CN102664234A - Piezoelectric ceramic actuation element and manufacturing method thereof - Google Patents
Piezoelectric ceramic actuation element and manufacturing method thereof Download PDFInfo
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- CN102664234A CN102664234A CN2012101571805A CN201210157180A CN102664234A CN 102664234 A CN102664234 A CN 102664234A CN 2012101571805 A CN2012101571805 A CN 2012101571805A CN 201210157180 A CN201210157180 A CN 201210157180A CN 102664234 A CN102664234 A CN 102664234A
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Abstract
The invention discloses a piezoelectric ceramic actuation element, which comprises a substrate with substrate electrodes and one or two piezoelectric ceramic plates each of which the front and back surfaces are bonded with electrode layers, wherein the piezoelectric ceramic plates and the substrate electrodes are bonded through bonding agents; and at least one bonding agent-free area filled with conductive materials is formed on the bonded surfaces of the piezoelectric ceramic plates and the substrate electrodes. The bonding agent-free area filled with conductive materials is formed on the bonded surfaces of the piezoelectric ceramic plates and the substrate electrodes, so that the electrode layers on the bonded surfaces of the substrate electrodes and the piezoelectric ceramic plates are fully conductive, the capability of the piezoelectric ceramic actuation element during working is improved, and the service life of the piezoelectric ceramic actuation element is prolonged; and through holes filled with conductive materials are formed in the substrate corresponding to the bonding agent-free area, so that the manufacturing process difficulty is reduced. Besides, the invention also provides a method for manufacturing the piezoelectric ceramic actuation element.
Description
Technical field
The present invention relates to a kind of piezoelectric ceramic actuator element and preparation method thereof, relate in particular to a kind of piezo ceramic unimorph or twin lamella actuation element and preparation method thereof, belong to the piezoelectric element technical field.
Background technology
Piezoelectric is meant to be under pressure makes voltage can appear in the time spent between both ends of the surface crystalline material, and this phenomenon then is called piezoelectric effect; Simultaneously, piezoelectric can produce distortion under external electric field, and this phenomenon is called as inverse piezoelectric effect.Utilize these characteristics of piezoelectric can realize the mutual conversion of mechanical oscillation and alternating current, thereby piezoelectric has been widely used in making elements such as transducer, transducer.
Piezoelectric is broadly divided into inorganic piezoelectric material and organic piezoelectric materials, and wherein inorganic piezoelectric material comprises piezoelectricity polycrystalline material (being piezoelectric ceramic) and piezoelectric single crystal material again.In existing piezoelectric, piezoelectric ceramic is most widely used a kind of.The anti-interference of the impact electric current of piezoelectric ceramic own is very strong, and it is little to generate heat, the transient process when not having current transients and more there is not phenomenons such as receiving the interference of electromagnetic field in the nuisance vibration that takes place, and particularly stability is very high in high speed motion, and error rate is low.Piezoelectric ceramic also has easy to control, and is in light weight, and volume is little, and electromagnetic noise is low, and displacement is directly proportional with voltage, safeguards that easily, energy conversion efficiency is high, is easy to be processed into advantages such as arbitrary shape, has been widely used in various precision optical machineries and the electromechanical integration equipment.
In piezoelectric actuated and driven application field, application mainly be the single, double wafer of piezoelectric ceramic.The single, double wafer actuation element of piezoelectric ceramic is an inverse piezoelectric effect of utilizing piezoelectric ceramic, makes the flexible actuation ends (end relative with it is fixing usually, is referred to as stiff end) that drives of piezoelectric element generation produce big displacement bending and exert oneself.Usually the piezoelectric ceramic actuator element is by substrate and piezoelectric ceramic piece is bonding forms; Substrate can adopt electric conducting materials such as metal, carbon fiber; This moment, substrate can be directly as substrate electrod, and the electrode surface on the non-bonding plane of piezoelectric ceramic piece forms two drive electrodes of input driving voltage; Substrate also can use non-conducting material to process, and needs this moment to utilize modes such as brush silver slurry, copper membrane to produce substrate electrod on its surface.
All there is the actuation ends smaller defect of exerting oneself in existing piezoelectric ceramic list/twin lamella actuation element, and its actual exerting oneself can't reach theoretical level far away; And along with service time is elongated, actual exert oneself and can descend more and more that it can produce, that is its actual life is shorter; What is more, and the voltage on the per unit thickness of at present domestic piezoelectric ceramic list/twin lamella is very limited, and piezoelectric ceramic piece can bear voltage but on-load voltage does not reach independently far away.
Summary of the invention
Technical problem to be solved by this invention is to overcome the existing in prior technology actuation ends defective that but less on-load voltage is not high and actual life is short of exerting oneself, but provide a kind of have more greatly exert oneself, higher on-load voltage and the piezoelectric ceramic actuator element and preparation method thereof of long life more.
The present invention is concrete to adopt following technical scheme to solve the problems of the technologies described above.
A kind of piezoelectric ceramic actuator element; Comprise substrate with substrate electrod; And a slice or two positive and negative surfaces are attached with the piezoelectric ceramic piece of electrode layer respectively; Said piezoelectric ceramic piece and substrate electrod are bonding each other through stick, exist at least one place to be filled with the no stick zone of conductive materials on the bonding plane of piezoelectric ceramic piece and substrate electrod.
As one of them preferred version, said no stick zone is positioned at the position near the stiff end of said Piezoelectric Ceramic element.
As another preferred version wherein, said conductive materials is conducting resinl or liquid metal.
A kind of manufacture method of the element of piezoelectric ceramic actuator as stated, said piezoelectric ceramic piece is a slice, may further comprise the steps:
Steps A, wherein apply one deck stick on the electrode layer of one side at said piezoelectric ceramic piece, forming at least one place in electrode layer surface during coating does not have the stick zone;
Step B, inject an amount of conductive materials in no stick zone;
Step C, above-mentioned piezoelectric ceramic piece is scribbled one of the stick horizontal positioned that faces up, substrate is covered on it, apply suitable pressure then, make the formation of substrate and the piezoelectric ceramic piece under it than stable whole;
Step D, said stick is solidified.
A kind of manufacture method of the element of piezoelectric ceramic actuator as stated, said piezoelectric ceramic piece is two, it is characterized in that, may further comprise the steps:
Steps A, on the electrode layer of the wherein one side of two piezoelectric ceramic pieces, apply one deck stick respectively, forming at least one place in electrode layer surface during coating does not have the stick zone;
Step B, inject an amount of conductive materials in the no stick zone of two piezoelectric ceramic pieces respectively;
Step C, will be wherein a slice piezoelectric ceramic piece scribble one of the stick horizontal positioned that faces up, substrate is covered on it, apply suitable pressure then, make the formation of substrate and the piezoelectric ceramic piece under it than stable whole;
Step D, another sheet piezoelectric ceramic piece is scribbled one of the stick horizontal positioned that faces up; Make the substrate another side down; Substrate is covered in this piezoelectric ceramic piece upper surface, applies suitable pressure then, two piezoelectric ceramic pieces and substrate are formed than stable whole;
Step e, said stick is solidified.
In order to reduce the manufacture craft difficulty; As further improvement project of the present invention; Said substrate is provided with the regional identical through hole of no stick on the bonding plane of quantity, position and size and said piezoelectric ceramic piece and substrate electrod; Through hole and corresponding no stick zone form intercommunicating pore, are full of conductive materials in the intercommunicating pore.
A kind of manufacture method like the said piezoelectric ceramic actuator element of further improvement project, said piezoelectric ceramic piece is a slice, this method may further comprise the steps:
Steps A, wherein apply one deck stick on the electrode layer of one side at said piezoelectric ceramic piece, forming at least one place in electrode layer surface during coating does not have the stick zone;
Step B, above-mentioned piezoelectric ceramic piece is scribbled one of the stick horizontal positioned that faces up; Substrate is covered on it; Be provided with quantity, position and the big or small through hole that adapts on the substrate in advance with said no stick zone; Make on-chip through hole and no stick regional alignment, apply suitable pressure then, substrate and the piezoelectric ceramic piece under it are formed than stable whole;
Step C, in on-chip through hole, fill with conductive materials;
Step D, generate a cover layer, make the conductive materials of injection be packaged in through hole at substrate upper surface;
Step e, said stick is solidified.
A kind of manufacture method like the said piezoelectric ceramic actuator element of further improvement project; Said piezoelectric ceramic piece is two; Quantity, position and the size in the no stick zone on the bonding plane of two piezoelectric ceramic pieces and substrate electrod are all identical, and this method may further comprise the steps:
Steps A, wherein apply one deck stick on the electrode layer of one side at a slice piezoelectric ceramic piece, forming at least one place in electrode layer surface during coating does not have the stick zone;
Step B, above-mentioned piezoelectric ceramic piece is scribbled one of the stick horizontal positioned that faces up; Substrate is covered on it; Be provided with quantity, position and the big or small through hole that adapts on the substrate in advance with said no stick zone; Make on-chip through hole and no stick regional alignment, apply suitable pressure then, substrate and the piezoelectric ceramic piece under it are formed than stable whole;
Step C, in on-chip through hole, fill with conductive materials;
Step D, wherein apply one deck stick on the electrode layer of one side at another sheet piezoelectric ceramic piece, during coating electrode layer surface form with substrate on the no stick zone that adapts of quantity, position and the size of through hole; Order is coated with one of stick and faces down, and piezoelectric ceramic piece is covered in substrate upper surface, makes no stick zone and on-chip through-hole alignment on the piezoelectric ceramic piece, applies suitable pressure then, and two piezoelectric ceramic pieces and substrate are formed than stable whole;
Step e, said stick is solidified.
The present invention is through being provided with the no stick zone that is filled with conductive materials on the bonding plane of piezoelectric ceramic piece and substrate electrod; Make between the electrode layer of substrate electrod and piezoelectric ceramic piece bonding plane and realize fully conducting; Exerting oneself when effectively having improved the work of piezoelectric ceramic actuator element, and increased the useful life of piezoelectric ceramic actuator element; And, reduced the manufacture craft difficulty further through on substrate, the through hole that is full of conductive materials being set with no stick area relative position.
Description of drawings
Fig. 1 is a kind of structural representation of existing piezoelectric ceramic twin lamella actuation element;
Fig. 2 is the equivalent circuit diagram of existing piezoelectric ceramic actuator element;
Fig. 3 is the structural representation of the embodiment of the invention one;
Fig. 4 is the structural representation of the embodiment of the invention two;
Fig. 5 is the structural representation of the embodiment of the invention three;
Fig. 6 is the structural representation of the embodiment of the invention four;
Fig. 7 is the structural representation of the embodiment of the invention five;
Fig. 8 is the structural representation of the embodiment of the invention six;
Fig. 9 is the employed test platform sketch map of contrast test;
Each label implication is following among the figure: 1 is substrate, and 11 is substrate electrod, and 2,3 is piezoelectric ceramic piece; 21,22 is two electrode layers of piezoelectric ceramic piece 2; 31,32 is two electrode layers of piezoelectric ceramic piece 3, and 4,5 is adhesive layer, and 6,7 are respectively the no stick zone in adhesive layer 4 and the adhesive layer 5; 8 is the through hole on the substrate 1, and 9 is cover layer.
Embodiment
Below in conjunction with accompanying drawing technical scheme of the present invention is elaborated:
A kind of structure of existing piezoelectric ceramic twin lamella actuation element is as shown in Figure 1; Comprise: substrate 1, piezoelectric ceramic piece 2, piezoelectric ceramic piece 3; Piezoelectric ceramic piece 2 and two surfaces of 3 have one deck electrode layer respectively: 21,22 and 31,32; The electrode layer 22 of piezoelectric ceramic piece 2 is through the surface adhesion of adhesive layer 4 with substrate 1, and the electrode layer 31 of piezoelectric ceramic piece 3 is through adhesive layer 5 another surface adhesion with substrate 1.Substrate 1 can directly use electric conducting materials such as metal material or carbon fiber to process, thus with itself as piezoelectric ceramic piece 2 and 3 shared substrate electrods; Also can form substrate electrod on its surface through criticizing methods such as covering silver slurry, copper film.One end of this piezoelectric ceramic twin lamella actuation element is fixed; The other end is as actuation ends; When at the electrode layer 21 of substrate electrod and piezoelectric ceramic piece 2 and 3, when applying driving voltage between 32, owing to the effect of inverse piezoelectric effect, piezoelectric ceramic piece 2 and 3 produces distortion; The drive actuation ends is subjected to displacement, thereby promotes load movement.
But this type of piezoelectric ceramic list/twin lamella actuation element all exists actual the exerting oneself of actuation ends can't reach the phenomenon of theoretical level far away; And along with service time is elongated, it can produce actual exert oneself and can descend more and more, that is its actual life is shorter, What is more, but its reality making alive can receive voltage well below piezoelectric ceramic piece independently.
Through testing and discovering, the generation of this kind phenomenon is because the existence of adhesive layer 4 and 5 produces.As everyone knows, when making piezoelectric ceramic list/twin lamella actuation element, need piezoelectric ceramic piece and substrate is bonding to play fixing effect.In order to ensure bonding fastness, common employed bonding agent is nonconducting organism glue, and under pressure, the formed adhesive layer of bonding agent is very thin, it is generally acknowledged conducting between the substrate electrod that can not influence its two ends and the piezoelectric ceramic electrode layer.But in fact, because the existence of adhesive layer, on microcosmic, presenting a kind of situation that contacts of putting between substrate electrod and the piezoelectric ceramic electrode layer, promptly is to realize conducting through some discontinuous contact points between the two, the therefore bad conducting of formation in fact easily.
The piezoelectric effect of piezoelectric ceramic piece satisfies following formula:
Q＝Fd (1)
Wherein d is a piezoelectric modulus, and F is the active force to piezoelectric ceramic piece, and Q is the quantity of electric charge on the piezoelectric ceramic piece two end electrodes face.The formula of inverse piezoelectric effect can be obtained by above fortran:
F＝Q/d (2)
Because d is a material parameter, so can know that the quantity of electric charge of piezoelectric ceramic piece two end electrodes face is big more, then the active force of piezoelectric ceramic piece generation is big more.
Consider to be bonded in the situation of on-chip piezo ceramic unimorph, piezoelectric ceramic piece is equivalent to an electric capacity, representes with C1.Under ideal state; Be substrate electrod and its be good conducting between the bonding piezoelectric ceramic electrode layer; The driving voltage that is carried between another electrode layer of substrate electrod and piezoelectric ceramic equates that with capacitor C 1 voltage this moment, actual the exerting oneself of piezoelectric ceramic piece can reach theoretical value.Yet, because the existence of adhesive layer, make the situation that presents incomplete conducting between substrate electrod and the piezoelectric ceramic electrode layer; Shown in the equivalent electric circuit of Fig. 2, be equivalent to know by circuit theory to capacitor C 1 resistance R 1 of having connected; When being carried in driving voltage between another electrode layer of substrate electrod and piezoelectric ceramic and being the alternating voltage of a fixed value, because capacitor C 1 (can reach 200～250nF), in a half period of driving voltage greatly; Can think positive charge; But because resistance R 1 is also very big, cause the electric current of circuit very little, also just very slow to the charging effect of capacitor C 1 so.So under a frequency, electric weight does not all reach the full value of capacitor C 1 chargeable lotus, so the working value of capacitor C 1 can't reach actual value C1 all the time at every turn.Can know that in conjunction with formula (2) traditional actual the exerting oneself of piezoelectric ceramic list/twin lamella actuation element actuation ends that is operated in equally under the alternating voltage situation can't reach theoretical level far away.Under the situation about working long hours; Bad conducting situation between substrate electrod and the piezoelectric ceramic electrode layer can more become serious; Be equivalent to resistance R 1 and progressively increasing, it is more and more littler to cause on the positive and negative polarities of piezoelectric ceramic piece the maximum electrical quantitative change to get thus, actuation element is actual exert oneself more and more littler.What is more; The positive and negative polarities voltage that is added in piezoelectric ceramic piece when alternating current is correct time; Because the alternating voltage of actuation element is generally square wave, thus at piezoelectric ceramic piece near glue-line one side because the influence of big resistance R 1, when its electric charge also is not full of; And thin low-k glue-line is arranged near the one side of glue-line and substrate around near the some contact position of the one side of glue-line at piezoelectric ceramic piece; Just formed a high potential difference on the two sides of these thin layers, and that voltage is worn in the resistance of glue-line is very low, so caused electric discharge phenomena at these thin layer places; And in actuation element especially piezoelectric ceramic list/twin lamella, be the generation of forbidding electric discharge phenomena; Very easily cause thin adhesive layer the peeling off on microcosmic around the contact position, make invocation point contact effect more abominable, cause more easily piezoelectric ceramic piece because of discharge produces dark crackle and breakdown effect.
Can know through above analysis, solve conventional piezoelectric pottery list/twin lamella actuation element actual exert oneself lower, can't add high pressure and problem that the life-span is relatively shorter, must make the good conducting of realization between substrate electrod and the piezoelectric ceramic electrode layer.A solution of expecting the most easily is to adopt the bonding agent of high conductivity; But existing conducting resinl is to add metal dust in glue; Though improved electric conductivity; But also can cause the abominable problem of whole bonding state, be mainly reflected in the deterioration of the performance such as coefficient of elasticity and thermal coefficient of expansion of gluing effect, piezoelectric ceramic list twin lamella, can have a strong impact on the reliability and the useful life of element.For this reason, the present invention adopts following technical scheme:
A kind of piezoelectric ceramic actuator element; Comprise substrate with substrate electrod; And a slice or two positive and negative surfaces are attached with the piezoelectric ceramic piece of electrode layer respectively; Said piezoelectric ceramic piece and substrate electrod are bonding each other through stick, it is characterized in that, exist at least one place to be filled with the no stick zone of conductive materials on the bonding plane of piezoelectric ceramic piece and substrate electrod.
Adopt technique scheme; Can be under the situation that does not reduce bonding fastness; The conductive materials of filling in the no stick zone through bonding plane makes the electrode layer of substrate electrod and piezoelectric ceramic piece realize fully conducting; Thereby thereby avoided the peeling off on microcosmic of stick under the harmful effect that adhesive layer directly brings and the state that works long hours to separate effect to what caused a contact position, improve the service behaviour of element, increase the service life.And the present invention realizes that technology is simple, helps producing in enormous quantities making.
In the technique scheme, no stick zone preferably is positioned at the position near the stiff end of said Piezoelectric Ceramic element, thereby avoids the issuable harmful effect of actuation ends long-term action.Said conductive materials can be the gas, liquid, solid or the compounding substances of conduction, but in order to be beneficial to the simplification manufacture craft, preferably adopts conducting resinl or liquid metal.
For the ease of public understanding technical scheme of the present invention, come piezoelectric ceramic actuator element of the present invention and preparation method thereof is described with several concrete embodiment below.
Embodiment one,
Fig. 3 has shown a kind of piezo ceramic unimorph actuation element that adopts technical scheme of the present invention; Its structure is as shown in the figure; Comprise metal substrate 1 and piezoelectric ceramic piece 2, two surfaces of piezoelectric ceramic piece 2 have two electrode layers 21,22, and electrode layer 22 is bonding with the wherein one side of substrate 1 through adhesive layer 4; Exist a place not have stick zone 6 in the adhesive layer 4, be filled with conductive materials such as conducting resinl or liquid metal in the no stick zone 6.In the present embodiment, adhesive layer 4 uses the strong non-conductive organic gel of cementability, and the position in no stick zone 6 is near stiff end.Metal substrate 1 itself is simultaneously as substrate electrod, its with electrode layer 22 between realized good conducting through the conductive materials in the no stick regional 6.Above-mentioned piezo ceramic unimorph actuation element can obtain through following method manufacturing:
Steps A, on the electrode layer 22 of piezoelectric ceramic piece 2, apply one deck stick, forming places on electrode layer 22 surfaces during coating does not have stick zone 6; For example, can be through on Printing screen, reserving the figure of correspondence position, thus when reaching the printing stick, form the regional effect of no stick in electrode surface 22 corresponding positions of piezoelectric ceramic piece 2;
Step B, injection in no stick zone 6 (for example can use perhaps other automation equipment of devices such as syringe, dropper) an amount of conducting resinl or liquid metal conductive materials such as (for example mercury);
Step C, electrode layer 22 horizontal positioned up that piezoelectric ceramic piece 2 is scribbled stick cover substrate 1 on it, apply suitable pressure then, make substrate 1 and its piezoelectric ceramic piece 2 formation down than stable whole;
Step D, adopt heating or dry in the shade etc. suitably that mode is solidified it according to the characteristic of employed stick, so far promptly obtained the piezo ceramic unimorph actuation element of present embodiment.Conductive materials in the no stick zone 6 makes between metal substrate 1 and the electrode layer 22 has realized good conducting, and since no stick regional 6 for whole bonding plane, shared area is minimum, so adhesive effect is not had influence.
Embodiment two,
Fig. 4 has shown a kind of piezoelectric ceramic twin lamella actuation element that adopts technical scheme of the present invention; Its structure is as shown in the figure; Comprise substrate 1, piezoelectric ceramic piece 2, piezoelectric ceramic piece 3; Piezoelectric ceramic piece 2 and two surfaces of 3 have one deck electrode layer respectively: 21,22 and 31,32, and 1 of substrate is as non-conducting material, and its surface is covered with one deck copper film 11 as substrate electrod; The electrode layer 22 of piezoelectric ceramic piece 2 is through the surface adhesion of adhesive layer 4 with substrate 1, and the electrode layer 31 of piezoelectric ceramic piece 3 is through adhesive layer 5 another surface adhesion with metal substrate 1.As shown in the figure, there are no stick zone 6, no stick zone 7 in adhesive layer 4, the adhesive layer 5 respectively, be filled with conductive materials respectively in no stick zone 6 and the no stick regional 7.In the present embodiment, the strong non-conductive organic gel of adhesive layer 4,5 preferred cementabilities, its optimum seeking site is near the stiff end place, and no stick zone 6 can be the same or different with position, shape and the size in no stick zone 7.Substrate electrod 11 respectively conductive materials and the electrode layer 22 through filling in no stick zone 6, the no stick zone 7, realized good conducting between 31.Above-mentioned piezoelectric ceramic twin lamella actuation element can be made through following method and obtain:
Steps A, on the electrode layer 31 of the electrode layer 22 of piezoelectric ceramic piece 2, piezoelectric ceramic piece 3, apply one deck stick respectively, forming a place respectively on the surface of electrode layer 22, electrode layer 31 during coating does not have stick zone 6, no stick regional 7; For example, can be through on Printing screen, reserving the figure of correspondence position, thus when reaching the printing stick, form the regional effect of no stick in the electrode layer surface corresponding position of piezoelectric ceramic piece;
Step B, in the no stick zone 6,7 of two piezoelectric ceramic pieces, inject an amount of conductive materials respectively;
Step C, electrode layer 22 horizontal positioned up that piezoelectric ceramic piece 2 is scribbled stick cover substrate 1 on it, apply suitable pressure then, make substrate 1 and its piezoelectric ceramic piece 2 formation down than stable whole;
Step D, electrode layer 31 horizontal positioned up that piezoelectric ceramic piece 3 is scribbled stick; Make substrate 1 another side down; Substrate 1 is covered in the upper surface of piezoelectric ceramic piece 3, applies suitable pressure then, two piezoelectric ceramic pieces and substrate are formed than stable whole;
Step e, adopt heating or dry in the shade etc. suitably that mode is solidified it according to the characteristic of employed stick, so far promptly obtained the piezoelectric ceramic twin lamella actuation element of present embodiment.
Embodiment three,
Fig. 5 has shown a kind of piezo ceramic unimorph actuation element that adopts technical scheme of the present invention, and its structure is as shown in the figure, comprises metal substrate 1 and piezoelectric ceramic piece 2; Two surfaces of piezoelectric ceramic piece 2 have two electrode layers 21,22; Electrode layer 22 is bonding with the wherein one side of substrate 1 through adhesive layer 4, and the another side of substrate 1 is fixed with a cover layer 9, on substrate 1, has a through hole 8; There is a no stick zone 6 in the adhesive layer 3; The position of through hole 8, shape and size are identical with no stick zone 6, and no stick zone 6 has constituted an intercommunicating pore with through hole 8, is full of conductive materials in this intercommunicating pore.In the present embodiment, adhesive layer 4 uses the strong non-conductive organic gel of cementability, conductive materials preferred conduction glue or liquid metal in the intercommunicating pore, and the position of intercommunicating pore is near stiff end.Metal substrate 1 itself is simultaneously as substrate electrod, realized good conducting through the conductive materials in the intercommunicating pore between itself and the electrode layer 22.Above-mentioned piezo ceramic unimorph actuation element can obtain through following method manufacturing:
Steps A, on the electrode layer 22 of piezoelectric ceramic piece 2, apply the non-conductive organic stick 4 of one deck, forming places on electrode layer 22 surfaces during coating does not have stick zone 6; For example, can be through on Printing screen, reserving the figure of correspondence position, thus when reaching the printing stick, form the regional effect of no sticks in the electrode layer 22 surperficial corresponding positions of piezoelectric ceramic piece 2;
Step B, electrode surface 22 horizontal positioned up that piezoelectric ceramic piece 2 is scribbled stick; Metal substrate 1 is covered on it; Be provided with the through hole 8 that position, shape and a size with no stick zone 6 adapts on the metal substrate 1 in advance; Through hole 8 on the metal substrate 1 is aimed at the no stick zone 6 on electrode layer 22 surfaces, applied suitable pressure then, metal substrate 1 and the piezoelectric ceramic piece under it 2 are formed than stable whole;
Fill with conducting resinl or liquid metal conductive materials such as (for example mercury) in step C, the through hole on metal substrate 18;
Step D, generate a cover layer 9, for example, can adopt the mode that applies one deck packaging plastic, make the conductive materials of injection be packaged in through hole 8 at metal substrate 1 upper surface;
Step e, adopt heating or dry in the shade etc. suitably that mode is solidified stick according to the characteristic of employed stick, so far promptly obtained the piezo ceramic unimorph actuation element of present embodiment.No stick zone 6 through holes 8 with metal substrate 1 on electrode layer 22 surfaces have constituted intercommunicating pore; The conductive materials of wherein filling makes between metal substrate 1 and the electrode layer 22 has realized good conducting; And because intercommunicating pore is for bonding plane; Shared area is minimum, therefore adhesive effect is not had influence.
Embodiment four,
Fig. 6 has shown the another kind of piezo ceramic unimorph actuation element that adopts technical scheme of the present invention; Basic structure and embodiment three are basic identical; The difference part is that substrate 1 is non-conducting material, criticizes on its surface to have covered one deck silver slurry 11 as substrate electrod, and its structure is as shown in the figure.This element can adopt the manufacture method identical with embodiment one, repeats no more here.The conductive materials of filling in the intercommunicating pore makes between substrate electrod 11 and the electrode layer 22 and has realized good conducting.
Embodiment five,
Fig. 7 has shown a kind of piezoelectric ceramic twin lamella actuation element that adopts technical scheme of the present invention; Its structure is as shown in the figure; Comprise metal substrate 1, piezoelectric ceramic piece 2, piezoelectric ceramic piece 3, piezoelectric ceramic piece 2 and two surfaces of 3 have one deck electrode layer respectively: 21,22 and 31,32, and the electrode layer 22 of piezoelectric ceramic piece 2 is through the surface adhesion of adhesive layer 4 with substrate 1; The electrode layer 31 of piezoelectric ceramic piece 3 is through adhesive layer 5 another surface adhesion with metal substrate 1; Have a no stick zone 6,7 in adhesive layer 4, the adhesive layer 5 respectively, have a through hole 8 on the metal substrate 1, position, shape and the size of no stick zone 6, no stick zone 7 and through hole 8 are all identical; Thereby constitute an intercommunicating pore jointly, be full of conductive materials in this intercommunicating pore.In the present embodiment, adhesive layer 4,5 uses the strong non-conductive organic gel of cementability, conductive materials preferred conduction glue or liquid metal in the intercommunicating pore, and the position of intercommunicating pore is near stiff end.Metal substrate 1 itself is simultaneously as substrate electrod, itself and electrode layer 22, realized good conducting through the conductive materials in the intercommunicating pore between 31.Above-mentioned piezoelectric ceramic twin lamella actuation element can obtain through following method manufacturing:
Steps A, on the electrode layer 22 of piezoelectric ceramic piece 2, apply one deck stick, forming places on electrode layer 22 surfaces during coating does not have stick zone 6; For example, can be through on Printing screen, reserving the figure of correspondence position, thus when reaching the printing stick, form the regional effect of no sticks in the electrode layer 22 surperficial corresponding positions of piezoelectric ceramic piece 2;
Step B, electrode layer 22 horizontal positioned up that piezoelectric ceramic piece 2 is scribbled stick; Metal substrate 1 is covered on it; Position, shape and the big or small through hole 8 that adapts in being and not being stick zone 6 are set on the metal substrate 1 in advance; Through hole 8 on the metal substrate 1 is aimed at the no stick zone 6 on electrode layer 22 surfaces, applied suitable pressure then, metal substrate 1 and the piezoelectric ceramic piece under it 2 are formed than stable whole;
Fill with conducting resinl or liquid metal conductive materials such as (for example mercury) in step C, the through hole on metal substrate 1;
Step D, on electrode layer 31 surfaces of piezoelectric ceramic piece 3, apply one deck stick, utilize during coating in the steps A similar method electrode layer 31 surfaces form with metal substrate 1 on the no stick zone 7 that adapts of position, shape and the size of through hole 8; Make electrode layer 31 surfaces down; Piezoelectric ceramic piece 3 is covered in the upper surface of metal substrate 1; No stick zone 7 on the piezoelectric ceramic piece 3 is aimed at the through hole 8 on the metal substrate 1, applied suitable pressure then, two piezoelectric ceramic pieces 2,3 and metal substrate 1 are formed than stable whole;
Step e, adopt heating or dry in the shade etc. suitably that mode is solidified said stick according to the characteristic of employed stick, so far promptly obtained the piezoelectric ceramic twin lamella actuation element of present embodiment.The through hole of no stick zone on metal substrate 1 on electrode layer 22, electrode layer 31 surfaces constituted an intercommunicating pore; The conductive materials of wherein filling makes between metal substrate 1 and electrode layer 22, the electrode layer 31 and has realized good conducting; And because intercommunicating pore is for bonding plane; Shared area is minimum, therefore adhesive effect is not had influence, has guaranteed bonding fastness.
Embodiment six,
Fig. 8 has shown the another kind of piezoelectric ceramic twin lamella actuation element that adopts technical scheme of the present invention; Basic structure and embodiment five are basic identical; The difference part is that substrate 1 is non-conducting material, criticizes on its surface to have covered one deck silver slurry 11 as substrate electrod, and its structure is as shown in the figure.This element can adopt the manufacture method identical with embodiment five, repeats no more here.The conductive materials of filling in the intercommunicating pore makes between substrate electrod 11 and electrode layer 22, the electrode layer 31 and has realized good conducting.
In order to verify beneficial effect of the present invention, carried out following contrast test.
Make two piezoelectric ceramic twin lamella actuation elements respectively: 1# and 2#, wherein, 1# is for using the conventional 60-2 two line pressure electric separation faller gills of metal substrate; 2# is for adopting the 60-2 two line pressure electric separation faller gills of the embodiment of the invention five schemes.Test the exerting oneself of two samples, life-span, electric capacity and high voltage limit respectively under the same conditions.The method of testing of each parameter is following:
1, test is exerted oneself
With subjects by device shown in Figure 9 on test platform, use piezoelectric ceramics power supply load at sample lead-out wire two ends 50V or-50V voltage, carry out the collection that static state goes out force data through the high accuracy pull and push dynamometer at the force-detecting position place.
2, the test life-span
Subjects is pressed device shown in Figure 9 on test platform, use piezoelectric ceramics power supply to continue to produce 50V, 50Hz alternating voltage at sample lead-out wire two ends.When product occurs static or dynamically go out force data through the high accuracy pull and push dynamometer at the force-detecting position place being lower than 110mN, then think damage of product.
3, testing capacitor
Sample is unloaded, uses LCR directly to test at the exit of 60-2 two line pressure electric separation faller gills.
4, high voltage limit
Power apparatus is identical with testing out, and is unloaded at the force-detecting position place, uses piezoelectric ceramics power supply to load a constant voltage, and recession in 2 seconds removes power supply and testing capacitor, like electric capacity 50% above variable quantity is arranged, and then thinks high-voltage breakdown; As then confirming high voltage limit through continuous incremental voltage value less than 50% variable quantity.
Table 1
Annotate: Vo is the free state lower piezoelectric pottery puncture voltage of this thickness
The test result that finally obtains is as above shown in the table 1, and though by test result can very clearly find out sample of the present invention at electric capacity, exert oneself, bear high pressure and all be much better than conventional sample on the life-span.Technical scheme of the present invention is particularly suited for the application of pin-insertion type piezoelectric selection piece.
Claims (9)
1. piezoelectric ceramic actuator element; Comprise substrate with substrate electrod; And a slice or two positive and negative surfaces are attached with the piezoelectric ceramic piece of electrode layer respectively; Said piezoelectric ceramic piece and substrate electrod are bonding each other through stick, it is characterized in that, exist at least one place to be filled with the no stick zone of conductive materials on the bonding plane of piezoelectric ceramic piece and substrate electrod.
2. piezoelectric ceramic actuator element according to claim 1 is characterized in that said no stick zone is positioned at the position near the stiff end of said Piezoelectric Ceramic element.
3. piezoelectric ceramic actuator element according to claim 1 is characterized in that said conductive materials is conducting resinl or liquid metal.
4. piezoelectric ceramic actuator element according to claim 1; It is characterized in that; Said substrate is provided with the regional identical through hole of no stick on the bonding plane of quantity, position and size and said piezoelectric ceramic piece and substrate electrod; Through hole and corresponding no stick zone form intercommunicating pore, are full of conductive materials in the intercommunicating pore.
5. like the said piezoelectric ceramic actuator element of claim 4, it is characterized in that said piezoelectric ceramic piece is two, quantity, position and the size in the no stick zone on the bonding plane of two piezoelectric ceramic pieces and substrate electrod are all identical.
6. manufacture method of piezoelectric ceramic actuator element according to claim 1, said piezoelectric ceramic piece is a slice, it is characterized in that, may further comprise the steps:
Steps A, wherein apply one deck stick on the electrode layer of one side at said piezoelectric ceramic piece, forming at least one place in electrode layer surface during coating does not have the stick zone;
Step B, inject an amount of conductive materials in no stick zone;
Step C, above-mentioned piezoelectric ceramic piece is scribbled one of the stick horizontal positioned that faces up, substrate is covered on it, apply suitable pressure then, make the formation of substrate and the piezoelectric ceramic piece under it than stable whole;
Step D, said stick is solidified.
7. manufacture method of piezoelectric ceramic actuator element according to claim 1, said piezoelectric ceramic piece is two, it is characterized in that, may further comprise the steps:
Steps A, on the electrode layer of the wherein one side of two piezoelectric ceramic pieces, apply one deck stick respectively, forming at least one place in electrode layer surface during coating does not have the stick zone;
Step B, inject an amount of conductive materials in the no stick zone of two piezoelectric ceramic pieces respectively;
Step C, will be wherein a slice piezoelectric ceramic piece scribble one of the stick horizontal positioned that faces up, substrate is covered on it, apply suitable pressure then, make the formation of substrate and the piezoelectric ceramic piece under it than stable whole;
Step D, another sheet piezoelectric ceramic piece is scribbled one of the stick horizontal positioned that faces up; Make the substrate another side down; Substrate is covered in this piezoelectric ceramic piece upper surface, applies suitable pressure then, two piezoelectric ceramic pieces and substrate are formed than stable whole;
Step e, said stick is solidified.
8. the manufacture method like the said piezoelectric ceramic actuator element of claim 5 is characterized in that, may further comprise the steps:
Steps A, wherein apply one deck stick on the electrode layer of one side at said piezoelectric ceramic piece, forming at least one place in electrode layer surface during coating does not have the stick zone;
Step B, above-mentioned piezoelectric ceramic piece is scribbled one of the stick horizontal positioned that faces up; Substrate is covered on it; Be provided with quantity, position and the big or small through hole that adapts on the substrate in advance with said no stick zone; Make on-chip through hole and no stick regional alignment, apply suitable pressure then, substrate and the piezoelectric ceramic piece under it are formed than stable whole;
Step C, in on-chip through hole, fill with conductive materials;
Step D, generate a cover layer, make the conductive materials of injection be packaged in through hole at substrate upper surface;
Step e, said stick is solidified.
9. the manufacture method like the said piezoelectric ceramic actuator element of claim 6 is characterized in that, may further comprise the steps:
Steps A, wherein apply one deck stick on the electrode layer of one side at a slice piezoelectric ceramic piece, forming at least one place in electrode layer surface during coating does not have the stick zone;
Step B, above-mentioned piezoelectric ceramic piece is scribbled one of the stick horizontal positioned that faces up; Substrate is covered on it; Be provided with quantity, position and the big or small through hole that adapts on the substrate in advance with said no stick zone; Make on-chip through hole and no stick regional alignment, apply suitable pressure then, substrate and the piezoelectric ceramic piece under it are formed than stable whole;
Step C, in on-chip through hole, fill with conductive materials;
Step D, wherein apply one deck stick on the electrode layer of one side at another sheet piezoelectric ceramic piece, during coating electrode layer surface form with substrate on the no stick zone that adapts of quantity, position and the size of through hole; Order is coated with one of stick and faces down, and piezoelectric ceramic piece is covered in substrate upper surface, makes no stick zone and on-chip through-hole alignment on the piezoelectric ceramic piece, applies suitable pressure then, and two piezoelectric ceramic pieces and substrate are formed than stable whole;
Step e, said stick is solidified.
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| CN113323848A (en) * | 2021-06-02 | 2021-08-31 | 北京机械设备研究所 | Liquid metal driving device based on piezoelectric film, control method and manufacturing method |
| CN113541630A (en) * | 2020-04-21 | 2021-10-22 | 济南晶正电子科技有限公司 | Composite single crystal piezoelectric substrate and preparation method thereof |
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