CN102724821B - Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera - Google Patents
Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera Download PDFInfo
- Publication number
- CN102724821B CN102724821B CN201210196537.0A CN201210196537A CN102724821B CN 102724821 B CN102724821 B CN 102724821B CN 201210196537 A CN201210196537 A CN 201210196537A CN 102724821 B CN102724821 B CN 102724821B
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- China
- Prior art keywords
- free
- halogen
- lead
- wiring board
- drift
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- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 43
- 238000012545 processing Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 17
- 238000004080 punching Methods 0.000 claims description 10
- 230000007423 decrease Effects 0.000 claims description 5
- 238000003801 milling Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a stamping process of a halogen-free and lead-free multi-layer precise circuit board for a digital camera. The method comprises the following steps of a pre-fishing process before a stamping process, a die-building process, a punch depth adjusting process and a stamping process. While the requirement on the quality of the halogen-free and lead-free environment-friendly multi-layer precise circuit board for the digital camera is met, the production efficiency is improved, and the production and processing cost is effectively reduced. Compared with the method in the prior art, the method has the advantages that the fishing time is reduced and the production cost is reduced.
Description
Technical field
The stamp processing technology that the invention discloses the accurate wiring board of a kind of digital camera halogen-free and lead-free multilayer, belongs to printed circuit board (PCB) stamp plate manufacture field.
Background technology
Along with the development of global environmental protection cause, the mankind more and more treasure the earth and the life of oneself.The mankind further recognize impact and the harm of metallic lead on the mankind in recent years, so that the mankind progressively limit the use of metallic lead and legalization in addition.Comply with epoch trend, in line with the theory of " protection of the environment, cherish life ", Green Product-unleaded, Halogen material are progressively applied printed circuit board (PCB).And along with development and the raising of scientific and technological level, consumption electronic product presents multifunction, miniaturization and light-weighted development trend, impels printed circuit board towards high accuracy, high density, high-performance, microporous, slimming and high stratification future development.
Digital camera with the method for processing forming that the accurate wiring board of halogen-free and lead-free multilayer generally adopts is at present: use forming machine to process, first get out shop bolt hole at the bakelite plate of forming machine work top, strike shop bolt, be enclosed within on shop bolt by design lamination number, recall cut type program to be processed, carry out cut type processing.
This kind of defect that processing method exists:
1, the processing and forming time is longer;
2, useful life in milling cutter life-span short, waste milling cutter.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, the stamp processing technology of the accurate wiring board of digital camera halogen-free and lead-free multilayer that a kind of production efficiency is high, simple to operate, processing cost is low is provided.
According to technical scheme provided by the invention, described digital camera comprises the steps: by the stamp processing technology of the accurate wiring board of halogen-free and lead-free multilayer
(1) before stamp, drag in advance: first use forming machine to dragging for groove operation in the plate of the accurate wiring board of halogen-free and lead-free multilayer, the position of the groove that drags for be the inside and outside sandwich circuit of the accurate wiring board of halogen-free and lead-free multilayer from the spacing of edges of boards for being less than 0.38mm place, after dragging for type and by accurate halogen-free and lead-free multilayer wiring board, cut along line of demarcation separately, obtain the accurate wiring board veneer of halogen-free and lead-free multilayer;
(2) shut die: digital camera is placed on work surface of punching machine with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, digital camera is pushed to the middle position of work surface of punching machine with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, start punch press, the drift of punch press declines, until drift and digital camera are 8 ~ 10mm by the spacing between the patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, the drift of punch press stops declining, guarantee digital camera aligns with the clamping screw mouth on punch press drift with the bolt mouth on the patrix of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, continue to make the drift of punch press to decline, until drift and digital camera are 2 ~ 3mm by the spacing at the patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, the drift of punch press stops declining, it is 320 ~ 330mm that the drift of adjusting punch press makes the spacing of drift and work top, and the patrix bolt of the particular manufacturing craft of the accurate wiring board stamp of locking digital camera use halogen-free and lead-free multilayer and counterdie bolt are with fixed mould,
(3) the debugging drift degree of depth: the drift of fine setting punch press, making the drift of punch press and the spacing of work top is 310 ~ 320mm, adopts the brown paper that thickness is 0.15 ~ 0.2mm to try to rush, the degree of depth that makes the drift of punch press just in time can thrust brown paper is as the criterion;
(4) stamp: the accurate wiring board veneer of halogen-free and lead-free multilayer that step (1) is obtained is enclosed within on the counterdie shop bolt of particular manufacturing craft of the accurate wiring board stamp of digital camera halogen-free and lead-free multilayer, startup punch press carries out stamp, and (this action is that mold is first flushed on bed die, then mold is just got back to original position under the effect of de-material system moment), just complete a veneer stamp action.Described platen pressure is 4 ~ 5kg/cm
2, punch press motor rotary speed is 35 ~ 65 revs/min, uses upper de-material mode to take off material when stamp, de-material pressure is controlled at 2 ~ 2.5kg/cm
2.
The present invention, ensureing, in the requirement of the accurate wiring board quality of digital camera halogen-free and lead-free environment friendly multi-layer, to have promoted production efficiency, effectively reduces production and processing cost.Compared with the method for method of the present invention and prior art, reduce and dragged for type process time, reduced production cost.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
Embodiment 1
A kind of digital camera comprises following processing step by the stamp processing technology of the accurate wiring board of halogen-free and lead-free environment friendly multi-layer:
(1) before stamp, drag in advance: first use is provided with the forming machine that diameter is 0.8mm milling cutter and operates dragging for groove in the plate of the accurate wiring boards of 4 layers of halogen-free and lead-free multilayer, the position of the groove that drags for be the accurate wiring board of halogen-free and lead-free multilayer in, outer-layer circuit from the spacing of edges of boards for being less than 0.38mm place, the thickness of the accurate wiring board of described halogen-free and lead-free multilayer is 0.8mm, veneer on the accurate wiring board of halogen-free and lead-free multilayer and the spacing between veneer are 1.6mm, after dragging for type, accurate halogen-free and lead-free multilayer wiring board is cut along line of demarcation separately, obtain the accurate wiring board veneer of 5 halogen-free and lead-free multilayers,
(2) shut die: digital camera is placed on work surface of punching machine with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, digital camera is pushed to the middle position of work surface of punching machine with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, start punch press, the drift of punch press declines, until drift and digital camera are 80mm by the spacing between the patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, the drift of punch press stops declining, guarantee digital camera aligns with the clamping screw mouth on punch press drift with the bolt mouth on the patrix of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, continue to make the drift of punch press to decline, until drift and digital camera are 2mm by the spacing at the patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, the drift of punch press stops declining, it is 320mm that the drift of adjusting punch press makes the spacing of drift and work top, and the patrix bolt of the particular manufacturing craft of the accurate wiring board stamp of locking digital camera use halogen-free and lead-free multilayer and counterdie bolt are with fixed mould,
(3) the debugging drift degree of depth: the drift of fine setting punch press, making the drift of punch press and the spacing of work top is 310mm, adopts the brown paper that thickness is 0.15mm to try to rush, the degree of depth that makes the drift of punch press just in time can thrust brown paper is as the criterion;
(4) stamp: the accurate wiring board veneer of halogen-free and lead-free multilayer that step (1) is obtained is enclosed within on the counterdie shop bolt of particular manufacturing craft of the accurate wiring board stamp of digital camera halogen-free and lead-free multilayer, start punch press and carry out stamp, just complete a veneer stamp action; Described platen pressure is 4kg/cm
2, punch press motor rotary speed is 65 revs/min, uses upper de-material mode to take off material when stamp, de-material pressure is controlled at 2kg/cm
2.
Embodiment 2
A kind of digital camera comprises following processing step by the stamp processing technology of the accurate wiring board of halogen-free and lead-free environment friendly multi-layer:
(1) before stamp, drag in advance: first use is provided with the forming machine that diameter is 1.0mm milling cutter and operates dragging for groove in the plate of the accurate wiring boards of 8 layers of halogen-free and lead-free multilayer, the position of the groove that drags for be the accurate wiring board of halogen-free and lead-free multilayer in, outer-layer circuit from the spacing of edges of boards for being less than 0.38mm place, the thickness of the accurate wiring board of described halogen-free and lead-free multilayer is 1.0mm, veneer on the accurate wiring board of halogen-free and lead-free multilayer and the spacing between veneer are 1.6mm, after dragging for type, accurate halogen-free and lead-free multilayer wiring board is cut along line of demarcation separately, obtain the accurate wiring board veneer of 5 halogen-free and lead-free multilayers,
(2) shut die: digital camera is placed on work surface of punching machine with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, digital camera is pushed to the middle position of work surface of punching machine with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, start punch press, the drift of punch press declines, until drift and digital camera are 10mm by the spacing between the patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, the drift of punch press stops declining, guarantee digital camera aligns with the clamping screw mouth on punch press drift with the bolt mouth on the patrix of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, continue to make the drift of punch press to decline, until drift and digital camera are 3mm by the spacing at the patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, the drift of punch press stops declining, it is 330mm that the drift of adjusting punch press makes the spacing of drift and work top, and the patrix bolt of the particular manufacturing craft of the accurate wiring board stamp of locking digital camera use halogen-free and lead-free multilayer and counterdie bolt are with fixed mould,
(3) the debugging drift degree of depth: the drift of fine setting punch press, making the drift of punch press and the spacing of work top is 320mm, adopts the brown paper that thickness is 0.15mm to try to rush, the degree of depth that makes the drift of punch press just in time can thrust brown paper is as the criterion;
(4) stamp: the accurate wiring board veneer of halogen-free and lead-free multilayer that step (1) is obtained is enclosed within on the counterdie shop bolt of particular manufacturing craft of the accurate wiring board stamp of digital camera halogen-free and lead-free multilayer, start punch press and carry out stamp, just complete a veneer stamp action; Described platen pressure is 4.2kg/cm
2, punch press motor rotary speed is 60 revs/min, uses upper de-material mode to take off material when stamp, de-material pressure is controlled at 2.2kg/cm
2.
Embodiment 3
A kind of digital camera comprises following processing step by the stamp processing technology of the accurate wiring board of halogen-free and lead-free environment friendly multi-layer:
(1) before stamp, drag in advance: first use is provided with the forming machine that diameter is 1.2mm milling cutter and operates dragging for groove in the plate of the accurate wiring boards of 6 layers of halogen-free and lead-free multilayer, the position of the groove that drags for be the accurate wiring board of halogen-free and lead-free multilayer in, outer-layer circuit from the spacing of edges of boards for being less than 0.38mm place, the thickness of the accurate wiring board of described halogen-free and lead-free multilayer is 0.8mm, spacing on the accurate wiring board of halogen-free and lead-free multilayer between veneer and veneer is 1.6mm, after dragging for type, accurate halogen-free and lead-free multilayer wiring board is cut along line of demarcation separately, obtain the accurate wiring board veneer of 5 halogen-free and lead-free multilayers,
(2) shut die: digital camera is placed on work surface of punching machine with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, digital camera is pushed to the middle position of work surface of punching machine with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, start punch press, the drift of punch press declines, until drift and digital camera are 9mm by the spacing between the patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, the drift of punch press stops declining, guarantee digital camera aligns with the clamping screw mouth on punch press drift with the bolt mouth on the patrix of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, continue to make the drift of punch press to decline, until drift and digital camera are 2.5mm by the spacing at the patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, the drift of punch press stops declining, it is 325mm that the drift of adjusting punch press makes the spacing of drift and work top, and the patrix bolt of the particular manufacturing craft of the accurate wiring board stamp of locking digital camera use halogen-free and lead-free multilayer and counterdie bolt are with fixed mould,
(3) the debugging drift degree of depth: the drift of fine setting punch press, making the drift of punch press and the spacing of work top is 315mm, adopts the brown paper that thickness is 0.15mm to try to rush, the degree of depth that makes the drift of punch press just in time can thrust brown paper is as the criterion;
(4) stamp: the accurate wiring board veneer of halogen-free and lead-free multilayer that step (1) is obtained is enclosed within on the counterdie shop bolt of particular manufacturing craft of the accurate wiring board stamp of digital camera halogen-free and lead-free multilayer, start punch press and carry out stamp, just complete a veneer stamp action; Described platen pressure is 4.5kg/cm
2, punch press motor rotary speed is 55 revs/min, uses upper de-material mode to take off material when stamp, de-material pressure is controlled at 2.5kg/cm
2.
Claims (1)
1. a stamp processing technology for the accurate wiring board of halogen-free and lead-free multilayer for digital camera, is characterized in that: this technique comprises the steps:
(1) before stamp, drag in advance: first use forming machine to dragging for groove operation in the plate of the accurate wiring board of halogen-free and lead-free multilayer, the position of the groove that drags for be the inside and outside sandwich circuit of the accurate wiring board of halogen-free and lead-free multilayer from the spacing of edges of boards for being less than 0.38mm place, after dragging for type and by accurate halogen-free and lead-free multilayer wiring board, cut along line of demarcation separately, obtain the accurate wiring board veneer of halogen-free and lead-free multilayer;
(2) shut die: digital camera is placed on work surface of punching machine with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, digital camera is pushed to the middle position of work surface of punching machine with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, start punch press, the drift of punch press declines, until drift and digital camera are 8 ~ 10mm by the spacing between the patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, the drift of punch press stops declining, guarantee digital camera aligns with the clamping screw mouth on punch press drift with the bolt mouth on the patrix of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, continue to make the drift of punch press to decline, until drift and digital camera are 2 ~ 3mm by the spacing at the patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer, the drift of punch press stops declining, it is 320 ~ 330mm that the drift of adjusting punch press makes the spacing of drift and work top, and the patrix bolt of the particular manufacturing craft of the accurate wiring board stamp of locking digital camera use halogen-free and lead-free multilayer and counterdie bolt are with fixed mould,
(3) the debugging drift degree of depth: the drift of fine setting punch press, making the drift of punch press and the spacing of work top is 310 ~ 320mm, adopts the brown paper that thickness is 0.15 ~ 0.2mm to try to rush, the degree of depth that makes the drift of punch press just in time can thrust brown paper is as the criterion;
(4) stamp: the accurate wiring board veneer of halogen-free and lead-free multilayer that step (1) is obtained is enclosed within on the counterdie shop bolt of particular manufacturing craft of the accurate wiring board stamp of digital camera halogen-free and lead-free multilayer, start punch press and carry out stamp, just complete a veneer stamp action; Platen pressure is 4 ~ 5kg/cm
2, punch press motor rotary speed is 35 ~ 65 revs/min, uses upper de-material mode to take off material when stamp, de-material pressure is controlled at 2 ~ 2.5kg/cm
2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210196537.0A CN102724821B (en) | 2012-06-15 | 2012-06-15 | Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210196537.0A CN102724821B (en) | 2012-06-15 | 2012-06-15 | Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102724821A CN102724821A (en) | 2012-10-10 |
| CN102724821B true CN102724821B (en) | 2014-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210196537.0A Expired - Fee Related CN102724821B (en) | 2012-06-15 | 2012-06-15 | Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1958249A (en) * | 2005-11-02 | 2007-05-09 | 上海华仕德电路技术有限公司 | Method for die cutting flexible circuit board |
| CN101618413A (en) * | 2009-07-27 | 2010-01-06 | 江苏银河电子股份有限公司 | Raising method for thin metal sheet |
| CN101618555A (en) * | 2008-07-02 | 2010-01-06 | 富葵精密组件(深圳)有限公司 | Punching mould |
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
-
2012
- 2012-06-15 CN CN201210196537.0A patent/CN102724821B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1958249A (en) * | 2005-11-02 | 2007-05-09 | 上海华仕德电路技术有限公司 | Method for die cutting flexible circuit board |
| CN101618555A (en) * | 2008-07-02 | 2010-01-06 | 富葵精密组件(深圳)有限公司 | Punching mould |
| CN101618413A (en) * | 2009-07-27 | 2010-01-06 | 江苏银河电子股份有限公司 | Raising method for thin metal sheet |
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
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| Publication number | Publication date |
|---|---|
| CN102724821A (en) | 2012-10-10 |
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