CN102676105B - 高热传导性膜状接着剂,该接着剂用组合物,使用该接着剂的半导体封装件及其制造方法 - Google Patents
高热传导性膜状接着剂,该接着剂用组合物,使用该接着剂的半导体封装件及其制造方法 Download PDFInfo
- Publication number
- CN102676105B CN102676105B CN201210071049.7A CN201210071049A CN102676105B CN 102676105 B CN102676105 B CN 102676105B CN 201210071049 A CN201210071049 A CN 201210071049A CN 102676105 B CN102676105 B CN 102676105B
- Authority
- CN
- China
- Prior art keywords
- thermal conductivity
- solid
- membranaceous
- high thermal
- membranaceous solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Epoxy Resins (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-057694 | 2011-03-16 | ||
JP2011057694 | 2011-03-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102676105A CN102676105A (zh) | 2012-09-19 |
CN102676105B true CN102676105B (zh) | 2016-03-02 |
Family
ID=46808671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210071049.7A Active CN102676105B (zh) | 2011-03-16 | 2012-03-16 | 高热传导性膜状接着剂,该接着剂用组合物,使用该接着剂的半导体封装件及其制造方法 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP5871428B2 (zh) |
KR (1) | KR101856557B1 (zh) |
CN (1) | CN102676105B (zh) |
TW (1) | TWI553077B (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6033734B2 (ja) * | 2013-04-30 | 2016-11-30 | 日東電工株式会社 | フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法 |
JP2015005636A (ja) * | 2013-06-21 | 2015-01-08 | 日東電工株式会社 | ダイシング・ダイボンディングフィルム |
JP2015103578A (ja) * | 2013-11-21 | 2015-06-04 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、及び、半導体装置の製造方法 |
JP6505362B2 (ja) * | 2013-11-21 | 2019-04-24 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、熱硬化型ダイボンドフィルムの製造方法、及び、半導体装置の製造方法 |
JP6366228B2 (ja) * | 2013-06-04 | 2018-08-01 | 日東電工株式会社 | 接着シート、及びダイシング・ダイボンディングフィルム |
JP6595336B2 (ja) | 2013-06-25 | 2019-10-23 | 味の素株式会社 | 樹脂組成物 |
JP2015103649A (ja) * | 2013-11-25 | 2015-06-04 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置の製造方法、及び、半導体装置 |
JP6379389B2 (ja) * | 2014-12-15 | 2018-08-29 | リンテック株式会社 | ダイシングダイボンディングシート |
JP6540259B2 (ja) * | 2015-06-18 | 2019-07-10 | Dic株式会社 | 熱伝導材料用エポキシ樹脂組成物、その硬化物および電子部材 |
KR102440882B1 (ko) * | 2015-06-29 | 2022-09-05 | 타츠타 전선 주식회사 | 방열재료 접착용 조성물, 접착제 부착 방열재료, 인레이 기판 및 그 제조방법 |
WO2017158994A1 (ja) * | 2016-03-15 | 2017-09-21 | 古河電気工業株式会社 | フィルム状接着剤用組成物、フィルム状接着剤、フィルム状接着剤の製造方法、フィルム状接着剤を用いた半導体パッケージおよびその製造方法 |
CN114410066A (zh) * | 2016-05-11 | 2022-04-29 | 日立化成株式会社 | 密封用液状树脂组合物及电子部件装置 |
TWI724179B (zh) * | 2016-06-10 | 2021-04-11 | 日商昭和電工材料股份有限公司 | 接著膜及切晶黏晶一體型膜 |
KR102019468B1 (ko) * | 2016-11-29 | 2019-09-06 | 주식회사 엘지화학 | 반도체용 접착 필름 및 반도체 장치 |
JP6615150B2 (ja) * | 2017-05-01 | 2019-12-04 | 古河電気工業株式会社 | 接着フィルム、半導体ウェハ加工用テープ、半導体パッケージおよびその製造方法 |
WO2019013299A1 (ja) * | 2017-07-14 | 2019-01-17 | 富士フイルム株式会社 | 熱伝導材料、熱伝導層付きデバイス、熱伝導材料形成用組成物、液晶性円盤状化合物 |
JP6889398B2 (ja) * | 2017-07-20 | 2021-06-18 | 昭和電工マテリアルズ株式会社 | 放熱性ダイボンディングフィルム及びダイシングダイボンディングフィルム |
US20210062010A1 (en) * | 2017-09-04 | 2021-03-04 | Toagosei Co., Ltd. | Composition for powder coating materials and coated article |
JP6800129B2 (ja) * | 2017-11-07 | 2020-12-16 | 古河電気工業株式会社 | フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法 |
JP7157511B2 (ja) * | 2018-04-19 | 2022-10-20 | 株式会社ディスコ | 切削装置及び切削ブレード検出方法 |
WO2021033368A1 (ja) * | 2019-08-22 | 2021-02-25 | 古河電気工業株式会社 | 接着剤用組成物、フィルム状接着剤及びその製造方法、並びに、フィルム状接着剤を用いた半導体パッケージおよびその製造方法 |
JP6863435B2 (ja) * | 2019-10-30 | 2021-04-21 | 味の素株式会社 | 保護フィルム付き接着シートの製造方法 |
CN111019578B (zh) * | 2019-12-26 | 2022-04-12 | 深圳德邦界面材料有限公司 | 一种环氧树脂导热粘接片及其制备方法 |
JP6902641B1 (ja) * | 2020-03-13 | 2021-07-14 | 古河電気工業株式会社 | ダイシングダイアタッチフィルム、並びに、ダイシングダイアタッチフィルムを用いた半導体パッケージ及びその製造方法 |
KR20220157370A (ko) * | 2020-04-01 | 2022-11-29 | 쇼와덴코머티리얼즈가부시끼가이샤 | 반도체용 접착제, 및, 반도체 장치 및 그 제조 방법 |
WO2022024510A1 (ja) * | 2020-07-30 | 2022-02-03 | 古河電気工業株式会社 | 接着剤用組成物及びフィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法 |
CN114774047A (zh) * | 2022-05-18 | 2022-07-22 | 江苏斯迪克新材料科技股份有限公司 | 一种柔性导热胶组合物及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1180368A (zh) * | 1995-04-04 | 1998-04-29 | 日立化成工业株式会社 | 粘合剂、胶膜及带粘合剂底面的金属箔 |
CN1539879A (zh) * | 2003-04-25 | 2004-10-27 | ������ѧ��ʽ���� | 环氧树脂组合物及其用途 |
JP2004331728A (ja) * | 2003-05-01 | 2004-11-25 | Nippon Steel Chem Co Ltd | 電子部品被覆用接着性フィルム |
CN101362926A (zh) * | 2003-06-06 | 2009-02-11 | 日立化成工业株式会社 | 粘合片、与切割胶带一体化的粘合片以及半导体的制造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004339371A (ja) * | 2003-05-15 | 2004-12-02 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物、及びその硬化物 |
JP4816871B2 (ja) * | 2004-04-20 | 2011-11-16 | 日立化成工業株式会社 | 接着シート、半導体装置、及び半導体装置の製造方法 |
JP2007270125A (ja) * | 2006-03-08 | 2007-10-18 | Hitachi Chem Co Ltd | 接着シート、一体型シート、半導体装置、及び半導体装置の製造方法 |
JP4893046B2 (ja) * | 2006-03-22 | 2012-03-07 | 東レ株式会社 | 電子機器用接着剤組成物、それを用いた電子機器用接着剤シート |
JP5524465B2 (ja) * | 2007-10-24 | 2014-06-18 | 日立化成株式会社 | 接着シート及びこれを用いた半導体装置およびその製造方法 |
JP5345313B2 (ja) * | 2007-12-19 | 2013-11-20 | 新日鉄住金化学株式会社 | フィルム状接着剤、それを用いた半導体パッケージ、及びその製造方法 |
JP4495768B2 (ja) * | 2008-08-18 | 2010-07-07 | 積水化学工業株式会社 | 絶縁シート及び積層構造体 |
JP4495772B1 (ja) * | 2009-03-02 | 2010-07-07 | 積水化学工業株式会社 | 絶縁シート及び積層構造体 |
JP2010254763A (ja) * | 2009-04-22 | 2010-11-11 | Hitachi Chem Co Ltd | 接着剤組成物、その製造方法、これを用いた接着シート、一体型シート、その製造方法、半導体装置及びその製造方法 |
TWI431090B (zh) * | 2010-04-07 | 2014-03-21 | Furukawa Electric Co Ltd | Wafer processing tape |
-
2012
- 2012-03-15 KR KR1020120026596A patent/KR101856557B1/ko active IP Right Grant
- 2012-03-15 JP JP2012058702A patent/JP5871428B2/ja active Active
- 2012-03-16 CN CN201210071049.7A patent/CN102676105B/zh active Active
- 2012-03-16 TW TW101109072A patent/TWI553077B/zh active
-
2016
- 2016-01-08 JP JP2016002581A patent/JP6005309B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1180368A (zh) * | 1995-04-04 | 1998-04-29 | 日立化成工业株式会社 | 粘合剂、胶膜及带粘合剂底面的金属箔 |
CN1539879A (zh) * | 2003-04-25 | 2004-10-27 | ������ѧ��ʽ���� | 环氧树脂组合物及其用途 |
JP2004331728A (ja) * | 2003-05-01 | 2004-11-25 | Nippon Steel Chem Co Ltd | 電子部品被覆用接着性フィルム |
CN101362926A (zh) * | 2003-06-06 | 2009-02-11 | 日立化成工业株式会社 | 粘合片、与切割胶带一体化的粘合片以及半导体的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5871428B2 (ja) | 2016-03-01 |
JP2016129231A (ja) | 2016-07-14 |
JP2012207222A (ja) | 2012-10-25 |
TW201239056A (en) | 2012-10-01 |
KR101856557B1 (ko) | 2018-05-10 |
CN102676105A (zh) | 2012-09-19 |
TWI553077B (zh) | 2016-10-11 |
KR20120106623A (ko) | 2012-09-26 |
JP6005309B2 (ja) | 2016-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102676105B (zh) | 高热传导性膜状接着剂,该接着剂用组合物,使用该接着剂的半导体封装件及其制造方法 | |
CN104245874B (zh) | 膜状接合剂用组合物及其制造方法、膜状接合剂和使用了膜状接合剂的半导体封装及其制造方法 | |
US11139261B2 (en) | Film-like adhesive and method for producing semiconductor package using film-like adhesive | |
TWI699419B (zh) | 膜狀接著劑用組成物、膜狀接著劑、膜狀接著劑之製造方法、使用膜狀接著劑之半導體封裝及其製造方法 | |
CN102167963B (zh) | 半导体隐形切割用粘结剂组合物、粘结剂膜和半导体器件 | |
CN106575625B (zh) | 膜状粘接剂、使用膜状粘接剂的半导体封装及其制造方法 | |
US6512031B1 (en) | Epoxy resin composition, laminate film using the same, and semiconductor device | |
TW201335260A (zh) | 樹脂硬化物與半硬化樹脂膜及其製造方法、樹脂組合物 | |
CN102282660A (zh) | 半导体封装的制造方法、半导体封装方法和溶剂型半导体封装环氧树脂组合物 | |
TWI835762B (zh) | 積層體及電子裝置 | |
CN105566913A (zh) | 有机硅树脂、树脂组合物、树脂膜、半导体器件和制造方法 | |
JP5308409B2 (ja) | 電子部品封止用シート状エポキシ樹脂組成物材料の製造方法と電子部品 | |
CN105593296A (zh) | 半导体密封用环氧树脂组合物、半导体安装结构体及其制造方法 | |
JP2008038111A (ja) | フィルム状接着剤及びそれを使用する半導体パッケージの製造方法 | |
US6383659B1 (en) | Epoxy resin composition, laminate film using the same, and semiconductor device | |
KR102505321B1 (ko) | 봉지용 필름, 봉지 구조체 및 봉지 구조체의 제조 방법 | |
CN103681530B (zh) | 电子部件密封用热固化性树脂片、树脂密封型半导体装置及该半导体装置的制造方法 | |
CN108140635A (zh) | 半导体封装件及其制造方法 | |
JP5637069B2 (ja) | 接着シート | |
KR102561428B1 (ko) | 열경화성 수지 조성물, 필름형 접착제, 접착 시트 및 반도체 장치의 제조 방법 | |
KR102441766B1 (ko) | 봉지용 필름 및 봉지 구조체, 및 이들의 제조 방법 | |
KR20170084015A (ko) | 세퍼레이터를 갖는 밀봉용 시트 및 반도체 장치의 제조 방법 | |
JP5906470B2 (ja) | フレーク状成形材料及びそれを使用した成形品 | |
TW202204558A (zh) | 接著劑用組成物及膜狀接著劑、以及使用有膜狀接著劑之半導體封裝及其製造方法 | |
CN114096610A (zh) | 环氧树脂组合物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: Tokyo, Japan, Japan Applicant after: Nippon Steel Chemical Co. Address before: Tokyo, Japan, Japan Applicant before: Nippon Seel Chemical Co., Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: NIPPON SEEL CHEMICAL CO., LTD. TO: NIPPON STEEL + SUMITOMO METAL CORPORATION |
|
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: FURUKAWA ELECTRIC CO., LTD. Free format text: FORMER OWNER: NIPPON STEEL + SUMITOMO METAL CORPORATION Effective date: 20141104 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20141104 Address after: Japan Tokyo Chiyoda nine two chome 2 No. 3 Applicant after: Furukawa Electric Co., Ltd. Address before: Tokyo, Japan, Japan Applicant before: Nippon Steel Chemical Co. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |