CN102666323B - Substrate processing apparatus and method for manufacturing display element - Google Patents
Substrate processing apparatus and method for manufacturing display element Download PDFInfo
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- CN102666323B CN102666323B CN201080048800.0A CN201080048800A CN102666323B CN 102666323 B CN102666323 B CN 102666323B CN 201080048800 A CN201080048800 A CN 201080048800A CN 102666323 B CN102666323 B CN 102666323B
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- 206010013786 Dry skin Diseases 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
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- 241000278713 Theora Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
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- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Disclosed is a substrate processing apparatus which is provided with: a processing section, which performs predetermined processing with respect to a substrate; and a substrate holding section, which moves with respect to the processing section, and which holds the substrate, while having the processed surface of the substrate being formed.
Description
Technical field
The present invention relates to the manufacture method of substrate board treatment and display element.
The Patent 2009-268789 CLAIM OF PRIORITY that the application proposed to Japan based on November 26th, 2009, and its content is quoted so far.
Background technology
As the display element forming the read out instruments such as display equipment, be known to such as organic electroluminescent (organic EL) element.Organic EL element becomes have anode and negative electrode on substrate, and has the formation of the organic luminous layer be clipped between these anode and negative electrodes.Organic EL element is formed as, from anode to organic luminous layer injected hole, making hole and electron recombination in organic luminous layer, obtains display light by the luminescence of this compound tense.Organic EL element is such as formed with the circuit etc. be connected with anode and negative electrode on substrate.
As one of method making organic EL element, be known to the method (such as with reference to patent documentation 1) being such as referred to as volume to volume (roll to roll) mode (hereinafter referred to as " volume mode ").Volume mode is while release the substrate of 1 sheet twisted on the roller of substrate supply side and utilize the roller of substrate recovery side to batch the substrate be released, while transmit substrate, during being released to being taken up from substrate, in processing equipment, on substrate, form the method for the luminescent layer, anode, negative electrode, circuit etc. that form organic EL element successively.
Patent documentation 1: International Publication No. 2006/100868 booklet
But, in such volume mode, such as, when the substrate using thickness of slab little, exist and be difficult to this problem of flatness guaranteeing substrate.Therefore, the raising of the processing accuracy of the formation processing of luminescent layer, electrode etc., registration process etc. is hampered.
Summary of the invention
The object of mode involved in the present invention is, the substrate board treatment providing a kind of processing accuracy good and the manufacture method of display element.
Substrate board treatment in mode involved in the present invention possesses: handling part, and its opposing substrate carries out the process specified; And board holder, it moves relative to this handling part, and keeps substrate while the processed surface forming substrate.
The manufacture method of the display element in mode involved in the present invention has: treatment process, to the process that the processed surface of substrate specifies; Substrate keeps operation, and the processed surface utilizing board holder to form substrate keeps substrate; And mobile process, the board holder of the support unit being configured at ring-type is moved to the direction of transfer of substrate.
According to mode of the present invention, the substrate board treatment that processing accuracy can be provided good and the manufacture method of display element.
Accompanying drawing explanation
Figure 1A is the pie graph of organic EL element.
Figure 1B is the b-b cutaway view of the organic EL element in Figure 1A.
Fig. 1 C is the c-c cutaway view of the organic EL element in Figure 1A.
Fig. 2 is the figure of the formation representing substrate board treatment.
Fig. 3 is the figure of the formation representing processing substrate portion.
Fig. 4 is the figure of the formation representing droplet applying apparatus.
Fig. 5 is the figure of the formation representing connecting gear.
Fig. 6 is the figure of the formation representing connecting gear.
Fig. 7 is the figure of the formation representing connecting gear.
Fig. 8 is the figure of the formation representing connecting gear.
Fig. 9 is the figure of the formation representing connecting gear.
Figure 10 is the figure of the next door formation process representing processing substrate portion.
Figure 11 represents the shape in the next door that sheet material substrate is formed and the figure of configuration.
Figure 12 is the cutaway view in the next door that sheet material substrate is formed.
Figure 13 A is the figure of the coating action representing drop.
Figure 13 B is the cutaway view of the drop be coated between next door.
Figure 14 A is formed in the cutaway view of the film between next door.
Figure 14 B is the figure of the formation representing the film be formed between next door.
Figure 15 is the figure representing the operation forming gate insulator on sheet material substrate.
Figure 16 represents the figure by the operation of the wiring cut-off of sheet material substrate.
Figure 17 represents the figure in the film forming operation of source drain forming region.
Figure 18 is the figure representing the operation forming organic semiconductor layer.
Figure 19 is the figure of the example representing aligning.
Figure 20 is the figure of the action representing connecting gear.
Figure 21 is the figure of the variation representing connecting gear.
Detailed description of the invention
[the 1st embodiment]
Below, with reference to accompanying drawing, the 1st embodiment that the present invention relates to is described.
(organic EL element)
Figure 1A is the birds-eye view of the formation representing organic EL element.Figure 1B is the b-b cutaway view in Figure 1A.Fig. 1 C is the c-c cutaway view in Figure 1A.
As shown in Figure 1A ~ Fig. 1 C, organic EL element 50 defines gate electrode G and gate insulator I on sheet material substrate FB, and then after forming source electrode S, drain electrode D and pixel electrode P, form the bottom contact-type of organic semiconductor layer OS.
As shown in Figure 1B, gate electrode G is formed with gate insulator I.Gate insulator I is formed the source electrode S of source bus line SBL, and is formed with the drain electrode D be connected with pixel electrode P.Organic semiconductor layer OS is formed between source electrode S and drain electrode D.So far, FET is completed.In addition, as shown in Figure 1B and Fig. 1 C, on pixel electrode P, form luminescent layer IR, this luminescent layer IR forms transparency electrode ITO.
As shown in Figure 1B and Fig. 1 C, such as, on sheet material substrate FB, be formed with next door BA (cofferdam layer).And as shown in Figure 1 C, source bus line SBL is formed between the BA of next door.Like this, by there is next door BA, source bus line SBL high precision is formed, and pixel electrode P and luminescent layer IR is also formed exactly.In addition, in Figure 1B and Fig. 1 C although not shown, but grid bus GBL be also formed in the same manner as source bus line SBL between the BA of next door.
This organic EL element 50 is applicable to such as with the display part etc. of the read out instruments such as the display equipment electronic machine that is representative.In this situation, use the parts such as organic EL element 50 being formed as panel shape.In the manufacture of such organic EL element 50, need to make the substrate defining thin film transistor (TFT), pixel electrode.In order to precision on pixel electrode on the substrate forms more than the 1 layer organic compound layer (light emitting element layer) comprising luminescent layer well, wish pixel electrode borderline region easily and precision forms next door BA (cofferdam layer) well.
(substrate board treatment)
Fig. 2 represents to use to have the skeleton diagram that flexual sheet material substrate FB carries out the formation of the substrate board treatment 100 processed.
Substrate board treatment 100 uses banded sheet material substrate FB to form the device of the organic EL element 50 shown in Figure 1A ~ Fig. 1 C.As shown in Figure 2, substrate board treatment 100 has: substrate supply unit 101, processing substrate portion 102, substrate recoverer 103 and control part 104.Sheet material substrate FB is transmitted to substrate recoverer 103 through processing substrate portion 102 by from substrate supply unit 101.The unified action controlling substrate board treatment 100 of control part 104.
In the following description, set XYZ orthogonal coordinate system, be described with reference to the position relationship of this XYZ orthogonal coordinate system to each parts.The direction of transfer of sheet material substrate FB in horizontal surface is set to X-direction, direction orthogonal with X-direction in horizontal surface is set to Y direction, direction (i.e. vertical) orthogonal with X-direction and Y direction is respectively set to Z-direction.In addition, rotation (inclination) direction around X-axis, Y-axis and Z axis is set to θ X, θ Y and θ Z-direction respectively.
As sheet material substrate FB, such as, can use the resin film of resistance to effect of heat, corrosion-resistant steel etc.Such as, resin film can use the materials such as poly-vinyl resin, acrylic resin, alkide resin, ethylene-vinyl alcohol copolymer resin, Vinyl chloride resin, celluosic resin, amilan, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin.The size of the Y-direction of sheet material substrate FB is such as formed about 1m ~ 2m, and the size of X-direction is such as formed more than 10m.Certainly, this size is an example only, is not limited thereto.Such as, the size of the Y-direction of sheet material substrate FB also can be below 50cm, also can be more than 2m.In addition, the size of the X-direction of sheet material substrate FB also can be below 10m.Wherein, though the pliability in present embodiment refer to such as to substrate apply at least to conduct oneself with dignity the specified force of degree also can not break, damaged, the character of this curved substrate can be made.In addition, above-mentioned pliability changes according to the material, size, the environment such as thickness or temperature etc. of this substrate.
The thermal expansion coefficient of preferred sheet material substrate FB is little, even if so that the hot size being such as subject to about 200 DEG C does not also change.Such as inorganic filler can be mixed in resin film to reduce thermal expansion coefficient.As the example of inorganic filler, titanium oxide, zinc oxide, aluminium oxide, monox etc. can be enumerated.
Substrate supply unit 101 is connected with the supply side connecting portion 102A being arranged at processing substrate portion 102.Substrate supply unit 101 supplies the sheet material substrate FB being such as rolled into web-like to processing substrate portion 102.Substrate recoverer 103 is recovered in the sheet material substrate FB after being processed in processing substrate portion 102.In addition, substrate supply unit 101 is not limited to the formation of the state storage sheet material substrate FB being rolled into web-like, such as, also can be with the formation of the state of multiple folding storage sheet material substrate FB.Wherein, even if this folding state also comprises and do not apply at least to conduct oneself with dignity that the specified force of degree also can not break, damaged state with folding line ground to substrate.
Fig. 3 is the figure of the formation representing processing substrate portion 102.
As shown in Figure 3, processing substrate portion 102 has transport unit 105, element forming part 106, aligned portions 107 and substrate cutting portion 108.Processing substrate portion 102 is while transmit the sheet material substrate FB supplied by substrate supply unit 101, while form each inscape of above-mentioned organic EL element 50 on this sheet material substrate FB, and send the part of the sheet material substrate FB after defining organic EL element 50 to substrate recoverer 103.
Element forming part 106 has next door forming portion 91, electrode forming portion 92 and luminescent layer forming portion 93.Next door forming portion 91, electrode forming portion 92 and luminescent layer forming portion 93 from the upstream side of the direction of transfer of sheet material substrate FB to downstream, by the arranged in order of next door forming portion 91, electrode forming portion 92 and luminescent layer forming portion 93.Below, each formation of element forming part 106 is described.
Next door forming portion 91 has roller platen 110 and hot transfer roll 115.Next door forming portion 91 forms next door BA to the sheet material substrate FB sent by substrate supply unit 101.In next door forming portion 91, utilize roller platen 110 to press sheet material substrate FB, and in order to make the next door BA be pressed into keep shape, utilize hot transfer roll 115 that sheet material substrate FB is heated to more than glass transition temperature.Therefore, the mould shape be formed on the roller surface of roller platen 110 can be transferred on sheet material substrate FB.Sheet material substrate FB is such as heated to about 200 DEG C by hot transfer roll 115.
The fine imprint mold 111 be made up of materials such as SiC, Ta, by mirror-like finish, has been installed on the surface in the roller surface of roller platen 110 at its roller.Fine imprint mold 111 defines the pressing mold (stamper) of the wiring of thin film transistor and the pressing mold of colored filter.
Roller platen 110 uses fine imprint mold 111 couples of sheet material substrate FB to form alignment mark AM.In order to form alignment mark AM in the both sides of the Width of sheet material substrate FB, i.e. Y direction, fine imprint mold 111 has the pressing mold of alignment mark AM.
Electrode forming portion 92 is arranged on the+X side of next door forming portion 91, such as, formed and employ organic semi-conductor thin film transistor.Specifically, after defining gate electrode G such shown in Figure 1A ~ Fig. 1 C, gate insulator I, source electrode S, drain electrode D and pixel electrode P, form organic semiconductor layer OS.
As thin film transistor (TFT), can be the thin film transistor of inorganic semiconductor system, also can be the use of organic semi-conductor thin film transistor.As the thin film transistor of inorganic semiconductor, be known to the thin film transistor of amorphous layer, but also can be the use of organic semi-conductor thin film transistor.If use this organic semiconductor to form thin film transistor, then can apply flexibly printing technology, droplet applying law technology to form thin film transistor.In addition, FET (FET) particularly preferably such shown in Figure 1A ~ Fig. 1 C in organic semi-conductor thin film transistor is being employed.
Electrode forming portion 92 has droplet applying apparatus 120, annealing device BK, shutoff device 130 etc.
In the present embodiment, as droplet applying apparatus 120, the droplet applying apparatus 120OS etc. droplet applying apparatus 120G, the droplet applying apparatus 120I used when forming gate insulator I such as used when formation gate electrode G, the droplet applying apparatus 120SD used when forming source electrode S, drain electrode D and pixel electrode P can be used, using when forming organic semiconductor OS.
Fig. 4 is the birds-eye view of the formation representing droplet applying apparatus 120.Illustrate in Fig. 4 from the formation during observation droplet applying apparatus 120 of+Z side.Droplet applying apparatus 120 along Y direction longer formed.Not shown actuating device is provided with in droplet applying apparatus 120.Droplet applying apparatus 120 by this actuating device such as can in X direction, Y-direction and θ Z-direction move.
Multiple nozzle 122 is formed in droplet applying apparatus 120.Nozzle 122 be arranged in droplet applying apparatus 120 with the opposed faces of sheet material substrate FB.Nozzle 122 is such as along Y direction arrangement, and the row (nozzle rows) of this nozzle 122 are such as formed with 2 row.Control part 104 can make all nozzles 122 apply drop in the lump, also can adjust the opportunity of coating drop respectively to each nozzle 122.
As droplet applying apparatus 120, such as, can adopt ink-jetting style, separatory mode etc.As ink-jetting style, charged mode, pressurization and vibration mode, data-collection formula, thermoelectricity conversion regime, electrostatic adherence mode etc. can be enumerated.Droplet applying method is wasted few in the use of material, and can the material of amount on the position of hope exactly desired by configuration.Wherein, the amount of of the metallic ink applied by droplet applying method is such as 1 ~ 300 nanogram.
Turn back to Fig. 3, droplet applying apparatus 120G is to plating ink in the next door BA of grid bus GBL.Droplet applying apparatus 120I is to the electrical insulating property ink of switch (switching) portion coating polyimide system resin or urethanes system resin.Droplet applying apparatus 120SD is plating ink in the next door BA of source bus line SBL and in the next door BA of pixel electrode P.Droplet applying apparatus 120OS applies organic ink ductor to the switch portion between source electrode S and drain electrode D.
Metallic ink is the liquid that particle diameter is about electric conductor stable dispersion in the solvent of room temperature of about 5nm, and carbon, silver (Ag) or gold (Au) etc. can be used as electric conductor.The compound forming organic ink ductor can be monocrystalline material section, and also can be amorphous materials, can be low molecule, also can be Polymer.As particularly preferred compound in the compound forming organic ink ductor, can enumerate with pentacene, benzo [9,10] phenanthrene, anthracene etc. is the single crystals of the contracting ring system aromatic hydrocarbon compound of representative or pi-conjugated system Polymer etc.
Annealing device BK is configured in the+X side (substrate direction of transfer downstream) of each droplet applying apparatus 120 respectively.Annealing device BK can radiate such as hot blast, far-infrared rays etc. to sheet material substrate FB.Annealing device BK uses these radiation heat carry out dry or that sintering (roasted) sheet material substrate FB is coated drop and make it solidify.
Shutoff device 130 be arranged on the+X side of droplet applying apparatus 120SD, the upstream side of droplet applying apparatus 120OS.Shutoff device 130 such as uses laser etc. to cut off the source electrode S and drain electrode D that are formed by droplet applying apparatus 120SD.Shutoff device 130 has not shown light source and makes the laser from this light source be irradiated to galvanometer mirror (galvanometer mirror) 131 on sheet material substrate FB.
As the kind of laser, be preferably can the laser of absorbed wavelength for the metallic membrane that will carry out cutting off, in wavelength conversion laser, 2,3,4 times of high order harmonics of YAG etc. be better.In addition, by using pulsed laser that thermal diffusion can be prevented, the damage beyond cutting portion can be reduced.When material is aluminium, preferably adopt the femto-second laser of 760nm wavelength.
In the present embodiment, have employed and such as use titanium sapphire laser device as the femtosecond laser irradiation portion of light source.This femtosecond laser irradiation portion is such as with the pulse irradiation laser LL of 10KHz ~ 40KHz.
Owing to using femto-second laser in present embodiment, so the processing of submicron order can be carried out, the source electrode S of performance and the interval of drain electrode D that determine FET can be cut off exactly.The interval of source electrode S and drain electrode D is such as about 3 μm ~ about 30 μm.
Except above-mentioned femto-second laser, also can use such as carbon dioxide laser or green (light) laser etc.In addition, except laser, also can adopt and mechanically carry out by cast-cutting saw etc. the formation cut off.
Galvanometer mirror 131 is configured in the light path of laser LL.Galvanometer mirror 131 makes the laser LL from light source reflex on sheet material substrate FB.Galvanometer mirror 131 is configured to such as to rotate in θ X-direction, θ Y-direction and θ Z-direction.Rotated by galvanometer mirror 131, the irradiation position of laser LL can change.
By using above-mentioned next door forming portion 91 and electrode forming portion 92 both sides, even if do not use so-called photo-mask process, printing technology, droplet applying law technology also can be applied flexibly to form thin film transistor etc.Such as only used adopt the electrode forming portion 92 of printing technology, droplet applying law technology etc. time, exist due to the infiltration of ink, expansion and precision can not form the situation of thin film transistor etc. well.
On the other hand, owing to forming next door BA, so infiltration, the expansion of ink can be prevented by use next door forming portion 91.In addition, determine that the source electrode S of performance of thin film transistor and the interval of drain electrode D are formed by laser beam machining or machine up.
Luminescent layer forming portion 93 is configured in the+X side of electrode forming portion 92.Luminescent layer forming portion 93 is formed such as luminescent layer IR, the pixel electrode ITO etc. of the inscape of organic el device on the sheet material substrate FB defining electrode.Luminescent layer forming portion 93 has droplet applying apparatus 140 and annealing device BK.
The luminescent layer IR formed by luminescent layer forming portion 93 contains host compound and phosphorescent compounds (also referred to as phosphorescence luminance compound).Host compound is the compound contained in luminescent layer.Phosphorescent compounds is the compound that observation carrys out the luminescence of self-stimulated triplet, at room temperature produces phosphorescence luminous.
In the present embodiment, as droplet applying apparatus 140, employ the droplet applying apparatus 140Re such as forming red light emitting layer, the droplet applying apparatus 140Gr forming green light emitting layer, form the droplet applying apparatus 140Bl of blue light-emitting layer, form the droplet applying apparatus 140I of insulating barrier and form the droplet applying apparatus 140IT etc. of pixel electrode ITO.
As droplet applying apparatus 140, same with above-mentioned droplet applying apparatus 120, ink-jetting style or separatory mode can be adopted.Such as when arranging the inscape as organic EL element 50 such as hole transmission layer and electron transfer layer, the device (such as droplet applying apparatus etc.) forming these layers is set in addition.
Droplet applying apparatus 140Re applies R solution on pixel electrode P.Droplet applying apparatus 140Re adjusts the spray volume of R solution, to make dried thickness for 100nm.As R solution, the polyvinylcarbazole (PVK) of such as material of main part can use the solution of Red dopants material dissolves in 1,2-dichlorethane.
Droplet applying apparatus 140Gr applies G solution on pixel electrode P.As G solution, such as material of main part PVK can use the solution of green dopant material dissolves in 1,2-dichlorethane.
Droplet applying apparatus 140Bl applies B solution on pixel electrode P.As B solution, such as material of main part PVK can use the solution of blue dopant material dissolves in 1,2-dichlorethane.
Droplet applying apparatus 120I is to the part coating electrical insulating property ink of grid bus GBL or source bus line SBL.As electrical insulating property ink, such as, can use the ink of polyimide system resin or urethanes system resin.
Droplet applying apparatus 120IT applies ITO (Indium Tin Oxide: indium tin oxide) ink on redness, green and blue light-emitting layer.As ITO ink water, indium oxide (In can be used in
2o
3) in the addition of the oxide of tin (SnO of several percentage points
2) compound etc.In addition, also can use and can use IDIXO (In
2o
3-ZnO) etc. noncrystalline make the material of nesa coating.The transmitance of preferably clear conducting film is more than 90%.
Annealing device BK is configured in the+X side (substrate direction of transfer downstream) of each droplet applying apparatus 140 respectively.Annealing device BK is same with the annealing device BK used in electrode forming portion 92, can radiate such as hot blast, far-infrared rays etc. to sheet material substrate FB.Annealing device BK uses these radiation heated dryings or the coated drop of sintering (roasted) sheet material substrate FB to solidify to make it.
Transport unit 105 has multiple roller RR and the connecting gear TR of the position be configured in along the X direction.Rotated by roller RR, sheet material substrate FB is by along X-direction transmission.Roller RR can be the rubber rollers from two sides clamping sheet material substrate FB, if sheet material substrate FB has perforation, also can be the roller RR of band ratchet.A part of roller RR in multiple roller RR can move to the Y direction orthogonal with direction of transfer.Connecting gear TR is configured in the position corresponding with electrode forming portion 92 and luminescent layer forming portion 93 in element forming part 106 in the X direction.
Aligned portions 107 has the multiple alignment cameras CA (CA1 ~ CA8) arranged along the X direction.Alignment cameras CA can utilize CCD or CMOS to make a video recording under visible light illumination, and processes this photographed images to detect the position of alignment mark AM, also can irradiate laser to alignment mark AM, and receive its scattering light to detect the position of alignment mark AM.
Alignment cameras CA1 is configured in the+X side of hot transfer roll 115.Alignment cameras CA1 detects the position of the alignment mark AM formed on sheet material substrate FB by hot transfer roll 115.Alignment cameras CA2 ~ CA8 is configured in the+X side of annealing device BK respectively.Alignment cameras CA2 ~ CA8 detects the position of the alignment mark AM of the sheet material substrate FB after have passed through annealing device BK.
Due to through overheated transfer roll 115 and annealing device BK, so sheet material substrate FB stretches to X-direction and Y direction sometimes.Like this, by+X the side of+X the side of the hot transfer roll 115 of heat-treating, annealing device BK configuration alignment cameras CA, the position deviation of the sheet material substrate FB caused because of thermal deformation etc. can be detected.
The testing result of alignment cameras CA1 ~ CA8 is sent to control part 104.Control part 104 carries out the coating position of the ink of such as droplet applying apparatus 120, droplet applying apparatus 140 and the adjustment on opportunity based on the testing result of alignment cameras CA1 ~ CA8, supplies the adjustment of the speed of sheet material substrate FB or the transfer rate of roller RR from substrate supply unit 101, by the adjustment of roller RR to the off-position and opportunity etc. of the adjustment of the movement of Y-direction, shutoff device 130.
(connecting gear)
Then, the formation of the connecting gear TR being located at aforesaid substrate handling part 102 is described.Fig. 5 is the figure of the formation representing connecting gear TR.The multiple connecting gear TR represented in above-mentioned Fig. 3 become identical formation respectively.Therefore, be described for the connecting gear TR configured corresponding to droplet applying apparatus 120 in the plurality of connecting gear TR in Figure 5.
As shown in Figure 5, connecting gear TR has: conveyer mechanism 10, belt drive mechanisms 20 and air cushion mechanism 40.Conveyer mechanism 10 and belt drive mechanisms 20 relatively sheet material substrate FB are configured in-Z side.In addition, the relative sheet material substrate FB of air cushion mechanism 40 is configured in+Z side.
Conveyer mechanism 10 configures along θ Y-direction around belt drive mechanisms 20.Conveyer mechanism 10 has rotating part 11 and absorption holding plate (board holder) 12.Rotating part 11 connects into ring-type by multiple support unit 13 and forms.Specifically, adjacent in θ Y-direction support unit 13 connects to can rotate each other by 1 public spindle unit 14.This formation is arranged continuously along θ Y-direction, and rotating part 11 is formed as ring-type.Conveyer mechanism 10 is configured to by the driving of belt drive mechanisms 20 and rotates along θ Y-direction.
Absorption holding plate 12 is arranged on the outer peripheral face of each support unit 13.Absorption holding plate 12 is such as the plate-shaped member being formed as rectangle.Absorption holding plate 12 has the absorption holding surface 12a adsorbing and keep sheet material substrate FB.Absorption holding surface 12a is located at the outside of conveyer mechanism 10.
Fig. 6 is figure when observing connecting gear TR from+Z side.As shown in Figure 6, adsorbing holding plate 12, to be formed as relative sheet material substrate FB outstanding to Y-direction.And as shown in figs.5 and 6, connecting gear TR keeps sheet material substrate FB in X-direction by 4 absorption holding plate 12 (S) being positioned at central authorities.
Fig. 7 and Fig. 8 is the figure of the formation representing 1 absorption holding plate 12.Fig. 7 is figure when observing absorption holding plate 12 from+Z side, and Fig. 8 is the figure of the formation of the A-A ' section represented in Fig. 7.
As shown in Figure 7 and Figure 8, adsorb holding plate 12 to become holding member 15 and suction tray 16 and be configured in formation on back plate 17 respectively.Holding member 15 is configured in the substantial middle of the Y-direction of back plate 17, is formed with the size of the processed part FBA of the sheet material substrate FB in the Y direction shown in coverage diagram 7.Therefore, at least processed part FBA in sheet material substrate FB is kept by holding member 15.
The face of+Z the side of the holding member 15 in Fig. 7 and Fig. 8 becomes the holding surface 15a kept sheet material substrate FB.It is smooth that holding member 15 is formed as this holding surface 15a.Therefore, the processed part FBA being kept the sheet material substrate FB that face 15a keeps flatly is kept by holding surface 15a.
Suction tray 16 relatively holding member 15 both end sides in the Y direction respectively configures 1.The ora terminalis side from processed part FBA to Y-direction in suction tray 16 adsorption sheet substrate FB away from position (position beyond the processed part FBA such as sheet material substrate FB).
Suction tray 16 is kept by dish support unit 17b, and the adsorption plane 16a being configured to the+Z side in Fig. 7 and Fig. 8 forms negative pressure.Suction tray 16 passes through this adsorption plane 16a to sheet material substrate FB vacuum suction.As an example ,-Z the side of suction tray 16 be formed in the pipe arrangement 16b coiled in support unit 17b and back plate 17 and be connected, this pipe arrangement 16b is connected with the outside pipe arrangement 17c of back plate 17.Pump machanism 18 shown in pipe arrangement 17c and Fig. 9 connects, and adsorption plane 16a forms negative pressure by this pump machanism 18.
This adsorption plane 16a is formed as becoming co-planar between the holding surface 15a of holding member 15.Therefore, the absorption holding surface 12a adsorbing holding plate 12 is formed by the holding surface 15a and adsorption plane 16a being mutually formed as co-planar.Sheet material substrate FB become absorption holding surface 12a in the adsorption plane 16a being located at the two ends of Y-direction on adsorbed, not by the formation of adsorbing on the holding surface 15a of central authorities in the Y direction.
Dish support unit 17b is configured to be moved along Y-direction by Y-direction actuator 17a.According to this formation, the position of the Y-direction of suction tray 16 can be made to move in the Y direction.
According to this formation, such as be assumed to be the state of having adsorbed sheet material substrate FB on 2 suction trays 16, move to+Y-direction by making the suction tray 16 of+Y side, the suction tray 16 of-Y side is moved to-Y-direction, and the hold mode that can maintain on holding surface 15a applies tension force to sheet material substrate FB to Y-direction.
Fig. 9 is the cutaway view of the formation representing the pump machanism 18 be connected with suction tray 16.
As shown in Figure 9, pump machanism 18 has stationary cylinder axle 30, rotating cylinder (cylinder) 31 and suction pump 32.
Stationary cylinder axle 30 is observed from Y-direction and is formed as cylindric, is kept with the state that position is fixing.Stationary cylinder axle 30 has protuberance 30a, attracts supply port 30b and air liberation port 30c.+ Z the side of protuberance 30a on the outside face of stationary cylinder axle 30 is provided with 2 places.Arrange along Y-direction respectively between the both ends that protuberance 30a spreads all over the Y-direction of stationary cylinder axle 30.
Attract supply port 30b to be the peristome formed along Y-direction in the inside of stationary cylinder axle 30, be connected with suction pump 32.Attract supply port 30b be provided with along in figure+the branch 30d that formed of Z-direction.This branch 30d is formed as being connected between 2 above-mentioned protuberance 30a.Therefore, the sucking action of suction pump 32 reaches between 2 protuberance 30a via attraction supply port 30b, branch 30d.Formed between the both ends that air liberation port 30c spreads all over the Y-direction of stationary cylinder axle 30, and be connected with air at these both ends.Air liberation port 30c has branch 30e.Position between branch 30e is connected to away from above-mentioned 2 protuberance 30a.
Rotating cylinder 31 is arranged to surround stationary cylinder axle 30.Rotating cylinder 31 such as by be arranged on the both ends of Y-direction etc. spacer 33 and with spaced apart certain gap configuration of stationary cylinder axle 30.The inside face of rotating cylinder 31 seamlessly contacts with 2 protuberance 30a of stationary cylinder axle 30 via spacer 33.Therefore, the space between the outside face of stationary cylinder axle 30 and the inside face of rotating cylinder 31 becomes the state being divided into space S 1 and space S 2 by 2 protuberance 30a.Wherein, space S 1 is in the state attracted by above-mentioned suction pump 32, and space S 2 is in the state of air release usually.
Rotating cylinder 31 is provided with multiple peristome 31a along θ Y-direction.Each peristome 31a is connected with above-mentioned pipe arrangement 16c respectively.The inboard portion of the peristome 31a be connected with space S 1 in multiple peristome 31a is attracted by above-mentioned suction pump 32.In addition, rotating cylinder 31 is by the rotative speed corresponding rotation of not shown rotating mechanism and conveyer mechanism 10, and the peristome 31a attracted is switched along with rotation.In the present embodiment, sucking action acts on the peristome 31a be connected with 4 rotating parts 11 of supporting sheet substrate FB.
In addition, in order to carry out receiving and grant of sheet material substrate FB smoothly, preferably this pump machanism 18 be formed as in 4 absorption holding plates 12 arrive by the absorption holding plate 12 of-θ Y side the position that sheet material substrate FB is kept before start to attract, when by+Y side absorption holding plate 12 from keep the position of sheet material substrate FB away from time, remove (air release) attraction simultaneously.
Turn back to Fig. 5, belt drive mechanisms 20 has base portion 21, belt conveyor press section 22 and belt conveyor by hydraulic actuator 23.Other parts (such as bottom surface sections, chassis portion etc.) of base portion 21 opposing substrate handling part 102 are fixed, and invariant position moves.Belt conveyor press section 22 is configured to opposed base wall 21 and is configured with multiple along θ Y-direction, to the rotating part 11 that the outside pressing of rotate path (periphery etc. of the rotate path of such as rotating part 11, the conveyer mechanism 10 of rotation) is corresponding with each absorption holding plate 12 of conveyer mechanism 10.Conveyer mechanism 10 is supported by the plurality of belt conveyor press section 22.The front end of belt conveyor press section 22 abuts with conveyer mechanism 10 via the roller that can rotate along θ Y-direction.
Belt conveyor press section 22 is provided with multiple along the hand of rotation of conveyer mechanism 10.Multiple belt conveyor press section 22 is according to the spacing configuration of absorption holding plate 12.As an example, belt conveyor press section 22 is configured with 4 in+Z the side of base portion 21, to press one by one keeping 4 of sheet material substrate FB to adsorb holding plates 12.Further, belt conveyor press section 22 is respectively configured with 4 in+X the side of base portion 21 and-X side, does not bend to make conveyer mechanism 10.4 the belt conveyor the press sections 22 being such as configured in+Z side of base portion 21 in multiple belt conveyor press section 22 are connected by hydraulic actuator 23 with belt conveyor respectively.These belt conveyor press sections 22 are configured to be moved along Z-direction in figure by the driving of belt conveyor by hydraulic actuator 23.Therefore, 4 the absorption holding plates 12 being configured in the+Z side of base portion 21 are pressed by+Z side.In addition, these 4 absorption holding plates 12 are configured near the position and its of being undertaken processing by droplet applying apparatus 120.Therefore, at least in the process position of droplet applying apparatus 120, absorption holding plate 12 is pressed by belt conveyor press section 22.In addition, 8 the belt conveyor press sections 22 difference opposed base wall 21 of+X side and-X side that are configured in base portion 21 are fixed.Wherein, as an example, belt conveyor press section 22 can be made up of the parts with higher rigidity, also can be made up of the elastomeric element that spring is such.
Air cushion mechanism 40 (gas blanket forming portion) has disk component 41, air-flow adjusting mechanism 42 and pipe arrangement 43.Disk component 41 such as respectively arranges 1 at the upstream side of droplet applying apparatus 120 (+X side) and downstream (-X side).Each disk component 41 is respectively arranged with and multiplely goes out the gas vent 41a of gas (such as the non-active gas such as air, nitrogen etc.) to-Z side spray and attract the gas suction port 41b of gas.Gas vent 41a and gas suction port 41b is connected with air-flow adjusting mechanism 42 respectively via pipe arrangement 43.Air-flow adjusting mechanism 42 adjusts the spray volume of gas vent 41a and the traffic attraction of gas suction port 41b.By utilizing air-flow adjusting mechanism 42 to adjust this spray volume and traffic attraction, form the layer (gas blanket or receiving portion) of gas with certain thickness along Z-direction in the-Z side of disk component 41.
In addition, as shown in Figure 3, in luminescent layer forming portion 93, connecting gear TR is configured to cross over droplet applying apparatus 140R, 140G and 140B, but be not limited to this formation, such as connecting gear TR also can become the formation that relatively each droplet applying apparatus 140R, 140G and 140B are arranged independently, can also become the formation of 2 configurations in leap 3 droplet applying apparatus 140.
In addition, in the electrode forming portion 92 of Fig. 3, connecting gear TR is relative, and droplet applying apparatus 120G, 120I and 120SD are arranged independently, but be not limited to this formation, such as connecting gear TR also can become the formation of crossing over these droplet applying apparatus 120G, 120I and 120SD and being configured, and can also become the formation of 2 configurations in leap 3 droplet applying apparatus 120.
(action of substrate board treatment)
Then, the action of the substrate board treatment 100 formed as described above is described.
As shown in Figure 2, substrate board treatment 100 supplies sheet material substrate FB from substrate supply unit 101 to processing substrate portion 102, and in processing substrate portion 102 on this sheet material substrate FB continuous forming element.As shown in Figure 3, in processing substrate portion 102, transmit sheet material substrate FB by roller RR and connecting gear TR.
Control part 104 according to the feed speed of the sheet material substrate FB supplied by substrate supply unit 101 to adjust the rotative speed etc. of the rotative speed of each roller RR in processing substrate portion 102, the conveyer mechanism 10 of connecting gear TR.And whether control part 104 measuring roll RR offsets in the Y-axis direction, roller RR is made to move correction position when offseting.In addition, control part 104 moves the position correction of carrying out sheet material substrate FB in the lump by making roller RR.
First the sheet material substrate FB being supplied to processing substrate portion 102 by substrate supply unit 101 is sent to next door forming portion 91.In next door forming portion 91, sheet material substrate FB is stamped roller 110 and hot transfer roll 115 clamps pressing, is transferred on sheet material substrate forms next door BA and alignment mark AM by heat.
Figure 10 represents the figure defining the state of next door BA and alignment mark AM on sheet material substrate FB.A part of Figure 10 is amplified the figure represented by Figure 11.Figure 12 is the figure of the formation represented along the D-D ' section in Figure 11.Figure 10 and Figure 11 illustrates from the appearance during observation sheet material substrate FB of+Z side.
As shown in Figure 10, next door BA is formed at the element-forming region 60 of the Y-direction central portion of sheet material substrate FB.As shown in figure 11, by forming next door BA, in element-forming region 60, the region (grid forming region 52) forming grid bus GBL and gate electrode G and the region (source drain forming region 53) forming source bus line SBL, source electrode S, drain electrode D and anode P are divided.As shown in figure 12, grid forming region 52 is formed as trapezoidal shape under analysing and observe.Though the diagram of eliminating, source drain forming region 53 also becomes same shape.Width W (μm) in the BA of next door becomes the live width of grid bus GBL.Preferably relative to the bubble diameter d (μm) applied by droplet applying apparatus 120G, this width W is the width of 2 times ~ about 4 times.
In addition, for the section shape of grid forming region 52 and source drain forming region 53, preferably analysing and observe lower is V-shape or U-shaped, and to make after fine imprint mold 111 has pressed sheet material substrate FB, sheet material substrate FB is easy to peel off.As other shape, such as, also can be that analysing and observe lower is rectangular shape.
On the other hand, as shown in Figure 10, alignment mark AM is formed a pair in the fringe region 61 at the Y-direction both ends of sheet material substrate FB.Next door BA and alignment mark AM due to mutual alignment relation more important, so be formed simultaneously.As shown in figure 11, define the predetermined distance PY between alignment mark AM and grid forming region 52 in Y direction, define the predetermined distance PX between alignment mark AM and source drain forming region 53 in X-direction.Therefore, the skew of X-direction of sheet material substrate FB, the skew of Y direction and θ can be detected based on the position of a pair alignment mark AM to rotate.
In Figure 10 and Figure 11, alignment mark AM is provided with a pair by the multirow next door BA of X-direction, but is not limited thereto, such as, also can arrange alignment mark AM by every 1 row next door BA.In addition, if sheet material substrate FB has living space, then except the fringe region 61 of sheet material substrate FB, also alignment mark AM can be set in element-forming region 60.In addition, in Figure 10 and Figure 11, alignment mark AM illustrates cross shape, but also can be other mark shape such as linear mark of sphere shaped markup, inclination.
Next, sheet material substrate FB is sent to electrode forming portion 92 by transfer roller RR.In electrode forming portion 92, carry out the coating of the drop based on each droplet applying apparatus 120, sheet material substrate FB forms electrode.
Control part 104, before sheet material substrate FB is sent to connecting gear TR, makes the air cushion mechanism 40 of connecting gear TR work, and pump machanism 18 is worked.By this action, form certain thickness air layer AR (with reference to Figure 20) in-Z side of disk component 41, and start the attraction action of the suction tray 16 of rotating part 11.
When sheet material substrate FB is sent to connecting gear TR in this condition, sheet material substrate FB is attracted on adsorption plane 16a by suction tray 16, and is maintained on the holding surface 15a of holding member 15.Therefore, sheet material substrate FB is adsorbed holding surface 12a and is kept.Control part 104, by making dish support unit 17b move to Y-direction as required, applies tension force to sheet material substrate FB and improves the flatness of sheet material substrate FB.
Control part 104, after applying tension force to sheet material substrate FB, as shown in figure 20, makes belt conveyor press section 22 move to+Z side, sheet material substrate FB is pressed to the gas blanket AR of-Z side being formed in disk component 41.In this action, due to counteraction, in disk component 41 side also to-Z side pressing sheet material substrate FB.Like this, by with the face ARc of-Z side of gas blanket AR for reference plane, utilize this gas blanket AR with absorption holding surface 12a clamp sheet material substrate FB, the flatness of the processed surface FBc of sheet material substrate FB can be maintained.Control part 104, by maintaining the flatness of the processed surface FBc of sheet material substrate FB and making conveyer mechanism 10 rotate, makes sheet material substrate FB to+X-direction transmission.After, control part 104 also makes the connecting gear TR in the downstream in processing substrate portion 102 carry out same action.
Like this, maintain sheet material substrate FB processed surface FBc flatness state under, control part 104 starts the action of droplet applying apparatus 120.Such as, on sheet material substrate FB, first utilize droplet applying apparatus 120G to form grid bus GBL and gate electrode G.Figure 13 A and Figure 13 B is the figure representing the appearance of being carried out the sheet material substrate FB of droplet applying by droplet applying apparatus 120G.
As shown in FIG. 13A, droplet applying apparatus 120G to define next door BA sheet material substrate FB grid forming region 52 such as with 1 ~ 9 order plating ink.This order is such as the order being coated in linearity with metallic ink tension force each other.Figure 13 B is the figure representing the state after being such as coated with 1 metallic ink.As shown in Figure 13 B, owing to being provided with next door BA, so be kept with being coated on the metallic ink indiffusion of grid forming region 52.Like this, droplet applying apparatus 120G is to the overall plating ink of grid forming region 52.
After being coated with metallic ink to grid forming region 52, the mode being positioned at the-Z side of annealing device BK according to the part being coated with this metallic ink transmits sheet material substrate FB.Annealing device BK heat-treats the metallic ink be coated on sheet material substrate FB, makes this metallic ink dry.Figure 14 A is the figure representing the state making the dried grid forming region 52 of metallic ink.As shown in Figure 14 A, by making metallic ink dry, the conductor layer comprised in metallic ink builds up film-form.The electric conductor of such film-form is formed at the entirety of grid forming region 52, as shown in Figure 14B, sheet material substrate FB forms grid bus GBL and gate electrode G.
Then, sheet material substrate FB is sent to the-Z side of droplet applying apparatus 120I.In droplet applying apparatus 120I, apply electrical insulating property ink to sheet material substrate FB.Such as, in droplet applying apparatus 120I, as shown in figure 15, by coated electrical insulating property ink on the grid bus GBL of source drain forming region 53 and on gate electrode G.
After coated electrical insulating property ink, sheet material substrate FB is sent to the-Z side of annealing device BK, implements heat treatment by annealing device BK to this electrical insulating property ink.Electrical insulating property ink is dry by this heat treatment, forms gate insulator I.Illustrate gate insulator I in Figure 15 and be formed as round-shaped state according to across the mode on the BA of next door, but do not need necessarily to cross over next door BA to be formed.
After defining gate insulator I, sheet material substrate FB is sent to the-Z side of droplet applying apparatus 120SD.In droplet applying apparatus 120SD, to the source drain forming region 53 plating ink of sheet material substrate FB.To the part striding across gate insulator I in source drain forming region 53, such as, with the order of 1 ~ 9 shown in Figure 16 ejection metallic ink.
After being ejected metallic ink, sheet material substrate FB has been sent to the-Z side of annealing device BK, carries out the drying process of metallic ink.After this drying process, the electric conductor tegillum contained by metallic ink builds up film-form, forms source bus line SBL, source electrode S, drain electrode D and anode P.But in this stage, be in the state be connected between source electrode S with drain electrode D.
Then, sheet material substrate FB is sent to the-Z side of shutoff device 130.In shutoff device 130, cut-off between the source electrode S of sheet material substrate FB and drain electrode D.Figure 17 is the figure representing the state after utilizing shutoff device 130 to be cut off at the interval of source electrode S and drain electrode D.In shutoff device 130, galvanometer mirror 131 is used to adjust the irradiation position of laser LL to sheet material substrate FB, while cut off.
After cut-off between source electrode S and drain electrode D, sheet material substrate FB is sent to the-Z side of droplet applying apparatus OS.In droplet applying apparatus OS, sheet material substrate FB forms organic semiconductor layer OS.Organic semiconductor ink is sprayed to the region overlapping with gate electrode G on sheet material substrate FB according to the mode striding across source electrode S and drain electrode D.
After being ejected organic semiconductor ink, sheet material substrate FB is sent to the-Z side of annealing device BK, carries out the drying process of organic semiconductor ink.After this drying process, semiconductor layer contained in organic semiconductor ink builds up film-form, as shown in figure 18, forms organic semiconductor OS.By above operation, sheet material substrate FB forms FET and connecting wiring.
Next, sheet material substrate FB is sent to luminescent layer forming portion 93 (with reference to Fig. 3) by transfer roller RR.In luminescent layer forming portion 93, droplet applying apparatus 140Re, droplet applying apparatus 140Gr, droplet applying apparatus 140Bl and annealing device BK is utilized to form redness, green, blue luminescent layer IR respectively.Owing to being formed with next door BA on sheet material substrate FB, even if so when not utilizing annealing device BK to heat-treat redness, green and blue luminescent layer IR and continue to apply, solution also can not overflow to adjacent pixel region and colour mixture occur.
After defining luminescent layer IR, sheet material substrate FB forms insulating barrier I through droplet applying apparatus 140I and annealing device BK, forms transparency electrode IT through droplet applying apparatus 140IT and annealing device BK.Through such operation, sheet material substrate FB forms the organic EL element 50 shown in Figure 1A ~ Fig. 1 C.
Formed in action at element, in order to be formed in the process of organic EL element 50 transmitting sheet material substrate FB as described above, prevent sheet material substrate FB from offseting to X-direction, Y-direction and θ Z-direction, having carried out alignment actions.Below, with reference to Figure 19, alignment actions is described.
In alignment actions, the multiple alignment cameras CA (CA1 ~ CA8) being located at each portion detect the alignment mark AM be suitably formed on sheet material substrate FB, and send testing result to control part 104.Control part 104 carries out alignment actions based on the testing result of sending.
Such as, the transfer rate of sheet material substrate FB is detected at the shooting interval etc. of the alignment mark AM that control part 104 detects based on alignment cameras CA (CA1 ~ CA8), judges whether roller RR such as rotates with specified speed.When being judged as that roller RR does not rotate with specified speed, the adjustment instruction that control part 104 sends the rotative speed of roller RR applies feedback.
In addition, such as control part 104 is based on the image pickup result of alignment mark AM, and whether the position detecting the Y direction of alignment mark AM offsets, and detects the position skew whether sheet material substrate FB exists Y direction.When detecting that position offsets, control part 104 detects the time that continue for how degree in the state upper/lower positions skew making sheet material substrate FB transmit.
If the time of position skew is the short time, then the nozzle 122 by switching the coating drop in multiple nozzles 122 of droplet applying apparatus 120 is dealt with.If the skew of the Y direction of sheet material substrate FB continue for the long period, then carried out the position correction of the Y direction of sheet material substrate FB by the movement of roller RR.
In addition, whether the X-axis of alignment mark AM that such as control part 104 detects based on alignment cameras CA and the position of Y direction, detect sheet material substrate FB and offset to θ Z-direction.When detecting that position offsets, control part 104 is same with when detecting that the position of Y direction offsets, and detects the time that continue for how degree in the state upper/lower positions skew transmitting sheet material substrate FB.
If the time of position skew is the short time, then the nozzle 122 by switching the coating drop in multiple nozzles 122 of droplet applying apparatus 120 is dealt with.If skew continue for the long period, then make to clip 2 roller RR that the position of the alignment cameras CA this skew being detected is arranged and move to X-direction or Y-direction, carry out the position correction of the θ Z-direction of sheet material substrate FB.
In addition, in the present embodiment, when control part 104 controls air cushion mechanism 40, preference is as being controlled to the layer of uniform thickness by gas blanket AR, and according to alignment actions, electrode forms action, luminescent layer forms action, the process in processing substrate portion 102 in the above-mentioned embodiment such as cut-out action of sheet material substrate FB, control thickness, the forming range of gas blanket AR, the feed speed of gas supplied by disk component 41 or delivery volume etc.
In sum, the substrate board treatment 100 in present embodiment possesses: droplet applying apparatus 120 and 140, its process specified sheet material substrate FB; And absorption holding plate 12, it moves relative to this droplet applying apparatus 120 and 140, and forms the processed surface FBc of sheet material substrate FB, while keep this sheet material substrate FB.In addition, substrate board treatment 100 according to the present embodiment, can guarantee the flatness of the processed surface FBc of sheet material substrate FB, while to sheet material substrate FB process.Thus, the substrate board treatment 100 to having flexual substrate and can be formed high-precision pattern can be provided.
Technical scope of the present invention is not limited to above-mentioned embodiment, can impose suitable change without departing from the scope of the subject in the invention.
Such as, in the above-described embodiment, be configured to the bottom surface sections relative to substrate board treatment 100, make connecting gear TR with direction of transfer (X-direction) for long side direction, with the vertical direction of direction of transfer (Z-direction) for short side direction, but be not limited thereto, also can as shown in figure 21, be configured to take Z-direction as long side direction.In this situation, sheet material substrate FB transmits along the Z direction, and the process for this sheet material substrate FB is carried out in the X direction or in Y-direction.
In addition, in the above-described embodiment, have employed and only use the absorption holding plate 12 of+Z side of the base portion 21 in connecting gear TR to carry out transmitting and the formation of formation of processed surface FBc, but be not limited thereto, also can as shown in figure 21, be use the absorption holding plate 12 of-Z side of base portion 21 to carry out transmitting and the formation of formation of processed surface FBc.In this situation, the droplet applying apparatus 120 of such as electrode forming portion 92 uses the absorption holding plate 12 couples of sheet material substrate FB of+Z side of base portion 21 to carry out above-mentioned process, and the droplet applying apparatus 140 of luminescent layer forming portion 93 uses the absorption holding plate 12 couples of sheet material substrate FB of-Z side of base portion 21 to carry out above-mentioned process.Thus, the size of the device of substrate board treatment 100 self diminishes, and the space of placement substrate processing equipment 100 is by space saving.
In addition, in the above-described embodiment, connecting gear TR is only arranged on and droplet applying apparatus 120,140 corresponding positions, but connecting gear TR also can be configured in other position.
Description of reference numerals: FB... sheet material substrate; TR... connecting gear; FBA... processed part; S1... space; S2... space; 10... conveyer mechanism; 12... holding plate is adsorbed; 12a... adsorbs holding surface; 13... support unit; 14... spindle unit; 15... holding member; 16... suction tray; 16a... adsorption plane; 17... back plate; 17a...Y direction actuator; 18... pump machanism; 20... belt drive mechanisms; 22... belt conveyor press section; 23... belt conveyor presses hydraulic actuator; 30... stationary cylinder axle; 31... rotating cylinder; 40... air cushion mechanism; 41... disk component; 43... pipe arrangement; 100... substrate board treatment; 104... control part; 105... transport unit.
Claims (10)
1. a substrate board treatment, is the substrate board treatment forming circuit in the processed surface of the sheet material substrate with flexual band shape, it is characterized in that possessing:
Transport unit, it comprises the multiple rotating rollers being carried out along banded direction with specified speed by described sheet material substrate transmitting;
Board holder, it becomes the such holding plate of smooth holding surface at described sheet material substrate with the direction had along described transmission, described processed surface opposition side, utilize described holding surface to keep described sheet material substrate with the face of described processed surface opposition side;
Drive division, it makes the described holding plate of this board holder move along the direction of described transmission with described specified speed;
Handling part, it carries out the process for forming described circuit in the described processed surface of the described sheet material substrate kept by described holding plate;
Gas blanket forming portion, it is arranged on described handling part side, comprises towards the disk component of the described processed surface ejection gas of the described sheet material substrate kept by described holding plate, between this disk component and the described processed surface of described sheet material substrate, forms gas blanket; And
Pressing mechanism, described holding plate along described transmission direction movement during, this pressing mechanism by described holding plate by described disk component, the described processed surface of described sheet material substrate is pressed onto described gas blanket.
2. substrate board treatment according to claim 1, is characterized in that,
Multiple holding plates that the described holding plate of described board holder is configured by the direction of the band shape at described sheet material substrate are formed,
Described drive division makes described multiple holding plate move relative to the direction of described handling part to the described processed surface along described sheet material substrate respectively.
3. substrate board treatment according to claim 2, is characterized in that,
The support unit that it is ring-type that described board holder comprises described multiple holding plate supporting,
Described drive division drives described support unit annularly.
4. substrate board treatment according to claim 3, is characterized in that,
Described pressing mechanism presses the part of the correspondence of the support unit of described ring-type, to make to keep the described holding plate of described sheet material substrate to be pressed by described disk component in the process position of described handling part.
5. substrate board treatment according to claim 2, is characterized in that,
Described board holder possesses for by the adsorption plant of described sheet material substrate adsorption to described multiple holding plate holding surface separately,
This adsorption plant has the shift position according to the described multiple holding plate realized by described drive division, switches the switching mechanism of the adsorbed state of described sheet material substrate by each described holding plate.
6. a manufacture method for display element, is the manufacture method of the display element to the sheet material Substrate manufacture display element with flexual band shape, it is characterized in that having:
Keep operation, the face of the opposition side of the processed surface of described sheet material substrate is kept by the smooth holding surface of board holder, to make the described processed surface of described sheet material substrate smooth, and, between the described processed surface and described disk component of the described sheet material substrate kept by described holding surface, form gas blanket by the disk component of the opposite disposed gas blanket forming portion of described board holder, clamp described sheet material substrate by the holding surface of described board holder and described gas blanket; With
Treatment process, by carrying out in the process being formed described display element by described maintenance operation by the described processed surface of the described sheet material substrate clamped for the manufacture of the handling part of described display element.
7. the manufacture method of display element according to claim 6, is characterized in that,
Described maintenance operation comprises the process controlling described gas blanket according to the described process in described treatment process.
8. the manufacture method of display element according to claim 6, is characterized in that,
Described maintenance operation comprises the pressing process of the holding surface of described board holder towards the described disk component pressing of described gas blanket forming portion.
9. the manufacture method of display element according to claim 8, is characterized in that,
Described board holder possesses the direction arrangement along the band shape of described sheet material substrate and described sheet material substrate flatly can be adsorbed multiple holding plates of maintenance,
Described multiple holding plate is configured to be moved relative to the described processed surface of described handling part along described sheet material substrate by drive division,
Described maintenance operation comprises the shift position according to the described multiple holding plate realized by described drive division, switches the switching process of the adsorbed state of described sheet material substrate by each described holding plate.
10. a substrate processing method using same, being transmit the sheet material substrate with flexual band shape continuously, for forming the substrate processing method using same of thin film transistor on described sheet material substrate, it is characterized in that having:
Keep operation, the face of the opposition side of the processed surface of described sheet material substrate is kept by the holding surface of board holder, to make the described processed surface of described sheet material substrate smooth, and, between the described processed surface and described disk component of the described sheet material substrate kept by described holding surface, form gas blanket by the disk component of the opposite disposed gas blanket forming portion of described board holder, clamp described sheet material substrate by the holding surface of described board holder and described gas blanket; With
Treatment process, is undertaken for the described processed surface of described sheet material substrate that clamps being formed the process of described thin film transistor by described maintenance operation by the handling part of the described processed surface side being configured in described sheet material substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009268789 | 2009-11-26 | ||
| JP2009-268789 | 2009-11-26 | ||
| PCT/JP2010/071124 WO2011065478A1 (en) | 2009-11-26 | 2010-11-26 | Substrate processing apparatus and method for manufacturing display element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102666323A CN102666323A (en) | 2012-09-12 |
| CN102666323B true CN102666323B (en) | 2015-06-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201080048800.0A Active CN102666323B (en) | 2009-11-26 | 2010-11-26 | Substrate processing apparatus and method for manufacturing display element |
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| JP (1) | JP5887935B2 (en) |
| KR (3) | KR101906129B1 (en) |
| CN (1) | CN102666323B (en) |
| HK (1) | HK1174316A1 (en) |
| WO (1) | WO2011065478A1 (en) |
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| WO2013107684A2 (en) * | 2012-01-17 | 2013-07-25 | Asml Netherlands B.V. | A method of loading a flexible substrate, a device manufacturing method, an apparatus for loading a flexible substrate, and a lithography apparatus |
| KR20210003358A (en) | 2019-07-01 | 2021-01-12 | 삼성디스플레이 주식회사 | Apparatus and method for manufacturing a display device |
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| JP2009218505A (en) * | 2008-03-12 | 2009-09-24 | Sumitomo Heavy Ind Ltd | Unload chamber, and method for operating the same |
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2010
- 2010-11-26 KR KR1020187019872A patent/KR101906129B1/en active IP Right Grant
- 2010-11-26 KR KR1020127009105A patent/KR101843545B1/en active IP Right Grant
- 2010-11-26 WO PCT/JP2010/071124 patent/WO2011065478A1/en active Application Filing
- 2010-11-26 JP JP2011543319A patent/JP5887935B2/en active Active
- 2010-11-26 CN CN201080048800.0A patent/CN102666323B/en active Active
- 2010-11-26 KR KR1020187007930A patent/KR101880017B1/en active IP Right Grant
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| CN100352000C (en) * | 2004-11-15 | 2007-11-28 | 大日本网目版制造株式会社 | Base-board treating device |
| CN101295661A (en) * | 2007-04-24 | 2008-10-29 | 东京毅力科创株式会社 | Substrate attracting device and substrate transfer apparatus |
| CN101323396A (en) * | 2007-06-11 | 2008-12-17 | 奥林巴斯株式会社 | Substrate absorbing apparatus, substrate conveying apparatus and exterior inspection apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180084144A (en) | 2018-07-24 |
| KR101843545B1 (en) | 2018-03-30 |
| JP5887935B2 (en) | 2016-03-16 |
| CN102666323A (en) | 2012-09-12 |
| JPWO2011065478A1 (en) | 2013-04-18 |
| HK1174316A1 (en) | 2013-06-07 |
| WO2011065478A1 (en) | 2011-06-03 |
| KR20120113699A (en) | 2012-10-15 |
| KR20180033596A (en) | 2018-04-03 |
| KR101906129B1 (en) | 2018-10-08 |
| KR101880017B1 (en) | 2018-07-18 |
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