CN102709443B - LED (Light-Emitting Diode) package and packaging method thereof - Google Patents
LED (Light-Emitting Diode) package and packaging method thereof Download PDFInfo
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- CN102709443B CN102709443B CN201210172657.7A CN201210172657A CN102709443B CN 102709443 B CN102709443 B CN 102709443B CN 201210172657 A CN201210172657 A CN 201210172657A CN 102709443 B CN102709443 B CN 102709443B
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Abstract
The invention provides an LED (Light-Emitting Diode) package and a packaging method thereof. The LED package comprises a substrata, first ceramic retaining walls, second ceramic retaining walls, a shell and a luminous body, wherein the first ceramic retaining walls are fixed on the substrate; the second ceramic retaining walls are annularly arranged on the peripheral sides of the first ceramic retaining walls and are fixed on the substrate; the shell is fixed on the substrate; the luminous body is contained in the shell; gaps are formed between the first ceramic retaining walls and the second ceramic retaining walls; the shell covers the first ceramic retaining walls and the luminous body; and the joints of the shell and the substrate are positioned in the gaps between the first ceramic retaining walls and the second ceramic retaining walls. The LED package and he packaging method thereof have the beneficial effects that the loss of a sealed stop agent and a phosphor material can be reduced, the mold expense of a pressure injection mold is saved, and the miniature LED package can be manufactured with a low cost.
Description
[technical field]
The invention belongs to photoelectric device technical field, particularly relate to a kind of LED and method for packing thereof.
[background technology]
Semiconductor light-emitting-diode (LED) has the features such as high brightness, low energy consumption, long-life, fast response time, is a kind of solid light source of environmental type, and thus in illumination, the fields such as traffic lights display, flat panel display are widely used.
And traditional LED often adopts and first utilizes Making mold to go out lens to be then mounted on barricade, like this, because often changing transfer mould mould on small lot batch manufacture and diversification of varieties, thus cause production cost high.In addition, above-mentioned conventional LED package is difficult to be applied on compact LED product, because in the LED product of microminiaturization, the assembling percent defective of small size object is high, and, also easily overflow when utilizing sealing agent and phosphor and spread unchecked and cause material unaccounted-for (MUF), like this, must cause using the LED product optical property of conventional LED package to be subject to negatively influencing.
Thus, how to manufacture that a kind of die cost is low, small size, sealing agent and phosphor material lose few LED is worth people to study.
[summary of the invention]
The present invention is high for solving prior art transfer mould die cost, and be difficult to low cost and manufacture compact LED encapsulation, in LED process, sealing agent and phosphor material lose serious deficiency, and provide a kind of LED and method for packing thereof.
A kind of LED, described LED comprises substrate, the ceramic barricade of circular ring type first be fixed on described substrate, ring are established the described first all sides of ceramic barricade and be fixed on the ceramic barricade of circular ring type second of substrate, the shell being fixed on described substrate and the luminous element be contained in described shell, gap is provided with between described first ceramic barricade and the second ceramic barricade, described shell covers described first ceramic barricade and luminous element, and in the gap of the junction of described shell and substrate between described first ceramic barricade and the second ceramic barricade.
Preferably, described substrate is ceramic substrate.
Preferably, described first ceramic barricade and the concentricity axle of the second ceramic barricade are arranged.
Preferably, described shell is the silicon lens shell of dome-type.
Preferably, the upper surface of described first ceramic barricade and the second ceramic barricade is also provided with glassy layer.
Preferably, described luminous element comprises LED chip and covers the phosphor of described LED chip.
A kind of method for packing of LED, the method comprises the steps: to provide ceramic substrate, fix the first ceramic barricade at described substrate, establish at all side rings of described first ceramic barricade the second ceramic barricade being fixed on substrate, described second ceramic barricade and the first ceramic barricade concentrically axle are arranged; All be coated with liquid glass at the upper surface of described first ceramic barricade and the second ceramic barricade, form the glassy layer with curved surface; LED chip settled by substrate within the scope of the inner ring that described first ceramic barricade surrounds, then on described LED chip, phosphor is dripped to cover described LED chip, prevent phosphor from overflowing by the glassy layer being placed in the first ceramic barricade upper surface, thus form luminous element; Drip liquid-state silicon in gap between described first ceramic barricade and the second ceramic barricade, prevent liquid-state silicon from overflowing by the glassy layer being placed in the second ceramic barricade upper surface, thus form the silicon shell covering described first ceramic barricade and luminous element.
LED provided by the invention and method for packing thereof, can reduce the loss of sealing agent and phosphor material, and the mould saving transfer mould takes, and can realize the encapsulation of low cost manufacture compact LED.
[accompanying drawing explanation]
Fig. 1 is the stereogram of LED of the present invention;
Fig. 2 is the cutaway view of LED in Fig. 1.
[embodiment]
Below in conjunction with drawings and embodiments, the invention will be further described.
As depicted in figs. 1 and 2, the invention provides a kind of LED and method for packing thereof, wherein, described LED comprises substrate 1, be fixed on the first ceramic barricade 2 on described substrate 1, ring is established described first ceramic barricade 2 weeks sides and is fixed on the second ceramic barricade 3 of substrate 1, the shell 4 being fixed on described substrate 1 and the luminous element 5 be contained in described shell 4, gap 6 is provided with between described first ceramic barricade 2 and the second ceramic barricade 3, described shell 4 covers described first ceramic barricade 2 and luminous element 5, space is formed between described shell 4 and luminous element 5, and in the gap 6 of the junction of described shell 4 and substrate 1 between described first ceramic barricade 2 and the second ceramic barricade 3.
In the present invention, preferably, described substrate 1 adopts ceramic substrate, and the first ceramic barricade 2 and the second ceramic barricade 3 that are fixed on described substrate 1 upper surface are all circular ring type, and concentrically axle is arranged.Preferably, described first ceramic barricade 2 and the second ceramic barricade 3 adopt whiteware, can effectively improve heat transfer, light efficiency and reliability like this.Described shell 4 is the silicon lens shell of dome-type, thus ensure that the characteristic such as protection against the tide, waterproof, resistance to ozone, radiation hardness, weather-resistant using the LED product of LED provided by the invention to have high transmission rate, excellence, and be applicable to high power products.
Glassy layer 7 is all provided with at the upper surface of described first ceramic barricade 2 and the second ceramic barricade 3, described glassy layer 7 is by the upper surface coating liquid glass at the first ceramic barricade 2 and the second ceramic barricade 3, utilize liquid glass to coat the outer surface of natural birth green tape curvature after the upper surface of above-mentioned first ceramic barricade 2 and the second ceramic barricade 3, thus form the glassy layer 7 with curvature outer surface.The effect of this glassy layer 7 is, when making above-mentioned silicon lens shell 4, when utilizing the outer surface of glassy layer 7 with curvature to prevent from being coated with liquid-state silicon, silicon overflows and spreads unchecked.
In the present invention, described luminous element 5 comprises LED chip 5a and covers the phosphor 5b of described LED chip 5a.Described luminous element 5 manufacture method as follows, substrate 1 upper surface within the scope of the inner ring that first ceramic barricade 1 surrounds settles LED chip, then the frock of syringe apperance is utilized to be dropped in by the phosphor of liquid state on described LED chip 5a to cover described LED chip 5a, and utilize the glassy layer 7 of the band curvature outer surface on the first ceramic barricade 1 upper surface to spread unchecked to prevent the phosphor 5b of liquid condition from overflowing, thus form luminous element 5.
Present invention also offers a kind of method for packing of LED, the method comprises the steps:
(1) provide ceramic substrate 1, fix the first ceramic barricade 2 at described substrate 1, establish at described first ceramic barricade 2 weeks side rings the second ceramic barricade 3 being fixed on substrate 1, described second ceramic barricade 3 and the first ceramic barricade 2 concentrically axle are arranged;
(2) be all coated with liquid glass at the upper surface of described first ceramic barricade 2 and the second ceramic barricade 3, form the glassy layer 7 with curvature outer surface;
(3) substrate 1 upper surface within the scope of the inner ring surrounded at described first ceramic barricade 2 settles LED chip 5a, then on described LED chip 5a, phosphor 5b is dripped to cover described LED chip 5a, prevent phosphor from overflowing by the glassy layer 7 being placed in the first ceramic barricade 2 upper surface, thus form luminous element 5;
(4) liquid-state silicon is dripped in the gap 6 between described first ceramic barricade 2 and the second ceramic barricade 3, prevent liquid-state silicon from overflowing by the glassy layer 7 being placed in the second ceramic barricade 3 upper surface, thus form the silicon lens shell 4 covering described first ceramic barricade 2 and luminous element 5.
LED provided by the invention and method for packing thereof, can reduce the loss of sealing agent and phosphor material, and the mould saving transfer mould takes, and can realize the encapsulation of low cost manufacture compact LED.
Above-described is only better embodiment of the present invention, it should be pointed out that for the person of ordinary skill of the art at this, without departing from the concept of the premise of the invention, can also make improvement, but these all belongs to protection scope of the present invention.
Claims (4)
1. a LED, it comprises substrate, be fixed on the first ceramic barricade on described substrate, ring is established the described first all sides of ceramic barricade and is fixed on the second ceramic barricade of substrate, the silicon lens shell being fixed on a dome-type of described substrate and the luminous element be contained in described shell, described luminous element comprises LED chip and covers the phosphor of described LED chip, gap is provided with between described first ceramic barricade and the second ceramic barricade, described shell covers described first ceramic barricade and luminous element, and in the gap of the junction of described shell and substrate between described first ceramic barricade and the second ceramic barricade, it is characterized in that, the upper surface of described first ceramic barricade and the second ceramic barricade is also provided with for preventing phosphor and liquid-state silicon from overflowing and with the glassy layer of curvature outer surface.
2. LED as claimed in claim 1, is characterized in that: described substrate is ceramic substrate.
3. LED as claimed in claim 2, is characterized in that: described first ceramic barricade and the second ceramic barricade are all circular ring type and concentrically axle is arranged.
4. a method for packing for LED as claimed in claim 1, is characterized in that, the method comprises the steps:
(1) provide ceramic substrate, fix the first ceramic barricade at described substrate, establish at all side rings of described first ceramic barricade the second ceramic barricade being fixed on substrate, described second ceramic barricade and the first ceramic barricade concentrically axle are arranged;
(2) be all coated with liquid glass at the upper surface of described first ceramic barricade and the second ceramic barricade, form the glassy layer with curved surface;
(3) LED chip settled by the substrate within the scope of the inner ring surrounded at described first ceramic barricade, then on described LED chip, phosphor is dripped to cover described LED chip, prevent phosphor from overflowing by the glassy layer being placed in the first ceramic barricade upper surface, thus form luminous element;
(4) liquid-state silicon is dripped in the gap between described first ceramic barricade and the second ceramic barricade, prevent liquid-state silicon from overflowing by the glassy layer being placed in the second ceramic barricade upper surface, thus form the silicon lens shell covering described first ceramic barricade and luminous element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210172657.7A CN102709443B (en) | 2012-05-30 | 2012-05-30 | LED (Light-Emitting Diode) package and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210172657.7A CN102709443B (en) | 2012-05-30 | 2012-05-30 | LED (Light-Emitting Diode) package and packaging method thereof |
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| Publication Number | Publication Date |
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| CN102709443A CN102709443A (en) | 2012-10-03 |
| CN102709443B true CN102709443B (en) | 2014-12-24 |
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| CN201210172657.7A Expired - Fee Related CN102709443B (en) | 2012-05-30 | 2012-05-30 | LED (Light-Emitting Diode) package and packaging method thereof |
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| CN104835895B (en) * | 2014-02-07 | 2017-12-01 | 弘凯光电(深圳)有限公司 | LED-mounted device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1898811A (en) * | 2004-10-18 | 2007-01-17 | Lg伊诺特有限公司 | Phosphor, light emitting device by using the same and manufacturing method of the same |
| CN202231053U (en) * | 2011-07-19 | 2012-05-23 | 彩虹集团公司 | LED (light-emitting diode) ceramic substrate for integrated packaging |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100752586B1 (en) * | 2004-06-28 | 2007-08-29 | 쿄세라 코포레이션 | Light-emitting apparatus and illuminating apparatus |
| CN100576291C (en) * | 2005-05-31 | 2009-12-30 | 皇家飞利浦电子股份有限公司 | light source with fabric diffusing layer |
| KR101104034B1 (en) * | 2007-12-06 | 2012-01-09 | 엘지이노텍 주식회사 | Lighting emitting diode, Lighting Emitting Apparatus and fabrication method thereof |
| TWI411142B (en) * | 2009-06-23 | 2013-10-01 | Delta Electronics Inc | Illuminating device and packaging method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1898811A (en) * | 2004-10-18 | 2007-01-17 | Lg伊诺特有限公司 | Phosphor, light emitting device by using the same and manufacturing method of the same |
| CN202231053U (en) * | 2011-07-19 | 2012-05-23 | 彩虹集团公司 | LED (light-emitting diode) ceramic substrate for integrated packaging |
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Effective date of registration: 20170524 Address after: Singapore Ang Mo Kio 65 Street No. 10 techpoint Building 1 floor, No. 8 Co-patentee after: AAC Precision Manufacturing Technology (Changzhou) Co., Ltd. Patentee after: AAC Technologies (Singapore) Co., Ltd. Address before: 518057 Nanshan District province high tech Industrial Park, Shenzhen, North West New Road, No. 18 Co-patentee before: AAC Precision Manufacturing Technology (Changzhou) Co., Ltd. Patentee before: AAC Acoustic Technologies (Shenzhen) Co., Ltd. |
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