CN102665375B - System and method for welding flexible printed circuit made of polyester material at low temperature - Google Patents
System and method for welding flexible printed circuit made of polyester material at low temperature Download PDFInfo
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- CN102665375B CN102665375B CN201210177135.6A CN201210177135A CN102665375B CN 102665375 B CN102665375 B CN 102665375B CN 201210177135 A CN201210177135 A CN 201210177135A CN 102665375 B CN102665375 B CN 102665375B
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- electric circuit
- flexible electric
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Abstract
The invention discloses a system and a method for welding a flexible printed circuit made of a polyester material at a low temperature. The low-temperature welding system comprises a reflow soldering device and soldering tin, particularly the soldering tin is lead-free low-temperature solder paste of which the welding temperature of lower than or equal to 110 DEG C; and the low-temperature welding system also comprises a surface mount carrier, and an insulation board which is used for covering a polyester material flexible printed circuit to insulate heat, wherein the insulation board has an avoiding space for avoiding surface mount components, so that the welding parts of the surface mount components are exposed so as to perform reflow soldering. According to the low-temperature welding system for the polyester material flexible printed circuit, the polyester material can be directly subjected to surface mount components and reflow soldering, and the overall expansion and deformation of the welded polyester material flexible printed circuit are in a completely controllable range which meets the requirement. In addition, the system is easy to operate, reliable in surface mount welding, energy-saving and highly efficient and can be applied to the wide application field, and the cost of a manufacturing enterprise and a using enterprise is reduced.
Description
Technical field
the present invention relates to a kind of polyester material flexible electric circuit board soldered system and welding method.
Background technology
in prior art, flexible circuit board industry is to needing the product of Surface Mount Component, (SMT) when designing, all select resistant to elevated temperatures polyimides (PI) material to carry out the making of product, follow-up while mounting after components and parts through high temperature Reflow Soldering to guarantee, processed product can Yin Gaowen and is produced serious harmomegathus and distortion.The maximum temperature of bearing due to the theory of polyester (PET) material own is 105 ℃, the flexible circuit panel products being processed into, if carry out operation according to 250 ℃ of the high temperature reflux welderings of polyimides (PI) material, polyester (PET) material definitely cannot stand; And polyimides (PI) material on year-on-year basis polyester (PET) material price is at least doubled.Therefore, the existence of objective condition problem, troubling for a long time the manufacturer of flexible circuit always and using producer, and manufacturing firm and use producer are also being explored hardy always, wish to find the method that can directly carry out Surface Mount Component, (SMT) and Reflow Soldering to polyester (PET) material, finally carry out to reduce better the use cost of product.
Summary of the invention
technical problem to be solved by this invention is to overcome the deficiencies in the prior art, provides a kind of and can directly to polyester material, carry out the polyester material flexible electric circuit board soldered system of Surface Mount Component, and Reflow Soldering.
the present invention also will provide a kind of simultaneously can directly carry out the polyester material flexible electric circuit board low-temperature welding method of Surface Mount Component, and Reflow Soldering to polyester material.
for solving above technical problem, a kind of technical scheme that the present invention takes is:
a kind of polyester material flexible electric circuit board soldered system, it comprises reflow soldering apparatus and is arranged on polyester material flexible electric circuit board and is mounted on the scolding tin between components and parts that mounts on polyester material flexible electric circuit board, particularly, described scolding tin is that welding temperature is less than or equal to the lead-free low-temperature tin cream of 110 ℃, soldered system also comprises the support plate that mounts for fixing polyester material flexible electric circuit board, for covering the thermal insulation board that plays heat-blocking action on polyester material flexible electric circuit board, this thermal insulation board has dodges the space of dodging that mounts components and parts, make the welding position that mounts components and parts expose and be convenient to carry out Reflow Soldering.
according to an aspect of the present invention, described scolding tin is that welding temperature is the lead-free low-temperature tin cream of 100 ℃ ~ 110 ℃.Field village TLF-204-NH lead-free low-temperature tin cream for example.
according to the present invention, the material of described thermal insulation board is heat stable resin, preferred epoxy or modified epoxy.
the another technical scheme that the present invention takes is:
a method that adopts above-mentioned polyester material flexible electric circuit board soldered system to weld, it comprises the steps:
(1), polyester material flexible electric circuit board is fixed on and is mounted above support plate, and complete and mount components and parts mounting on polyester material flexible electric circuit board;
(2), thermal insulation board is fixed on polyester material flexible electric circuit board, in the time of fixedly, guarantee that the welding position that mounts components and parts exposes, and obtains assembly to be welded;
(3), above-mentioned assembly to be welded is placed in the reflow soldering apparatus that sets temperature parameter, by reflow soldering apparatus, to mounting components and parts above polyester material flexible electric circuit board, carry out Reflow Soldering;
(4), after Reflow Soldering completes, thermal insulation board is laid down, then polyester material flexible electric circuit board is taken off above mounting support plate, so far all weld jobs complete.
preferably, in step (3), the temperature of Reflow Soldering is 100 ~ 110 ℃.
due to the enforcement of above technical scheme, the present invention compared with prior art tool has the following advantages:
the present invention proposes polyester material flexible electric circuit board soldered system first, utilize this system directly to polyester material, to carry out Surface Mount Component, and Reflow Soldering, after welding, the whole harmomegathus of polyester material flexible circuit panel products and distortion are completely within satisfactory controlled range.In addition, the Reflow Soldering temperature of soldered system of the present invention is lower, compared with the prior art, and Reflow Soldering equipment power consumption decline to a great extent (nearly 35%).
Accompanying drawing explanation
below in conjunction with accompanying drawing and concrete execution mode, the present invention will be further described in detail.
fig. 1 is the structural representation (reflow soldering apparatus does not show) of polyester material flexible electric circuit board soldered system of the present invention;
wherein: 1, mount components and parts; 2, low-temperature lead-free solder; 3, thermal insulation board; 4, polyester material flexible electric circuit board; 5, mount support plate.
Embodiment
as shown in Figure 1, according to the polyester material flexible electric circuit board soldered system of the present embodiment, comprise reflow soldering apparatus (not shown), low-temperature lead-free solder 2(Tian village TLF-204-NH lead-free low-temperature tin cream), thermal insulation board 3(material is epoxy resin), polyester material flexible electric circuit board 4 and mount support plate 5.
utilize the soldered system of the present embodiment to carry out the step of Reflow Soldering as follows:
(1), polyester material flexible electric circuit board 4 is fixed on and is mounted above support plate 5, and complete and mount components and parts 1 mounting on polyester material flexible electric circuit board 4;
(2), by thering is the thermal insulation board 3 of dodging space, be fixed on polyester material flexible electric circuit board 4, in the time of fixedly, guarantee that the soldered welding position that mounts components and parts 1 exposes, and obtains assembly to be welded;
(3), assembly to be welded is placed into and is set in the isoparametric reflow soldering apparatus of all temperature, by reflow soldering apparatus, completed polyester material flexible electric circuit board 4 is mounted to the soldered process of components and parts 1 above, Reflow Soldering temperature is 100 ~ 110 ℃.
(4), after Reflow Soldering completes, thermal insulation board 3 is laid down, then polyester material flexible electric circuit board 4 is taken off above mounting support plate 5, completed thus the soldered operation process of the Surface Mount Component, of whole polyester material flexible circuit panel products.
the present invention compares with the high-temperature soldering technology that traditional polyimides product mounts components and parts, simple to operate, to mount welding reliable, mount the components and parts that welded, through actual thrust strength test, all more than one kilogram, its components and parts welding quality meets all specification requirements completely, improve original product and directly entered the technique that Reflow Soldering is processed, re-designed polyester (PET) material product surface thermal insulation board, guaranteed that polyester (PET) material product completes Surface Mount Component, again after low temperature (110 ℃) Reflow Soldering processing, the whole harmomegathus of polyester (PET) material product and distortion are completely within satisfactory controlled range, to the reprocessing of subsequent handling without any adverse effect and hidden danger of quality, thoroughly realized polyester material flexible circuit panel products, can be carried out in enormous quantities the soldered technology of Surface Mount Component, do not change any technique that original polyester material flexible electric circuit board is produced, and because the processing temperature of soldered tin cream is low, compare original high temperature tin cream operation, it is nearly 35% that the Reflow Soldering equipment power consumption of soldered has also reduced, basic neutralisation the price difference of two kinds of tin creams.Therefore, in the situation that meeting equal serviceability, can be in the situation that not increasing any cost payout, really accomplished simple and reliable and efficient energy-saving, for enterprise opens up a market better and provides advantage for client reduces costs better, also make the application of polyester material flexible circuit panel products more wide simultaneously.
to sum up, polyester material flexible electric circuit board soldered system according to the present invention is simple to operate, it is reliable to mount welding, and efficient energy-saving for manufacturing enterprise with use enterprise to reduce cost, has more wide application.
above the present invention is described in detail, but the invention is not restricted to the embodiments described.The equivalence that all Spirit Essences according to the present invention are done changes or modifies, and all should be encompassed in protection scope of the present invention.
Claims (1)
1. a method that adopts polyester material flexible electric circuit board soldered system to weld, described polyester material is PET, described polyester material flexible electric circuit board soldered system comprises reflow soldering apparatus and is arranged on described polyester material flexible electric circuit board (4) and is mounted on the scolding tin (2) between components and parts (1) that mounts on described polyester material flexible electric circuit board (4), it is characterized in that: described soldered system also comprises and mounts support plate (5) for fixing described polyester material flexible electric circuit board (4), be used for covering the thermal insulation board (3) that described polyester material flexible electric circuit board (4) has been gone up heat-blocking action, described thermal insulation board (3) has dodges the described space of dodging that mounts components and parts (1), make the welding position that mounts components and parts (1) expose and be convenient to carry out Reflow Soldering, the material of described thermal insulation board (3) is epoxy resin, described method comprises the steps:
(1), polyester material flexible electric circuit board is fixed on and is mounted above support plate, and complete and mount components and parts mounting on polyester material flexible electric circuit board;
(2), thermal insulation board is fixed on polyester material flexible electric circuit board, in the time of fixedly, guarantee that the welding position that mounts components and parts exposes, and obtains assembly to be welded;
(3), above-mentioned assembly to be welded is placed in the reflow soldering apparatus that sets temperature parameter, by reflow soldering apparatus, to mounting components and parts above polyester material flexible electric circuit board, carry out Reflow Soldering;
(4), after Reflow Soldering completes, thermal insulation board is laid down, then polyester material flexible electric circuit board is taken off above mounting support plate, so far all weld jobs complete.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210177135.6A CN102665375B (en) | 2012-05-31 | 2012-05-31 | System and method for welding flexible printed circuit made of polyester material at low temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210177135.6A CN102665375B (en) | 2012-05-31 | 2012-05-31 | System and method for welding flexible printed circuit made of polyester material at low temperature |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102665375A CN102665375A (en) | 2012-09-12 |
| CN102665375B true CN102665375B (en) | 2014-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210177135.6A Active CN102665375B (en) | 2012-05-31 | 2012-05-31 | System and method for welding flexible printed circuit made of polyester material at low temperature |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102922070B (en) * | 2012-11-05 | 2015-07-15 | 上海航嘉电子科技股份有限公司 | Lead-free surface mounting technology (SMT) welding process for FR-1 paper printed circuit board (PCB) and special heat insulation fixture |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101521994A (en) * | 2009-04-03 | 2009-09-02 | 苏州市飞莱克斯电路电子有限公司 | Reflow soldering shield jig for flexible circuit board |
| CN202634899U (en) * | 2012-05-31 | 2012-12-26 | 昆山市线路板厂 | Low-temperature welding system for flexible polyester circuit board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041637A (en) * | 1996-07-23 | 1998-02-13 | Nec Corp | High-density multilayer wiring board |
| JP2000357869A (en) * | 1999-06-17 | 2000-12-26 | Sony Corp | Method of mounting components |
| JP2003059971A (en) * | 2001-08-20 | 2003-02-28 | Nec Kansai Ltd | Wiring board and manufacturing method therefor, and semiconductor device |
| JP4633110B2 (en) * | 2002-01-11 | 2011-02-16 | Ｎｅｃインフロンティア株式会社 | Soldering method |
| US7524920B2 (en) * | 2004-12-16 | 2009-04-28 | Eastman Chemical Company | Biaxially oriented copolyester film and laminates thereof |
| CN101350464B (en) * | 2007-07-20 | 2011-05-04 | 深圳富泰宏精密工业有限公司 | Conductive pole and electronic device containing the same |
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- 2012-05-31 CN CN201210177135.6A patent/CN102665375B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101521994A (en) * | 2009-04-03 | 2009-09-02 | 苏州市飞莱克斯电路电子有限公司 | Reflow soldering shield jig for flexible circuit board |
| CN202634899U (en) * | 2012-05-31 | 2012-12-26 | 昆山市线路板厂 | Low-temperature welding system for flexible polyester circuit board |
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| CN102665375A (en) | 2012-09-12 |
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