rear portion returns the front portion from enclosure top or side again, with after cold air mixes once more by the server suction, greatly reduce cooling effectiveness.Because the cold wind that air-conditioning is seen off in traditional machine room can not 100% delivered to server end, the efficient of most of air conditioner in machine room is also only about 50%.In addition, owing to the application of power management and power conservation techniques efficiently, the dynamic change of the power consumption of server under different loads is very big.
To the problems referred to above, Intel company once proposed series of measures, as special return air channel is set, in enclosure top barrier is set, design air tight eyelet strip, make rack parallel with airflow direction, air humidity is carried out independence control etc.Ai Mosheng company has developed the product of a kind of being called " DataCool ", and it is a ceiling type air conditioner evaporimeter or water cooling heat exchanger, and betiding in minimizing has certain validity aspect " recirculation " effect here.The HP Lab proposes the monitor message based on the temperature sensor acquisition that extensively distributes in the data center, and every air conditioner in machine room (CRAC) is implemented control (claiming Dynamic Smart Cooling again) separately to avoid the generation of focus.IBM Corporation is devoted to develop wind-water mixing cooling scheme, and (Rear Door Heat Exchanger RDHX) reduces return air temperature, thereby the hot-spot problem of avoiding " recirculation " to cause alleviates the burden of CRAC simultaneously through the back door cooler is installed.Prestige figure Rimatrix 5 has developed a kind of closed liquid cooling system (Liquid Cooling Package; LCP); Water-cooled heat exchange module by being installed in side of cabinet is taken away heat, makes the cooling air only in the circulation of rack inner horizontal, and can obtaining very, uniform airflow distributes and higher cooling effectiveness.The InfraStruXure InRow RC system that Schneider Electric Devices IT division department (APC) releases is through monitoring information technoloy equipment inlet temperature; Regulate refrigerating capacity according to cooling requirement again; And cold air carried out reasonable distribution; Thereby the control fan speed effectively cut down the consumption of energy in the non-spike refrigeration period, and realized heat sinking function through existing chilled water system in building or special-purpose handpiece Water Chilling Units.A Erxi company is proposing corresponding technology aspect the method for operation of CRAC, its core concept is utilized extraneous air directly to cool off and carried cold medium to reduce the energy consumption of air-conditioning system under the enough low situation of outdoor environment temperature, to close CRAC.In order to optimize cooling system, Google company has proposed the conception of " marine data center ", is intended to save a large amount of energy consumptions equally.
Though said method all improves the heat management at data center, realized the purpose that cuts down the consumption of energy to a certain extent, but still had deficiencies such as reliability is not high, heat transfer efficiency is low, noise is big.For current data center, urgent problem is exactly that technology through innovation realizes energy-efficient consumption reduction.
Summary of the invention
The object of the invention is to provide the heating system of a kind of data center two-fluid heat management; Promptly adopt the liquid metal of high heat conductance that the server at data center and the heat generating components of other computers are cooled off; And through liquid metal and water heat exchange waste heat is sent to heating system and utilizes again; Both when guaranteeing the components and parts reliability service, improve cooling effectiveness, significantly improved rate of energy again.
The present invention is for utilizing liquid metal as a heat exchanging fluid, and water is as the heating system of data center's two-fluid heat management of secondary heat exchange fluid; On the one hand because the thermal conductivity far of low melting point liquid metal is higher than conventional fluids such as sky G&W; Have higher energy density; Thereby directly dispel the heat with the heat generating components of liquid metal to the server at data center and other computers; Make heat transfer efficiency be able to remarkable lifting, and drive, can realize the low noise heat transmission of high efficient and reliable because of liquid metal is easy to adopt the fluid driven pumps (like electromagnetic pump) of movement-less part; The waste heat that then through liquid metal and water heat exchange transmission is come out is on the other hand supplied with heating system, realizes the recycling of waste heat, thereby improves rate of energy greatly.
Technical scheme of the present invention is following:
The heating system of data center provided by the invention two-fluid heat management comprises:
One storage tank 2, a liquid metal heat radiation device and a heating system;
Said liquid metal heat radiation device comprises:
One group of surperficial contacted heat conduction plain film 5 of CPU direct and data center server or other computers; Be arranged at the liquid metal runner 1 within each heat conduction plain film 5, be installed on first connecting line 61 and second connecting line 62 of 1 liang of port of export of said liquid metal runner respectively;
Recirculated water 16 and built-in finned radiator are housed in the said storage tank 2; Said finned radiator is the finned radiator that has radiated rib 9 that is provided with hollow flow passage in the heat dissipation base 8, and two ports of export of the hollow flow passage in the said heat dissipation base 8 are connected with said first transmission pipeline 66 and second transmission pipeline 661 respectively;
Hollow flow passage, second transmission pipeline 661 and said liquid metal runners 1 in said liquid metal runner 1, first transmission pipeline 66, the heat dissipation base 8 are connected successively and form circulatory flow, and the liquid metal 10 that circulates is housed in this circulatory flow;
Heating system comprises heating equipment 4, the hot water inlet pipe road that is communicated with said heating equipment 4 and the hot water pipeline 3 between the water tank 2; And the cold-water return pipeline of the said heating equipment 4 of connection and the cold water pipes 31 between the water tank 2;
On the said hot water pipeline 3 from temperature sensor 11, flow sensor 12, first control valve 14, water circulating pump 13 and second control valve 141 are installed near water tank 2 one ends successively;
On the said cold water pipes 31 filter 15 is installed;
Said driving pump 7 is electromagnetic pump, mechanical pump or electric Wetting pump.
Said electromagnetic pump comprises: one has the electromagnetic pump substrate 17 of conduit 21 in it; Lie against a pair of permanent magnetism sheet 18 on said electromagnetic pump substrate 17 upper and lower surfaces respectively; Pair of electrical pole piece 19 with being installed in conduit in the said electromagnetic pump substrate 17 21 on relative two walls; Said this plate plane to electrode slice 19 is vertical with said permanent magnetism sheet 18 plate planes; Said this to the contact conductor 22 of electrode slice 19 by drawing in the small through hole of being located on the two relative walls of said conduit 21 23, and be electrically connected with power supply 20; Said electrode slice 19 materials are copper, graphite or stainless steel; Said permanent magnet sheet 18 is the permanent magnet sheet of 0.01～3 tesla's magnetic strength.
Said first transmission pipeline 66 and second transmission pipeline, 661 internal diameters are 10 nanometers～100 millimeter; Length is 1 meter～100 meters, and its material is plastics, stainless steel, aluminium, copper, glass or organic polymer.
Described liquid metal 10 is gallium, sodium, potassium, mercury, gallium indium alloy, gallium ashbury metal, indium stannum alloy, gallium-indium-tin alloy or Na-K alloy.
Be provided for heat is passed to rapidly the agitator of recirculated water 16 in the said storage tank 2.
Said heating installation 4 is radiator or heating network.
Hollow flow passage in said liquid metal runner 1 and the heat dissipation base 8 Wei rotation shape runner.
Uniqueness of the present invention is: the heating system of data center of the present invention two-fluid heat management has adopted the heat management mode that is different from conventional data centers; Here; Carry out the also non-air or the water of data center's heat radiation task, but liquid metal, because liquid metal has the thermal conductivity far above nonmetal fluid such as water, air and even other mixing materials; Thereby it during as heat-transfer fluid, can be realized very excellent solar collecting performance; And, because liquid metal has electric conductivity, thereby can adopt the electromagnetic pump of movement-less part to drive, and power consumption is extremely low.The whole system energy consumption is low, cooling is big, simple in structure, noise is little, reliability is high and operate very simple; The cyclic process of liquid metal is sealed in the entire radiator, can not impact environment, thereby have the tangible feature of environmental protection; The heat that data center sheds avoided the waste of energy, thereby the energy utilization efficiency of whole system will be able to promote greatly through heat exchanger guiding heating system.
Description of drawings
Accompanying drawing 1 is the structural representation of the heating system of data center provided by the invention two-fluid heat management;
Accompanying drawing 2 is structure (cross section) sketch map of liquid metal heat radiation device of the present invention;
Accompanying drawing 3 is an electromagnetic pump structural representation of the present invention.
The specific embodiment
Further describe patent of the present invention below in conjunction with accompanying drawing and specific embodiment:
Technology path provided by the invention can be realized liquid metal heat transfer and the energy storage of multiple complicacy, the combination of heating installation.As an example, only explain here with the most basic structure.
Fig. 1 is the structural representation of the heating system of data center provided by the invention two-fluid heat management, also is one embodiment of the present of invention; Fig. 2 is the schematic cross-section of liquid metal heat radiation device provided by the invention; Fig. 3 is an electromagnetic pump sketch map provided by the invention.
Can know that by figure the heating system of data center provided by the invention two-fluid heat management comprises:
(this storage tank 2 can directly adopt the water tank of purchasing from market that insulation and pressure-bearing function are arranged to one storage tank 2; After also can be directly buying primary element from market, follow procedure processes), a liquid metal heat radiation device and a heating system;
Said liquid metal heat radiation device comprises:
One group directly (each heat conduction plain film 5 contacts with each interior CPU face of other computers with server with the surperficial contacted heat conduction plain film 5 of the CPU of data center server or other computers; Be used for to be discharged into from the heat of CPU heating surface the recirculated water 16 of far-end storage tank 2; In order to the heat energy of heating system 4 to be provided); Be arranged at the liquid metal runner 1 within each heat conduction plain film 5, be installed on first connecting line 61 and second connecting line 62 of 1 liang of port of export of said liquid metal runner respectively;
Recirculated water 16 and built-in finned radiator are housed in the said storage tank 2; Said finned radiator is the finned radiator that has radiated rib 9 that is provided with hollow flow passage in the heat dissipation base 8, and two ports of export of the hollow flow passage in the said heat dissipation base 8 are connected with said first transmission pipeline 66 and second transmission pipeline 661 respectively;
Hollow flow passage, second transmission pipeline 661 and said liquid metal runners 1 in said liquid metal runner 1, first transmission pipeline 66, the heat dissipation base 8 are connected successively and form circulatory flow, and the liquid metal 10 that circulates is housed in this circulatory flow;
Heating system comprises heating equipment 4 (this heating installation 4 can be heating installation or whole heating network), the hot water inlet pipe road that is communicated with said heating equipment 4 and the hot water pipeline 3 between the water tank 2; And the cold-water return pipeline of the said heating equipment 4 of connection and the cold water pipes 31 between the water tank 2;
On the said hot water pipeline 3 from temperature sensor 11, flow sensor 12, first control valve 14, water circulating pump 13 and second control valve 141 are installed near water tank 2 one ends successively;
On the said cold water pipes 31 filter 15 is installed;
Described driving pump 7 can be electromagnetic pump, mechanical pump or electric Wetting pump; Can directly choose or by ripe principles by market; Electromagnetic pump structure wherein comprises: one has the electromagnetic pump substrate 17 of conduit 21 in it; Lie against a pair of permanent magnetism sheet 18 on said electromagnetic pump substrate 17 upper and lower surfaces respectively; Pair of electrical pole piece 19 with being installed in conduit in the said electromagnetic pump substrate 17 21 on relative two walls; Said this plate plane to electrode slice 19 is vertical with said permanent magnetism sheet 18 plate planes; Said this to the contact conductor 22 of electrode slice 19 by drawing in the small through hole of being located on the two relative walls of said conduit 21 23, and be electrically connected with power supply 20; Said electrode slice 19 materials are copper, graphite or stainless steel; Said permanent magnet sheet 18 is the permanent magnet sheet of 0.01～3 tesla's magnetic strength;
Described liquid metal 10 is gallium, sodium, potassium, mercury, gallium indium alloy, gallium ashbury metal, indium stannum alloy, gallium-indium-tin alloy or Na-K alloy.
Finned radiator is made by materials such as high-thermal conductive metal such as aluminium, copper, gold or silver;
Heat conduction plain film 5, heat dissipation base 8, first connecting line 61 and second connecting line 62 are made by stainless steel, diamond, copper, plastics, lucite or polymerizable material etc.; Said liquid metal runner 1 is rectangle, circle, square or triangle with hollow flow passage shape of cross sections in the heat dissipation base 8, and its external diameter can be in 10 nanometers to 100 millimeter, and length can be at 1 meter to 100 meters;
Hollow flow passage, second transmission pipeline 661 and said liquid metal runners 1 in liquid metal runner 1, first transmission pipeline 66, the heat dissipation base 8 are connected successively and form circulatory flow, and the liquid metal 10 that circulates is housed in this circulatory flow; Liquid metal 10 is realized stable in this circulatory flow and circular flow reliably.
The uniqueness of present embodiment is, introduces superpower liquid metal in data center heat management field first and conducts heat, thereby can the waste heat of the server that is absorbed and other computers promptly be passed to heating system flexibly, has realized high efficiency heat utilization thus; This scheme is changed conventional data centers thermal management technology scheme, and a whole set of structure is a kind of residual neat recovering system of high-efficient low-noise.It is significant aspect the large-scale promotion that this system carries out heat management at liquid metal to the data center is popularized.
It should be noted last that above embodiment is only unrestricted in order to technical scheme of the present invention to be described.Adopt all places combination of this two-fluid heat management system and data center server and other computers all to belong to the scope that the present invention is contained.Although the present invention is specified with reference to embodiment; Those of ordinary skill in the art is to be understood that; Technical scheme of the present invention is made amendment or is equal to replacement, do not break away from the spirit and the scope of technical scheme of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (8)
1. the heating system of data center's two-fluid heat management comprises:
One storage tank (2), a liquid metal heat radiation device and a heating system;
Said liquid metal heat radiation device comprises:
One group of surperficial contacted heat conduction plain film (5) of CPU direct and data center server or other computers; Be arranged at the liquid metal runner (1) within each heat conduction plain film (5), be installed on first connecting line (61) and second connecting line (62) of said liquid metal runner (1) two port of export respectively;
First transmission pipeline (66) that is connected with said first connecting line (61) and second connecting line (62) respectively and second transmission pipeline (661); On said first transmission pipeline (66) and second transmission pipeline (661) driving pump (7) is housed respectively;
Recirculated water (16) and built-in finned radiator are housed in the said storage tank (2); Said finned radiator is the finned radiator that has radiated rib (9) that is provided with hollow flow passage in the heat dissipation base (8), and two ports of export of the hollow flow passage in the said heat dissipation base (8) are connected with said first transmission pipeline (66) and second transmission pipeline (661) respectively;
Hollow flow passage, second transmission pipeline (661) and said liquid metal runner (1) in said liquid metal runner (1), first transmission pipeline (66), the heat dissipation base 8 is connected successively and forms circulatory flow, and the liquid metal (10) that circulates is housed in this circulatory flow;
Heating system comprises heating equipment (4), is communicated with the hot water inlet pipe road of said heating equipment (4) and the hot water pipeline (3) between the water tank (2); And the cold-water return pipeline of the said heating equipment of connection (4) and the cold water pipes (31) between the water tank (2);
Said hot water pipeline (3) is gone up near water tank (2) one ends temperature sensor (11), flow sensor (12), first control valve (14), water circulating pump (13) and second control valve (141) being installed successively;
Filter (15) is installed on the said cold water pipes (31);
Said one group directly with interior liquid metal runner (1) serial or parallel connection of the CPU contacted heat conduction plain film in surface (5) of data center server or other computers.
2. by the heating system of the described data center of claim 1 two-fluid heat management, it is characterized in that said driving pump (7) is electromagnetic pump, mechanical pump or electric Wetting pump.
3. by the heating system of the described data center of claim 2 two-fluid heat management, it is characterized in that said electromagnetic pump comprises: one has the electromagnetic pump substrate (17) of conduit (21) in it; Lie against a pair of permanent magnetism sheet (18) on said electromagnetic pump substrate (17) upper and lower surfaces respectively; Pair of electrical pole piece (19) with being installed in the interior conduit of said electromagnetic pump substrate (17) (21) on relative two walls; Said this plate plane to electrode slice (19) is vertical with said permanent magnetism sheet (18) plate plane; Said this contact conductor to electrode slice (19) (22) is by drawing in the small through hole of being located on the two relative walls of said conduit (21) (23), and is electrically connected with power supply (20); Said electrode slice (19) material is copper, graphite or stainless steel; Said permanent magnet sheet (18) is the permanent magnet sheet of 0.01～3 tesla's magnetic strength.
4. by the heating system of the described data center of claim 1 two-fluid heat management, it is characterized in that said first transmission pipeline (66) and second transmission pipeline (661) internal diameter are 10 nanometers～100 millimeter; Length is 1 meter～100 meters, and the material of first transmission pipeline (66) and second transmission pipeline (661) is plastics, stainless steel, aluminium, copper, glass or organic polymer.
5. by the heating system of the described data center of claim 1 two-fluid heat management, it is characterized in that described liquid metal (10) is gallium, sodium, potassium, mercury, gallium indium alloy, gallium ashbury metal, indium stannum alloy, gallium-indium-tin alloy or Na-K alloy.
6. by the heating system of the described data center of claim 1 two-fluid heat management, it is characterized in that, be provided for heat is passed to rapidly the agitator of recirculated water 16 in the said storage tank (2).
7. by the heating system of the described data center of claim 1 two-fluid heat management, it is characterized in that said heating installation (4) is radiator or heating network.
8. by the heating system of the described data center of claim 1 two-fluid heat management, it is characterized in that the interior hollow flow passage of said liquid metal runner (1) and heat dissipation base (8) Wei rotation shape runner.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529906A (en) * | 2016-01-14 | 2016-04-27 | 国网智能电网研究院 | Liquid metal based converter valve cooling system |
| CN105674777A (en) * | 2016-01-25 | 2016-06-15 | 云南科威液态金属谷研发有限公司 | Intelligent device based on liquid metal |
| CN108196650A (en) * | 2018-01-17 | 2018-06-22 | 云南靖创液态金属热控技术研发有限公司 | Supercomputer cooling heat radiator based on liquid metal |
| CN108980973A (en) * | 2018-05-24 | 2018-12-11 | 杭州微兔科技有限公司 | Dig mine formula heating system |
| CN109579100A (en) * | 2018-10-26 | 2019-04-05 | 南京艾科美热能科技有限公司 | A kind of data center's residual heat using device |
| CN113531102A (en) * | 2021-07-16 | 2021-10-22 | 盐城工学院 | CST liquid metal circulation loop system with cooling and power generation functions |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2736933Y (en) * | 2004-07-02 | 2005-10-26 | 中国科学院理化技术研究所 | Liquid metal chip radiator driven by thermoelectric-electromagnetic pump |
| KR20060091393A (en) * | 2005-02-14 | 2006-08-21 | 송인관 | Heating system for floor using conventional fire |
| WO2006112747A1 (en) * | 2005-04-19 | 2006-10-26 | Vladimir Sergevich Vinogradov | Hot water supply solar power plant |
| CN101430591A (en) * | 2007-11-06 | 2009-05-13 | 富士通西门子电脑股份有限公司 | Method and system for using the waste heat of a computer system |
-
2011
- 2011-04-12 CN CN2011100905344A patent/CN102734860A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2736933Y (en) * | 2004-07-02 | 2005-10-26 | 中国科学院理化技术研究所 | Liquid metal chip radiator driven by thermoelectric-electromagnetic pump |
| KR20060091393A (en) * | 2005-02-14 | 2006-08-21 | 송인관 | Heating system for floor using conventional fire |
| WO2006112747A1 (en) * | 2005-04-19 | 2006-10-26 | Vladimir Sergevich Vinogradov | Hot water supply solar power plant |
| CN101430591A (en) * | 2007-11-06 | 2009-05-13 | 富士通西门子电脑股份有限公司 | Method and system for using the waste heat of a computer system |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529906A (en) * | 2016-01-14 | 2016-04-27 | 国网智能电网研究院 | Liquid metal based converter valve cooling system |
| CN105674777A (en) * | 2016-01-25 | 2016-06-15 | 云南科威液态金属谷研发有限公司 | Intelligent device based on liquid metal |
| CN108196650A (en) * | 2018-01-17 | 2018-06-22 | 云南靖创液态金属热控技术研发有限公司 | Supercomputer cooling heat radiator based on liquid metal |
| CN108196650B (en) * | 2018-01-17 | 2020-06-02 | 云南靖创液态金属热控技术研发有限公司 | Supercomputer cooling heat abstractor based on liquid metal |
| CN108980973A (en) * | 2018-05-24 | 2018-12-11 | 杭州微兔科技有限公司 | Dig mine formula heating system |
| CN109579100A (en) * | 2018-10-26 | 2019-04-05 | 南京艾科美热能科技有限公司 | A kind of data center's residual heat using device |
| CN113531102A (en) * | 2021-07-16 | 2021-10-22 | 盐城工学院 | CST liquid metal circulation loop system with cooling and power generation functions |
| CN113531102B (en) * | 2021-07-16 | 2023-07-04 | 盐城工学院 | CST liquid metal circulation loop system with cooling and power generation functions |
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Application publication date: 20121017 |