CN102717201B - High-strength high-temperature soldering flux with corrosion resistance - Google Patents
High-strength high-temperature soldering flux with corrosion resistance Download PDFInfo
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- CN102717201B CN102717201B CN201210229474.4A CN201210229474A CN102717201B CN 102717201 B CN102717201 B CN 102717201B CN 201210229474 A CN201210229474 A CN 201210229474A CN 102717201 B CN102717201 B CN 102717201B
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Abstract
The invention discloses a high-strength high-temperature soldering flux with corrosion resistance, the main ingredients of the soldering flux comprise tin, stibium, tantalum and ruthenium, wherein stibium accounts for 1-20%, tantalum accounts for 1-5% and ruthenium accounts for 2-5%. A rare earth metal adding method is adopted, so the cracking phenomenon is obviously improved, the product stability is increased, and moreover, the corrosion resistance and thermostable performance of the soldering flux are obviously improved.
Description
Technical field
The present invention relates to welding material, particularly for the high-temperature solder of circuit board double welding.
Background technology
All generally adopt first to carry out single-sided welding during welding circuit board, and then carry out the welding of one side in addition, so, two sides can not adopt the solder of same fusing point, and current high-temperature solder due to tin and antimony for main component, at high operating temperatures, resistant to elevated temperatures performance is not very stable, intensity is also poor, is easy to the phenomenon causing remelt and cracking.
Summary of the invention
The invention provides a kind of high-temperature solder adding rare earth metal, solve the technical problem of solder instability under the condition of high temperature in prior art.
The present invention is for solve the problems of the technologies described above and the main component of this high-temperature solder provided comprises tin, antimony and tantalum.Tantalum element has high-melting-point, high strength and erosion-resisting characteristic, can improve the fastness of welding, resistance to elevated temperatures and corrosion resistance.
Further improvement of the present invention is: also include ruthenium further in this solder main constituents.Ruthenium element utilizes ruthenium under high temperature action, plays invigoration effect to solder.
The present invention adds tantalum and ruthenium, utilize the high-melting-point of tantalum element, high strength and erosion-resisting characteristic, utilize ruthenium element to play invigoration effect to solder, improve solder intensity at high operating temperatures, improve the fastness of welding, resistance to elevated temperatures and corrosion resistance.
The present invention adopts the method for adding rare earth metal, and significantly improve the phenomenon of remelt and cracking, improve the stability of product, meanwhile, anticorrosion and the resistance to elevated temperatures of solder significantly improve.
Detailed description of the invention
Specific embodiments of the invention are described below in detail.
This to have in the main component of corrosion resistant high-strength high-temperature solder except comprising tin and antimony, also includes tantalum and ruthenium.Inventor is engaged in solder research for many years, find in production practices for many years, in welding circuit board process, because the resistant to elevated temperatures performance of high-temperature solder is inadequate, after one side adopts high-temperature solder welding, when welding in addition one side, high-temperature solder there will be thawing and cooled crack performance repeatedly, although this be full of cracks is very tiny, but, very large impact is created for product quality, inventor carries out statistics and finds, the quality problems caused that chap account for about 20% of problems of welded quality, therefore, the resistance to elevated temperatures and the strengthening solder that how to improve solder become the key of dealing with problems.The present inventor starts with from interpolation rare earth metal, has carried out test for many years, and here is inventor through the be full of cracks situation statistical form of Test Summary for many years:
Can find out from list above, antimony accounts for 1 ~ 20%, tantalum accounts for 1 ~ 5%, ruthenium accounts for 2 ~ 5%, in this ratio range, remelt phenomenon is improved obvious, and crack performance also has improvement in various degree, but, along with increase and the minimizing of proportioning, the effect that crack performance improves is different, and wherein in preferred version, antimony accounts for 5 ~ 10%, tantalum accounts for 2 ~ 4%, ruthenium accounts in the ratio range of 2 ~ 3%, and be full of cracks improves obvious, just can observe be full of cracks obviously reduce with common magnifying glass, from the result of Metallographic Analysis, also demonstrate that this point.
Above content is in conjunction with concrete preferred embodiment further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (1)
1. one kind has corrosion resistant high-strength high-temperature solder, this solder main constituents comprises tin and antimony, it is characterized in that: in this solder main constituents, also include tantalum, also ruthenium is included further in this solder main constituents, antimony in this solder main constituents accounts for 8%, tantalum accounts for 3%, and ruthenium accounts for 2.5%, and surplus is tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210229474.4A CN102717201B (en) | 2012-07-04 | 2012-07-04 | High-strength high-temperature soldering flux with corrosion resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210229474.4A CN102717201B (en) | 2012-07-04 | 2012-07-04 | High-strength high-temperature soldering flux with corrosion resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102717201A CN102717201A (en) | 2012-10-10 |
| CN102717201B true CN102717201B (en) | 2015-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210229474.4A Active CN102717201B (en) | 2012-07-04 | 2012-07-04 | High-strength high-temperature soldering flux with corrosion resistance |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101209516A (en) * | 2005-12-27 | 2008-07-02 | 株式会社东芝 | Lead-free metallic material for electronic component |
| CN101641179A (en) * | 2007-12-31 | 2010-02-03 | 德山金属株式会社 | Lead free solder alloy and manufacturing method thereof |
| CN101905388A (en) * | 2005-05-20 | 2010-12-08 | 富士电机***株式会社 | The semiconductor device of solder alloy and this solder alloy of use |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63123594A (en) * | 1986-11-12 | 1988-05-27 | Toshiba Corp | Alloy for low temperature joining |
| JPH09206981A (en) * | 1996-01-30 | 1997-08-12 | Taiho Kogyo Co Ltd | Solder material |
| CN100467191C (en) * | 2005-10-28 | 2009-03-11 | 河南科技大学 | High-temp leadless soft solder |
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2012
- 2012-07-04 CN CN201210229474.4A patent/CN102717201B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101905388A (en) * | 2005-05-20 | 2010-12-08 | 富士电机***株式会社 | The semiconductor device of solder alloy and this solder alloy of use |
| CN101209516A (en) * | 2005-12-27 | 2008-07-02 | 株式会社东芝 | Lead-free metallic material for electronic component |
| CN101641179A (en) * | 2007-12-31 | 2010-02-03 | 德山金属株式会社 | Lead free solder alloy and manufacturing method thereof |
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| Publication number | Publication date |
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| CN102717201A (en) | 2012-10-10 |
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Effective date of registration: 20150805 Address after: 518000 Guangdong city of Shenzhen province Baoan District Fuyong street baishixia Longwangmiao Industrial Zone A9 building first floor West Patentee after: Shenzhen Sitena New Materials Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Fuyong Street white Shixia Longwangmiao Industrial Zone A9 building first floor West Patentee before: Shenzhen Sitena New Materials Co.,Ltd. Patentee before: Yichengda Industrial Co., Ltd., Shenzhen City |
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Address after: 516600 No. 1, Changqing Road, Hongcao high tech Zone, Shanwei City, Guangdong Province Patentee after: Guangdong Steiner New Material Co.,Ltd. Address before: 518000 west of the first floor of building A9, longshimiao Industrial Zone, baishixia, Fuyong street, Bao'an District, Shenzhen, Guangdong Province Patentee before: SHENZHEN SITENA NEW MATERIALS Co.,Ltd. |