CN102693969B - 一种igbt功率模块 - Google Patents
一种igbt功率模块 Download PDFInfo
- Publication number
- CN102693969B CN102693969B CN201210201158.6A CN201210201158A CN102693969B CN 102693969 B CN102693969 B CN 102693969B CN 201210201158 A CN201210201158 A CN 201210201158A CN 102693969 B CN102693969 B CN 102693969B
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- CN
- China
- Prior art keywords
- chip
- igbt
- layer
- conductive layer
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210201158.6A CN102693969B (zh) | 2012-06-18 | 2012-06-18 | 一种igbt功率模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210201158.6A CN102693969B (zh) | 2012-06-18 | 2012-06-18 | 一种igbt功率模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102693969A CN102693969A (zh) | 2012-09-26 |
CN102693969B true CN102693969B (zh) | 2014-12-24 |
Family
ID=46859325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210201158.6A Active CN102693969B (zh) | 2012-06-18 | 2012-06-18 | 一种igbt功率模块 |
Country Status (1)
Country | Link |
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CN (1) | CN102693969B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367305A (zh) * | 2013-07-31 | 2013-10-23 | 西安永电电气有限责任公司 | 一种用于igbt器件的电连接结构 |
JP2016099127A (ja) * | 2014-11-18 | 2016-05-30 | 富士電機株式会社 | パワー半導体モジュールの製造方法及びその中間組立ユニット |
CN105590930B (zh) * | 2016-02-02 | 2018-05-08 | 中国第一汽车股份有限公司 | 一种新能源车用igbt功率模块 |
CN105914205A (zh) * | 2016-05-09 | 2016-08-31 | 株洲中车时代电气股份有限公司 | 一种功率模块结构及制造方法 |
CN108615717A (zh) * | 2018-07-20 | 2018-10-02 | 井敏 | 一种金属化陶瓷基板、基板制作方法及基板与芯片焊接方法 |
CN109659280A (zh) * | 2018-12-27 | 2019-04-19 | 西安中车永电电气有限公司 | 一种压接式igbt内部封装结构 |
CN113823614A (zh) * | 2021-08-05 | 2021-12-21 | 山东斯力微电子有限公司 | 无引线的igbt模块及其制作工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1649098A (zh) * | 2004-01-30 | 2005-08-03 | 株式会社电装 | 半导体器件 |
CN102254886A (zh) * | 2011-08-04 | 2011-11-23 | 株洲南车时代电气股份有限公司 | 一种免引线键合igbt模块 |
CN202695428U (zh) * | 2012-06-18 | 2013-01-23 | 南京银茂微电子制造有限公司 | 一种igbt功率模块 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4635564B2 (ja) * | 2004-11-04 | 2011-02-23 | 富士電機システムズ株式会社 | 半導体装置 |
-
2012
- 2012-06-18 CN CN201210201158.6A patent/CN102693969B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1649098A (zh) * | 2004-01-30 | 2005-08-03 | 株式会社电装 | 半导体器件 |
CN102254886A (zh) * | 2011-08-04 | 2011-11-23 | 株洲南车时代电气股份有限公司 | 一种免引线键合igbt模块 |
CN202695428U (zh) * | 2012-06-18 | 2013-01-23 | 南京银茂微电子制造有限公司 | 一种igbt功率模块 |
Also Published As
Publication number | Publication date |
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CN102693969A (zh) | 2012-09-26 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An IGBT power module Effective date of registration: 20211112 Granted publication date: 20141224 Pledgee: Bank of China Limited by Share Ltd. Lishui branch Pledgor: NANJING SILVERMICRO ELECTRONICS, LTD. Registration number: Y2021980012353 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221116 Granted publication date: 20141224 Pledgee: Bank of China Limited by Share Ltd. Lishui branch Pledgor: NANJING SILVERMICRO ELECTRONICS, LTD. Registration number: Y2021980012353 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: IGBT power module Effective date of registration: 20221117 Granted publication date: 20141224 Pledgee: Bank of China Limited by Share Ltd. Lishui branch Pledgor: NANJING SILVERMICRO ELECTRONICS, LTD. Registration number: Y2022980022200 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |