CN102723184B - Novel solid-state inductor and preparation method thereof - Google Patents
Novel solid-state inductor and preparation method thereof Download PDFInfo
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- CN102723184B CN102723184B CN201210117668.5A CN201210117668A CN102723184B CN 102723184 B CN102723184 B CN 102723184B CN 201210117668 A CN201210117668 A CN 201210117668A CN 102723184 B CN102723184 B CN 102723184B
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Abstract
The invention discloses a novel solid-state inductance, relating to the field of magnetic materials for solid-state inductances. The novel solid-state inductance is composed of magnetic powders, a coil, an auxiliary material and a material frame, wherein the coil is spot-welded on the material frame, the magnetic powder, the coil and the material frame are in integrated shaping, the auxiliary material is a solvent or a bonding agent of the magnetic powder, and the magnetic powder is composed of Fe, Si, Cr, Cu, Ni, V and P. The invention also discloses a preparation method of the novel solid-state inductance. The novel solid-state inductance has the advantages that the inductance is characterized by anti-corrosion, high electromagnetic properties, and easy processes; and that using of the inductance can shorten device production periods and reduce labor forces.
Description
Technical field
The present invention relates to solid-state inductance field of magnetic material, particularly a kind of New Solid inductance and preparation method.
Background technology
The magnetic material of traditional solid-state inductance is if reduced iron powder, carbonyl iron dust are as base material using iron powder, add the granulations such as passivator, binding agent, release agent, by dry-pressing formed method, coil is compressed on to magnetic inside again, after products solidifying, outside is applied, pins of products is processed, produced solid-state inductance.This material can meet the requirement of magnetic property, when the severe adverse circumstances as high humidity, high salt of environment, need to protect device, conventionally adopts and applies at device surface, to measures such as veneer seal, guarantees like this overall performance.But increase coat, can cause the heat radiation of device bad, and device temperature rise, cause the life-span of device to be reduced.
Summary of the invention
In order to solve the problems of the prior art, the invention provides a kind of New Solid inductance and preparation method, thereby solve in prior art the problem that life-span of causing the bad and device temperature rise of device heat radiation to cause device when magnetic material protects reduces.
The present invention solves the technical scheme that prior art problem adopts: a kind of New Solid inductance of Design and manufacture, by magnetic, coil, auxiliary material and bin, formed, described coil point is welded on described bin, and described magnetic, coil and bin are one-body molded, the solvent that described auxiliary material are described magnetic or bonding agent, described magnetic is by Fe, Si, Cr, Cu, Ni, V and P composition.
As a further improvement on the present invention: described magnetic is grouped into by the one-tenth of following percentage by weight: Fe 90 ~ 90.5%, Si 4.9 ~ 5.1%, Cr 4.7 ~ 4.8%, Cu 0.01 ~ 0.05%, Ni 0.01 ~ 0.03%, V 0.01 ~ 0.03%, P is less than 0.01%.
As a further improvement on the present invention: described magnetic is grouped into by the one-tenth of following percentage by weight: Fe 89 ~ 90%, Si 5.2 ~ 5.3%, Cr 4.8 ~ 4.9%, Cu 0.01 ~ 0.05%, Ni 0.01 ~ 0.03%, V 0.01 ~ 0.03%, P is less than 0.01%.
A kind of preparation method of New Solid inductance, there are following steps: (A) magnetic is made, (B) coil bin welding, (C) magnetic coil bin is one-body molded, (D) heat treatment, (E) SMD processing go-on-go, lettering.
As a further improvement on the present invention: in described steps A, described magnetic is made the compound coating method that adopts, be specially: by the bonderite surface treatment of load weighted magnetic, after completing, phosphatization add mica powder to mix magnetic, mixed powder is added to bonding agent, after mixing, the processing of sieving.
As a further improvement on the present invention: the percentage by weight of the use amount of described bonderite is 3-5%, phosphating time was controlled in 5 hours, and the mass percent of described mica powder is 1-3%, and the percentage by weight of described bonding agent is 3-7%; Described sieving is treated to 120 ~ 150 orders that sieve.
As a further improvement on the present invention: in described step (B), coil is welded on the zinc-plated copper sheet of nickel plating by the method for electric welding; In described step (C), magnetic and the coil having welded are put into die for molding, form one-body molded product; In described step (D), one-body molded product is toasted and processes the part stress producing to eliminate moulding; In described step (E), the pin of one-body molded product both sides is carried out to cutting clubfoot.
As a further improvement on the present invention: in described step (D), the temperature of baking is in 200 degree, and temperature retention time is between 40-60 minute.
As a further improvement on the present invention: described magnetic is magnetic 1, its percentage by weight is Fe 90 ~ 90.5%, Si 4.9 ~ 5.1%, Cr 4.7 ~ 4.8%, Cu 0.01 ~ 0.05%, Ni 0.01 ~ 0.03%, V 0.01 ~ 0.03%, P be less than 0.01% or described magnetic be magnetic 2, its percentage by weight is Fe 89 ~ 90%, Si 5.2 ~ 5.3%, Cr 4.8 ~ 4.9%, Cu 0.01 ~ 0.05%, Ni 0.01 ~ 0.03%, V 0.01 ~ 0.03%, P is less than 0.01%.
As a further improvement on the present invention: described magnetic is the mixture of magnetic 1 and magnetic 2.
The invention has the beneficial effects as follows: this New Solid inductance has the features such as anticorrosion, high electromagnetic performance, easy processing; Use this material can shorten the device production cycle, reduce labour.
Accompanying drawing explanation
Fig. 1 is the sectional drawing of New Solid inductance of the present invention.
Fig. 2 is the manufacture method step schematic diagram of New Solid inductance of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
A kind of New Solid inductance, as Fig. 1, comprises magnetic 1, coil 2, auxiliary material and bin composition, 2 of described coils are welded on described bin, described magnetic 1, coil 2 and bin are one-body molded, and described auxiliary material are solvent or the bonding agent of described magnetic 1, and described magnetic 1 is by Fe, Si, Cr, Cu, Ni, V and P composition, pin 3 and the coil 2 of bin weld together.
Described magnetic is grouped into by the one-tenth of following percentage by weight: Fe 90 ~ 90.5%, and Si 4.9 ~ 5.1%, Cr 4.7 ~ 4.8%, Cu 0.01 ~ 0.05%, Ni 0.01 ~ 0.03%, V 0.01 ~ 0.03%, P is less than 0.01%.
Described magnetic is grouped into by the one-tenth of following percentage by weight: Fe 89 ~ 90%, and Si 5.2 ~ 5.3%, Cr 4.8 ~ 4.9%, Cu 0.01 ~ 0.05%, Ni 0.01 ~ 0.03%, V 0.01 ~ 0.03%, P is less than 0.01%.
A preparation method for New Solid inductance, has following steps: A magnetic is made, the welding of B coil bin, and C magnetic coil bin is one-body molded, D heat treatment, E SMD processing go-on-go, lettering.
In described steps A, described magnetic is made and is adopted compound coating method, is specially: by the bonderite surface treatment of load weighted magnetic, after phosphatization completes, add mica powder to mix magnetic, mixed powder is added to bonding agent, and after mixing, the processing of sieving.
The percentage by weight of the use amount of described bonderite is 3-5%, and phosphating time was controlled in 5 hours, and the mass percent of described mica powder is 1-3%, and the percentage by weight of described bonding agent is 3-7%; Described sieving is treated to 120 ~ 150 orders that sieve.
In described step B, coil is welded on the zinc-plated copper sheet of nickel plating by the method for electric welding; In described step C, magnetic and the coil having welded are put into die for molding, form one-body molded product; In described step D, one-body molded product is toasted and processes the part stress producing to eliminate moulding; In described step e, the pin of one-body molded product both sides is carried out to cutting clubfoot.
In described step D, the temperature of baking is in 200 degree, and temperature retention time is between 40-60 minute.
Described magnetic is magnetic 1, and its percentage by weight is Fe 90 ~ 90.5%, Si 4.9 ~ 5.1%, Cr 4.7 ~ 4.8%, Cu 0.01 ~ 0.05%, Ni 0.01 ~ 0.03%, V 0.01 ~ 0.03%, P be less than 0.01% or described magnetic be magnetic 2, its percentage by weight is Fe 89 ~ 90%, Si 5.2 ~ 5.3%, Cr 4.8 ~ 4.9%, Cu 0.01 ~ 0.05%, Ni 0.01 ~ 0.03%, V 0.01 ~ 0.03%, P is less than 0.01%.
Described magnetic is the mixture of magnetic 1 and magnetic 2.
In actual applications, magnetic is comprised of following two kinds of alloy powders, following alloy powder A and alloy powder B,
(1) alloy powder A
Its component content sees the following form, and particle is ball-type,
| Fe | Si | Cr | Cu | Ni | V | P | Other |
| 90-90.5 | 4.9-5.1 | 4.7-4.8 | 0.01-0.05 | 0.01-0.03 | 0.01-0.03 | <0.01 | 0-0.03 |
(2) alloy powder B
Its component content sees the following form, and particle is irregular,
| Fe | Si | Cr | Cu | Ni | V | P | Other |
| 89-90 | 5.2-5.3 | 4.8-4.9 | 0.01-0.05 | 0.01-0.03 | 0.01-0.03 | <0.01 | 0-0.03 |
Make magnetic equipment and generally comprise smelting furnace, atomisation tower, reciprocating sieve.For the welding of coil bin, refer to the method for coil electric welding is welded on the zinc-plated copper sheet of nickel plating.Magnetic and coil bin are one-body molded: refer to the coil having welded is put into special die for molding, reach the molding effect of coil and magnetic one.
In one embodiment, the coated processing method of magnetic: compound coating method.
Take alloy magnetic powder A/B and mica powder etc. as raw material, first by the bonderite surface treatment of load weighted magnetic, the use amount of bonderite is at 3-5%, phosphating time is controlled at 5 hours, after phosphatization completes, magnetic is added the mica powder of 1-3 to mix, mixed powder is added to the bonding agent of 3-7%, after mixing, the 120-150 order that sieves, processes magnetic according to integrated inductance technique.Wherein baking temperature is in 200 degree, temperature retention time 40-60min.
Be below two preferred embodiments:
Example 1: manufactured size is
The wide * of long * is high=7.3 mm * 6.5 mm * 3.0 mm(maximums)
Each 50% (weight is meter) of alloy powder A/B, first mix, add 3.5% bonderite, phosphatization 3.5 hours, after phosphatization completes, add 1.2% mica powder and add 3.5% bonding agent to mix, 120 orders that sieve after dry, moulding solid-state inductance, wherein baking temperature, at 180 degree, is incubated 40 minutes.Inductance performance is as follows
Inductance: 3.3 μ H ± 20%(100KHz 0.1V)
(2) DC impedance :≤30 m Ω
(3) L
dc/ L
0(direct current biasing inductance/normality inductance):>=80%(100KHz, 0.1V, I
dC=13A) (4) temperature rise :≤38 ℃ (25 ℃, I=6A)
Example 2: alloy powder A accounts for 70%, B accounts for 30% (weight is meter), first mix, add 4% bonderite, phosphatization 3 hours, after phosphatization completes, add 2% mica powder and add 3.2% bonding agent to mix, 120 orders that sieve after dry, moulding solid-state inductance, wherein baking temperature, at 180 degree, is incubated 40 minutes.Inductance performance is as follows
Inductance: 3.3 μ H ± 20%(100KHz 0.1V)
(2) DC impedance :≤30 m Ω
(3) L
dc/ L
0(direct current biasing inductance/normality inductance):>=78%(100KHz, 0.1V, I
dC=13A) (4) temperature rise :≤36 ℃ (25 ℃, I=6A)
From embodiment, this alloy material not only meets the requirement of magnetic property, can also solve the perishable difficult problem of device surface, and device temperature rise can reduce 5-10 degree, extends the useful life of device; Material is ball-type, and device is easy to processing.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (3)
1. the preparation method of a New Solid inductance, it is characterized in that: there are following steps: (A) magnetic is made, (B) coil bin welding, (C) magnetic coil bin is one-body molded, (D) heat treatment, (E) SMD processing go-on-go, lettering; New Solid inductance is comprised of magnetic, coil, auxiliary material and bin, and described coil point is welded on described bin, and described magnetic, coil and bin are one-body molded, the solvent that described auxiliary material are described magnetic or bonding agent, described magnetic is by Fe, Si, Cr, Cu, Ni, V and P composition; In described steps A, described magnetic is made and is adopted compound coating method, is specially: by the bonderite surface treatment of load weighted magnetic, after phosphatization completes, add mica powder to mix magnetic, mixed powder is added to bonding agent, and after mixing, the processing of sieving.
2. the preparation method of New Solid inductance according to claim 1, is characterized in that: in described step (B), coil is welded on the zinc-plated copper sheet of nickel plating by the method for electric welding; In described step (C), magnetic and the coil having welded are put into die for molding, form one-body molded product; In described step (D), one-body molded product is toasted and processes the part stress producing to eliminate moulding; In described step (E), the pin of one-body molded product both sides is carried out to cutting clubfoot.
3. the preparation method of New Solid inductance according to claim 1, is characterized in that: in described step (D), the temperature of baking is in 200 degree, and temperature retention time is between 40-60 minute.
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| CN103745821A (en) * | 2013-12-20 | 2014-04-23 | 吴江市震宇缝制设备有限公司 | Stress eliminating method of magnetic ring sleeved with insulating sleeve |
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| CN1506983A (en) * | 2002-12-06 | 2004-06-23 | ������������ʽ���� | Composite magnetic material, magnetic core and magnetic element using the same composite magnetic element |
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| CN102362317A (en) * | 2009-04-02 | 2012-02-22 | 胜美达集团株式会社 | Composite magnetic material and magnetic element |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4166460B2 (en) * | 2001-11-26 | 2008-10-15 | 松下電器産業株式会社 | Composite magnetic material, magnetic element using the same, and method of manufacturing the same |
| JP5841705B2 (en) * | 2007-04-02 | 2016-01-13 | セイコーエプソン株式会社 | Atomized soft magnetic powder, dust core and magnetic element |
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| CN1204843A (en) * | 1997-07-04 | 1999-01-13 | 安费公司 | Sof magnetic alloy of Fe-Ni-Cr-Ti type for magnetic circuit of high-sensitivy relay |
| CN1372272A (en) * | 2001-02-21 | 2002-10-02 | Tdk株式会社 | Coil closed moulded powder core and method for making same |
| CN1403615A (en) * | 2002-08-16 | 2003-03-19 | 安泰科技股份有限公司 | Iron-base bulk amorphous soft-magnetic alloy material |
| CN1506983A (en) * | 2002-12-06 | 2004-06-23 | ������������ʽ���� | Composite magnetic material, magnetic core and magnetic element using the same composite magnetic element |
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