CN102719808A - Pallet and substrate processing equipment with pallet - Google Patents
Pallet and substrate processing equipment with pallet Download PDFInfo
- Publication number
- CN102719808A CN102719808A CN2011100790302A CN201110079030A CN102719808A CN 102719808 A CN102719808 A CN 102719808A CN 2011100790302 A CN2011100790302 A CN 2011100790302A CN 201110079030 A CN201110079030 A CN 201110079030A CN 102719808 A CN102719808 A CN 102719808A
- Authority
- CN
- China
- Prior art keywords
- pallet
- tray body
- reaction chamber
- hollow structure
- tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Chemical Vapour Deposition (AREA)
Abstract
The invention provides a pallet, comprising: a tray body. The tray body has a hollow structure inside, wherein, the hollow structure is filled with a material, the melting point of which is lower than that of the tray body. The invention also provides substrate processing equipment, which comprises the above pallet. According to the substrate processing equipment of the present invention, when the temperature of the pallet reaches a certain temperature, the material filled in the pallet melts into a liquid. Therefore, characteristics of the liquid material make the surface temperature of the pallet more uniform, thereby raising temperature uniformity of MOCVD (metal organic chemical vapor deposition) conducted on a substrate by the substrate processing equipment. In addition, the pallet of the present invention has the advantages of simple structure, low cost and strong practicability.
Description
Technical field
The present invention relates to microelectronics technology, particularly a kind of pallet and have its substrate processing apparatus.
Background technology
Rate of heating is fast, efficient is high, the Heating temperature advantages of higher is used to CVD (chemical vapor deposition) owing to having for induction heating, especially need be heated to pyritous CVD equipment, as: MOCVD (organometallics chemical vapor deposition).For the CVD equipment that suitability for industrialized production is used; Temperature homogeneity can guarantee the quality of product; Especially temperature homogeneity has very important effect for use characteristics on the pallet of carrying substrates, in order to reach this temperature homogeneity, can adopt the planetary structure of Aixtron to adopt the horizontal load coil to heat the big pallet of whole graphite at present; But carry the little pallet of rotation on the big pallet; Realize in the little pallet temperature homogeneity preferably through little pallet from transferring, yet, temperature homogeneity is restricted because inductive current flows in whole big pallet.A kind of in addition design is in order to obtain bigger production capacity, has proposed the reaction chamber design of many support holder structures, all carries the substrate of some amount on each pallet, and along with tray number increases, the reaction chamber capacity increases thereupon on a large scale.Simultaneously, because this many support holder structures reaction chamber adopts the mode of vertical induction heating to heat, so relative single mount dish configurations difficult is a lot of aspect temperature homogeneity control.
The shortcoming of prior art is, because the characteristic of induction heating: promptly the off-line circle is near more, and magneticline of force is close more, and induced current density is big more, and the temperature that is heated to is just high more; The off-line circle is far away more, and magneticline of force is thin more, and induced current density is more little, and the temperature that is heated to is just low more.Therefore the temperature that is heated of pallet reduces from the edge to the center gradually, thereby causes the Heating temperature of pallet inhomogeneous, therefore is difficult to reach the epitaxially grown processing requirement of MOCVD.
Summary of the invention
The object of the invention is intended to solve at least one of above-mentioned technological deficiency, solves pallet especially and heats uneven shortcoming.
For this reason, the objective of the invention is to propose a kind ofly make heating more even, and pallet simple in structure.
Another object of the present invention is to propose a kind of substrate processing apparatus.
A purpose more of the present invention is to propose another kind of substrate processing apparatus.
To achieve these goals, the embodiment of one aspect of the present invention proposes a kind of pallet, comprising: tray body, said tray body inside has hollow structure, wherein, is filled with the material that fusing point is lower than said tray body in the said hollow structure.
Pallet according to the embodiment of the invention; Pallet self temperature under faradic effect raises, and reaches the fusing point of packing material in the pallet, and the material of filling in the pallet is melted to liquid; Thereby forming thermal convection makes liquid temperature even; It is harmonious through thermal conduction the tray surface temperature to be arrived, and therefore improves the temperature homogeneity of substrate being carried out MOCVD (organometallics chemical vapor deposition), reaches desirable processing requirement.
In one embodiment of the invention, said tray body has annular substrate supporting region, is provided with annular hollow structure in pairing position, said substrate bearing district.
In one embodiment of the invention, said tray body comprises: first body, and the lower surface of said first body has first groove; With second body, the upper surface of said second body has second groove with said first groove coupling, and said first body and second body interconnect so that said first groove and second groove form said hollow structure.
In one embodiment of the invention, said pallet also comprises: be arranged on first connection mechanism between the said tray body, said first syndeton links to each other said first body with second body.
In one embodiment of the invention, said tray body comprises: the 3rd body; With the 4th body, said the 4th body is arranged under said the 3rd body, wherein, is formed with said hollow structure in said the 4th body.
In one embodiment of the invention, said pallet also comprises: be arranged on second connection mechanism between the said tray body, said second syndeton links to each other said the 3rd body with the 4th body.
In one embodiment of the invention, the said material that is filled in the said hollow structure is one of bismuth, tin, lead, cadmium and indium, or is at least two kinds combination arbitrarily in said bismuth, tin, lead, cadmium and the indium.
In one embodiment of the invention; Said pallet also comprises: be formed at least one passage in the said tray body; One end of said at least one passage links to each other with said hollow structure; The other end is exposed to the outward flange of said tray body, and said passage is used for filling said material to said hollow structure.
In one embodiment of the invention, be filled with graphite, SiC, molybdenum or molybdenum alloy in the said passage.
In one embodiment of the invention, said tray body is graphite, SiC, molybdenum or molybdenum alloy.
In one embodiment of the invention, if said tray body is a graphite, then the surface of said tray body also is coated with SiC or SP 1.
The present invention embodiment on the other hand proposes a kind of substrate processing apparatus, comprising: reaction chamber, said reaction chamber comprise reaction chamber inwall and reaction chamber outer wall, and said reaction chamber inwall is used for the defined reaction space; A plurality of ruhmkorff coils, said a plurality of ruhmkorff coils are arranged on the outside of said reaction chamber outer wall; With a pallet, said pallet is the pallet of above-mentioned first aspect embodiment.
Substrate processing apparatus according to the embodiment of the invention; Ruhmkorff coil carries out induction heating to pallet; The pallet temperature is brought up to the fusing point of inner packing material, forms liquid material, liquid material form thermal convection and with pallet generation heat exchange; Thereby make the tray surface temperature more even, arrive the processing requirement of the MOCVD (organometallics chemical vapor deposition) of substrate.
The embodiment of third aspect present invention proposes a kind of substrate processing apparatus, comprising: reaction chamber, said reaction chamber comprise reaction chamber inwall and reaction chamber outer wall, and said reaction chamber inwall is used for the defined reaction space; A plurality of ruhmkorff coils, said a plurality of ruhmkorff coils are arranged on the outside of said reaction chamber outer wall; With a plurality of pallets, said pallet is the pallet of above-mentioned first aspect embodiment.
According to the substrate processing apparatus of the embodiment of the invention, in the reaction compartment in the reaction chamber a plurality of pallets are set, can improve the substrate working (machining) efficiency.
In one embodiment of the invention, said a plurality of pallet uniformly-spaced is provided with in said reaction compartment vertically or flatly.
Additional aspect of the present invention and advantage part in the following description provide, and part will become obviously from the following description, or recognize through practice of the present invention.
Description of drawings
The present invention above-mentioned and/or additional aspect and advantage from obviously with easily understanding becoming the description of embodiment, wherein below in conjunction with accompanying drawing:
Fig. 1 is the pallet longitudinal sectional drawing of one embodiment of the invention;
Fig. 2 is the pallet longitudinal sectional drawing of another embodiment of the present invention;
Fig. 3 is the pallet longitudinal sectional drawing of yet another embodiment of the invention; And
Fig. 4 is the synoptic diagram of the substrate processing apparatus of the embodiment of the invention.
Embodiment
Describe embodiments of the invention below in detail, the example of said embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Be exemplary through the embodiment that is described with reference to the drawings below, only be used to explain the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention; It will be appreciated that; Term " vertically ", " laterally ", " on ", the orientation of indications such as D score, " preceding ", " back ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward " or position relation be for based on orientation shown in the drawings or position relation; Only be to describe with simplifying for the ease of describing the present invention; Rather than the device or the element of indication or hint indication must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.
In addition, term " first ", " second " only are used to describe purpose, and can not be interpreted as indication or hint relative importance.
In description of the invention, need to prove, unless otherwise prescribed and limit; Term " installation ", " linking to each other ", " connection " should be done broad understanding, for example, can be mechanical connection or electrical connection; Also can be the connection of two element internals, can be directly to link to each other, and also can link to each other indirectly through intermediary; For those of ordinary skill in the art, can understand the concrete implication of above-mentioned term as the case may be.
Below in conjunction with accompanying drawing 1-3 the pallet according to the embodiment of the invention is described at first.
[embodiment 1]
As shown in Figure 1, be the longitudinal sectional view of the pallet of one embodiment of the invention.Pallet 100 according to the embodiment of the invention comprises tray body 110, and tray body 110 inside have hollow structure 111.Wherein, be filled with the material that fusing point is lower than tray body 110 in the hollow structure 111, be preferably metal.
Preferably; In one embodiment of the invention; The material that is filled in the hollow structure 111 for example includes but not limited to: one of them perhaps wherein any several kinds combination of bismuth, tin, lead, cadmium, indium, tray body 110 includes but not limited to graphite, SiC, molybdenum or molybdenum alloy.The fusing point of graphite, SiC, molybdenum or molybdenum alloy is higher than bismuth, tin, lead, cadmium, indium.Therefore, in the induction heating process, packing material melts and to be liquid, and liquid bismuth, tin, lead, cadmium, indium have higher heat conductance, thereby make pallet 100 surface temperatures consistent apace.If tray body 110 is a graphite, then the surface of tray body 110 also is coated with SiC or SP 1.
In addition, tray body 110 has annular substrate supporting region, is provided with annular hollow structure 111 in pairing position, substrate bearing district.Need to understand; The shaped design of hollow structure 111 becomes with the substrate bearing district shape of tray body 110 to coincide, and makes heat passage convenience between the two, and it is quick to reach the temperature consistence; But; Those of ordinary skill in the art knows, both shapes also can be different, and for example: hollow structure can be circular or Polygons and this Polygons substrate bearing district uniform distribution along tray body 110; Also can reach consistent based on the tray surface temperature of inventive concept, these also should classify protection domain of the present invention as.
[embodiment 2]
As shown in Figure 2, be the longitudinal sectional view of the pallet of another embodiment of the present invention.In some embodiments of the invention, tray body 200 comprises first body 210 and second body 220.
Wherein, the lower surface of first body 210 has first groove 211.The upper surface of second body 220 has second groove, 221, the first bodies 210 that mate with first groove 211 and second body 220 interconnects so that first groove 211 and second groove 221 form said hollow structure.Through the lower surface at first body 210 be provided with first groove 211 and the upper surface of second body 220 be provided with second groove 221 make the processing of first body 210 and second body 220 more simple, convenient.In addition, preferably, in one embodiment of the invention, connect first body 210 and second body 220 through first connection mechanism 213 that is arranged between first body 210 and second body 220.For example: first connection mechanism 213 can be bolt or pin, and its installing/dismounting is more simple.
[embodiment 3]
In addition, as shown in Figure 3, be the longitudinal sectional view of the pallet of yet another embodiment of the invention.For making pallet simpler in design, tray body can also comprise the 3rd body 310 and the 4th body 320.
Wherein, the 4th body 320 is arranged under the 3rd body 310, and is as shown in Figure 3, and in the 4th body 320, is formed with hollow structure 321.Preferably, connect the 4th body 320 and the 3rd body 310 through second connection mechanism 312.For example, above-mentioned second coupling device 312 can be bolt or pin.
In embodiments of the invention 1-3, the tray body among any embodiment 1-3 is provided with passage (passage 112 as shown in Figure 1, passage 212 shown in Figure 2, shown in Figure 3 passage 311).
Below be that example is described with Fig. 1.Passage 112 is formed in the tray body 110, for example, can be 1 or a plurality of passages.One end of passage 112 links to each other with hollow structure, and the other end is exposed to the outward flange of tray body 110.The high-temp liquid packing material is injected tray body 110 from passage 112, and with material closed channels 112 such as the high graphite of fusing point, SiC, molybdenum or molybdenum alloys.Thereby form pallet as shown in Figure 1.
Need to understand, the filling mode of Fig. 2 and pallet shown in Figure 3 and packing material and pallet filling mode and underfill material shown in Figure 1 are similar, in order to reduce redundancy, the omission explanation.
In one embodiment of the invention, if tray body is a graphite material, then the surfaces coated of tray body is covered with SiC or SP 1.SiC or SP 1 are dense, and chemicalstability is good, can prevent the tray body damage.
Pallet according to the embodiment of the invention; In tray body, be filled with fusing point and be lower than the material of said tray body, in the induction heating process, when the tray body temperature raises when reaching the fusing point of packing material; Packing material can be melted into liquid state; Liquid packing material self forms thermal convection makes self temperature even, and liquid packing material and tray body formation heat exchange, thereby reduces the temperature head of tray surface.In addition, can form through assembling, thereby make tray body processing more convenient through tray body.Make installing/dismounting more simple through bolt or pin connection.In addition, the support holder structure of the embodiment of the invention is simple, is easy to realize.
Below in conjunction with Fig. 4 the substrate processing apparatus according to the embodiment of the invention is described.
Substrate processing apparatus according to the embodiment of the invention comprises reaction chamber, a plurality of ruhmkorff coil and a pallet.Preferably, as shown in Figure 4, be the substrate processing apparatus of the embodiment of the invention.Substrate processing apparatus 400 comprises the pallet 420 that reaction chamber 440, a plurality of ruhmkorff coil 430 and a plurality of is vertically or level uniformly-spaced is provided with.A plurality of pallets 420 can be processed a plurality of substrates simultaneously, improve the substrate working (machining) efficiency.
Be that example is described all below with a plurality of pallets.In conjunction with Fig. 4, in examples more of the present invention, reaction chamber 440 comprises reaction chamber inwall and reaction chamber outer wall, and the reaction chamber inwall is used for the defined reaction space.A plurality of ruhmkorff coils 430 are arranged on the outside of reaction chamber 440 outer walls.Pallet 420 is the pallet of above-mentioned first aspect embodiment, and pallet links to each other with column air intake structure 410 through hollow region, and its pallet 420 inside are hollow structure 421.
According to the substrate processing apparatus 400 of the embodiment of the invention, 430 pairs of pallets of ruhmkorff coil 420 carry out induction heating, and the pallet temperature is increased to the fusing point of inner packing material; Form liquid material; Liquid material forms thermal convection and with the surface of pallet 420 heat exchange takes place, thereby makes pallet 420 surface temperatures more even, arrives the processing requirement of the MOCVD (organometallics chemical vapor deposition) of substrate; A plurality of pallets 420 can be processed a plurality of substrates simultaneously, improve the substrate working (machining) efficiency.In addition, this substrate processing apparatus 400 is simple in structure, easy to operate.
Although illustrated and described embodiments of the invention; For those of ordinary skill in the art; Be appreciated that under the situation that does not break away from principle of the present invention and spirit and can carry out multiple variation, modification, replacement and modification that scope of the present invention is accompanying claims and be equal to and limit to these embodiment.
Claims (14)
1. a pallet is characterized in that, comprising:
Tray body, said tray body inside has hollow structure, wherein, is filled with the material that fusing point is lower than said tray body in the said hollow structure.
2. pallet as claimed in claim 1 is characterized in that, said tray body has annular substrate supporting region, is provided with annular hollow structure in pairing position, said substrate bearing district.
3. pallet as claimed in claim 1 is characterized in that, said tray body comprises:
First body, the lower surface of said first body has first groove; With
Second body, the upper surface of said second body have second groove with said first groove coupling, and said first body and second body interconnect so that said first groove and second groove form said hollow structure.
4. pallet as claimed in claim 1 is characterized in that, also comprises:
Be arranged on first connection mechanism between the said tray body, said first syndeton links to each other said first body with second body.
5. pallet as claimed in claim 1 is characterized in that, said tray body comprises:
The 3rd body; With
The 4th body, said the 4th body are arranged under said the 3rd body, wherein, are formed with said hollow structure in said the 4th body.
6. pallet as claimed in claim 5 is characterized in that, also comprises:
Be arranged on second connection mechanism between the said tray body, said second syndeton links to each other said the 3rd body with the 4th body.
7. like each described pallet of claim 1-6, it is characterized in that the said material that is filled in the said hollow structure is one of bismuth, tin, lead, cadmium and indium, or be at least two kinds combination arbitrarily in said bismuth, tin, lead, cadmium and the indium.
8. pallet as claimed in claim 7 is characterized in that, also comprises:
Be formed at least one passage in the said tray body, an end of said at least one passage links to each other with said hollow structure, and the other end is exposed to the outward flange of said tray body, and said passage is used for filling said material to said hollow structure.
9. pallet as claimed in claim 8 is characterized in that, is filled with graphite, SiC, molybdenum or molybdenum alloy in the said passage.
10. pallet as claimed in claim 1 is characterized in that, said tray body is graphite, SiC, molybdenum or molybdenum alloy.
11. pallet as claimed in claim 10 is characterized in that, if said tray body is a graphite, then the surface of said tray body also is coated with SiC or SP 1.
12. a substrate processing apparatus is characterized in that, comprising:
Reaction chamber, said reaction chamber comprise reaction chamber inwall and reaction chamber outer wall, and said reaction chamber inwall is used to be limited with reaction compartment;
A plurality of ruhmkorff coils, said a plurality of ruhmkorff coils are arranged on the outside of said reaction chamber outer wall; With
A pallet, said pallet are like each described pallet of claim 1-11.
13. a substrate processing apparatus is characterized in that, comprising:
Reaction chamber, said reaction chamber comprise reaction chamber inwall and reaction chamber outer wall, and said reaction chamber inwall is used for the defined reaction space;
A plurality of ruhmkorff coils, said a plurality of ruhmkorff coils are arranged on the outside of said reaction chamber outer wall; With
A plurality of pallets, said pallet are like each described pallet of claim 1-11.
14. substrate processing apparatus as claimed in claim 13 is characterized in that, said a plurality of pallets uniformly-spaced are provided with in said reaction compartment vertically or flatly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100790302A CN102719808A (en) | 2011-03-30 | 2011-03-30 | Pallet and substrate processing equipment with pallet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100790302A CN102719808A (en) | 2011-03-30 | 2011-03-30 | Pallet and substrate processing equipment with pallet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102719808A true CN102719808A (en) | 2012-10-10 |
Family
ID=46945669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100790302A Pending CN102719808A (en) | 2011-03-30 | 2011-03-30 | Pallet and substrate processing equipment with pallet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102719808A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051316A (en) * | 2014-06-23 | 2014-09-17 | 厦门市三安光电科技有限公司 | Graphite bearing tray capable of regulating and controlling local temperature field |
| WO2015014069A1 (en) * | 2013-08-02 | 2015-02-05 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber and mocvd device |
| CN105097621A (en) * | 2014-05-04 | 2015-11-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate bearing device and substrate processing equipment |
| CN105977190A (en) * | 2016-07-11 | 2016-09-28 | 中山德华芯片技术有限公司 | Heating plate of MOCVD system |
| CN111599742A (en) * | 2020-06-04 | 2020-08-28 | 西南大学 | Temporary bonding and debonding method based on graphite |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4345743A (en) * | 1980-10-10 | 1982-08-24 | Alcan Research And Development Limited | Means and method for containing flowing or standing molten metal |
| US20050126738A1 (en) * | 2003-12-11 | 2005-06-16 | Tingey John S. | Heated trough for molten metal |
| CN101254638A (en) * | 2008-03-10 | 2008-09-03 | 株洲科力通用设备有限公司 | Heating roller heating method and heating roller |
| CN101404834A (en) * | 2008-11-10 | 2009-04-08 | 西安电子科技大学 | Electromagnetic heater |
| CN101811871A (en) * | 2010-01-07 | 2010-08-25 | 中国科学院半导体研究所 | Liner tray for metal organic chemical vapor deposition equipment and manufacturing process thereof |
-
2011
- 2011-03-30 CN CN2011100790302A patent/CN102719808A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4345743A (en) * | 1980-10-10 | 1982-08-24 | Alcan Research And Development Limited | Means and method for containing flowing or standing molten metal |
| US20050126738A1 (en) * | 2003-12-11 | 2005-06-16 | Tingey John S. | Heated trough for molten metal |
| CN101254638A (en) * | 2008-03-10 | 2008-09-03 | 株洲科力通用设备有限公司 | Heating roller heating method and heating roller |
| CN101404834A (en) * | 2008-11-10 | 2009-04-08 | 西安电子科技大学 | Electromagnetic heater |
| CN101811871A (en) * | 2010-01-07 | 2010-08-25 | 中国科学院半导体研究所 | Liner tray for metal organic chemical vapor deposition equipment and manufacturing process thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015014069A1 (en) * | 2013-08-02 | 2015-02-05 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber and mocvd device |
| CN104342751B (en) * | 2013-08-02 | 2017-07-21 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber and MOCVD device |
| CN105097621A (en) * | 2014-05-04 | 2015-11-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate bearing device and substrate processing equipment |
| CN105097621B (en) * | 2014-05-04 | 2018-04-06 | 北京北方华创微电子装备有限公司 | A kind of substrate bearing device and substrate processing equipment |
| CN104051316A (en) * | 2014-06-23 | 2014-09-17 | 厦门市三安光电科技有限公司 | Graphite bearing tray capable of regulating and controlling local temperature field |
| CN105977190A (en) * | 2016-07-11 | 2016-09-28 | 中山德华芯片技术有限公司 | Heating plate of MOCVD system |
| CN111599742A (en) * | 2020-06-04 | 2020-08-28 | 西南大学 | Temporary bonding and debonding method based on graphite |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102719808A (en) | Pallet and substrate processing equipment with pallet | |
| US9139438B2 (en) | Graphitization furnace and method for producing graphite | |
| CN102498558B (en) | Substrate is placed equipment in the processing chamber and allow substrate in treatment chamber towards the method at center | |
| CN201756596U (en) | Multi-petal graphite crucible | |
| CN105140157A (en) | BATCH TYPE HEAT TREATMENT APPARATUS and heater for such heat treatment apparatus | |
| CN202989330U (en) | Novel polycrystalline furnace heating device | |
| CN103828035A (en) | Substrate support bushing | |
| US11427929B2 (en) | Wafer supporting mechanism, chemical vapor deposition apparatus, and epitaxial wafer manufacturing method | |
| CN204162787U (en) | For adding the equipment of the pedestal of hot CVD reactor | |
| CN103074606A (en) | Graphite plate, reaction chamber with graphite plate, and substrate heating method | |
| CN101896634B (en) | Chamber and film-forming apparatus | |
| US9428831B2 (en) | Heat equalizer | |
| CN101981223B (en) | Vacuum deposition apparatus and method for adjusting temperature | |
| CN202945364U (en) | Crucible shaft and crucible combination body comprising same | |
| CN102677164A (en) | Tray, chamber device and epitaxy equipment | |
| CN101298665A (en) | Chemical vapor deposition device for plane display | |
| CN104046959A (en) | Chemical vapor deposition device for epitaxial growth of silicon carbide | |
| CN102732861A (en) | Pallet and chemical vapor deposition equipment with pallet | |
| CN103540912B (en) | Tray support rotational system in MOCVD device and this equipment | |
| JP2011140421A (en) | Apparatus for manufacturing single crystal | |
| CN103794528A (en) | Semiconductor processing equipment | |
| CN103928359A (en) | Method of bonding vertical carbon nano tube array and metal substrate | |
| CN101540271A (en) | Mask for forming a thermal sprayed protrusion, method for forming a thermal sprayed protrusion using the mask and method for manufacturing a substrate supporting apparatus using the mask | |
| CN111218672A (en) | MOCVD heater | |
| CN103160812A (en) | Lower electrode assembly and chemical vapor deposition equipment comprising the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121010 |