CN102675881A - High temperature resistant rubber base composite material used for chip packaging and application thereof - Google Patents
High temperature resistant rubber base composite material used for chip packaging and application thereof Download PDFInfo
- Publication number
- CN102675881A CN102675881A CN2012101516992A CN201210151699A CN102675881A CN 102675881 A CN102675881 A CN 102675881A CN 2012101516992 A CN2012101516992 A CN 2012101516992A CN 201210151699 A CN201210151699 A CN 201210151699A CN 102675881 A CN102675881 A CN 102675881A
- Authority
- CN
- China
- Prior art keywords
- temperature resistant
- chip packaging
- chip
- resistant rubber
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a high temperature resistant rubber base composite material used for chip packaging and an application thereof, and belongs to the technical field of the high temperature resistant chip packaging material. The invention aims to provide a high temperature resistant, moisture-proof and damp-proof chip packaging composite material. The high temperature resistant rubber base composite material used for the chip packaging adopts the technical scheme that the high temperature resistant rubber base composite material used for the chip packaging comprises the following raw materials in parts by weight: 100 parts of silicon rubber, 0.1-2 parts of plasticizer, 1-10 parts of reinforcing agent, 50-100 parts of heat insulation microsphere and 1-15 parts of vulcanizing agent. The plastic rubber base composite material related by the invention has a high temperature resistant characteristic, a radio frequency identification device (RFID) chip can be comprehensively protected to normally work in the high temperature environment, the chip is free from being damaged due to overheat at the temperature of 300DEG C, and the packaged chip has an excellent moisture-proof and damp-proof performance.
Description
Technical field
A kind of Chip Packaging of the present invention belongs to high temperature resistant chip encapsulation material technical field with high-temperature resistant rubber based composites and application thereof.
Background technology
The RFID term is a radio-frequency apparatus, is commonly called as electronic tag, RF tag, transponder, data carrier.Common RFID packaged material comprises: the encapsulation of papery cassette, PVC encapsulation; Use is confined to the Air drying environment; Use temperature is the highest can not to surpass 85 ℃, also prevents anti-adverse environment characteristics such as the wet anti-salt fog of tidal rip, makes the RFID technology when using, receive very big restriction.
Summary of the invention
The present invention provides a kind of high temperature resistant, separated wet moistureproof packaged chip matrix material in order to overcome the deficiency of prior art.
In order to solve the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of Chip Packaging is used the high-temperature resistant rubber based composites, is made up of according to components in weight portions following:
100 parts in Zylox, softening agent 0.1-2 part, strengthening agent 1-10 part, adiabatic microballon 50-100 part, vulcanizing agent 1-15 part.
The preferred weight part proportioning of each component is:
100 parts in Zylox, softening agent 0.5-1.2 part, strengthening agent 3-8 part, adiabatic microballon 70-85 part, vulcanizing agent 6-10 part.
Said Zylox is methyl vinyl silicone rubber or methyl ethylene phenyl siloxane rubber.
Said strengthening agent is superfine silicon dioxide, ultra-fine carbon black or fibrous silicate.
Said softening agent is a hydroxy silicon oil.
Said adiabatic microballon is a hollow glass micropearl.
Said vulcanizing agent is a Di Cumyl Peroxide 99, two 25 or two 24.
Carry out according to following steps: Zylox, softening agent, strengthening agent, adiabatic microballon and vulcanizing agent are mixed according to said weight part proportioning with mixing roll; Be squeezed into sheet material; Cut into small pieces by chip size then; After cutting out good sheet material packaged chip, open fairlead again, promptly obtain the finished product packaged chip at 150 ℃ of-168 ℃ of sintering 12min-20min of temperature at last.
The beneficial effect that the present invention compared with prior art has is: the plasticity-rubber-base composite material that the present invention relates to has high-temperature stability; Can omnibearing protection RFID chip works better in hot environment; Can not only guarantee that chip can be because of overheated not impaired in 300 ℃ of environment, the chip after the encapsulation also has good separated wet humidity resistance.Guarantee that simultaneously chip technology can not be stolen, can in false proof, industries such as the turnover depositary management is made an inventory, logistics transportation new idea in management be provided widely.
RFID through matrix material encapsulation of the present invention can work in severe environment, and can be widely used in aspect.
1, false proof, the inbound/outbound process management of high-end article are made an inventory, for large supermarket's logistics transportation, goods deposit provide the management new approaches.
2, the rare plant-animal to the rare species of rare species such as marine existence, field survivorship identify, tracking and information acquisition.
3, goods and materials and the equipment to working in the special environment or storing, like the device identification of working in the hot environment, the food sign that stores in the low temperature environment etc. provides new management mode and management method.
4, the electronic tag that carries out the secondary plastic packaging under 300 ℃ of hot environments is carried out high temperature resistant in advance packaging protection.
Embodiment
Below in conjunction with specific embodiment the present invention is described further.
A kind of Chip Packaging of the present invention utilizes mixing roll that each component is mixed extrusion molding according to described weight part proportioning with the preparation method of high-temperature resistant rubber based composites.Also can adopt other existing extrusion forming technology preparation.
The granularity of superfine silicon dioxide, ultra-fine carbon black and fibrous silicate is limited to the micro/nano level granularity among the present invention.
Embodiment 1
A kind of Chip Packaging is used the high-temperature resistant rubber based composites, is made up of according to components in weight portions following:
100 parts of methyl vinyl silicone rubbers, 0.5 part of hydroxy silicon oil, 5 parts of superfine silicon dioxides, 50 parts of hollow glass micropearls, two 245 parts.
A kind of Chip Packaging is with the application of high-temperature resistant rubber based composites; Carry out according to following steps: methyl vinyl silicone rubber, hydroxy silicon oil, superfine silicon dioxide, hollow glass micropearl and two 24 are mixed according to above-mentioned weight part proportioning with mixing roll; Be squeezed into the uniform sheet material of thickness; Cut into small pieces by chip size then, with cutting out good sheet material packaged chip, packaged chip profile is standard evenly; Open fairlead again, promptly obtain the finished product packaged chip at 160 ℃ of sintering 15min of temperature at last.
Embodiment 2
A kind of Chip Packaging is used the high-temperature resistant rubber based composites, is made up of according to components in weight portions following:
100 parts of methyl ethylene phenyl siloxane rubbers, 1.2 parts of hydroxy silicon oils, 8 parts of ultra-fine carbon blacks, 100 parts of hollow glass micropearls, two 256 parts.
A kind of Chip Packaging is with the application of high-temperature resistant rubber based composites; Carry out according to following steps: methyl ethylene phenyl siloxane rubber, hydroxy silicon oil, ultra-fine carbon black, hollow glass micropearl and two 25 are mixed according to above-mentioned weight part proportioning with mixing roll; Be squeezed into the uniform sheet material of thickness; Cut into small pieces by chip size then, with cutting out good sheet material packaged chip, packaged chip profile is standard evenly; Open fairlead again, promptly obtain the finished product packaged chip at 168 ℃ of sintering 12min of temperature at last.
Embodiment 3
A kind of Chip Packaging is used the high-temperature resistant rubber based composites, is made up of according to components in weight portions following:
100 parts of methyl ethylene phenyl siloxane rubbers, 2 parts of hydroxy silicon oils, 10 parts of fibrous silicates, 70 parts of hollow glass micropearls, 10 parts of Di Cumyl Peroxide 99s.
A kind of Chip Packaging is with the application of high-temperature resistant rubber based composites; Carry out according to following steps: methyl ethylene phenyl siloxane rubber, hydroxy silicon oil, fibrous silicate, hollow glass micropearl and Di Cumyl Peroxide 99 are mixed according to above-mentioned weight part proportioning with mixing roll; Be squeezed into the uniform sheet material of thickness; Cut into small pieces by chip size then, with cutting out good sheet material packaged chip, packaged chip profile is standard evenly; Open fairlead again, promptly obtain the finished product packaged chip at 150 ℃ of sintering 20min of temperature at last.
Embodiment 4
A kind of Chip Packaging is used the high-temperature resistant rubber based composites, is made up of according to components in weight portions following:
100 parts of methyl vinyl silicone rubbers, 0.1 part of hydroxy silicon oil, 3 parts of fibrous silicates, 85 parts of hollow glass micropearls, two 24 15 parts.
A kind of Chip Packaging is with the application of high-temperature resistant rubber based composites; Carry out according to following steps: methyl vinyl silicone rubber, hydroxy silicon oil, fibrous silicate, hollow glass micropearl and two 24 are mixed according to above-mentioned weight part proportioning with mixing roll; Be squeezed into the uniform sheet material of thickness; Cut into small pieces by chip size then, with cutting out good sheet material packaged chip, packaged chip profile is standard evenly; Open fairlead again, promptly obtain the finished product packaged chip at 155 ℃ of sintering 18min of temperature at last.
Embodiment 5
A kind of Chip Packaging is used the high-temperature resistant rubber based composites, is made up of according to components in weight portions following:
100 parts of methyl ethylene phenyl siloxane rubbers, 0.5 part of hydroxy silicon oil, 1 part of superfine silicon dioxide, 50 parts of hollow glass micropearls, 1 part of Di Cumyl Peroxide 99.
A kind of Chip Packaging is with the application of high-temperature resistant rubber based composites; Carry out according to following steps: methyl ethylene phenyl siloxane rubber, hydroxy silicon oil, superfine silicon dioxide, hollow glass micropearl and Di Cumyl Peroxide 99 are mixed according to above-mentioned weight part proportioning with mixing roll; Be squeezed into the uniform sheet material of thickness; Cut into small pieces by chip size then, with cutting out good sheet material packaged chip, packaged chip profile is standard evenly; Open fairlead again, promptly obtain the finished product packaged chip at 165 ℃ of sintering 16min of temperature at last.
Embodiment 6
A kind of Chip Packaging is used the high-temperature resistant rubber based composites, is made up of according to components in weight portions following:
100 parts of methyl vinyl silicone rubbers, 1 part of hydroxy silicon oil, 6 parts of fibrous silicates, 80 parts of hollow glass micropearls, two 257 parts.
A kind of Chip Packaging is with the application of high-temperature resistant rubber based composites; Carry out according to following steps: methyl vinyl silicone rubber, hydroxy silicon oil, fibrous silicate, hollow glass micropearl and two 25 are mixed according to above-mentioned weight part proportioning with mixing roll; Be squeezed into the uniform sheet material of thickness; Cut into small pieces by chip size then, with cutting out good sheet material packaged chip, packaged chip profile is standard evenly; Open fairlead again, promptly obtain the finished product packaged chip at 162 ℃ of sintering 13min of temperature at last.
The present invention can summarize with other the specific form without prejudice to spirit of the present invention or principal character.Therefore; No matter from that, above-mentioned embodiment of the present invention all can only be thought can not limit invention to explanation of the present invention, and claims have been pointed out scope of the present invention; And scope of the present invention is not pointed out in above-mentioned explanation; Therefore, in implication suitable and any variation in the scope, all should think to be included in the scope of claims with claims of the present invention.
Claims (8)
1. a Chip Packaging is used the high-temperature resistant rubber based composites, it is characterized in that being made up of according to components in weight portions following:
100 parts in Zylox, softening agent 0.1-2 part, strengthening agent 1-10 part, adiabatic microballon 50-100 part, vulcanizing agent 1-15 part.
2. a kind of Chip Packaging according to claim 1 is used the high-temperature resistant rubber based composites, it is characterized in that being made up of according to components in weight portions following:
100 parts in Zylox, softening agent 0.5-1.2 part, strengthening agent 3-8 part, adiabatic microballon 70-85 part, vulcanizing agent 6-10 part.
3. a kind of Chip Packaging according to claim 1 is used the high-temperature resistant rubber based composites, it is characterized in that said Zylox is methyl vinyl silicone rubber or methyl ethylene phenyl siloxane rubber.
4. a kind of Chip Packaging according to claim 1 is used the high-temperature resistant rubber based composites, it is characterized in that said strengthening agent is superfine silicon dioxide, ultra-fine carbon black or fibrous silicate.
5. a kind of Chip Packaging according to claim 1 is used the high-temperature resistant rubber based composites, it is characterized in that said softening agent is a hydroxy silicon oil.
6. a kind of Chip Packaging according to claim 1 is used the high-temperature resistant rubber based composites, it is characterized in that said adiabatic microballon is a hollow glass micropearl.
7. a kind of Chip Packaging according to claim 1 is used the high-temperature resistant rubber based composites, it is characterized in that said vulcanizing agent is a Di Cumyl Peroxide 99, two 25 or two 24.
8. the described a kind of Chip Packaging of claim 1 is with the application of high-temperature resistant rubber based composites; It is characterized in that carrying out: Zylox, softening agent, strengthening agent, adiabatic microballon and vulcanizing agent are mixed according to said weight part proportioning with mixing roll according to following steps; Be squeezed into sheet material; Cut into small pieces by chip size then, after cutting out good sheet material packaged chip, open fairlead again, promptly obtain the finished product packaged chip at 150 ℃ of-168 ℃ of sintering 12min-20min of temperature at last.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210151699.2A CN102675881B (en) | 2012-05-16 | 2012-05-16 | High temperature resistant rubber base composite material used for chip packaging and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210151699.2A CN102675881B (en) | 2012-05-16 | 2012-05-16 | High temperature resistant rubber base composite material used for chip packaging and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102675881A true CN102675881A (en) | 2012-09-19 |
| CN102675881B CN102675881B (en) | 2014-01-01 |
Family
ID=46808462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210151699.2A Expired - Fee Related CN102675881B (en) | 2012-05-16 | 2012-05-16 | High temperature resistant rubber base composite material used for chip packaging and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102675881B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103351621A (en) * | 2013-05-31 | 2013-10-16 | 镇江天信电器有限公司 | Insulation rubber tube for heater, and making method thereof |
| CN103820072A (en) * | 2012-11-19 | 2014-05-28 | 郑州中原应用技术研究开发有限公司 | Double-component silicone structural sealant for heat mirror hollow glass and preparation method thereof |
| CN104371331A (en) * | 2014-11-18 | 2015-02-25 | 滁州君越高分子新材料有限公司 | Silicone rubber for sealing two ends of heater |
| CN104403329A (en) * | 2014-11-18 | 2015-03-11 | 滁州君越高分子新材料有限公司 | Heat-conducting silicone rubber |
| CN104725876A (en) * | 2014-12-17 | 2015-06-24 | 苏州锦腾电子科技有限公司 | Oil-resistant and high-temperature-resistant room temperature vulcanized silicone rubber and preparation method thereof |
| CN106328739A (en) * | 2016-08-19 | 2017-01-11 | 中国建筑材料科学研究总院 | Flexible cover plate of solar cell and fabrication method of flexible cover plate |
| CN106419442A (en) * | 2016-08-30 | 2017-02-22 | 软控股份有限公司 | Plane storage location management system based on RFID (radio frequency identification) ground mats |
| CN107541069A (en) * | 2017-10-12 | 2018-01-05 | 西北橡胶塑料研究设计院有限公司 | A kind of silicone rubber seal section bar |
| CN108467592A (en) * | 2018-04-09 | 2018-08-31 | 武汉理工大学 | A kind of heat-insulated solar heat protection room temperature curing organosilicon film and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950692A (en) * | 2010-09-28 | 2011-01-19 | 彩虹集团公司 | Packaging material and packaging method for dye sensitized solar cell |
-
2012
- 2012-05-16 CN CN201210151699.2A patent/CN102675881B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950692A (en) * | 2010-09-28 | 2011-01-19 | 彩虹集团公司 | Packaging material and packaging method for dye sensitized solar cell |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103820072A (en) * | 2012-11-19 | 2014-05-28 | 郑州中原应用技术研究开发有限公司 | Double-component silicone structural sealant for heat mirror hollow glass and preparation method thereof |
| CN103820072B (en) * | 2012-11-19 | 2015-07-01 | 郑州中原应用技术研究开发有限公司 | Double-component silicone structural sealant for heat mirror hollow glass and preparation method thereof |
| CN103351621A (en) * | 2013-05-31 | 2013-10-16 | 镇江天信电器有限公司 | Insulation rubber tube for heater, and making method thereof |
| CN104371331A (en) * | 2014-11-18 | 2015-02-25 | 滁州君越高分子新材料有限公司 | Silicone rubber for sealing two ends of heater |
| CN104403329A (en) * | 2014-11-18 | 2015-03-11 | 滁州君越高分子新材料有限公司 | Heat-conducting silicone rubber |
| CN104725876A (en) * | 2014-12-17 | 2015-06-24 | 苏州锦腾电子科技有限公司 | Oil-resistant and high-temperature-resistant room temperature vulcanized silicone rubber and preparation method thereof |
| CN106328739A (en) * | 2016-08-19 | 2017-01-11 | 中国建筑材料科学研究总院 | Flexible cover plate of solar cell and fabrication method of flexible cover plate |
| CN106328739B (en) * | 2016-08-19 | 2018-02-09 | 中国建筑材料科学研究总院 | Solar cell flexible cover plate and preparation method thereof |
| CN106419442A (en) * | 2016-08-30 | 2017-02-22 | 软控股份有限公司 | Plane storage location management system based on RFID (radio frequency identification) ground mats |
| CN106419442B (en) * | 2016-08-30 | 2019-01-22 | 软控股份有限公司 | Plane warehouse compartment management system based on RFID ground cushion |
| CN107541069A (en) * | 2017-10-12 | 2018-01-05 | 西北橡胶塑料研究设计院有限公司 | A kind of silicone rubber seal section bar |
| CN108467592A (en) * | 2018-04-09 | 2018-08-31 | 武汉理工大学 | A kind of heat-insulated solar heat protection room temperature curing organosilicon film and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102675881B (en) | 2014-01-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102675881B (en) | High temperature resistant rubber base composite material used for chip packaging and application thereof | |
| CN102663468A (en) | Fragile RFID smart label and processing method thereof | |
| KR20110134303A (en) | Encapsulating sheet for optical semiconductor | |
| CN205721892U (en) | A kind of frangible electronic anti-counterfeit tag | |
| TW201225833A (en) | Electromagnetic wave isolator | |
| CN104210141A (en) | Rich mineral paper-based turnover box for cigarettes and processing technology thereof | |
| CN102587205A (en) | Antistatic release paper and making method thereof | |
| CN207513360U (en) | A kind of shared express box and the lock for sharing express box | |
| CN104934183A (en) | Composite magnetic material | |
| CN105209227A (en) | Board comprising biodegradable resin and wooden flour and method of manufacturing the same | |
| CN102516722B (en) | Polyester film for electronic tag and preparation method thereof | |
| CN202502521U (en) | Fragile RFID intelligent label | |
| CN206388212U (en) | A kind of woven label label | |
| CN201946224U (en) | Disposable electronic lead seal with switching device | |
| CN209193865U (en) | A kind of anti abrasive double-sided adhesive | |
| CN207208901U (en) | A kind of packing case | |
| CN205219980U (en) | Packing is with double -colored piece | |
| CN207725969U (en) | A kind of elastic construction of shared express box | |
| CN206975677U (en) | One kind is anti-to tear RFID label tag paster | |
| CN201965647U (en) | High-temperature-resistant waterproof radio frequency identification (RFID) electronic tag | |
| CN204773915U (en) | Thermal quilt | |
| CN210776776U (en) | RFID label capable of preventing chip from being reused | |
| CN205240294U (en) | Antistatic membrane of transparent PET | |
| KR102556539B1 (en) | Eco-friendly release paper with improved water dissociation | |
| CN204390270U (en) | A kind of frangible electronic tag of multi-functional ultrahigh frequency |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140101 Termination date: 20190516 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |