CN102701591A - Laser packaged glass powder sealing material for photoelectric device packaging - Google Patents
Laser packaged glass powder sealing material for photoelectric device packaging Download PDFInfo
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- CN102701591A CN102701591A CN2012101849276A CN201210184927A CN102701591A CN 102701591 A CN102701591 A CN 102701591A CN 2012101849276 A CN2012101849276 A CN 2012101849276A CN 201210184927 A CN201210184927 A CN 201210184927A CN 102701591 A CN102701591 A CN 102701591A
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- glass powder
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- frit
- sealing material
- powder
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Abstract
The invention discloses a laser packaged glass powder sealing material for photoelectric device packaging, and belongs to the technical field of photoelectric device packaging. The sealing material is a combined material of laser packaged glass powder and high-temperature non-conductive ceramic powder added according to the proportion of 5 to 15%. All elements in the sealing material are easily available, so that the cost is low. The softening point of the packaged glass powder has the temperature of 420 to 450 DEG C and the coefficient of thermal expansion of 75*10 <-7>/DEG C. In the packaging of glass, the selection range of laser heating equipment is wider, the laser packaged glass powder sealing material adapts to various different packaging manners, the cost is lowered, and the efficiency is improved; the added ceramic powder plays a role in supporting frit bands, and the frit bands have relatively low flowability in packaging, the packaged bands are closer to the distribution of the frits in sedimentation, the displacement deformation generated in the frit heating process is easy to control to enable the packaged bands to be regular; the frit bands have no great displacement deformation, no remark air holes exit in the packaged bands, and the erosion of oxygen and moisture is blocked by the effective airtight.
Description
Technical field
The present invention relates to a kind of glass powder sealing material that is used for package sealing with laser OLED device, belong to photoelectric device encapsulation technology field.
Background technology
Luminescent device is that this studied quite a lot ofly in recent years, and display of organic electroluminescence OLED attracts people's attention especially as a kind of emerging flat-panel monitor, uses and potential using value because they all have in many electroluminescent devices.Since its have good color contrast, active illuminating, wide visual angle, can slimming, response speed is fast and advantage such as less energy-consumption.Yet traditional OLED particularly is positioned at wherein electrode and organic layer, is easy to have a strong impact on the work-ing life of OLED because of making degradation in oxygen in the surrounding environment and the moisture entering OLED indicating meter.If with the electrode in the OLED indicating meter and organic layer and the surrounding environment air hermetic is isolated opens, then the life-span of OLED indicating meter will significantly increase.Yet this sealing process that carries out hermetically sealing for active display is difficult to reach desirable requirement.Industry adopts various material seal OLED devices in glass shell at present, and it is following that institute will reach the hermetically sealing specific requirement:
Hermetically sealing should provide to oxygen (10
-3Centimetre
3/ rice
2/ day) and water (10
-6Gram/rice
2/ sky) blocking layer.
That the width of hermetically sealing should reach as far as possible is minimum (as, 1mm), reduce the disadvantageous effect that the size of active display causes.
The temperature that produces in the seal process should be low as far as possible, reduces the disadvantageous effect of material such as electrode and organic layer for example in the OLED device.And in seal process, the temperature apart from first pixel of the OLED at the about 1-2 millimeter of sealing member place in the OLED device should not be higher than 100 ℃.
The gas that discharges in the seal process should be compatible with the material in the OLED device.
Hermetically sealing should be able to make electric connecting part (like membrane electrode) can get into the OLED device.
Laser scanning encapsulation, laser point add heat-seal or the matrix laser package is the encapsulation means that are applied to indicating meter main in the present industry.The scanning encapsulation, promptly beam of laser projects on the envelope material of the piece surface of treating sealing-in, and laser beam seals material fusion completion sealing-in along the material profile run-down thereby make then; Point encapsulation, promptly the different positions at packaging carries out the laser point encapsulation, finally reaches the effect that encapsulation requires, but in the encapsulation process of reality because speed is slow, and efficient is low, be not suitable for device fabrication in batches; The matrix laser package; Promptly according to the position of the shape adjustments laser array of package line; Be that laser and the complete vertical irradiation of diode laser matrix are on sealing surface; Package is encapsulated simultaneously, have short, advantages such as relative displacement is little when heating, thermal distortion is little, suitable production in enormous quantities heat-up time.Yet so far; Industry inside also do not have a kind of can be good at solving produced surface elasticity displacement that stress crack and frit cause owing to LASER HEATING during the course and made the frit skewness; The local area occurs the space is arranged; Thereby make packaging effect not good, have a strong impact on the resistance to air loss of encapsulation, finally influence the work-ing life of OLED.
Summary of the invention
The present invention proposes a kind of frit that adds non-conductive pyroceramic powder and strengthens sealing OLED device sealing performance.The purpose of this invention is to provide a kind of unleaded cheaply frit, the thermal expansivity that it has lower fusing point and adapts with glass substrate.The present invention can effectively make OLED indicating meter laser package process frit be evenly distributed, and makes upper substrate hypocoxa two substrates fully bonding and be subjected to displacement deformation can not heat owing to frit the time and pore occurs, reach gas-tight seal the requirement that will reach.This packaged glass material is non-conductive, has protected electrode; And effective isolation the infringement of moisture and oxygen to the OLED device.
A kind of glass powder sealing material that is used for the laser package of photoelectric device encapsulation of the present invention is characterized in that being made up of laser package glass powder and pyroceramic powder; Laser package glass powder is that following chemical constitution and weight percent thereof are arranged:
Bismuth oxide 70～75%
Boron oxide 10～13%
Zinc oxide 10～13%
Aluminum oxide 2～6%
In addition, as mete-wand, adding pyroceramic grain weight amount per-cent is 5～15% with above-mentioned glass powder 100; Main chemical compositions is SiO in the pyroceramic powder
2And Al
2O
3
The preparation method that a kind of glass powder sealing that is used for the laser package of light device package of the present invention is expected is characterized in that it being that following process and step are arranged.
A. by the admixtion of above-mentioned formulated laser package glass powder and pyroceramic powder, fully grind and mix;
B. above-mentioned compound is put into agate mortar, add an amount of alcohol and ground 10～30 minutes again, the alcohol add-on does
2ml/g adds little binder then and is modulated into pasty state, and vacuumizes, and places 10～15 minutes, to get rid of bubble in the material.
The purposes of glass powder sealing material of the present invention is a laser package OLED device.
Characteristics of the present invention and mechanism
When the present invention was applicable to laser package, because LASER HEATING rises to after the melt temperature again cool to room temperature rapidly from room temperature rapidly, the temperature too fast frit surface elasticity displacement that causes of rising made hole to occur by frit heating cooling back skewness.In order to overcome this problem, in frit, add the pyroceramic powder, because ceramic powder does not react with frit when high temperature or makes the ceramic powder fusing, it well plays the support effect.The performance of frits of the present invention is following: 427～454 ℃ of transition points, 451～480 ℃ of softening temperatures, 580～590 ℃ of sealing temperatures, thermal expansivity 65 * 10
-7/ ℃～70 * 10
-7/ ℃.
Laser source in the invention is a semiconductor laser, and it is the method that example has been described a kind of sealed glass shell and the glass shell of making sealing that device to be packaged is to use the OLED device.Through two glass substrates are provided, and the frit for preparing is screen-printed on the top glass substrate, carries out pre-sintering process frit is deposited on the substrate, with the glass substrate of another piece deposition OLED and close, make the OLED indicating meter of sealing.Use source of radiation (like laser, infrared rays) frit then; Make the frit fusing together with described two substrate bondings; And protection OLED deposition and external membrane electrode are not destroyed, and have effectively prevented the entering of oxygen and moisture, form a complete sealed structure.Added the pyroceramic powder in this frit;, reduced by frit the flowability of frit when melting; Make laser package front and back frit beam thickness reduction amplitude reduce; Better protection OLED settling, ceramic powder support whole glass band when frit is softening bonding shape effects is obvious.Ceramic powder is non-conductive.
Glass powder sealing material of the present invention meets basic glass powder thermal expansivity 35 * 10 fully
-7/ ℃～80 * 10
-7/ ℃ requirement, and use adulterated packaged glass material, be that the component that absorbs the visible laser heating is arranged.
Description of drawings
Fig. 1. be the glass powder sealing material inner structure synoptic diagram that OLED device package of the present invention is used.
Among the figure: 1. top glass substrate; 2. be deposited on the frit of first adding ceramic powder on the glass substrate; 3.OLED settled layer; 4. lower baseplate glass.
Embodiment
Specify the present invention through specific embodiment below.
In the present embodiment, be used for the glass powder sealing material of the laser package of photoelectric device encapsulation, form by laser package glass powder and pyroceramic powder; Laser package glass powder is that following chemical constitution and weight percent thereof are arranged:
Bismuth oxide 72%,
Boron oxide 12%,
Zinc oxide 12%,
In addition, as mete-wand, adding pyroceramic grain weight amount per-cent is 11.11% with above-mentioned glass powder 100; Main chemical compositions is SiO in the pyroceramic powder
2And Al
2O
3
Referring to Fig. 1, the OLED indicating meter essential part of its explanation sealing is made up of upper substrate 1, hypocoxa 4, frit strip of paper used for sealing 2 and OLED settled layer 3.Frit 400 orders that are used for glass-encapsulated add the non-conductive pyroceramic powder of 300 orders with the ratio of 85:15.At first the glass frit powder for preparing is put into agate mortar and add 2ml/g alcohol; Fully ground about 10 minutes; Treat that alcohol volatilization adds fully and process pasty state with suitable solvent/adhesive composition such as pentyl acetate/Nitrocellulose/TKK 021 etc.; Vacuum was placed 10 minutes, and frit pasty state inner air vent is got rid of.Then, become glass envelope material bar 2 band shapes of upper substrate 1 correspondence among Fig. 1 with silk screen printing.Below softening point temperature, carry out presintering and handle, tackiness agent is removed in about 350 ℃ insulations of tackiness agent point of ignition 20 minutes fully.
The frit that is deposited on the glass substrate for preparing is polished flat, according to Fig. 1 the mode of below legend with two substrates to catching, carry out laser package.Because deformation quantity is little during the encapsulation of the frit band here, thermal stresses is low, is not very high for the relative requirement of the selection of laser apparatus, can satisfy an encapsulation simultaneously, scanning encapsulation, matrix encapsulation.This example is set out with practical simplicity and is selected to use the scanning encapsulation.Generally speaking; Select the diameter of outgoing laser beam littler than the width of frit-sealed band 2; On substrate 1,2, apply certain stress, select certain laser output power (37.5W) and sweep velocity (1.2mm/s), laser diode is along frit-sealed band 2 run-downs; Accomplish laser package, packaging effect is better.
Claims (3)
1. a glass powder sealing material that is used for the photoelectric device laser package is characterized in that being made up of laser package glass powder and pyroceramic powder; Glass powder packaged glass powder is following its weight percent of chemical constitution:
Bismuth oxide: 70-75%,
Boron oxide: 10-13%,
Zinc oxide: 10-13%,
Aluminum oxide: 2-6%;
In addition, as mete-wand, adding the pyroceramic weight percent is 5-15% with above-mentioned glass powder 100; Main chemical compositions is SiO2 and Al2O3 in the pyroceramic powder.
2. preparation method who is used for the glass powder sealing material of photoelectric device laser package is characterized in that it being that following process and step are arranged:
A. by the admixtion of above-mentioned formulated laser package glass powder and pyroceramic powder, fully grind and mix;
B. above-mentioned compound is put into agate mortar, add an amount of alcohol, ground 10～30 minutes again, the alcohol add-on is 2ml/g, adds little binder then and adjusts into pasty state, and vacuumize, and places 10～15 minutes, to get rid of bubble in the material.
3. the purposes of the described glass powder sealing of claim 1 material is a laser package OLED device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101849276A CN102701591A (en) | 2012-06-07 | 2012-06-07 | Laser packaged glass powder sealing material for photoelectric device packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101849276A CN102701591A (en) | 2012-06-07 | 2012-06-07 | Laser packaged glass powder sealing material for photoelectric device packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102701591A true CN102701591A (en) | 2012-10-03 |
Family
ID=46894724
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101849276A Pending CN102701591A (en) | 2012-06-07 | 2012-06-07 | Laser packaged glass powder sealing material for photoelectric device packaging |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102945927A (en) * | 2012-11-09 | 2013-02-27 | 京东方科技集团股份有限公司 | Packaging method and display device |
| CN103779503A (en) * | 2012-10-17 | 2014-05-07 | 奇美电子股份有限公司 | Organic light emitting diode display and manufacturing method thereof |
| CN103964695A (en) * | 2014-03-31 | 2014-08-06 | 上海天马有机发光显示技术有限公司 | Frit mixture as well as application and preparation method thereof |
| CN104600204A (en) * | 2014-12-26 | 2015-05-06 | 深圳市华星光电技术有限公司 | OLED package structure and OLED packaging method |
| CN105070850A (en) * | 2015-09-24 | 2015-11-18 | 京东方科技集团股份有限公司 | Pedestal of laser packaging equipment and laser packaging equipment |
| CN105140372A (en) * | 2015-07-08 | 2015-12-09 | 上海大学 | Annealing method for photoelectric device laser packaging and application thereof |
| CN105679960A (en) * | 2014-11-20 | 2016-06-15 | 昆山国显光电有限公司 | Light emitting device and packaging method therefor |
| CN105789259A (en) * | 2016-03-29 | 2016-07-20 | 上海天马有机发光显示技术有限公司 | Organic electroluminescent display panel, manufacturing method thereof, and display device |
| CN106098968A (en) * | 2016-08-12 | 2016-11-09 | 京东方科技集团股份有限公司 | A kind of sintering method |
| CN106641897A (en) * | 2017-02-27 | 2017-05-10 | 江苏集萃有机光电技术研究所有限公司 | OLED (Organic Light-Emitting Diode) light source and lamp |
| CN108511620A (en) * | 2018-03-02 | 2018-09-07 | 南京第壹有机光电有限公司 | A kind of laser package OLED illumination panels and packaging method |
| CN108779034A (en) * | 2016-04-01 | 2018-11-09 | 日本电气硝子株式会社 | Ceramic powders and its manufacturing method |
| CN108883973A (en) * | 2016-04-21 | 2018-11-23 | 日本电气硝子株式会社 | Ceramic powders, composite powder material and sealing material |
| US10205120B2 (en) | 2015-01-13 | 2019-02-12 | Boe Technology Group Co., Ltd. | Encapsulating method, display panel and display apparatus |
| CN112897884A (en) * | 2021-02-22 | 2021-06-04 | 合肥邦诺科技有限公司 | Preformed low-temperature glass soldering lug and screen printing manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101079476A (en) * | 2007-06-20 | 2007-11-28 | 华中科技大学 | A sealing material of solid oxide fuel cell and its sealing method |
| CN101684034A (en) * | 2008-09-26 | 2010-03-31 | 中国科学院过程工程研究所 | Sealing glass powder, sealing glass ceramic powder and application |
| CN101723589A (en) * | 2008-10-29 | 2010-06-09 | 珠海彩珠实业有限公司 | Lead-free glass powder with low melting point for sealing PDP and preparation method thereof |
-
2012
- 2012-06-07 CN CN2012101849276A patent/CN102701591A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101079476A (en) * | 2007-06-20 | 2007-11-28 | 华中科技大学 | A sealing material of solid oxide fuel cell and its sealing method |
| CN101684034A (en) * | 2008-09-26 | 2010-03-31 | 中国科学院过程工程研究所 | Sealing glass powder, sealing glass ceramic powder and application |
| CN101723589A (en) * | 2008-10-29 | 2010-06-09 | 珠海彩珠实业有限公司 | Lead-free glass powder with low melting point for sealing PDP and preparation method thereof |
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|---|---|---|---|---|
| CN103779503B (en) * | 2012-10-17 | 2017-04-12 | 群创光电股份有限公司 | Organic light emitting diode display and manufacturing method thereof |
| CN103779503A (en) * | 2012-10-17 | 2014-05-07 | 奇美电子股份有限公司 | Organic light emitting diode display and manufacturing method thereof |
| US10205134B2 (en) | 2012-11-09 | 2019-02-12 | Boe Technology Group Co., Ltd. | Packaging method and display device |
| CN102945927A (en) * | 2012-11-09 | 2013-02-27 | 京东方科技集团股份有限公司 | Packaging method and display device |
| US9831470B2 (en) | 2012-11-09 | 2017-11-28 | Boe Technology Group Co., Ltd. | Packaging method and display device |
| CN102945927B (en) * | 2012-11-09 | 2015-01-28 | 京东方科技集团股份有限公司 | Packaging method and display device |
| CN103964695B (en) * | 2014-03-31 | 2017-05-17 | 上海天马有机发光显示技术有限公司 | Frit mixture as well as application and preparation method thereof |
| CN103964695A (en) * | 2014-03-31 | 2014-08-06 | 上海天马有机发光显示技术有限公司 | Frit mixture as well as application and preparation method thereof |
| CN105679960A (en) * | 2014-11-20 | 2016-06-15 | 昆山国显光电有限公司 | Light emitting device and packaging method therefor |
| CN104600204A (en) * | 2014-12-26 | 2015-05-06 | 深圳市华星光电技术有限公司 | OLED package structure and OLED packaging method |
| US9893310B2 (en) | 2014-12-26 | 2018-02-13 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | OLED package structure and packaging method |
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| CN105140372A (en) * | 2015-07-08 | 2015-12-09 | 上海大学 | Annealing method for photoelectric device laser packaging and application thereof |
| CN105140372B (en) * | 2015-07-08 | 2017-12-05 | 上海大学 | The method for annealing of photoelectric device laser package and its application |
| US10270066B2 (en) | 2015-09-24 | 2019-04-23 | Boe Technology Group Co., Ltd. | Pedestal of laser packaging device and laser packaging device |
| CN105070850B (en) * | 2015-09-24 | 2017-04-05 | 京东方科技集团股份有限公司 | The base and laser package equipment of laser package equipment |
| CN105070850A (en) * | 2015-09-24 | 2015-11-18 | 京东方科技集团股份有限公司 | Pedestal of laser packaging equipment and laser packaging equipment |
| CN105789259A (en) * | 2016-03-29 | 2016-07-20 | 上海天马有机发光显示技术有限公司 | Organic electroluminescent display panel, manufacturing method thereof, and display device |
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| CN108779034A (en) * | 2016-04-01 | 2018-11-09 | 日本电气硝子株式会社 | Ceramic powders and its manufacturing method |
| CN108883973A (en) * | 2016-04-21 | 2018-11-23 | 日本电气硝子株式会社 | Ceramic powders, composite powder material and sealing material |
| US10807905B2 (en) | 2016-04-21 | 2020-10-20 | Nippon Electric Glass Co., Ltd. | Ceramic powder, composite powder material, and sealing material |
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| CN106641897B (en) * | 2017-02-27 | 2023-08-15 | 江苏集萃有机光电技术研究所有限公司 | OLED light source and lamp |
| CN106641897A (en) * | 2017-02-27 | 2017-05-10 | 江苏集萃有机光电技术研究所有限公司 | OLED (Organic Light-Emitting Diode) light source and lamp |
| CN108511620A (en) * | 2018-03-02 | 2018-09-07 | 南京第壹有机光电有限公司 | A kind of laser package OLED illumination panels and packaging method |
| CN108511620B (en) * | 2018-03-02 | 2020-09-08 | 江苏壹光科技有限公司 | Laser packaging OLED lighting panel and packaging method |
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Application publication date: 20121003 |