CN102683576B - Piezoelectric actuator and manufacturing method thereof - Google Patents

Piezoelectric actuator and manufacturing method thereof Download PDF

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CN102683576B
CN102683576B CN201210147357.3A CN201210147357A CN102683576B CN 102683576 B CN102683576 B CN 102683576B CN 201210147357 A CN201210147357 A CN 201210147357A CN 102683576 B CN102683576 B CN 102683576B
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electrode
piezoelectric actuator
piezoelectric
piezoelectric ceramic
ceramic piece
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CN102683576A (en
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董蜀湘
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Peking University
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Abstract

The invention provides a piezoelectric actuator and a manufacturing method thereof. The manufacturing method comprises the steps of: respectively manufacturing inner electrodes with preset patterns on the upper surface and the lower surface of a piezoelectric ceramic chip; bonding a plurality of the piezoelectric ceramic chips, on which the inner electrodes are manufactured, together by using high-temperature-resistant inorganic polymer silica gel materials to form multilayer ceramic of an integrated structure; respectively manufacturing outer electrodes on two opposite side faces of the multilayer ceramic of the integrated structure to realize parallel connection of the piezoelectric ceramic chips on a circuit; and polarizing the multilayer ceramic of the integrated structure to obtain the piezoelectric actuator. The piezoelectric actuator disclosed by the invention is simple to manufacture and stable and reliable in working and has better high-temperature resistance.

Description

Piezoelectric actuator manufacture method and piezoelectric actuator
Technical field
The present invention relates to piezoelectric actuator technology, relate in particular to a kind of piezoelectric actuator manufacture method and piezoelectric actuator.
Background technology
Piezoelectric actuator, for example piezoelectric microactuators device is the New Solid actuator that utilizes the inverse piezoelectric effect of piezoelectric to be made, it has the advantages such as size is little, good linearity, control convenience, displacement resolution is high, frequency response good, energy consumption is low, noiseless, is widely applied at high-technology fields such as precision optics, micromachine, microelectric techniques.
Wherein, according to the difference of type of drive, piezoelectric actuator can be divided into rigid displacement driver and resonance displacement driver, rigid displacement driver comprises multiple field driver, list (two) crystal chip driver, rainbow type (Rainbow) driver, month dentition formula (Moonie) driver and cymbals formula (Cymbals) driver etc.Having the advantages such as bearing capacity is large, fast response time, displacement is reproducible, volume efficiency is high, electric field controls is relatively simple due to multiple field driver, is a kind of common piezoelectric actuator, is widely applied in precision optical machinery field.
At present, when multiple field driver is made, normally adopt traditional casting film-forming multilayer co-firing preparation technology, comprise the following steps: (1) flow casting molding, it is to make slurry add organic solvent in raw material after, and slurry curtain coating is obtained to rete; (2) dry, the rete curtain coating being obtained is dried; (3) stack, plates silver electrode by the rete after drying, and superposes; (4) burn altogether, by the multilayer film high-temperature calcination obtaining after stack, obtain the piezoelectric actuator of sandwich construction.In the traditional casting film-forming multilayer co-firing of existing employing preparation technology, need with an organic solvent, and organic solvent is conventionally poisonous; In burning process, the silver electrode of plating on rete easily spreads altogether, causes the Piezo-actuator after making to decline, degenerate; Meanwhile, existing preparation technology's flow process complexity, fail safe is poor, and cost of manufacture is higher.In addition, prior art also has by adopting epoxy resin to paste mode and obtain piezoelectric actuator.
To sum up, in the multilayer co-firing preparation technology of existing piezoelectric actuator, in multilayer co-firing process, easily cause silver electrode diffusion on rete, between piezoceramics layer, easily produce creep, make the energy conversion efficiency of piezoelectric actuator low, displacement loss is larger, and Piezo-actuator is poor; In addition, existing piezoelectric actuator complicated process of preparation, quality is wayward.And existing employing epoxy resin mode is while preparing piezoelectric actuator, the piezoelectric actuator preparing cannot be applicable to hot environment work.
Summary of the invention
The invention provides a kind of piezoelectric actuator manufacture method and piezoelectric actuator, can effectively overcome the problem that prior art adopts the piezoelectric actuator burning altogether and prepare by epoxy resin to exist, simplifying under piezoelectric actuator preparation technology's prerequisite, can effectively improve the driveability of piezoelectric actuator and improve the working temperature scope of application.
The invention provides a kind of piezoelectric actuator manufacture method, comprising:
Make respectively the interior electrode of predetermined pattern in the upper and lower surface of piezoelectric ceramic piece;
By high temperature resistant inorganic polymerization silica gel material, the multiple piezoelectric ceramic pieces after electrode in making are bonded together, form the multi-layer ceramics of integral structure;
On two relative sides of the multi-layer ceramics of described integral structure, make respectively external electrode, so that each piezoelectric ceramic piece is formed and to be connected in parallel on circuit;
Multi-layer ceramics to described integral structure polarizes, and obtains described piezoelectric actuator.
In above-mentioned piezoelectric actuator manufacture method, described high temperature resistant inorganic polymerization silicon gel is that magnesium silicate, aluminum phosphate and inorganic polymer are mixed to form.
In above-mentioned piezoelectric actuator manufacture method, described high temperature resistant inorganic polymerization silicon gel is the inorganic polymerization silicon gel of resistance to more than 500 DEG C high temperature.
In above-mentioned piezoelectric actuator manufacture method, described piezoelectric ceramic piece is to adopt Curie temperature to make and obtain higher than the piezoelectric of 120 DEG C.
In above-mentioned piezoelectric actuator manufacture method, an example of described piezoelectric ceramic sheet material is to adopt scandium acid bismuth-titanate lead solid solution, the chemical formula of described scandium acid bismuth-titanate lead solid solution is (1-x) BiScO3-xPbTiO3, wherein: 0.2≤x<1.
In above-mentioned piezoelectric actuator manufacture method, the described upper and lower surface at piezoelectric ceramic piece also comprises before making respectively the electrode of predetermined pattern:
Utilize solid reaction process to prepare piezoelectric ceramic piece.
In above-mentioned piezoelectric actuator manufacture method, the electrode width w of described piezoelectric ceramic piece upper and lower surface is less than the width W of potsherd, and the relative two sides of the electrode of upper and lower surface antisymmetry arranges;
The arbitrary lip-deep electrode of described potsherd is to the gap d=W-w of side, and described gap d is greater than the thickness t of described piezoelectric ceramic piece.
In above-mentioned piezoelectric actuator manufacture method, described interior electrode and external electrode are silver electrode.Wherein, described interior electrode and external electrode form by firing, and firing temperature is 500 DEG C-900 DEG C.Described interior electrode can be also copper, nickel or gold, or their mixed electrode; Interior electrode also can adopt sputtering method preparation.
In addition, the present invention also provides a kind of piezoelectric actuator, and it adopts the piezoelectric actuator manufacture method making that the invention described above provides to obtain.
Piezoelectric actuator manufacture method provided by the invention and piezoelectric actuator, by adopting high temperature resistant inorganic polymerization silicon gel cementing, the problem of having avoided traditional multilayer co-firing method to decline, degenerate because of silver electrode piezoelectric property that diffusion causes, simultaneously, also can avoid conventional epoxies adhering method can not bear the inherent shortcoming of high temperature, eliminate the creep between piezoelectric ceramic piece, can effectively improve the energy conversion efficiency of piezoelectric actuator, the high-temperature piezoelectric driver obtaining has more excellent electrical property and better consistency.Simple, with low cost advantage that piezoelectric actuator manufacture method provided by the invention has manufacture craft, can prepare the piezoelectric actuator that is applicable to work under hot environment, and the piezoelectric actuator steady quality of making, reliable.
Brief description of the drawings
The schematic flow sheet of the piezoelectric actuator manufacture method that Fig. 1 provides for the embodiment of the present invention one;
Fig. 2 is preparation method's schematic diagram of piezoelectric ceramic piece in the embodiment of the present invention;
Fig. 3 makes and obtains the measured voltage-micrometric displacement curve chart of piezoelectric actuator according to the present invention;
The structural representation of the piezoelectric actuator that Fig. 4 provides for the embodiment of the present invention two.
Embodiment
In view of the problem that existing piezoelectric actuator exists, the embodiment of the present invention provides a kind of piezoelectric actuator, multiple piezoelectric ceramic pieces can be made to the piezoelectric actuator of integrated, multi-level structure after with parallel way interaction cascading, bonding.To describe the present embodiment piezoelectric actuator manufacture method and piezoelectric actuator structure below.
The schematic flow sheet of the piezoelectric actuator manufacture method that Fig. 1 provides for the embodiment of the present invention one.As shown in Figure 1, the present embodiment piezoelectric actuator manufacture method can comprise the following steps:
Step 101, make respectively the interior electrode of predetermined pattern in the upper and lower surface of piezoelectric ceramic piece;
Step 102, by high temperature resistant inorganic polymerization silica gel material, the multiple piezoelectric ceramic pieces after electrode in making are bonded together, form the multi-layer ceramics of integral structure;
Step 103, on two relative sides of the multi-layer ceramics of integral structure, make respectively external electrode, so that each piezoelectric ceramic piece is formed and to be connected in parallel on circuit;
Step 104, the multi-layer ceramics of integral structure is polarized, obtain piezoelectric actuator.
The present embodiment is in the time making piezoelectric actuator, can multiple piezoelectric ceramic pieces be bonded together by resistant to elevated temperatures inorganic polymerization silicon gel, the problem having existed while having avoided existing employing co-firing technology to make piezoelectric actuator, simplify piezoelectric actuator manufacturing process, improve the efficiency that piezoelectric actuator is made, reduced cost of manufacture; Meanwhile, by adopting high temperature resistant inorganic polymerization silica gel material that each piezoelectric ceramic piece is bonded together, eliminate the creep between piezoelectric ceramic piece, can effectively improve the performance of making the piezoelectric actuator obtaining, can effectively improve energy conversion efficiency; In addition,, by adopting high temperature resistant inorganic polymerization silicon gel as binding agent, can effectively improve the reliability that piezoelectric actuator is at high temperature worked, applicable to the application demand under hot environment.
In the present embodiment, described high temperature resistant inorganic polymerization silicon gel can be the inorganic polymerization silicon gel of resistance to more than 500 DEG C high temperature, for example, can adopt magnesium silicate, aluminum phosphate and inorganic polymer to be mixed to form.Particularly, tiny to magnesium silicate, aluminum phosphate etc. inorganic particle and inorganic polymer can be mixed to form to inorganic binder, it can have stronger adhesion strength and good high-temperature stability, therefore, can be used as high temperature resistant inorganic polymerization silicon gel cementing material.
In the present embodiment, described piezoelectric ceramic piece can adopt Curie temperature to make and obtain higher than the piezoelectric of 120 DEG C, and particularly, in the present embodiment, the Curie temperature of piezoelectric ceramic piece is between 400 ~ 500 DEG C.Particularly, the material of making piezoelectric ceramic piece can be scandium acid bismuth-titanate lead solid solution, and the chemical formula of this scandium acid bismuth-titanate lead solid solution can be expressed as (1-x) BiScO3-xPbTiO3, wherein: 0.2≤x<1.
In the present embodiment, piezoelectric ceramic piece can utilize solid reaction process to prepare, particularly, and before above-mentioned step 101, can prepare piezoelectric ceramic piece by solid reaction process, below the process of preparing piezoelectric ceramic piece with scandium acid bismuth-titanate lead solid solution be described.
Fig. 2 is preparation method's schematic diagram of piezoelectric ceramic piece in the embodiment of the present invention.As shown in Figure 2, the preparation process of piezoelectric ceramic piece can comprise the following steps:
Step 201, definite material of making piezoelectric ceramic piece, prepare burden.
Particularly, the material of determining making piezoelectric ceramic piece is the chemical formula of scandium acid bismuth-titanate lead solid solution, and weighs and prepare burden by the stoichiometric proportion of chemical formula, obtains making the material of piezoelectric ceramic piece.
In the present embodiment, adopt scandium acid bismuth-titanate lead solid solution that chemical formula is 0.633BiScO3-0.367PbTiO3, in the time of this solid solution of preparation, Bi2O3, the Sc2O3, PbO and the TiO2 powder that adopt purity to be greater than 99.9%, and weigh according to the metering ratio in chemical formula, mix, configuration obtains some grams of powders; In the powder being mixed to get, add appropriate absolute ethyl alcohol to make ball milling agent, make ball-milling medium with zirconia ball, and three's part by weight is powder: zirconia ball: ethanol=1:1.5:1; Be placed on the interior ball milling of ball mill 24 hours, oxide fully mixed also levigate.
Step 202, above-mentioned steps 201 is ground to the oxide mixture obtaining calcine, obtain solid-solution powder.
Particularly, the mixture obtaining after can first above-mentioned steps 201 being ground is dried at 80 DEG C, then, be warmed up to 450 DEG C with 5 DEG C/component velocity, be incubated 2 hours, then be warmed up to 750 DEG C with same speed, be incubated 4 hours, form the solid-solution powder with certain crystallographic structure; ,, by powder ball milling 24 hours again, make grain refine thereafter; Finally, carry out secondary clacining, and again carry out ball milling, obtain the tiny uniform solid-solution powder of particle.
In this step, oxide mixture by calcining 4 hours, can make, between oxide, solid state reaction occurs at 750 DEG C, forms the solid-solution powder with perovskite crystal structure.
Step 203, the solid-solution powder that above-mentioned steps 202 is obtained carry out moulding, obtain biscuit.
Particularly, the solid-solution powder that above-mentioned steps 202 is obtained takes out, and adds 3% polyvinyl alcohol adhesive, fully mix, granulation is also crossed after 80 mesh sieves, takes out appropriate powder and puts into mould, at the forming under the pressure of 120MPa, obtain the square biscuit of required size.
In this step, can effectively improve mobility and the suppression performance of the particle of acquisition by 80 mesh sieves, and can be unidirectional compressing under 120MPa pressure, biscuit obtained.
Step 204, the biscuit that above-mentioned steps 203 is obtained are proceeded calcining, obtain scandium acid bismuth-titanate lead solid solution ceramic.
Particularly, the square biscuit that above-mentioned steps 203 is obtained is warmed up to 450 DEG C with 1 DEG C of/point of speed, is incubated 3 hours, under 2 DEG C of/point of speed, be warmed up to 600 DEG C again, be incubated 3 hours, cooling with stove afterwards, this process can fully exclude the polyvinyl alcohol adhesive organic substance in biscuit.Subsequently, biscuit is positioned in the crucible of sealing, is warming up to 1050 ~ 1150 DEG C with 5 DEG C of/point of speed, be incubated 60 ~ 180 minutes; Then cooling with stove, finally obtain the potsherd that shrinks, its shrinkage is 18%, is the scandium acid bismuth-titanate lead solid solution ceramic of fine and close homogeneous.
In this step, first remove the binding agent organic substance containing in biscuit, then at 1050-1150 DEG C, carry out sintering, thereby can obtain the scandium acid bismuth-titanate lead solid solution ceramic of densification, homogeneous.
Step 205, the solid solution ceramic that above-mentioned steps 204 is obtained are processed, and obtain the potsherd that thickness is 0.1-10mm.
The square ceramic that above-mentioned steps 204 can be obtained particularly, makes by the piezoelectric ceramic of densified sintering product the potsherd that thickness is 0.1 ~ 10mm through flow processs such as polishing, ultrasonic cleaning, oven dry.
Just can prepare the piezoelectric ceramic piece of requirement according to step 201-step 205.In practical application, also can adopt as required and prick film method and prepare the piezoelectric ceramic piece of thinner size, the piezoelectric ceramic piece of for example 0.02mm-0.2mm.
After obtaining the certain potsherd of thickness by above-mentioned steps, just can, according to step shown in Fig. 1, make and obtain piezoelectric actuator.Particularly, in the present embodiment, the thickness of the piezoelectric ceramic piece of making is 1mm; In the interior electrode of making on the surface of piezoelectric ceramic piece, electric conducting material is that weight ratio is 100% silver, wherein the performance parameter of ag material is: piezoelectric constant d33=441pC/N, DIELECTRIC CONSTANT ε=1051, dielectric loss tan θ=3%, radially electromechanical coupling factor kp=0.58.In addition on boning two opposite flanks of the integral structure that forms, fires piezoelectric ceramic piece, or sputter external electrode is also silver electrode.
In the present embodiment, when interior electrode and external electrode, form by firing, and firing temperature is 500 DEG C-900 DEG C, when silver electrode is made, can reduces interpenetrating between electrode and pottery, improve the reliability of device work.And, can there is advantage with low cost with respect to the silver-colored palladium electrode of existing employing.In addition, in the present embodiment, interior electrode and external electrode also can adopt other metal electrodes, such as copper electrode, nickel electrode, gold electrode etc., or also can be the mixed metal electrode of the two or more metal mixed such as silver, copper, nickel, gold, to this present embodiment and be not particularly limited.
In practical application, can be as required, the thickness of the piezoelectric ceramic piece obtaining by step 201-step 205 can be between 0.02-10mm, to meet actual needs; In addition, on piezoelectric ceramic piece, the width of interior electrode is less than the width of piezoelectric ceramic piece, to guarantee the service behaviour of the piezoelectric actuator of making.
In practical application, can be as required, the piezoelectric ceramic piece bonding that suitable quantity is set forms the piezoelectric actuator of integral structure, and the quantity of for example piezoelectric ceramic piece can be between 2-1000, and in the present embodiment, the quantity of piezoelectric ceramic piece is 10.
In the present embodiment, for guaranteeing the service behaviour of piezoelectric actuator, the interior electrode of making on the upper and lower surface of each piezoelectric ceramic piece, its electrode pattern size, shape are identical, but antisymmetry setting; One end of piezoelectric ceramic piece is electrically connected with external electrode, the other end is not by being coated with the piezoelectric ceramic region itself and the isolation of external electrode electricity of electrode, and in adjacent two potsherds, the one end being connected with external electrode is to be crisscross arranged, thereby make in the multi-layer ceramics of integral structure, each piezoelectric ceramic piece can form and be connected in parallel on circuit.
In practical application, the pattern of the interior electrode of making on piezoelectric ceramic piece can be arranged to suitable pattern as required, in the present embodiment, be produced on the upper surface of piezoelectric ceramic piece and interior electrode pattern size, the shape of lower surface are consistent, one end is concordant with a side of piezoelectric ceramic piece, one side of one end and piezoelectric ceramic piece has certain distance gap, and two interior electrode antisymmetry in upper and lower surface are crisscross arranged.Like this, multiple potsherds are by interaction cascading, make the interior electrode on adjacent two piezoelectric ceramic pieces can be adjacent with the external electrode of both sides respectively, and each piezoelectric ceramic piece is formed and is connected in parallel on circuit.For fear of the inadequate thickness polarization of piezoelectric ceramic piece, the electrode width w of described piezoelectric ceramic piece above and below is less than the width W of potsherd, and top and bottom electrode antisymmetry end face arranges; On potsherd, the electrode on arbitrary surface, to the gap d=W-w of side, should be greater than the thickness t of this piezoelectric ceramic piece.In the present embodiment, as shown in Figure 4, the integral thickness of piezoelectric ceramic piece 101 is L, and the electrode width w of upper and lower surface is less than the width W of piezoelectric ceramic piece 101, and the relative two sides of the electrode of upper and lower surface antisymmetry arranges; The arbitrary lip-deep electrode of piezoelectric ceramic piece 101 is to the gap d=W-w of side, and gap d is greater than the thickness t of piezoelectric ceramic piece.
Fig. 3 makes and obtains the measured voltage-micrometric displacement curve chart of piezoelectric actuator according to the present invention.As shown in Figure 3, wherein abscissa is electric field strength, and ordinate micrometric displacement can be found out, along with temperature raises, under identical test electric field strength, makes the piezoelectric actuator displacement increase obtaining according to the embodiment of the present invention, and can be at 200 DEG C steady operation.
Piezoelectric actuator manufacture method provided by the invention, by adopting high temperature resistant inorganic polymerization silicon gel cementing, the problem of having avoided traditional multilayer co-firing method to decline, degenerate because of silver electrode piezoelectric property that diffusion causes, simultaneously, also can avoid conventional epoxies adhering method can not bear the inherent shortcoming of high temperature, improved electromechanical conversion efficiency, the high-temperature piezoelectric driver obtaining there is more excellent electrical property and consistency better.Simple, with low cost advantage that piezoelectric actuator manufacture method provided by the invention can have manufacture craft, can prepare the piezoelectric actuator that is applicable to work under hot environment.
The structural representation of the piezoelectric actuator that Fig. 4 provides for the embodiment of the present invention two.As shown in Figure 4, the present embodiment piezoelectric actuator is for being made and obtained by method shown in above-mentioned Fig. 1, this piezoelectric actuator 10 comprises multilayer piezoelectric ceramic sheet 101, the upper and lower surface of each piezoelectric ceramic piece 101 is provided with interior electrode 102, and on piezoelectric actuator 10, relative both sides are respectively arranged with external electrode 103, so that each piezoelectric ceramic piece 101 is formed and to be connected in parallel on circuit, and each piezoelectric ceramic piece 101 is through-thickness polarization, the polarised direction of adjacent two piezoelectric ceramic pieces is contrary, its specific implementation can be referring to the explanation of the invention described above embodiment of the method, do not repeat them here.
The present embodiment piezoelectric actuator can be under additional voltage effect, the common through-thickness of each piezoelectric ceramic piece is elongated or shortened, thereby realize required displacement, and its specific implementation process is identical with conventional piezoelectric driver or similar, does not repeat them here.
Finally it should be noted that: above each embodiment, only in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to aforementioned each embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or some or all of technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.

Claims (9)

1. a piezoelectric actuator manufacture method, is characterized in that, comprising:
Make respectively the interior electrode of predetermined pattern in the upper and lower surface of piezoelectric ceramic piece;
By high temperature resistant inorganic polymerization silica gel material, the multiple piezoelectric ceramic pieces after electrode in making are bonded together, form the multi-layer ceramics of integral structure;
On two relative sides of the multi-layer ceramics of described integral structure, make respectively external electrode, so that each piezoelectric ceramic piece is formed and to be connected in parallel on circuit;
Multi-layer ceramics to described integral structure polarizes, and obtains described piezoelectric actuator;
Wherein, described high temperature resistant inorganic polymerization silicon gel is that magnesium silicate, aluminum phosphate and inorganic polymer are mixed to form.
2. piezoelectric actuator manufacture method according to claim 1, is characterized in that, described high temperature resistant inorganic polymerization silicon gel is the inorganic polymerization silicon gel of resistance to more than 500 DEG C high temperature.
3. piezoelectric actuator manufacture method according to claim 2, is characterized in that, described piezoelectric ceramic piece is to adopt Curie temperature to make and obtain higher than the piezoelectric of 120 DEG C.
4. piezoelectric actuator manufacture method according to claim 3, is characterized in that, the material of described piezoelectric ceramic piece is scandium acid bismuth-titanate lead solid solution, and the chemical formula of described scandium acid bismuth-titanate lead solid solution is (1-x) BiScO 3-xPbTiO 3, wherein: 0.2≤x<1.
5. according to the arbitrary described piezoelectric actuator manufacture method of claim 1-4, it is characterized in that, the described upper and lower surface at piezoelectric ceramic piece also comprises before making respectively the electrode of predetermined pattern:
Utilize solid reaction process to prepare piezoelectric ceramic piece.
6. piezoelectric actuator manufacture method according to claim 1, is characterized in that, the electrode width w of described piezoelectric ceramic piece upper and lower surface is less than the width W of potsherd, and the relative two sides of the electrode of upper and lower surface antisymmetry arranges;
The arbitrary lip-deep electrode of described potsherd is to the gap d=W-w of side, and described gap d is greater than the thickness t of described piezoelectric ceramic piece.
7. piezoelectric actuator manufacture method according to claim 1, is characterized in that, the very mixed metal electrode of silver electrode, copper electrode, nickel electrode, gold electrode or above-mentioned at least two kinds of metal mixed of described interior electrode and dispatch from foreign news agency.
8. piezoelectric actuator manufacture method according to claim 7, is characterized in that, described interior electrode and external electrode are by firing or sputter forms.
9. one kind adopts the arbitrary described piezoelectric actuator manufacture method of claim 1-8 to make the piezoelectric actuator obtaining.
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CN105675648A (en) * 2014-11-17 2016-06-15 中国航空工业第六八研究所 Diaphragm-type piezoelectric actuator defect detection method
CN104446451B (en) * 2014-12-05 2017-03-01 中国科学技术大学 A kind of have bismuth-containing piezoelectric of piezoelectricity enhancing structure and preparation method thereof
CN105634326A (en) * 2016-03-18 2016-06-01 河南师范大学 Piezoelectric bimorph type inertial piezoelectric motor
CN111785827A (en) * 2020-06-30 2020-10-16 深圳振华富电子有限公司 Manufacturing method of piezoelectric actuator

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