CN102689071B - Reflow soldering equipment - Google Patents
Reflow soldering equipment Download PDFInfo
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- CN102689071B CN102689071B CN201210201010.2A CN201210201010A CN102689071B CN 102689071 B CN102689071 B CN 102689071B CN 201210201010 A CN201210201010 A CN 201210201010A CN 102689071 B CN102689071 B CN 102689071B
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Abstract
Disclosure one reflow soldering equipment, include multiple warm area and for transmitting the PCB drive mechanism of pcb board at the plurality of warm area, having at least two warm areas vertically setting up and down in the plurality of warm area, described PCB drive mechanism at least includes the vertical transmission guide rail vertically transmitting PCB between warm area setting up and down.Present invention may effectively utilize production site, save floor occupying area, reduce energy consumption, convenient transport, and be easily deformed after improving transport guide rails heating and cause board falling, transport unstable problem.
Description
Technical field
The present invention relates to electronic circuit surface-mounted devices field, particularly relate to a kind of reflow soldering equipment.
Background technology
Electronic circuit surface installation technique (SurfaceMountTechnology, SMT), also referred to as surface mount or surface mounting technique.It is a kind of by the surface mount device (SurfaceMountedcomponent without pin or short leg, or surface mounting devices SurfaceMountedDevices SMC), SMD), also referred to as claiming lamellar components and parts, it is arranged on printed circuit board (PrintedCircuitBoard, PCB) on surface or the surface of other substrate, by the circuit load technology of the method such as Reflow Soldering or immersed solder welding assembly in addition.----paster-----welding----maintenance (all can add detection in every procedure to control quality) that its technical process is: printing.Wherein, welding sequence mainly adopts reflow soldering equipment to weld.
Reflow soldering equipment is also known as " reflow welding connects equipment " or " Re-current welder " or " reflow ovens " (ReflowOven), it is by providing a kind of heating environment, makes solder(ing) paste be heated and melts thus allowing Surface Mount Component and PCB pad pass through the equipment that solder(ing) paste alloy reliably combines.Development according to solder reflow techniques, can be divided into: gas phase Reflow Soldering, infrared reflow weldering, far infrared Reflow Soldering, Infrared Heating wind Reflow Soldering and full hot air reflux weldering；According further to the needs that welding is special, also has the reflow soldering of nitrogen charging.Popular and practical is far infrared Reflow Soldering, Infrared Heating wind Reflow Soldering and full hot air reflux weldering mostly at present.
It it is the structural representation of the hot air reflux stove of prior art with reference to Fig. 1, this figure；As shown in the figure, the hot air reflux stove of prior art is generally made up of the preheating zone 10 being arranged in upper furnace body 101 and lower furnace body 102, heat preservation zone 20, recirculating zone 30, cooling zone 40 isothermal region, each warm area is transversely arranged, and PCB or other substrates are transmitted between each warm area by horizontal transport mechanism 50.Wherein, the quantity of preheating zone 10 and heat preservation zone 20 can increase as required.Along with the use of lead-free solder, preheating zone 10, heat preservation zone 20 there are is higher length requirement, desirable reflow soldering temperature curve could be realized.Therefore, of prior art is for the hot air reflux stove of pb-free solder, and length is generally all more than 5 meters, and in such length range, each warm area to realize hot air circulation convection current up and down, consumes energy more；And as with one or more than one reflow ovens distribution, then taken production region very big on SMT automatic assembly line, conversion products distribution is dumb；And so long reflow ovens transport gets up also cumbersome.
Summary of the invention
The technical problem to be solved is: provide a kind of reflow soldering equipment, this equipment can effectively utilize production site, save floor occupying area, reduce energy consumption, convenient transport, and is easily deformed after improving transport guide rails heating and causes board falling, transport unstable problem.
For solving above-mentioned technical problem, the present invention adopts the following technical scheme that
A kind of reflow soldering equipment, include multiple warm area and for transmitting the PCB drive mechanism of pcb board at the plurality of warm area, having at least two warm areas vertically setting up and down in the plurality of warm area, described PCB drive mechanism at least includes the vertical transmission guide rail vertically transmitting PCB between warm area setting up and down.
Preferably, described PCB drive mechanism also includes the horizontal transport guide rail of horizontal transport PCB in each warm area.
Preferably, the entrance and exit of described each warm area further respectively has plate taking-out mechanism and the rushing board mechanism for picking and placeing PCB between described vertical transmission guide rail and horizontal transport guide rail.
Preferably, separated by sealing device between described each warm area, form freestanding modular structure, and be connected with heater or chiller by pipeline.
Preferably, this equipment also includes for loading the PCB PCB carrier moved in the plurality of warm area and between warm area.
Preferably, described PCB carrier is hopper, and the vertical direction centre position of this hopper is provided with PCB and places position, and this PCB places and is respectively arranged with at least one thermal insulation layer above and below position.
Preferably, each thermal insulation layer is provided with air inlet, air outlet and hot air circulation passage and hot blast microcirculation fairing, and described hopper forms closed hot blast back cavity body respectively in moving up and down process with each warm area.
Preferably, the plurality of warm area includes preheating zone, heat preservation zone, recirculating zone and cooling zone.
Preferably, described preheating zone, heat preservation zone, recirculating zone, cooling zone are arranged successively from bottom to top, and described vertical transmission guide rail is separately positioned on the left and right sides of described each warm area.
Preferably, this equipment is connected with SMT automatic assembly line equipment on-line.
The invention has the beneficial effects as follows:
Embodiments of the invention are by setting up and down along vertically side by preheating zone, heat preservation zone, recirculating zone, cooling zone, pcb board is driven from top to bottom or from the bottom to top to cross plate between above-mentioned each warm area by PCB drive mechanism, realize the reflow soldering of pcb board, thus substantially reducing the lengthwise dimension of reflow soldering equipment, efficiently utilize production site, saved floor space, decrease energy consumption, facilitate transport, and be easily deformed after improving transport guide rails heating and cause board falling, transport unstable problem.
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Accompanying drawing explanation
Fig. 1 is the structural representation of the hot air reflux stove of prior art.
Fig. 2 is the implementation structural representation including two warm areas of one embodiment of reflow soldering equipment of the present invention.
Fig. 3 is the implementation structural representation including four warm areas of one embodiment of reflow soldering equipment of the present invention.
Fig. 4 is the implementation structural representation including four warm areas and hopper of one embodiment of reflow soldering equipment of the present invention.
Detailed description of the invention
An embodiment of provided by the invention tower reflow ovens is described in detail below with reference to Fig. 2-Fig. 4；As shown in the figure, the present embodiment mainly includes multiple warm area 1 and for transmitting the PCB drive mechanism 2 of pcb board at the plurality of warm area 1, having at least two warm areas 11,13 vertically setting up and down in the plurality of warm area 1, described PCB drive mechanism 2 at least includes the vertical transmission guide rail 21 vertically transmitting PCB between warm area setting up and down.
It addition, described PCB drive mechanism 2 also includes the horizontal transport guide rail (not shown) of horizontal transport PCB in each warm area 2.
It addition, the entrance and exit of described each warm area 1 further respectively has plate taking-out mechanism 31 and rushing board mechanism 32 for picking and placeing PCB between described vertical transmission guide rail 21 and horizontal transport guide rail.
When implementing, separated by sealing device 5 between described each warm area 1, form freestanding modular structure, it is simple to control each warm area temperature and facilitate the replacing of module；Each warm area 1 is connected with heater (not shown) or chiller (not shown) respectively through pipeline (not shown).
It addition, the present embodiment also includes for loading the PCB PCB carrier 4 moved in the plurality of warm area 1 and between warm area 1.
When implementing, described PCB carrier 4 can be hopper, and the vertical direction centre position of this hopper 4 is provided with PCB and places position 41, and this PCB places and is respectively arranged with at least one thermal insulation layer 42 above and below position.
Further, each thermal insulation layer 42 is provided with air inlet 421, air outlet 422 and hot air circulation passage 423 and hot blast microcirculation fairing 424, described hopper 4 forms closed hot blast back cavity body respectively in moving up and down process with each warm area 1, namely airtight warm area is formed, it may be achieved pcb board top and the bottom components and parts are uniformly heated up.
As an optimum implementation of the present embodiment, the plurality of warm area 1 may particularly include preheating zone 11, heat preservation zone 12, recirculating zone 13 and cooling zone 14.Preheating zone 11, heat preservation zone 12, recirculating zone 13, cooling zone 14 are arranged successively from bottom to top, and vertically transmission guide rail 2 is separately positioned on the left and right sides of described each warm area 1.
The present embodiment also can be connected with SMT automatic assembly line equipment on-line, it is achieved the online production of pcb board.
Compared with prior art, the invention have the advantages that
1, the lengthwise dimension of reflow soldering equipment is substantially reduced, the reflow soldering equipment of the present invention is when identical with the reflow soldering functions of the equipments and usefulness of prior art, and length is only the 1/3 of prior art, can effectively utilize production site, save floor occupying area, convenient transport.
2, each warm area above-below direction tower design, preheats, is incubated, refluxes, cools down that each warm area is airtight, the thermal efficiency is high, and heat loss is few, can be substantially reduced energy consumption.
3, it is easily deformed after improving the heating of conventional backflow furnace superintendent transport guide rails and causes board falling, transport unstable problem.
The above is the preferred embodiment of the present invention; it should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention; can also making some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (6)
1. a reflow soldering equipment, include multiple warm area and for transmitting the PCB drive mechanism of pcb board at the plurality of warm area, it is characterized in that: the plurality of warm area has at least two warm areas vertically setting up and down, described PCB drive mechanism at least includes the vertical transmission guide rail vertically transmitting PCB between warm area setting up and down, and described PCB drive mechanism also includes the horizontal transport guide rail of horizontal transport PCB in each warm area；The plurality of warm area has specifically included preheating zone, heat preservation zone, recirculating zone and cooling zone；Preheating zone, heat preservation zone, recirculating zone, cooling zone are arranged successively from bottom to top, and vertically transmission guide rail is separately positioned on the left and right sides of described each warm area；Separated by sealing device between described each warm area, form freestanding modular structure, and be connected with heater or chiller by pipeline.
2. reflow soldering equipment as claimed in claim 1, it is characterised in that: the entrance and exit of described each warm area further respectively has plate taking-out mechanism and rushing board mechanism for picking and placeing PCB between described vertical transmission guide rail and horizontal transport guide rail.
3. reflow soldering equipment as claimed in claim 1, it is characterised in that: this equipment also includes for loading the PCB PCB carrier moved in the plurality of warm area and between warm area.
4. reflow soldering equipment as claimed in claim 3, it is characterised in that: described PCB carrier is hopper, and the vertical direction centre position of this hopper is provided with PCB and places position, and this PCB places and is respectively arranged with at least one thermal insulation layer above and below position.
5. reflow soldering equipment as claimed in claim 4, it is characterized in that: each thermal insulation layer is provided with air inlet, air outlet and hot air circulation passage and hot blast microcirculation fairing, described hopper forms closed hot blast back cavity body respectively in moving up and down process with each warm area.
6. reflow soldering equipment as claimed in claim 1, it is characterised in that: this equipment is connected with SMT automatic assembly line equipment on-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210201010.2A CN102689071B (en) | 2012-06-18 | 2012-06-18 | Reflow soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210201010.2A CN102689071B (en) | 2012-06-18 | 2012-06-18 | Reflow soldering equipment |
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| Publication Number | Publication Date |
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| CN102689071A CN102689071A (en) | 2012-09-26 |
| CN102689071B true CN102689071B (en) | 2016-07-06 |
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| CN201210201010.2A Active CN102689071B (en) | 2012-06-18 | 2012-06-18 | Reflow soldering equipment |
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| CN103354165B (en) * | 2013-06-26 | 2016-08-10 | 安徽省科林电子有限公司 | A kind of segmentation cooling-down type transformer package equipment |
| CN104363716A (en) * | 2014-11-15 | 2015-02-18 | 中国航天科工集团第三研究院第八三五七研究所 | Microwave circuit substrate grounding welding technology |
| CN106964862A (en) * | 2016-01-13 | 2017-07-21 | 谢玉强 | Save reflow machine |
| CN107225303B (en) * | 2016-03-25 | 2019-12-10 | 深圳市宝瑞达科技有限公司 | Precise reflow welding machine |
| CN105772885A (en) * | 2016-05-24 | 2016-07-20 | 深圳市劲拓自动化设备股份有限公司 | Reflow soldering device |
| CN106112168B (en) * | 2016-08-22 | 2019-02-22 | 朗微士光电（苏州）有限公司 | A kind of online vacuum back-flow welding machine |
| CN108063108A (en) * | 2018-01-22 | 2018-05-22 | 广安市嘉乐电子科技有限公司 | A kind of MB bridges heap bonding machine |
| JP7024464B2 (en) * | 2018-02-02 | 2022-02-24 | 浜名湖電装株式会社 | Electrical parts manufacturing equipment and manufacturing method of electrical parts |
| CN108380999A (en) * | 2018-05-18 | 2018-08-10 | 深圳市宏佳鑫自动化设备有限公司 | A kind of bonding machine and welding method |
| CN109014481B (en) * | 2018-09-21 | 2021-04-09 | 安徽机电职业技术学院 | Energy-saving efficient reflow soldering machine |
| CN112719501B (en) * | 2021-01-29 | 2022-10-28 | 合肥市贵谦信息科技有限公司 | Reflow furnace for rapid fusion welding and operation method thereof |
| CN113618240B (en) * | 2021-08-19 | 2023-02-28 | 深圳市尚拓激光技术有限公司 | Laser welding equipment for lithium battery explosion-proof valve |
| CN114029577B (en) * | 2021-10-21 | 2022-08-09 | 先之科半导体科技(东莞)有限公司 | Reflow soldering device of low-loss Schottky rectifier tube |
| CN114845479A (en) * | 2022-05-20 | 2022-08-02 | 深圳市兆驰数码科技股份有限公司 | Through hole reflow soldering infrared head implementation method |
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| CN101707857A (en) * | 2009-11-25 | 2010-05-12 | 深圳市诺斯达科技有限公司 | PCB welding machine and welding method |
| CN202667854U (en) * | 2012-06-18 | 2013-01-16 | 日东电子科技(深圳)有限公司 | Reflow soldering equipment |
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| JP2583981B2 (en) * | 1988-06-30 | 1997-02-19 | 松下電器産業株式会社 | Soldering equipment |
| JP2682085B2 (en) * | 1988-11-17 | 1997-11-26 | 松下電器産業株式会社 | Reflow soldering equipment |
| JP2518539B2 (en) * | 1993-11-15 | 1996-07-24 | 日本電気株式会社 | Vertical reflow soldering device |
| JP2001274541A (en) * | 2000-03-24 | 2001-10-05 | Koyo Thermo System Kk | Reflow furnace |
| DE10023358A1 (en) * | 2000-05-12 | 2001-11-29 | Siemens Ag | Production line for one-sided and double-sided assembly of printed circuit boards |
| EP1974844A4 (en) * | 2006-01-06 | 2009-10-14 | Tamura Seisakusho Kk | Reflow apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101707857A (en) * | 2009-11-25 | 2010-05-12 | 深圳市诺斯达科技有限公司 | PCB welding machine and welding method |
| CN202667854U (en) * | 2012-06-18 | 2013-01-16 | 日东电子科技(深圳)有限公司 | Reflow soldering equipment |
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| CN102689071A (en) | 2012-09-26 |
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Address after: 518103 Guangdong city of Shenzhen province Baoan District Fuyong street baishixia Industrial Zone Road East Industrial Park Patentee after: Ridong intelligent equipment technology (Shenzhen) Co.,Ltd. Address before: 518103 Guangdong city of Shenzhen province Baoan District Fuyong street baishixia Industrial Zone Road East Industrial Park Patentee before: UNISPLENDOUR SUNEAST TECHNOLOGY (SHENZHEN) Co.,Ltd. Address after: 518103 Guangdong city of Shenzhen province Baoan District Fuyong street baishixia Industrial Zone Road East Industrial Park Patentee after: UNISPLENDOUR SUNEAST TECHNOLOGY (SHENZHEN) Co.,Ltd. Address before: 518103 Guangdong city of Shenzhen province Baoan District Fuyong street baishixia Industrial Zone Road East Industrial Park Patentee before: SUN EAST ELECTRONIC TECHNOLOGY (SHENZHEN) Co.,Ltd. |
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