CN102709053A - Polymer stack capacitor and manufacturing method thereof - Google Patents
Polymer stack capacitor and manufacturing method thereof Download PDFInfo
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- CN102709053A CN102709053A CN2012101799099A CN201210179909A CN102709053A CN 102709053 A CN102709053 A CN 102709053A CN 2012101799099 A CN2012101799099 A CN 2012101799099A CN 201210179909 A CN201210179909 A CN 201210179909A CN 102709053 A CN102709053 A CN 102709053A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
- H01G9/028—Organic semiconducting electrolytes, e.g. TCNQ
Abstract
The invention relates to a polymer stack capacitor and a preparation method thereof, belonging to the technical field of electronic components. Because an organic polymer with high dielectric constant has poor processability, the capacitor can not be manufactured in the winding way. The polymer stack capacitor manufactured in a stacking way can accurately control the dimensions and the thickness of each organic polymer dielectric film. Meanwhile, an organic polymer electrode material is adopted, so that the effective area of electrodes can be greatly increased. The capacitor of the polymer stack capacitor is 10-100 times of that of the traditional metalized film capacitor with the same volume, and the miniaturization and high-capacity development of the stack capacitor is promoted. Moreover, with the stack square structure, the capability of product end face resisting the current impact can be enhanced, the inductance is reduced, and the stability and the reliability of the product can be increased. Meanwhile, because the polymer stack capacitor is made of a polymer, the use of resource raw materials can be reduced, and the purposes of protecting environment and saving energy can be achieved.
Description
Technical field
The invention belongs to technical field of electronic components, relate to polymer lamination type electric container and manufacturing technology thereof.
Background technology
Chip capacitor is an element indispensable on the modern electronic equipment, can be used as the circuit rectification filter element, DC power supply push away bypass in coupling element and the voicefrequency circuit, coupling element etc.So chip capacitor at all kinds of electron electric power devices, finds broad application in space flight and aviation and the military weapon field.Along with the 21 century progress of science and technology, the development of electronics miniaturization, high capacity, miniaturization, wideband, wide voltage, wide temperature, environmental protection and energy saving are main directions of chip capacitor development.
What traditional metallized polymeric films capacitor adopted usually is takeup type technology; Require the organic polymer dielectric to have preferably mechanical property and ductility; The processing so that reel; And the polymer of general high-k does not often possess this performance, or even exists with powdered form, and what adopt is to have materials (relative dielectric constant is 1 ~ 3) such as 10 μ m left and right thicknesses, polyethylene that dielectric constant is lower, polypropylene, polyphenylene sulfide so metallic film capacitor is general; The effective area of metallic electrode is less simultaneously; More than some all is unfavorable for the development of chip capacitor to the miniaturization high capacity.
Summary of the invention:
The present invention provides a kind of polymer lamination type electric container, has the lamination sheet type structure, and dielectric material adopts the organic polymer of dielectric constant higher relatively (about 10), and inner electrode adopts conducting polymer.The present invention provides the preparation method of the simple polymer stack chip capacitor of a kind of technology simultaneously.
Technical scheme of the present invention is following:
A kind of polymer lamination type electric container, as shown in Figure 1, comprise capacitor body by the alternately laminated square shape lamination of multilayer organic polymer dielectric film 3 and multilayer conductive polymer electrode film 4.In the capacitor body of said square shape lamination; The two-layer conductive polymer electrodes film 4 property one-tenth that are positioned at each layer organic polymer dielectric film 3 two sides are interspersed: promptly wherein one deck conductive polymer electrodes film 4 is coated with the left side of organic polymer dielectric film 3 upper surfaces, and another layer conductive polymer electrodes film 4 is coated with the right side of organic polymer dielectric film 3 lower surfaces; By the dielectric layer of up and down two-layer conductive polymer electrodes film 4 staggered microcapacitor unit of parts formation that cover, the two-layer conductive polymer electrodes film 4 that is interspersed up and down constitutes the upper/lower electrode of a microcapacitor unit in one deck organic polymer dielectric film 3.Respectively there is one deck backing material 1 the capacitor body end face and the bottom surface of said square shape lamination; The right ends of the capacitor body of said square shape lamination respectively has 6, two metal end electrodes 6 of a metal end electrode all microcapacitor unit of capacitor body inner stacks is connected in parallel.
Above-mentioned polymer lamination type electric container, the said polymer lamination type electric container part except that metal end electrode 6 adopts epoxy powder spraying encapsulation.
In the above-mentioned polymer lamination type electric container, said organic polymer dielectric film 3 is Kynoar/Graphene laminated film (PVDF/Graphene), nano barium phthalate/Kynoar laminated film (BT/PVDF), titanium cyanines copper film (Cu (ttb) Pc), polypropylene/Kynoar laminated film (PP/PVDF), ethylene/vinyl acetate copolymer film (EVA) or economize and quinone film (PAQR) more.
In the above-mentioned polymer lamination type electric container, said conductive polymer electrodes film 4 is layer/polyaniline conductive film (Pani), polythiophene conductive film (PT), polypyrrole conductive film (PPY) or polythiophene/kayexalate composite conductive thin films (PEDOT/PSS).
A kind of preparation method of polymer lamination type electric container may further comprise the steps:
Step 1: at backing material 1 surface deposition one deck organic polymer dielectric film 3;
Step 2: at organic polymer dielectric film 3 surface deposition one deck conductive polymer electrodes films 4;
Step 3: at conductive polymer electrodes film 4 surface deposition one deck organic polymer dielectric films 3;
Step 4: execution in step 2 and step 3 repeatedly, till the capacitor body of the square shape lamination that obtains reaches the thickness that needs; Should guarantee that when depositing electrically conductive electrostrictive polymer very thin films 4 two-layer conductive polymer electrodes film 4 formation that are positioned at each layer organic polymer dielectric film 3 two sides are interspersed: wherein one deck conductive polymer electrodes film 4 is coated with the left side of organic polymer dielectric film 3 upper surfaces, and another layer conductive polymer electrodes film 4 is coated with the right side of organic polymer dielectric film 3 lower surfaces; By the dielectric layer of up and down two-layer conductive polymer electrodes film 4 staggered microcapacitor unit of parts formation that cover, the two-layer conductive polymer electrodes film 4 that is interspersed up and down constitutes the upper/lower electrode of a microcapacitor unit in one deck organic polymer dielectric film 3;
Step 5: the capacitor body end face at step 4 gained square shape lamination increases a backing material 1, obtains the capacitor body of final square shape lamination;
Step 6: at the capacitor body two ends impregnated silver pulp of the final square shape lamination of step 5 gained;
Step 7: silver slurry end-blocking, make metal end electrode 6, and will spray encapsulation except that the part the metal end electrode 6 with powdered epoxy resin.
Through above-mentioned steps, can prepare polymer lamination type electric container according to the invention.
Need to prove that in the above-mentioned method for preparing polymer lamination type electric container, the depositing operation of said organic polymer dielectric film 3 and conductive polymer electrodes film 4 can adopt self assembly coating technique or Langmuir-Blodgett film technology.
Owing to the organic polymer processing characteristics that dielectric constant is higher is relatively poor, can not adopt winding method to make capacitor, the present invention adopts the polymer lamination type electric container of overlapped way making, can accurately control size, the thickness of every layer of organic polymer dielectric film; What the present invention simultaneously adopted is the organic polymer electrode material, can carry the effective area of electrode greatly; Can reach 10 ~ 100 times of traditional metallic film capacitor capacity with polymer lamination type electric container of the present invention under the volume, advance the miniaturization high capacity progress of chip capacitor.The lamination square shape structure that adopts of the present invention in addition can strengthen the ability of the anti-rush of current of product end surface, reduces inductance, improves product stability and reliability; The material that polymer lamination type electric container simultaneously of the present invention adopts is a polymer, can reduce the raw-material use of resource, reaches the purpose of environmental protection and energy saving.
Description of drawings
Fig. 1 is a polymer lamination type electric container core structures sketch map provided by the invention.Wherein: 1 is backing material, and 3 is the organic polymer dielectric film, and 4 is the conductive polymer electrodes film, and 6 is the metal end electrode.
Embodiment
Embodiment one
(a) on the self assembly coating machine, clamp an end of clean substrate with clip, it is 5mm/min that the pull rate that makes progress is set, and pull rate is 20mm/min downwards.In the PVDF/Graphene composite solution of substrate immersion 8%, come and go 2 times, can form PVDF/Graphene composite high-dielectric film.
(b) on the self assembly coating machine, clamp the other end of handling back substrate through step (a) with clip, it is 10mm/min that the pull rate that makes progress is set, pull rate is 30mm/min downwards.In the PEDOT/PSS solution of substrate immersion 10%, the degree of depth is no more than 90% of substrate length, comes and goes 5 times, can form the PEDOT/PSS electrode.
(c) on the self assembly coating machine, clamp an end of handling back substrate through step (b) with clip, it is 5mm/min that the pull rate that makes progress is set, and pull rate is 20mm/min downwards.In the PVDF/Graphene composite solution of substrate immersion 8%, come and go 2 times, can form PVDF/Graphene composite high-dielectric film.
(d) on the self assembly coating machine, clamp the other end of handling back substrate through step (c) with clip, it is 10mm/min that the pull rate that makes progress is set, pull rate is 30mm/min downwards.In the PEDOT/PSS solution of substrate immersion 10%, the degree of depth is no more than 90% of substrate length, comes and goes 5 times, can form the PEDOT/PSS electrode.
(e) repeat above-mentioned (a) ~ (d) process repeatedly, can form the capacitor body of the square shape lamination that cascades by a plurality of microcapacitors unit.
(f) impregnated silver pulp at the capacitor body two ends of square shape lamination respectively.
(g) capacitor body is bonded on the lead frame, adopts epoxy powder spraying encapsulation, obtain final polymer lamination type electric container.
Embodiment two
(a) on the self assembly coating machine, clamp an end of clean substrate with clip, it is 5mm/min that the pull rate that makes progress is set, and pull rate is 20mm/min downwards.In the PP/PVDF composite solution of substrate 15%, come and go 2 times, can form PP/PVDF composite high-dielectric film.
(b) on the self assembly coating machine, clamp the other end of handling back substrate through step (a) with clip, it is 10mm/min that the pull rate that makes progress is set, pull rate is 30mm/min downwards.In the PPY solution of substrate immersion 10%, the degree of depth is no more than 90% of substrate length, comes and goes 5 times, can form the PPY electrode.
(c) on the self assembly coating machine, clamp an end of handling back substrate through step (b) with clip, it is 5mm/min that the pull rate that makes progress is set, and pull rate is 20mm/min downwards.In the PP/PVDF composite solution of substrate immersion 15%, come and go 2 times, can form PP/PVDF composite high-dielectric film.
(d) on the self assembly coating machine, clamp the other end of handling back substrate through step (c) with clip, it is 10mm/min that the pull rate that makes progress is set, pull rate is 30mm/min downwards.In the PPY solution of substrate immersion 10%, the degree of depth is no more than 90% of substrate length, comes and goes 5 times, can form the PPY electrode.
(e) repeat above-mentioned (a) ~ (d) process repeatedly, can form the capacitor body of the square shape lamination that cascades by a plurality of microcapacitors unit.
(f) impregnated silver pulp at the capacitor body two ends of square shape lamination respectively.
(g) capacitor body is bonded on the lead frame, adopts epoxy powder spraying encapsulation, obtain final polymer lamination type electric container.
Embodiment three
(a) on the self assembly coating machine, clamp an end of clean substrate with clip, it is 5mm/min that the pull rate that makes progress is set, and pull rate is 20mm/min downwards.In the PAQR solution of substrate immersion 6%, come and go 2 times, can form the PAQR high dielectric thin film.
(b) on the self assembly coating machine, clamp the other end of handling back substrate through step (a) with clip, it is 10mm/min that the pull rate that makes progress is set, pull rate is 30mm/min downwards.In the Pani solution of substrate immersion 8%, the degree of depth is no more than 90% of substrate length, comes and goes 5 times, can form the Pani electrode.
(c) on the self assembly coating machine, clamp an end of handling back substrate through step (b) with clip, it is 5mm/min that the pull rate that makes progress is set, and pull rate is 20mm/min downwards.In the PAQR solution of substrate immersion 6%, come and go 2 times, can form the PAQR high dielectric thin film.
(d) on the self assembly coating machine, clamp the other end of handling back substrate through step (c) with clip, it is 10mm/min that the pull rate that makes progress is set, pull rate is 30mm/min downwards.In the Pani solution of substrate immersion 8%, the degree of depth is no more than 90% of substrate length, comes and goes 5 times, can form the Pani electrode.
(e) repeat above-mentioned (a) ~ (d) process repeatedly, can form the capacitor body of the square shape lamination that cascades by a plurality of microcapacitors unit.
(f) impregnated silver pulp at the capacitor body two ends of square shape lamination respectively.
(g) capacitor body is bonded on the lead frame, adopts epoxy powder spraying encapsulation, obtain final polymer lamination type electric container.
Claims (9)
1. polymer lamination type electric container comprises the capacitor body by the alternately laminated square shape lamination of multilayer organic polymer dielectric film (3) and multilayer conductive polymer electrode film (4);
In the capacitor body of said square shape lamination; The two-layer conductive polymer electrodes film (4) that is positioned at each layer organic polymer dielectric film (3) two sides forms and to be interspersed: promptly wherein one deck conductive polymer electrodes film (4) is coated with the left side of organic polymer dielectric film (3) upper surface, and another layer conductive polymer electrodes film (4) is coated with the right side of organic polymer dielectric film (3) lower surface; One deck organic polymer dielectric film (3) is middle by the dielectric layer of a microcapacitor unit of part formation of the staggered covering of two-layer conductive polymer electrodes film (4) up and down, and the two-layer conductive polymer electrodes film (4) that is interspersed up and down constitutes the upper/lower electrode of a microcapacitor unit;
Respectively there is one deck backing material (1) the capacitor body end face of said square shape lamination and bottom surface;
The right ends of the capacitor body of said square shape lamination respectively has a metal end electrode (6), and two metal end electrodes (6) are connected in parallel all microcapacitor unit of capacitor body inner stacks.
2. polymer lamination type electric container according to claim 1 is characterized in that, the part of said polymer lamination type electric container except that metal end electrode (6) adopts epoxy powder spraying encapsulation.
3. polymer lamination type electric container according to claim 1 and 2; It is characterized in that said organic polymer dielectric film (3) is Kynoar/Graphene laminated film, nano barium phthalate/Kynoar laminated film, titanium cyanines copper film, polypropylene/Kynoar laminated film, ethylene/vinyl acetate copolymer film or economize and the quinone film more.
4. polymer lamination type electric container according to claim 1 and 2; It is characterized in that said conductive polymer electrodes film (4) is layer/polyaniline conductive film, polythiophene conductive film, polypyrrole conductive film or polythiophene/kayexalate composite conductive thin film.
5. polymer lamination type electric container according to claim 1 and 2 is characterized in that said metal end electrode (6) is a silver electrode.
6. the preparation method of a polymer lamination type electric container may further comprise the steps:
Step 1: at backing material (1) surface deposition one deck organic polymer dielectric film (3);
Step 2: at organic polymer dielectric film (3) surface deposition one deck conductive polymer electrodes film (4);
Step 3: at conductive polymer electrodes film (4) surface deposition one deck organic polymer dielectric film (3);
Step 4: execution in step 2 and step 3 repeatedly, till the capacitor body of the square shape lamination that obtains reaches the thickness that needs; Should guarantee that when depositing electrically conductive electrostrictive polymer very thin films (4) two-layer conductive polymer electrodes film (4) formation that is positioned at each layer organic polymer dielectric film (3) two sides is interspersed: wherein one deck conductive polymer electrodes film (4) is coated with the left side of organic polymer dielectric film (3) upper surface, and another layer conductive polymer electrodes film (4) is coated with the right side of organic polymer dielectric film (3) lower surface; One deck organic polymer dielectric film (3) is middle by the dielectric layer of a microcapacitor unit of part formation of the staggered covering of two-layer conductive polymer electrodes film (4) up and down, and the two-layer conductive polymer electrodes film (4) that is interspersed up and down constitutes the upper/lower electrode of a microcapacitor unit;
Step 5: the capacitor body end face at step 4 gained square shape lamination increases a backing material (1), obtains the capacitor body of final square shape lamination;
Step 6: at the capacitor body two ends impregnated silver pulp of the final square shape lamination of step 5 gained;
Step 7: silver slurry end-blocking, make metal end electrode (6), and will spray encapsulation except that the part the metal end electrode (6) with powdered epoxy resin.
7. the preparation method of polymer lamination type electric container according to claim 6; It is characterized in that said organic polymer dielectric film (3) is Kynoar/Graphene laminated film, nano barium phthalate/Kynoar laminated film, titanium cyanines copper film, polypropylene/Kynoar laminated film, ethylene/vinyl acetate copolymer film or economize and the quinone film more.
8. the preparation method of polymer lamination type electric container according to claim 6; It is characterized in that said conductive polymer electrodes film (4) is layer/polyaniline conductive film, polythiophene conductive film, polypyrrole conductive film or polythiophene/kayexalate composite conductive thin film.
9. the preparation method of polymer lamination type electric container according to claim 6; It is characterized in that the depositing operation of said organic polymer dielectric film (3) and conductive polymer electrodes film (4) adopts self assembly coating technique or Langmuir-Blodgett film technology.
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| CN2012101799099A CN102709053A (en) | 2012-06-04 | 2012-06-04 | Polymer stack capacitor and manufacturing method thereof |
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| CN2012101799099A CN102709053A (en) | 2012-06-04 | 2012-06-04 | Polymer stack capacitor and manufacturing method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109841430A (en) * | 2019-03-22 | 2019-06-04 | 杭州灵通电子有限公司 | A kind of termination device and closed-end technology for large scale multilayer ceramic capacitor |
| EP3511964A1 (en) * | 2013-03-14 | 2019-07-17 | Saudi Basic Industries Corporation | Fractional order capacitor based on dielectric polymer doped with conductive nano-fillers |
| CN110556247A (en) * | 2019-09-11 | 2019-12-10 | 邯郸学院 | preparation method of sandwich-structure high-energy-storage low-conductivity polymer-based composite film |
| CN110931261A (en) * | 2019-12-18 | 2020-03-27 | 中原工学院 | Preparation method of flexible fabric supercapacitor electrode material with graphene/polypyrrole as active substance |
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| US5731948A (en) * | 1996-04-04 | 1998-03-24 | Sigma Labs Inc. | High energy density capacitor |
| CN1321993A (en) * | 2000-08-12 | 2001-11-14 | 王喜成 | Film capacitor and its production method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP3511964A1 (en) * | 2013-03-14 | 2019-07-17 | Saudi Basic Industries Corporation | Fractional order capacitor based on dielectric polymer doped with conductive nano-fillers |
| CN109841430A (en) * | 2019-03-22 | 2019-06-04 | 杭州灵通电子有限公司 | A kind of termination device and closed-end technology for large scale multilayer ceramic capacitor |
| CN110556247A (en) * | 2019-09-11 | 2019-12-10 | 邯郸学院 | preparation method of sandwich-structure high-energy-storage low-conductivity polymer-based composite film |
| CN110931261A (en) * | 2019-12-18 | 2020-03-27 | 中原工学院 | Preparation method of flexible fabric supercapacitor electrode material with graphene/polypyrrole as active substance |
| CN110931261B (en) * | 2019-12-18 | 2021-10-29 | 中原工学院 | Preparation method of flexible fabric supercapacitor electrode material with graphene/polypyrrole as active substance |
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Application publication date: 20121003 |