CN102717185B - Full-automatic semiconductor wafer laser processing device and processing method thereof - Google Patents
Full-automatic semiconductor wafer laser processing device and processing method thereof Download PDFInfo
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- CN102717185B CN102717185B CN201210119776.6A CN201210119776A CN102717185B CN 102717185 B CN102717185 B CN 102717185B CN 201210119776 A CN201210119776 A CN 201210119776A CN 102717185 B CN102717185 B CN 102717185B
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Abstract
The invention discloses a full-automatic semiconductor wafer laser processing device and a processing method thereof. The full-automatic semiconductor wafer laser processing device is composed of a front support, a rear support, a laser processing system, a plurality of rotating platforms, an automatic transportation system, a plurality of automatic wafer fetching/placing systems corresponding to the rotating platforms and two wafer box lifting systems, wherein the laser processing system and the plurality of rotating platforms are all arranged on the rear support; the automatic transportation system, the plurality of automatic wafer fetching/placing systems and the two wafer box lifting systems are all arranged on the front support; and the two wafer box lifting systems are respectively arranged at the two ends of the automatic transportation system. The full-automatic semiconductor wafer laser processing device employs an automatic feed system, an automatic discharge system and an automatic processing system for processing, and operators only need to switch on and off the related parts, therefore, the device is safe and simple to operate.
Description
Technical field
The present invention relates to semiconductor wafer production and manufacture field, specifically a kind of full-automatic semiconductor wafer laser processing device and processing method thereof.
Background technology
Along with the promotion and application of laser processing technology, Laser Processing treatment facility is widely used in semiconductor wafer production manufacture field in recent years.Particularly, in photovoltaic cell field, the application of laser technology has increased substantially production efficiency and the quality of cell piece, has also reduced to a great extent the manufacturing cost of cell piece simultaneously.Yet current semiconductor wafer, the laser process equipment majority that comprises photovoltaic cell still adopts the semi-automatic mode of artificial loading and unloading, has following shortcoming and is badly in need of improving:
1. average needs two operative employees operate an equipment, causes the waste of human resources, efficiency not high.
2. manual operation easily makes mistakes, and causes fragment rate and defect rate higher.
3. manual operation easily produces and pollutes wafer, affects product quality.
4. manual operation cannot realize the connection between laser process equipment and front and back procedure.
Summary of the invention
The present invention relates to a kind of full-automatic semiconductor wafer laser processing device and processing method thereof, adopt automatic feed, auto discharging system and automatic processing system to process, the start and stop of manual operation associated components, safe and simple to operate.
Technical scheme of the present invention is:
A full-automatic semiconductor wafer laser processing device, is comprised of fore-stock, after-poppet, laser-processing system, a plurality of rotation platform, automatic transmission system, a plurality of automatic sheet-fetching/film releasing system relative with rotation platform and two wafer magazine jacking systems; Described laser-processing system and a plurality of rotation platform are all arranged on after-poppet; Described automatic transmission system, a plurality of automatic sheet-fetching/film releasing system and two wafer magazine jacking systems are all arranged on fore-stock, and two wafer magazine jacking systems are arranged at respectively the two ends of automatic transmission system;
Described laser-processing system includes support platform, laser instrument and a plurality of scanning galvanometers relative with rotation platform of quadruple board platform stepwise, and described laser instrument and scanning galvanometer are arranged on the upper surface that support platform tops bar;
Described rotation platform is arranged on support platform gets out of a predicament or an embarrassing situation, rotation platform comprises rotating suction disc and rotary drive mechanism, rotating suction disc comprises that two are placed station board and are connected two connectors of placing station board, described connector is connected with rotary drive mechanism, and is provided with groove on each placement station board;
Described automatic transmission system includes the transmission unit that a row is relative with a plurality of rotation platforms and is arranged at the substrate of row's transmission unit front end bottom, the station height of one row's transmission unit is lower than the station height of described rotating suction disc, and on each transmission unit, be provided with two standing grooves, on substrate, be provided with the hole clipping that a plurality of cards are established automatic sheet-fetching/film releasing system;
Described automatic sheet-fetching/film releasing system comprises mobile link plate, the axis of guide, lifting motor, fixed mount, slide unit and absorption crotch, the described axis of guide is vertically connected on mobile link plate, the apical support of the axis of guide is provided with fixed mount, on fixed mount, be provided with lifting motor, on the top end face of fixed mount, be provided with slide unit, on slide unit, slide and be provided with absorption crotch, two standing grooves of the front end of absorption crotch and each transmission unit or the groove fit of rotating suction disc.
Described wafer magazine jacking system includes crane and is arranged at the wafer magazine on crane.
Described laser-processing system also includes a plurality of light splitting and light beam power Real-Time Monitoring and adjustment System that coordinate respectively with each scanning galvanometer on the upper surface that support platform tops bar that are arranged at, and is arranged on the upper surface that support platform tops bar to accept with the laser instrument surface of emission, light splitting and light beam power Real-Time Monitoring and adjustment System that face becomes the speculum of miter angle setting and for fixing the scanning galvanometer fixed support of each scanning galvanometer.
Described rotary drive mechanism is selected oscillating cylinder or rotary servomotor; On described rotary drive mechanism, be provided with runing rest, described rotating suction disc is arranged on runing rest.
Each transmission unit of described automatic transmission system all by transmission support, be arranged at transmission forming with wheels, the drive motors that is wound in the transport tape on wheels and the motion of rotating band wheels on support; Both sides, top and the bottom of two standing grooves on each described transmission unit are provided with idle pulley.
The lifting motor of described automatic sheet-fetching/film releasing system is selected linear stepping motor; The described axis of guide is selected the ball axis of guide; Described slide unit is selected Pneumatic slid platform.
The crane of described wafer magazine jacking system is comprised of trapezoidal screw and the self-raising platform being arranged on trapezoidal screw; Described wafer magazine is arranged on the top end face of self-raising platform.
A processing method for full-automatic semiconductor wafer laser processing device, comprises the following steps:
(1), semiconductor wafer to be processed is put into the wafer magazine of one end wafer magazine jacking system, the absorption crotch front end of each automatic sheet-fetching/film releasing system is positioned in two standing grooves of each transmission unit;
(2), the downward stepping of the crane of wafer magazine jacking system is until that semiconductor wafer of the bottom in wafer magazine touches the station of automatic transmission system, then automatic transmission system starts and semiconductor wafer to be transferred to each transmission unit successively until while being all placed with semiconductor wafer on all transmission units, the shutting down of automatic transmission system;
(3), after the absorption crotch of automatic sheet-fetching/film releasing system absorption semiconductor wafer, rise until during a little higher than rotating suction disc of absorption crotch, then adsorbing crotch moves horizontally and vertically declines until the front end of absorption crotch and rotating suction disc one are placed the groove fit placement of station board again to rotating suction disc direction, finally adsorb crotch and close adsorption function, slide unit and crane drive absorption crotch to return in two standing grooves of each transmission unit, and rotating suction disc 180 rotates semiconductor wafer is delivered to Laser Processing station simultaneously;
(4), laser instrument opens, laser beam reflexes on each scanning galvanometer through speculum, starts semiconductor wafer to carry out view picture scanning machining and processing;
(5), after processing is finished dealing with, rotary-tray Rotate 180 degree forwards the semiconductor wafer processing to the loading and unloading station of rotary-tray, a slice wafer to be processed rotated to Laser Processing station simultaneously and start processing, then the absorption crotch of automatic sheet-fetching/film releasing system reaches rotary-tray and places in the groove of station board and then move up the semiconductor wafer processing is lifted, adsorb crotch absorption simultaneously and fix semiconductor wafer, automatic sheet-fetching/film releasing system is returning to above automatic transmission system, then move down until adsorb two standing groove matched in clearance of crotch front end and each transmission unit, last automatic transmission system is delivered to semiconductor wafer successively in the wafer magazine of wafer magazine jacking system of the other end and completes semiconductor wafer processing.
In described step 3, slide unit is first to move horizontally absorption crotch to the movement of rotating suction disc direction, then move down, and the adsorption function that adsorbs crotch when semiconductor wafer soon touches rotary-tray is closed, and semiconductor wafer is steadily positioned on rotary-tray.
Advantage of the present invention:
The present invention can be practically applicable to wafer process and the manufacture of multiple different process, comprises Precision Machining and the processing of crystal silicon photovoltaic cell and film photovoltaic cell, as laser cutting, laser scoring, laser sintered, laser boring, laser making herbs into wool, laser scribing limit etc.Full-automatic wafer laser processing device, without the operation of operative employee's intervening equipment, has been saved human resources, has improved production efficiency; Having reduced people is the error causing, and has improved yield rate; The pollution of having avoided the direct contact wafer of operative employee to cause it, has improved the quality of product.Simultaneously full-automatic charging and discharging mechanism can also be realized this operation and the connection between next procedure on it, can save the man-handling of materials step of workpiece between operation.
Accompanying drawing explanation
Fig. 1 is the structural representation of the full-automatic semiconductor wafer laser processing device of the present invention.
Fig. 2 is the structural representation of laser-processing system of the present invention.
Fig. 3 is the structural representation of rotation platform of the present invention.
Fig. 4 is the structural representation of automatic transmission system of the present invention.
Fig. 5 is the structural representation of automatic sheet-fetching/film releasing system of the present invention.
Fig. 6 is the structural representation of wafer magazine jacking system of the present invention.
The specific embodiment
See Fig. 1, a full-automatic semiconductor wafer laser processing device, is comprised of fore-stock 1, after-poppet 2, laser-processing system 3, four rotation platforms 4, automatic transmission system 5, four automatic sheet-fetching/film releasing systems 6 relative with rotation platform 4 and two wafer magazine jacking systems 7; Laser-processing system 3 and four rotation platforms 4 are all arranged on after-poppet 2; Automatic transmission system 5, four automatic sheet-fetching/film releasing systems 6 and two wafer magazine jacking systems 7 are all arranged on fore-stock 1, and two wafer magazine jacking systems 7 are arranged at respectively the two ends of automatic transmission system 5;
See Fig. 2, laser-processing system 3 includes the support platform 31 of quadruple board platform stepwise, laser instrument 32, speculum 33, four scanning galvanometers 34 relative with rotation platform 4 and four light splitting that coordinate respectively with each scanning galvanometer 34 and light beam power Real-Time Monitoring and adjustment System 35, the reflecting surface of speculum 33 and laser instrument 32 surface of emissions, light splitting and light beam power Real-Time Monitoring and adjustment System 35 are accepted face and are become miter angle setting, laser instrument 32, speculum 33 and light splitting and light beam power Real-Time Monitoring and adjustment System 35 are all arranged on the upper surface that support platform 31 tops bar, each scanning galvanometer 34 is fixed on the upper surface that support platform 31 tops bar by scanning galvanometer fixed support 36, watt level when light splitting and light beam power Real-Time Monitoring and adjustment System 35 can arrange and control Laser Processing and process semiconductor wafers is to guarantee processing and the quality of processing, this system also has the function of automatic focusing, and focal plane and the wafer surface relative position of light beam is reasonable when guaranteeing to process, in laser-processing system, each scanning galvanometer represents an independently machining cell, if certain scanning galvanometer cisco unity malfunction, can close it, and other galvanometer can also be proceeded processing, and equipment can also continue operation, equally, if the power of laser instrument declines, can reduce the quantity of light splitting, guarantee that remaining light path has enough power to proceed Laser Processing and processing,
See Fig. 3, rotation platform 4 is arranged on support platform 31 gets out of a predicament or an embarrassing situation, the runing rest 42 that rotation platform 4 comprises oscillating cylinder 41, be connected with oscillating cylinder and be arranged at the rotating suction disc 43 on runing rest 42, rotating suction disc 43 comprises that two are placed station board and are connected two connectors of placing station board, connector is connected with oscillating cylinder, and is provided with groove 44 on each placement station board; Because rotating suction disc 43 has two stations, when a station carries out laser scanning manufacturing, on another station, can get the work of sheet and film releasing simultaneously, thereby save the nonproductive stand-by period, increased substantially production efficiency.
See Fig. 4, automatic transmission system 5 includes the transmission unit that a row is relative with a plurality of rotation platforms 4 and is arranged at the substrate 51 of row's transmission unit front end bottom, on substrate, be provided with a plurality of cards and establish the hole clipping 58 of automatic sheet-fetching/film releasing system, the station height of one row's transmission unit is lower than the station height of rotating suction disc 4, each transmission unit is all by transmission support 52, be arranged at the band wheels 53 on transmission support 52, the drive motors 55 being wound in the transport tape 54 on wheels 53 and 53 motions of rotating band wheels forms, on each transmission unit, be provided with two standing grooves 56, both sides, top and the bottom of standing groove 56 are provided with idle pulley 57, if device need to be connected with the equipment of upper next procedure, magazine jacking system can be taken away, automatic transmission system 5 and the equipment of upper next procedure are directly connected together, realize the seamless link with front and back procedure,
See Fig. 5, automatic sheet-fetching/film releasing system 6 comprises mobile link plate 61, the ball axis of guide 62, linear stepping motor 63, fixed mount 64, Pneumatic slid platform 65 and absorption crotch 66, the ball axis of guide 62 is vertically connected on mobile link plate 61, the apical support of the ball axis of guide 62 is provided with fixed mount 64, on fixed mount 64, be provided with linear stepping motor 63, on the top end face of fixed mount 64, be provided with Pneumatic slid platform 65, on Pneumatic slid platform 65, slide and be provided with absorption crotch 66, two standing grooves 56 of front end and each transmission unit of absorption crotch 66 or the groove 44 of rotating suction disc coordinate,
See Fig. 6, wafer magazine jacking system 7 includes crane and is arranged at the wafer magazine 71 on crane, and crane is comprised of trapezoidal screw 72 and the self-raising platform 73 being arranged on trapezoidal screw that slides; Wafer magazine 71 is arranged on the top end face of self-raising platform 73.
A processing method for full-automatic semiconductor wafer laser processing device, comprises the following steps:
(1), semiconductor wafer to be processed is put into the wafer magazine 71 of one end wafer magazine jacking system, absorption crotch 66 front ends of each automatic sheet-fetching/film releasing system are positioned in two standing grooves 56 of each transmission unit;
(2), the downward stepping of the crane of wafer magazine jacking system is until that semiconductor wafer of the bottom in wafer magazine 71 touches the station of automatic transmission system 5, then automatic transmission system 5 starts and semiconductor wafer is transferred to each transmission unit successively until while being all placed with semiconductor wafer on all transmission units, the shutting down of automatic transmission system 5;
(3), after the absorption crotch 66 absorption semiconductor wafers of automatic sheet-fetching/film releasing system, rise until the absorption top end face of crotch 66 and the top end face of rotating suction disc 43, then Pneumatic slid platform 65 moves absorption crotch 66 and the adsorption function that adsorbs crotch 66 when semiconductor wafer soon touches rotary-tray 43 is closed to rotating suction disc 43 directions, until the groove 44 that the front end of absorption crotch 66 and rotating suction disc 43 1 are placed station board is connected, semiconductor wafer is steadily positioned on rotary-tray 43, finally adsorb crotch 66 and close adsorption function, Pneumatic slid platform 65 and crane drive absorption crotch 66 to return in two standing grooves 56 of each transmission unit, rotating suction disc 43 1 hundred 80 degree rotate semiconductor wafer are delivered to Laser Processing station simultaneously,
(4), laser instrument 32 opens, laser beam reflexes on each scanning galvanometer 34 through speculum 33, starts semiconductor wafer to carry out view picture scanning machining and processing;
(5), after processing is finished dealing with, rotary-tray 43 rotation 180 degree forward the semiconductor wafer processing to the loading and unloading station of rotary-tray, a slice wafer to be processed rotated to Laser Processing station simultaneously and start processing, then the absorption crotch 66 of automatic sheet-fetching/film releasing system reaches rotary-tray and places in the groove 44 of station board and then move up the semiconductor wafer processing is lifted, adsorb crotch 66 absorption simultaneously and fix semiconductor wafer, automatic sheet-fetching/film releasing system 6 is returning to above automatic transmission system 5, then move down until adsorb crotch 66 front ends and engage with two standing grooves 56 of each transmission unit, last automatic transmission system 5 is delivered to semiconductor wafer successively in the wafer magazine 71 of wafer magazine jacking system 7 of the other end and completes semiconductor wafer processing.
Claims (8)
1. a full-automatic semiconductor wafer laser processing device, is characterized in that: described full-automatic semiconductor wafer laser processing device is comprised of fore-stock, after-poppet, laser-processing system, a plurality of rotation platform, automatic transmission system, a plurality of automatic sheet-fetching/film releasing system relative with rotation platform and two wafer magazine jacking systems; Described laser-processing system and a plurality of rotation platform are all arranged on after-poppet; Described automatic transmission system, a plurality of automatic sheet-fetching/film releasing system and two wafer magazine jacking systems are all arranged on fore-stock, and two wafer magazine jacking systems are arranged at respectively the two ends of automatic transmission system;
Described laser-processing system includes support platform, laser instrument and a plurality of scanning galvanometers relative with rotation platform of quadruple board platform stepwise, and described laser instrument and scanning galvanometer are arranged on the upper surface that support platform tops bar;
Described rotation platform is arranged on support platform gets out of a predicament or an embarrassing situation, rotation platform comprises rotating suction disc and rotary drive mechanism, rotating suction disc comprises that two are placed station board and are connected two connectors of placing station board, described connector is connected with rotary drive mechanism, and is provided with groove on each placement station board;
Described automatic transmission system includes the transmission unit that a row is relative with a plurality of rotation platforms and is arranged at the substrate of row's transmission unit front end bottom, the station height of one row's transmission unit is lower than the station height of described rotating suction disc, and on each transmission unit, be provided with two standing grooves, on substrate, be provided with the hole clipping that a plurality of cards are established automatic sheet-fetching/film releasing system;
Described automatic sheet-fetching/film releasing system comprises mobile link plate, the axis of guide, lifting motor, fixed mount, slide unit and absorption crotch, the described axis of guide is vertically connected on mobile link plate, the apical support of the axis of guide is provided with fixed mount, on fixed mount, be provided with lifting motor, on the top end face of fixed mount, be provided with slide unit, on slide unit, slide and be provided with absorption crotch, two standing grooves of the front end of absorption crotch and each transmission unit or the groove fit of rotating suction disc;
Described wafer magazine jacking system includes crane and is arranged at the wafer magazine on crane.
2. a kind of full-automatic semiconductor wafer laser processing device according to claim 1, it is characterized in that: described laser-processing system also includes a plurality of light splitting and light beam power Real-Time Monitoring and adjustment System that coordinate respectively with each scanning galvanometer on the upper surface that support platform tops bar that are arranged at, be arranged on the upper surface that support platform tops bar and accept with the laser instrument surface of emission, light splitting and light beam power Real-Time Monitoring and adjustment System that face becomes the speculum of miter angle setting and for fixing the scanning galvanometer fixed support of each scanning galvanometer.
3. a kind of full-automatic semiconductor wafer laser processing device according to claim 1, is characterized in that: described rotary drive mechanism is selected oscillating cylinder or rotary servomotor; On described rotary drive mechanism, be provided with runing rest, described rotating suction disc is arranged on runing rest.
4. a kind of full-automatic semiconductor wafer laser processing device according to claim 1, is characterized in that: each transmission unit of described automatic transmission system all by transmission support, be arranged at forming with wheels, the drive motors that is wound in the transport tape on wheels and the motion of rotating band wheels on transmission support; Both sides, top and the bottom of two standing grooves on each described transmission unit are provided with idle pulley.
5. a kind of full-automatic semiconductor wafer laser processing device according to claim 1, is characterized in that: the lifting motor of described automatic sheet-fetching/film releasing system is selected linear stepping motor; The described axis of guide is selected the ball axis of guide; Described slide unit is selected Pneumatic slid platform.
6. a kind of full-automatic semiconductor wafer laser processing device according to claim 1, is characterized in that: the crane of described wafer magazine jacking system is comprised of trapezoidal screw and the self-raising platform being arranged on trapezoidal screw; Described wafer magazine is arranged on the top end face of self-raising platform.
7. the processing method of a kind of full-automatic semiconductor wafer laser processing device according to claim 1, is characterized in that: comprise the following steps:
(1), semiconductor wafer to be processed is put into the wafer magazine of one end wafer magazine jacking system, the absorption crotch front end of each automatic sheet-fetching/film releasing system is positioned in two standing grooves of each transmission unit;
(2), the downward stepping of the crane of wafer magazine jacking system is until that semiconductor wafer of the bottom in wafer magazine touches the station of automatic transmission system, then automatic transmission system starts and semiconductor wafer to be transferred to each transmission unit successively until while being all placed with semiconductor wafer on all transmission units, the shutting down of automatic transmission system;
(3), after the absorption crotch of automatic sheet-fetching/film releasing system absorption semiconductor wafer, rise until during a little higher than rotating suction disc of absorption crotch, then adsorbing crotch moves horizontally and vertically declines until the front end of absorption crotch and rotating suction disc one are placed the groove fit placement of station board again to rotating suction disc direction, finally adsorb crotch and close adsorption function, slide unit and crane drive absorption crotch to return in two standing grooves of each transmission unit, and rotating suction disc 180 rotates semiconductor wafer is delivered to Laser Processing station simultaneously;
(4), laser instrument opens, laser beam reflexes on each scanning galvanometer through speculum, starts semiconductor wafer to carry out view picture scanning machining and processing;
(5), after processing is finished dealing with, rotary-tray Rotate 180 degree forwards the semiconductor wafer processing to the loading and unloading station of rotary-tray, a slice wafer to be processed rotated to Laser Processing station simultaneously and start processing, then the absorption crotch of automatic sheet-fetching/film releasing system reaches rotary-tray and places in the groove of station board and then move up the semiconductor wafer processing is lifted, adsorb crotch absorption simultaneously and fix semiconductor wafer, automatic sheet-fetching/film releasing system is returning to above automatic transmission system, then move down until adsorb two standing groove matched in clearance of crotch front end and each transmission unit, last automatic transmission system is delivered to semiconductor wafer successively in the wafer magazine of wafer magazine jacking system of the other end and completes semiconductor wafer processing.
8. the processing method of a kind of full-automatic semiconductor wafer laser processing device according to claim 7, it is characterized in that: in described step 3, slide unit is first to move horizontally absorption crotch to the movement of rotating suction disc direction, then move down, and the adsorption function that adsorbs crotch when semiconductor wafer soon touches rotary-tray is closed, and semiconductor wafer is steadily positioned on rotary-tray.
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| CN201210119776.6A CN102717185B (en) | 2012-04-23 | 2012-04-23 | Full-automatic semiconductor wafer laser processing device and processing method thereof |
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