CN102703867A - Electron bombardment coating machine - Google Patents
Electron bombardment coating machine Download PDFInfo
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- CN102703867A CN102703867A CN2012100125370A CN201210012537A CN102703867A CN 102703867 A CN102703867 A CN 102703867A CN 2012100125370 A CN2012100125370 A CN 2012100125370A CN 201210012537 A CN201210012537 A CN 201210012537A CN 102703867 A CN102703867 A CN 102703867A
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Abstract
The invention discloses an electron bombardment coating machine which comprises a cavity, an evacuating device, a substrate conveying device, an evaporation source device, a coating thickness monitoring unit and a controller. The cavity is provided with a vacuum cavity communicated with the evacuating device. The substrate conveying device is used for conveying substrates between the outside and the vacuum cavity. The evaporation source device located inside the vacuum cavity below the substrate inside the vacuum cavity comprises a body, an electron gun, deflecting electrodes and an evaporation source carrier. The electron gun and the evaporation source carrier are respectively arranged in the body of the evaporation source device. The deflecting electrodes are located between the electron gun and the evaporation source carrier. The top of the body is provided with an electron gun ejection outlet and a sputtering opening. The coating thickness monitoring unit comprises a coating thickness monitor which is located inside the vacuum cavity and between the evaporation source device and one substrate. The controller is respectively electrically connected with the evacuating device, the electron gun, the deflecting electrodes, the substrate conveying device and the coating thickness monitor. By the electron bombardment coating machine, evaporating efficiency and material utilization rate can be improved to meet the requirement for automation.
Description
Technical field
The present invention relates to a kind of coating equipment that the substrate in the Organic Light Emitting Diode is carried out plated film that is applicable to, relate in particular to a kind of electron-bombardment coating equipment that substrate in the Organic Light Emitting Diode is carried out plated film.
Background technology
Thin plates such as glass baseplate have been widely used in makes LCD-TFT image display, organic light emitting display (OLED) panel, solar panel and other fellows.In this type of is used mostly at cleaning plating film on glass; The processing procedure of this type large glass base material comprises usually implements a plurality of consecutive steps, comprises like chemical vapor deposition process (CVD), physical vapor deposition processing procedure (PVD), organic substance vapor deposition, magnetron sputtering deposition or etch process.
Because the processing requirement of above-mentioned processing procedure is all relatively stricter; Especially organic substance vapor deposition processing procedure; Not only need in clean fully space environment, carry out; And also quite strict for the requirement of the coating film thickness of glass substrate, need the staff can in coating process, accomplish complete monitoring, understand the thickness of coatings at any time so that the coatings thickness of the glass substrate behind the plated film reaches the needed uniformity requirement of technology.Wherein, In the glass substrate process of plating; The evaporation source that can use coating equipment evaporates organic substance; And the quality of the evaporation source performance of coating equipment directly has influence on the homogeneity of glass substrate coatings thickness, and therefore, the evaporation source of the coating equipment that chooses is to guarantee that the glass substrate coatings has one of inhomogeneity essential condition.But but there is following deficiency in the evaporation source of existing coating equipment:
The evaporation source of existing coating equipment is in the heating chamber that places evaporation source of concentrating all organic substances; Hot-plate to evaporation source applies electric current so that hot-plate generates heat and then carry out heating evaporation formation evaporated material to the organic substance in the heating chamber then; Evaporated material through behind the evaporation source nozzle of evaporation source to around diffusion, the evaporated material of diffusion is attached at glass substrate to realize the plated film of glass substrate.
Yet; Hot-plate generates heat and then carries out heating evaporation formation evaporated material to the organic substance in the heating chamber substrate is carried out vapor deposition because the evaporation source of existing coating equipment is through hot-plate is applied electric current; Make that on the one hand thermal conduction and thermal radiation loss are big, it is low to have reduced vaporization efficiency; The heating of evaporating materials disperses on the other hand, has correspondingly increased the usage quantity of evaporating materials, thereby has reduced the utilization ratio of evaporating materials; Moreover the nuclear power when evaporating materials is evaporated is less, thus make that the film adhesion of film forming on substrate is relatively poor, so have influence on the coating quality of substrate; In addition, cannot to some metals hard to tolerate and non-metallic material (like golden, tungsten and silicon-dioxide etc. " carry out vapor deposition, so the accommodation of the existing coating equipment that contracted.
Therefore, be badly in need of a kind of electron-bombardment coating equipment and overcome above-mentioned defective.
Summary of the invention
The object of the present invention is to provide a kind of electron-bombardment coating equipment, this electron-bombardment coating equipment can improve vaporization efficiency and evaporating materials utilization ratio on the one hand; Make film adhesion on the substrate better to improve the coating quality of substrate on the other hand, can also enlarging application range.
For realizing above-mentioned purpose; The invention provides a kind of electron-bombardment coating equipment; Be applicable to that to substrate evaporated film layer wherein, said electron-bombardment coating equipment comprises cavity, vacuum extractor, base board delivery device, evaporation source, film thickness monitoring device and unit.Offer the vacuum chamber that vacuum environment is provided in the said cavity, said vacuum extractor is communicated with said vacuum chamber.Said base board delivery device is arranged on the said cavity, and said base board delivery device is born the conveying of substrate between extraneous and said vacuum chamber.Said evaporation source is built in the said vacuum chamber and is positioned under the substrate of said vacuum chamber, and said evaporation source comprises device body and is built in the electron beam gun of said device body, deflection electrode and evaporation source and takes up device; Said electron beam gun is positioned at the left end of said device body; Said evaporation source takes up the right-hand member that device is positioned at said device body; Said deflection electrode takes up between the device at said electron beam gun and evaporation source; And the top of said device body offers the electron beam gun exit wound of bullet corresponding with said electron beam gun respectively, takes up the corresponding sputter opening of device with evaporation source, and the electron beam that said deflection electrode sends said electron beam gun passes the electron beam gun exit wound of bullet and injects said sputter opening and then make the said evaporation source of this electron beam evaporation take up the evaporating materials in the device.Said film thickness monitoring device comprises film thickness monitor, and said film thickness monitor is arranged in the said vacuum chamber, and between the substrate of said film thickness monitor in said evaporation source and said vacuum chamber.Said unit is respectively with said vacuum extractor, electron beam gun, the conduct electricity utmost point, base board delivery device and thick film monitor electrically connects partially.
Preferably; Said cavity comprises secondary cavity and the main cavity that is connected; Said main cavity be positioned at said secondary cavity directly over; Said evaporation source is arranged in the vacuum chamber of said secondary cavity, and said base board delivery device is born the conveying of substrate between the vacuum chamber of extraneous and said main cavity, and it is interior and be positioned at the top of said evaporation source that said film thickness monitor is arranged at the vacuum chamber of said secondary cavity; And said film thickness monitoring device also is provided with first feedthrough that is connected with said film thickness monitor, and said first feedthrough and said unit electrically connect and be arranged on the said secondary cavity.Wherein,, be convenient to the processing of cavity on the one hand and can reduce its manufacturing cost, also be convenient to the conveying of the installation and maintenance of evaporation source and base board delivery device to substrate by the cavity that above-mentioned secondary cavity and main cavity form; Can work more reliably to guarantee film thickness monitor by the first above-mentioned feedthrough.
Preferably; Said electron-bombardment coating equipment also comprises heating unit; Said heating unit comprises hot-plate, thermopair and second feedthrough that electrically connects with said unit; Said hot-plate is arranged in the vacuum chamber of said main cavity and is positioned at directly over the substrate of vacuum chamber of said main cavity; The bottom of said thermopair is corresponding with said hot-plate, and stretch out outside the said main cavity on the top of said thermopair, and said second feedthrough is the junction of said thermopair of being arranged at of sealing and said main cavity.Wherein,, can carry out uniform heating to the substrate in the vacuum chamber of main cavity by above-mentioned heating unit, thus more effective raising film forming speed and film adhesion; By the above-mentioned thermopair and second feedthrough, can be in real time with the Temperature Feedback in the main cavity in unit, make unit revise the electric current of hot-plate, thereby make heating unit can keep on the more excellent Heating temperature according to the temperature of feedback.
Preferably; Be provided with dismountable antifouling board in the vacuum chamber of said main cavity and secondary cavity; And the cooling tube that also is provided with viewing window on said main cavity and the secondary cavity and is connected with extraneous refrigerating unit; The cooling tube of said main cavity be positioned at said main cavity with the corresponding sidewall of said hot-plate outside; The viewing window of said main cavity is positioned at outside the sidewall of said main cavity, and the substrate in the vacuum chamber of the viewing window of said main cavity and said main cavity is corresponding, and the cooling tube of said main cavity is positioned at the top of the viewing window of said main cavity; The cooling tube of said secondary cavity and viewing window all be positioned at said secondary cavity with the corresponding sidewall of said evaporation source outside, and the viewing window of said secondary cavity is positioned at the top of the cooling tube of said secondary cavity.Wherein, by above-mentioned antifouling board, prevent that main cavity and secondary cavity are contaminated, thereby be convenient to maintenance main cavity and secondary cavity; Simultaneously, the antifouling board of secondary cavity can also be avoided the injury of the secondary cavity of harmful electron pair of electron beam gun generation; By above-mentioned cooling tube, rapidly the thermal-radiating heat of main cavity and secondary cavity is taken away, work thereby make cavity be maintained under the more excellent temperature; By the viewing window of above-mentioned main cavity, be convenient to the assurance of operator to the substrate film coating situation in the vacuum chamber of main cavity; By the viewing window of above-mentioned secondary cavity, be convenient to the assurance of operator to the evaporation situation of evaporation source.
Preferably; Said electron-bombardment coating equipment also comprises the viewing window radical occlusion device; Said viewing window shutter device comprises a shutter and orders about the rotary drive of said shutter rotation; Said rotary drive is installed on the sidewall of said secondary cavity; And an end of said rotary drive is in the vacuum chamber that stretches into said secondary cavity of sealing and with said shutter and is connected, and said shutter blocks the viewing window of said secondary cavity, thereby prevents effectively that viewing window on the secondary cavity is contaminated and influence monitoring effect.Particularly, said secondary cavity also is provided with a maintenance door, and the viewing window of said film thickness monitor, first feedthrough, viewing window radical occlusion device and said secondary cavity all is arranged on the said maintenance door, so that operator safeguard the intravital parts in secondary chamber.
Preferably; Said base board delivery device comprises magnetic fluid seal, delivery wheel and the substrate driving mechanism that electrically connects with said unit; Said main cavity is provided with two tracks along the fore-and-aft direction of this main cavity; Said track lays respectively at the right ends of the vacuum chamber in the said main cavity; Said delivery wheel is being arranged on each said track of row's shape along the fore-and-aft direction of said main cavity, forms the delivery area that supplies conveying substrate to use between the delivery wheel on the two said tracks, and said substrate driving mechanism is installed on the said main cavity; And the output shaft along continuous straight runs of said substrate driving mechanism stretches in the vacuum chamber of said main cavity and with said delivery wheel and is connected, and said magnetic fluid seal is installed on the said main cavity and seals the junction of the output shaft and the main cavity of said substrate driving mechanism.Wherein, Reach the base board delivery device of the substrate driving mechanism composition that electrically connects with unit by above-mentioned magnetic fluid seal, delivery wheel; Make base board delivery device can bear substrate more reliably and between the vacuum chamber of extraneous and main cavity, carry, and can simplify the structure of base board delivery device.Particularly; Said base board delivery device also comprises the little kickstand that is carried in the said delivery area; Said little kickstand is provided with several substrate gripper jaws; Said substrate gripper jaw is and is distributed in being provided with around the substrate and forms the substrate clamp area, makes substrate to be clamped in reliably on the little kickstand, and by little kickstand make substrate can be more reliably in the vacuum chamber of extraneous and main cavity between conveying.Simultaneously, offer in the said track and put the cooling loop that is connected with extraneous refrigerating unit,, thereby safeguard being in the more excellent temperature in the main cavity so that the heat that is produced by thermal radiation on the track is taken away.
Preferably; Said electron-bombardment coating equipment also comprises retaining device; Said retaining device comprises evaporation shield and the flapper actuator that electrically connects with said unit; The output shaft of said flapper actuator is in the vacuum chamber that stretches into said secondary cavity of sealing and with said evaporation shield and is connected; Said evaporation shield is arranged between the substrate of the vacuum chamber in said evaporation source and the said main cavity, and said evaporation shield is opened or separated the spatial communication that substrate and said evaporation source in the vacuum chamber of said main cavity take up device.Wherein, by above-mentioned retaining device, the vapor deposition time of control basal plate that can be strict, thus improved the coating quality of substrate.
Preferably, said vacuum extractor comprises vacuum pipe and the vacuum pump that electrically connects with said unit, and said vacuum pipe is provided with thick vacuum pumping valve, high vacuum pumping valve, inflation valve and vacuum gauge.Wherein,, shorten the time that forms vacuum environment in the cavity on the one hand, make that on the other hand the quality of the interior vacuum environment that forms of cavity is higher by the cooperation of thick vacuum pumping valve and high vacuum pumping valve; By above-mentioned vacuum gauge, be convenient to the assurance of operator to the intravital vacuum environment in chamber; By above-mentioned inflation valve, be convenient to operator to the intravital component maintenance in chamber.Particularly, as follows:
Said vacuum extractor also comprises the condensation pump that is arranged on the said vacuum pipe; Dampening assembly between said condensation pump and the said vacuum pipe; Said dampening assembly comprises damping air spring and damping corrugated tube, and the upper end of said damping corrugated tube is connected with said vacuum pipe, and the lower end of said damping corrugated tube is connected with said condensation pump; Said damping air spring be distributed in said ripple shake corrugated tube around, and the two ends of said damping air spring are connected with said vacuum pipe and condensation pump respectively.Wherein, by ripple shake corrugated tube and damping air spring, weaken of the vibrations of the condensation pump of work effectively to cavity; By above-mentioned condensation pump, for cavity can be created more excellent vacuum environment.
Compared with prior art; Because electron beam gun of the present invention is positioned at the left end of device body; Evaporation source takes up the right-hand member that device is positioned at device body; Deflection electrode takes up between the device at electron beam gun and evaporation source; And the top of device body offers the electron beam gun exit wound of bullet corresponding with electron beam gun respectively, takes up the corresponding sputter opening of device with evaporation source, so the electron beam that electron beam gun is sent by deflection electrode passes the electron beam gun exit wound of bullet and injects the sputter opening and then make this electron beam evaporation evaporation source take up the evaporating materials in the device, makes that on the one hand the thermo-efficiency when electron beam gun evaporates evaporating materials is high; Thermal conduction and thermal radiation loss are few, thereby have improved vaporization efficiency; On the other hand the heating of evaporating materials is concentrated, correspondingly reduce the waste of evaporating materials, thereby improved the utilization ratio of evaporating materials; Simultaneously, with electron beam evaporating materials is evaporated, the atom kinetic energy when making evaporation is bigger; Correspondingly improved on the substrate sticking power of rete after the film forming; Thereby improved the coating quality of substrate, and combined film thickness monitor, thereby made that the consistence of substrate film coating is fabulous.Moreover; With electron beam evaporating materials is evaporated; Make electron-bombardment plated film function of the present invention to some metals hard to tolerate and non-metallic material carry out evaporation coating (like gold, tungsten or silicon-dioxide etc.), thereby enlarged the use range of electron-bombardment coating equipment of the present invention.In addition, electron-bombardment coating equipment of the present invention can be adapted under the control of unit in the occasion of robotization control.
Description of drawings
Fig. 1 is the structural representation of electron-bombardment coating equipment of the present invention.
Fig. 2 is that heating unit and base board delivery device shown in Figure 1 is installed in the structural representation on the main cavity.
Fig. 3 is that film thickness monitoring device, evaporation source, retaining device and viewing window radical occlusion device shown in Figure 1 is installed in the structural representation on the secondary cavity.
Fig. 4 is the structural representation of little kickstand of the base board delivery device of electron-bombardment coating equipment of the present invention.
Fig. 5 is the structural representation of the evaporation source of electron-bombardment coating equipment of the present invention.
Fig. 6 is the structural representation of the vacuum extractor of electron-bombardment coating equipment of the present invention.
Embodiment
In order to specify technology contents of the present invention, structural attitude, be described further below in conjunction with embodiment and conjunction with figs..
See also Fig. 1 to Fig. 5; Electron-bombardment coating equipment 100 of the present invention is used for substrate 200 evaporated film layers; Wherein, electron-bombardment coating equipment 100 of the present invention comprises cavity 10, vacuum extractor 20, base board delivery device 30, evaporation source 40, film thickness monitoring device 50 and unit.Offer the vacuum chamber 11 that vacuum environment is provided in the said cavity 10, create vacuum environment for the plated film of substrate 200, said vacuum extractor 20 is communicated with said vacuum chamber 11.Said base board delivery device 30 is arranged on the said cavity 10, and said base board delivery device 30 is born the conveying of substrate 200 between extraneous and said vacuum chamber 11.Said evaporation source 40 is built in the said vacuum chamber 11 and is positioned under the substrate 200 of said vacuum chamber 11, and said evaporation source 40 comprises device body 41 and is built in the electron beam gun 42 of said device body 41, deflection electrode 43 and evaporation source and takes up device 44.Said electron beam gun 42 is positioned at the left end of said device body 41; Said evaporation source takes up device 44 and more preferably is selected as crucible to simplify the structure that evaporation source takes up device 44; This evaporation source takes up the right-hand member that device 44 is positioned at said device body 41; Said deflection electrode 43 takes up between the device 44 at said electron beam gun 42 and evaporation source; And the top of said device body 41 offers the electron beam gun exit wound of bullet 41a corresponding with said electron beam gun 42 respectively, takes up the corresponding sputter opening 41b of device 44 with evaporation source; The electron beam that said deflection electrode 43 sends said electron beam gun 42 passes electron beam gun exit wound of bullet 41a and injects said sputter opening 41b and then make the said evaporation source of this electron beam evaporation take up the evaporating materials 300 in the device 44; And the direction of the directive of electron beam shown in the arrow A among Fig. 5, the direction of evaporated material sputter direction shown in the arrow B among Fig. 5 after evaporating materials 300 is evaporated.Said film thickness monitoring device 50 comprises film thickness monitor 51, and said film thickness monitor 51 is arranged in the said vacuum chamber 11, and between the substrate 200 of said film thickness monitor 51 in said evaporation source 40 and said vacuum chamber 11.Said unit is respectively with said vacuum extractor 20, electron beam gun 42, the conduct electricity utmost point 43, base board delivery device 30 and thick film monitor 51 electrically connects partially.
Wherein, for the ease of cavity 10 stable being placed on the ground, so on cavity 10, connect a resting support 15; Processing for the ease of cavity 10 also can reduce its manufacturing cost; Also be convenient to the installation and maintenance of evaporation source 40 and the conveying of 30 pairs of substrates 200 of base board delivery device; So said cavity 10 comprises secondary cavity 10b and the main cavity 10a that is connected; Said main cavity 10a be positioned at said secondary cavity 10b directly over; Said evaporation source 40 is arranged in the vacuum chamber 11b of said secondary cavity 10b; Said base board delivery device 30 is born the conveying of substrate 200 between the vacuum chamber 11a of extraneous and said main cavity 10a, and it is interior and be positioned at the top of said evaporation source 40 that said film thickness monitor 51 is arranged at the vacuum chamber 11b of said secondary cavity 10b, and said film thickness monitoring device 50 also is provided with first feedthrough 52 that is connected with said film thickness monitor 51; Said first feedthrough 52 electrically connects and is arranged on the said secondary cavity 10b with said unit, and can do more reliable work to guarantee film thickness monitor 51 by first feedthrough 52; For vapor deposition time of control basal plate 200 that can be strict to improve the coating quality of substrate 200; So electron-bombardment coating equipment 100 of the present invention also is provided with retaining device 90; Said retaining device 90 comprises evaporation shield 91 and the flapper actuator 92 that electrically connects with said unit; This flapper actuator 92 more preferably is selected as a motor provides the flapper actuator 92 of rotary power with simplification structure; And the output shaft 92a of said flapper actuator 92 is in the vacuum chamber 11b of the said secondary cavity 10b of stretching into of sealing and with said evaporation shield 91 and is connected; Said evaporation shield 91 is arranged between the substrate 200 of the vacuum chamber 11a in said evaporation source 40 and the said main cavity 10a, and said evaporation shield 91 is opened or separated the spatial communication that substrate 200 and said evaporation source in the vacuum chamber 11a of said main cavity 10a takes up device 44; In order to carry out uniform heating to the substrate in the vacuum chamber 11a of main cavity 10a 200; Thereby more effective raising film forming speed and film adhesion; Can also be in real time with the Temperature Feedback in the main cavity 10a in unit; Make unit carry out the correction of electric current according to the temperature of feedback; Thereby make main cavity 10a keep on the more excellent Heating temperature, so electron-bombardment coating equipment 100 of the present invention also is provided with heating unit 60, this heating unit 60 comprises hot-plate 61, thermopair 62 and second feedthrough 63 that electrically connects with said unit.Said hot-plate 61 is installed in the vacuum chamber 11a of said main cavity 10a through mounting block 64, and hot-plate 61 and being positioned at directly over the substrate 200 of vacuum chamber 11a of said main cavity 10a, so that the one side of substrate 200 is carried out uniform heating; The bottom of said thermopair 62 is corresponding with said hot-plate 61, and stretch out outside the said main cavity 10a on the top of said thermopair 62, and said second feedthrough 63 is the junction of the said thermopair 62 of being arranged at of sealing and said main cavity 10a.More specifically, as follows:
Than the superior; Be provided with dismountable antifouling board 71 in the vacuum chamber 11a of said main cavity 10a and the vacuum chamber 11b of secondary cavity 10b, and the cooling tube 72 that also is provided with viewing window 73 and is connected with extraneous refrigerating unit on said main cavity 10a and the secondary cavity 10b.The cooling tube 72 of said main cavity 10a be positioned at said main cavity 10a with said hot-plate 61 corresponding sidewalls outside; The viewing window 73 of said main cavity 10a is positioned at outside the sidewall of said main cavity 10a; And the viewing window 73 of said main cavity 10a is corresponding with the substrate 200 in the vacuum chamber 11a of said main cavity 10a, and the cooling tube 72 of said main cavity 10a is positioned at the top of the viewing window 73 of said main cavity 10a; The cooling tube 72 of said secondary cavity 10b and viewing window 73 all be positioned at said secondary cavity 10b with said evaporation source 40 corresponding sidewalls outside, and the viewing window 73 of said secondary cavity 10b is positioned at the top of the cooling tube 72 of said secondary cavity 10b.Wherein, by above-mentioned antifouling board 71, prevent that main cavity 10a and secondary cavity 10b are contaminated, thereby be convenient to maintenance main cavity 10a and secondary cavity 10b; Simultaneously, the antifouling board 71 of secondary cavity 10b can also be avoided the injury of the secondary cavity 10b of harmful electron pair of electron beam gun 42 generations; By above-mentioned cooling tube 72, rapidly the thermal-radiating heat of main cavity 10a and secondary cavity 10b is taken away, work thereby make cavity 10 be maintained under the more excellent temperature; By the viewing window 73 of above-mentioned main cavity 10a, be convenient to the assurance of operator to the substrate 200 plated film situation in the vacuum chamber 11b of main cavity 10a; By the viewing window 73 of above-mentioned secondary cavity 10b, be convenient to the assurance of operator to the evaporation situation of evaporation source 40.
Simultaneously; Electron-bombardment coating equipment 100 of the present invention also is provided with viewing window radical occlusion device 80; This viewing window shutter device 80 comprises a shutter 81 and orders about the rotary drive 82 of said shutter 81 rotations that this rotary drive 82 can also can be mechanically operated for manual; And said rotary drive 82 is installed on the sidewall of said secondary cavity 10b; One end of said rotary drive 82 is in the vacuum chamber 11b of the said secondary cavity 10b of stretching into of sealing and with said shutter 81 and is connected, and said shutter 81 blocks the viewing window 73 of said secondary cavity 10b, thereby prevents effectively that viewing window 73 on the secondary cavity 10b is contaminated and influence monitoring effect.Wherein, For the ease of operator the parts in the secondary cavity 10b are safeguarded; So also be provided with a maintenance door 12 at said secondary cavity 10b, this maintenance door 12 is connected on the secondary cavity 10b through door lock 12a, and maintenance door 12 is locked on the secondary cavity 10b through this door lock 12a; Or maintenance door 12 is opened, and the viewing window 73 of above-mentioned film thickness monitor 51, first feedthrough 52, viewing window radical occlusion device 80 and said secondary cavity 10b all is arranged on the said maintenance door 12.
Moreover the above-mentioned base board delivery device of mentioning 30 comprises magnetic fluid seal 31, delivery wheel 32 and the substrate driving mechanism 33 that electrically connects with said unit.Said main cavity 10a is provided with two tracks 13 along the fore-and-aft direction of this main cavity 10a; This track 13 lays respectively at the right ends of the vacuum chamber 11a in the said main cavity 10a; Said delivery wheel 32 is being arranged on each said track 13 of row's shape along the fore-and-aft direction of said main cavity 10a; Form the delivery area (not annotating among the figure) that supplies conveying substrate 200 usefulness between the delivery wheel 32 on the two said tracks 13; Said substrate driving mechanism 33 more preferably is selected as a motor provides the substrate driving mechanism 33 of rotary power with simplification structure; And substrate driving mechanism 33 is installed on the said main cavity 10a; The output shaft 33a along continuous straight runs of said substrate driving mechanism 33 stretches in the vacuum chamber 11a of said main cavity 10a and with said delivery wheel 32 and is connected, and said magnetic fluid seal 31 is installed on the said main cavity 10a and seals the junction of the output shaft 33a and the main cavity 10a of said substrate driving mechanism 33.Particularly; Said base board delivery device 30 also comprises the dolly support 34 that is carried in the said delivery area; This dolly support 34 is provided with several substrate gripper jaws 34a; Said substrate gripper jaw 34a is and is distributed in being provided with around the substrate 200 and forms substrate clamp area 34b so that substrate 200 can be clamped on the dolly support 34 reliably, and by dolly support 34 make substrate 200 can be more reliably in the vacuum chamber 11a of extraneous and main cavity 10a between conveying.Simultaneously, offer in the said track 13 and put the cooling loop 13a that is connected with extraneous refrigerating unit,, thereby safeguard being in the more excellent temperature in the main cavity 10a so that the heat that is produced by thermal radiation on the track 13 is taken away.Wherein, Reach the base board delivery device 30 of substrate driving mechanism 33 compositions that electrically connect with unit by above-mentioned magnetic fluid seal 31, delivery wheel 32; Make base board delivery device 30 can bear substrate 200 more reliably and between the vacuum chamber 11a of extraneous and main cavity 10a, carry, and can simplify the structure of base board delivery device 30.
Combine Fig. 6 at last; The above-mentioned vacuum extractor of mentioning 20 comprises vacuum pipe 21 and the vacuum pump (not shown) that electrically connects with said unit; Said vacuum pipe 21 all is communicated with the vacuum chamber 11a of main cavity 10a and the vacuum chamber 11b of secondary cavity 10b, and vacuum pipe 21 is provided with thick vacuum pumping valve 21a, high vacuum pumping valve 21b, inflation valve 21c and vacuum gauge 21d.Simultaneously; The above-mentioned vacuum extractor of mentioning 20 also is provided with condensation pump 23; This condensation pump 23 is arranged on the said vacuum pipe 21, and dampening assembly 24 between condensation pump 23 and the said vacuum pipe 21, and this dampening assembly 24 comprises damping air spring 24a and damping corrugated tube 24b; The upper end of said damping corrugated tube 24b is connected with said vacuum pipe 21; The lower end of said damping corrugated tube 24b is connected with said condensation pump 23, said damping air spring 24a be distributed in said ripple shake corrugated tube 24b around, and the two ends of said damping air spring 24a are connected with said vacuum pipe 21 and condensation pump 23 respectively.Purpose is by ripple shake corrugated tube 24b and damping air spring 24a, weakens the vibrations of 23 pairs of cavitys 10 of condensation pump of work effectively, simultaneously can also be by condensation pump 23, for cavity 10 can be created more excellent vacuum environment.Wherein,, shorten the time that forms vacuum environment in the cavity 10 on the one hand, make that on the other hand the quality of the cavity 10 interior vacuum environments that form is higher through the cooperation of thick vacuum pumping valve 21a and high vacuum pumping valve 21b; Through above-mentioned vacuum gauge 21d, be convenient to the assurance of operator to the vacuum environment in the cavity 10; Through above-mentioned inflation valve 21c, be convenient to the maintenance of operator to part in the cavity 10.
In conjunction with accompanying drawing; Principle of work to electron-bombardment coating equipment of the present invention describes: during work; When base board delivery device 30 makes the dolly support 34 that carries substrate 200 be input to the vacuum chamber 11a of main cavity 10a by the external world; The black vacuum valve 21a of the vacuum extractor 20 of this moment opens under atmospheric condition, and under the work of vacuum pump, makes the vacuum of cavity 10 be evacuated to 10
-2After below the milli handkerchief, close black vacuum valve 21a again; Then open high vacuum pumping valve 21b and start condensation pump 23, make the vacuum of cavity 10 be pumped down to 10
-7The milli handkerchief, thus reach the process environments that evaporating materials 300 evaporates, and the vacuum tightness of cavity 10 is carried out real-time monitoring by vacuum gauge 21d; Then; Unit makes evaporation source 40 and heating unit 60 work; The electron beam gun 42 of work is under the guiding of the utmost point 43 that conducts electricity partially; The electron beam that makes electron beam gun 42 send passes electron beam gun exit wound of bullet 41a and injects said sputter opening 41b; And then make the said evaporation source of this electron beam evaporation take up the evaporating materials 300 in the device 44, the material that this evaporating materials 300 is evaporated arrow B indication evaporation in Fig. 5, and the heating unit 60 of work makes the substrate 200 in the vacuum chamber 11a of main cavity 10a be heated more equal; And heating unit 60 is also revised through the electric current of 62 pairs of hot-plates 61 of thermopair, thereby makes heating unit 60 more excellent temperature environment of vacuum chamber 11a creation for main cavity 10a; At this moment; 92 work of unit control flapper actuator; Make the flapper actuator 92 of work order about evaporation shield 91 and open the spatial communication between the interior substrate 200 of evaporation sources 40 and the vacuum chamber 11a of main cavity 10a; The plated film material of this moment just is plated on the substrate 200 in the vacuum chamber 11a of main cavity 10a, thereby accomplishes the coating process of substrate 200.Wherein, in substrate 200 coating process, unit is also controlled 50 work of thickness monitoring device, and the concentration that makes film thickness monitor 51 real-time monitoring plated film materials is to guarantee the safety of substrate 200 plated films; Simultaneously, unit also makes cooling tube 72 and cooling loop 13a be connected with extraneous refrigerating unit to take away heat that thermal radiation produces to guarantee cavity 10 desired suitable temps according to practical situation.Moreover operator can also be according to the assurance of the evaporation situation of the plated film of substrates 200 in 73 pairs of cavitys of viewing window 10 and evaporation source 40.
The person of meriting attention, the structure of above-mentioned first feedthrough of mentioning 52 and second feedthrough 63 and principle of work are well known to those of ordinary skill in the art, so no longer their structure is described in detail at this.
Above disclosedly be merely preferred embodiments of the present invention, can not limit the present invention's interest field certainly with this, the equivalent variations of therefore doing according to claim of the present invention still belongs to the scope that the present invention is contained.
Claims (13)
1. an electron-bombardment coating equipment is applicable to substrate evaporated film layer, it is characterized in that, said electron-bombardment coating equipment comprises:
Cavity offers the vacuum chamber that vacuum environment is provided in the said cavity;
Vacuum extractor, said vacuum extractor is communicated with said vacuum chamber;
Base board delivery device, said base board delivery device are arranged on the said cavity, and said base board delivery device is born the conveying of substrate between extraneous and said vacuum chamber;
Evaporation source; Said evaporation source is built in the said vacuum chamber and is positioned under the substrate of said vacuum chamber; Said evaporation source comprises device body and is built in the electron beam gun of said device body, deflection electrode and evaporation source and takes up device; Said electron beam gun is positioned at the left end of said device body; Said evaporation source takes up the right-hand member that device is positioned at said device body; Said deflection electrode takes up between the device at said electron beam gun and evaporation source, and the top of said device body offers the electron beam gun exit wound of bullet corresponding with said electron beam gun respectively, takes up the corresponding sputter opening of device with evaporation source, and the electron beam that said deflection electrode sends said electron beam gun passes the electron beam gun exit wound of bullet and injects said sputter opening and then make the said evaporation source of this electron beam evaporation take up the evaporating materials in the device;
The film thickness monitoring device, said film thickness monitoring device comprises film thickness monitor, said film thickness monitor is arranged in the said vacuum chamber, and between the substrate of said film thickness monitor in said evaporation source and said vacuum chamber; And
Unit, said unit are respectively with said vacuum extractor, electron beam gun, the conduct electricity utmost point, base board delivery device and thick film monitor electrically connects partially.
2. electron-bombardment coating equipment according to claim 1; It is characterized in that; Said cavity comprises secondary cavity and the main cavity that is connected; Said main cavity be positioned at said secondary cavity directly over; Said evaporation source is arranged in the vacuum chamber of said secondary cavity, and said base board delivery device is born the conveying of substrate between the vacuum chamber of extraneous and said main cavity, and it is interior and be positioned at the top of said evaporation source that said film thickness monitor is arranged at the vacuum chamber of said secondary cavity; And said film thickness monitoring device also is provided with first feedthrough that is connected with said film thickness monitor, and said first feedthrough and said unit electrically connect and be arranged on the said secondary cavity.
3. electron-bombardment coating equipment according to claim 2; It is characterized in that; Also comprise heating unit; Said heating unit comprises hot-plate, thermopair and second feedthrough that electrically connects with said unit, and said hot-plate is arranged in the vacuum chamber of said main cavity and is positioned at directly over the substrate of vacuum chamber of said main cavity, and the bottom of said thermopair is corresponding with said hot-plate; Stretch out outside the said main cavity on the top of said thermopair, and said second feedthrough is the junction of said thermopair of being arranged at of sealing and said main cavity.
4. according to claim 2 or 3 described electron-bombardment coating equipments; It is characterized in that; Be provided with dismountable antifouling board in the vacuum chamber of said main cavity and secondary cavity; And the cooling tube that also is provided with viewing window on said main cavity and the secondary cavity and is connected, the cooling tube of said main cavity with extraneous refrigerating unit be positioned at said main cavity with the corresponding sidewall of said hot-plate outside, the viewing window of said main cavity is positioned at outside the sidewall of said main cavity; And the viewing window of said main cavity is corresponding with the substrate in the vacuum chamber of said main cavity; The cooling tube of said main cavity is positioned at the top of the viewing window of said main cavity, the cooling tube of said secondary cavity and viewing window all be positioned at said secondary cavity with the corresponding sidewall of said evaporation source outside, and the viewing window of said secondary cavity is positioned at the top of the cooling tube of said secondary cavity.
5. electron-bombardment coating equipment according to claim 4; It is characterized in that; Also comprise the viewing window radical occlusion device, said viewing window shutter device comprises a shutter and orders about the rotary drive of said shutter rotation that said rotary drive is installed on the sidewall of said secondary cavity; And an end of said rotary drive is in the vacuum chamber that stretches into said secondary cavity of sealing and with said shutter and is connected, and said shutter blocks the viewing window of said secondary cavity.
6. electron-bombardment coating equipment according to claim 5 is characterized in that, said secondary cavity also is provided with a maintenance door, and the viewing window of said film thickness monitor, first feedthrough, viewing window radical occlusion device and said secondary cavity all is arranged on the said maintenance door.
7. electron-bombardment coating equipment according to claim 2; It is characterized in that; Said base board delivery device comprises magnetic fluid seal, delivery wheel and the substrate driving mechanism that electrically connects with said unit; Said main cavity is provided with two tracks along the fore-and-aft direction of this main cavity; Said track lays respectively at the right ends of the vacuum chamber in the said main cavity; Said delivery wheel is being arranged on each said track of row's shape along the fore-and-aft direction of said main cavity, forms the delivery area that supplies conveying substrate to use between the delivery wheel on the two said tracks, and said substrate driving mechanism is installed on the said main cavity; And the output shaft along continuous straight runs of said substrate driving mechanism stretches in the vacuum chamber of said main cavity and with said delivery wheel and is connected, and said magnetic fluid seal is installed on the said main cavity and seals the junction of the output shaft and the main cavity of said substrate driving mechanism.
8. electron-bombardment coating equipment according to claim 7; It is characterized in that; Said base board delivery device also comprises the little kickstand that is carried in the said delivery area; Said little kickstand is provided with several substrate gripper jaws, and said substrate gripper jaw is and is distributed in being provided with around the substrate and forms the substrate clamp area.
9. electron-bombardment coating equipment according to claim 7 is characterized in that, offers in the said track to put the cooling loop that is connected with extraneous refrigerating unit.
10. electron-bombardment coating equipment according to claim 2; It is characterized in that; Also comprise retaining device; Said retaining device comprises evaporation shield and the flapper actuator that electrically connects with said unit; The output shaft of said flapper actuator is in the vacuum chamber that stretches into said secondary cavity of sealing and with said evaporation shield and is connected, and said evaporation shield is arranged between the substrate of the vacuum chamber in said evaporation source and the said main cavity, and said evaporation shield unlatching or separate the interior substrate of the vacuum chamber of said main cavity and spatial communication that said evaporation source takes up device.
11. electron-bombardment coating equipment according to claim 1; It is characterized in that; Said vacuum extractor comprises vacuum pipe and the vacuum pump that electrically connects with said unit, and said vacuum pipe is provided with thick vacuum pumping valve, high vacuum pumping valve, inflation valve and vacuum gauge.
12. electron-bombardment coating equipment according to claim 11 is characterized in that said vacuum extractor also comprises the condensation pump that is arranged on the said vacuum pipe, dampening assembly between said condensation pump and the said vacuum pipe.
13. electron-bombardment coating equipment according to claim 12; It is characterized in that; Said dampening assembly comprises damping air spring and damping corrugated tube, and the upper end of said damping corrugated tube is connected with said vacuum pipe, and the lower end of said damping corrugated tube is connected with said condensation pump; Said damping air spring be distributed in said ripple shake corrugated tube around, and the two ends of said damping air spring are connected with said vacuum pipe and condensation pump respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100125370A CN102703867A (en) | 2012-01-13 | 2012-01-13 | Electron bombardment coating machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100125370A CN102703867A (en) | 2012-01-13 | 2012-01-13 | Electron bombardment coating machine |
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| CN102703867A true CN102703867A (en) | 2012-10-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100125370A Pending CN102703867A (en) | 2012-01-13 | 2012-01-13 | Electron bombardment coating machine |
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| CN (1) | CN102703867A (en) |
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| CN106148893A (en) * | 2016-08-11 | 2016-11-23 | 京东方科技集团股份有限公司 | A kind of evaporation coating device and evaporation coating method, substrate |
| CN107254668A (en) * | 2017-07-28 | 2017-10-17 | 佛山市联仪光学有限公司 | Automate coating machine |
| CN108286036A (en) * | 2018-01-04 | 2018-07-17 | 湘潭大学 | A kind of original position oxygenating type scanning electron beam vapor deposition (IOC-SEVD) devices and methods therefor |
| CN112795896A (en) * | 2021-04-15 | 2021-05-14 | 苏州迈为科技股份有限公司 | Vacuum coating device |
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| CN108286036A (en) * | 2018-01-04 | 2018-07-17 | 湘潭大学 | A kind of original position oxygenating type scanning electron beam vapor deposition (IOC-SEVD) devices and methods therefor |
| CN108286036B (en) * | 2018-01-04 | 2020-05-19 | 湘潭大学 | In-situ oxygen supplement type scanning electron beam vapor deposition (IOC-SEVD) device and method thereof |
| CN112795896A (en) * | 2021-04-15 | 2021-05-14 | 苏州迈为科技股份有限公司 | Vacuum coating device |
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Application publication date: 20121003 |