CN102662548B - A kind of capacitance type touch-control panel - Google Patents
A kind of capacitance type touch-control panel Download PDFInfo
- Publication number
- CN102662548B CN102662548B CN201210105057.9A CN201210105057A CN102662548B CN 102662548 B CN102662548 B CN 102662548B CN 201210105057 A CN201210105057 A CN 201210105057A CN 102662548 B CN102662548 B CN 102662548B
- Authority
- CN
- China
- Prior art keywords
- ito
- layer
- metal wire
- conducting film
- insulation course
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Position Input By Displaying (AREA)
Abstract
The invention discloses a kind of capacitance type touch-control panel, the ITO inductive layer being wherein compound in transparency carrier lower surface comprises multiple ITO inductive layer, the periphery of ITO inductive layer lower surface is compounded with shielding layer, and the region of the non-crested of lower surface of ITO inductive layer is sensing area; Lower surface compound one insulation course of multiple ITO inductive layers in the same direction, wherein the party's each ITO inductive layer is upwards interconnected; Be compound in shielding layer is connected different directions ITO inductive layer with the conductive layer of insulation course lower surface, this conductive layer extends to the binding district of a certain edge formation for transmission signal of transparency carrier; The lower surface of conductive layer is fitted by an adhesive coating and a display panel.Described capacitance type touch-control panel is while the substrate saving the contact panel be laid in traditionally between cover plate and display panel, improve the adhesion of ITO inductive layer, product yield is improved, and is conducive to production control cost and time, is beneficial to the thin type design of electronic product.
Description
Technical field
The present invention relates to a kind of contact panel, particularly relate to a kind of assembling capacitance type touch-control panel on a display panel.
Background technology
Existing electronic product, comprise PC, mobile phone, cameras etc. all include a touching display screen, this display screen comprises a transparency carrier (Coverlens), display panel and the contact panel between both, and user can use the objects such as finger or pointer, touch panel is pressed, the content on screen is operated.
Fig. 1 shows the section of structure of touching display screen of the prior art, as shown in Figure 1, and compound one black matrix" district 116 around the lower surface of transparency carrier 110; Between transparent covering layer 115 is laid in 116 and lower surface, improve flatness; Touch sensitive layer 117 is compounded in transparent covering layer 115 lower surface, and this touch sensitive layer 117 can be a transparent electrode layer, also can be an ITO layer.Also can add a protective layer (not drawing in figure) in transparency carrier 110 with black matrix" district 116 in some embodiments to be used for preventing from disturbing.Trackpad is fit together by adhesive coating 118 and display panel 119.
Although above-mentioned electronic product saves material, simplify bonding process, because the laying of shielding layer is laid prior to inductive layer, in the touch sensitive layer 117 made, the adhesion of ITO is not high, causes product yield not high, therefore needs to be improved.
Summary of the invention
The object of the present invention is to provide one containing the capacitance type touch-control panel of capacitive touch control circuit, by providing a new process sequence, make ITO inductive layer direct combination in the lower surface of transparency carrier, improve the adhesion of ITO inductive layer, thus the yield of improving product, save production cost, be beneficial to the thin type design of electronic product.
For achieving the above object, the feature of described capacitance type touch-control panel is, comprises a transparency carrier, an ITO inductive layer, a shielding layer, an insulation course and a conductive layer; Wherein, described transparency carrier has the lower surface of a tangibly upper surface and a compound; The ITO inductive layer being compound in described transparency carrier lower surface comprises multiple ITO inductive layer, the periphery of described ITO inductive layer lower surface is compounded with described shielding layer, the region of the non-crested of lower surface of ITO inductive layer is sensing area, and the touching that sensing area is subject to transparency carrier upper surface produces capacity effect and exports induced signal; Lower surface compound one insulation course of multiple ITO inductive layers in the same direction, wherein the party's each ITO inductive layer is upwards interconnected; Be compound in described shielding layer is connected different directions ITO inductive layer with the conductive layer of insulation course lower surface, this conductive layer extends to the binding district of a certain edge formation for transmission signal of transparency carrier; Further, the lower surface of described conductive layer is fitted by an adhesive coating and a display panel.
Preferably, described conductive layer has metal wire or ITO conducting film; The ITO inductive layer of different directions is connected by the metal wire or ITO conducting film being laid in the insulation course lower surface in sensing area, and described metal wire or the ITO conducting film insulation course place in sensing area correspondingly forms metal and builds bridge or ITO bridge formation; Be positioned at a certain edge that the metal wire of shielding layer lower surface or the ITO conducting film via hole run through on shielding layer extend to transparency carrier and form binding district, with transmission signal.
Preferably, described conductive layer has metal wire or ITO conducting film; The ITO inductive layer of different directions is connected by the metal wire or ITO conducting film being laid in the insulation course lower surface in sensing area, and described metal wire or the ITO conducting film insulation course place in sensing area forms metal and builds bridge or ITO bridge formation; The conducting resinl via hole run through on shielding layer being positioned at shielding layer lower surface extends to the formation binding district, a certain edge of transparency carrier, with transmission signal.
Preferably, described conductive layer comprises metal wire or ITO conducting film; The ITO inductive layer of different directions is connected by the metal wire or ITO conducting film being laid in the insulation course lower surface in sensing area, and described metal wire or the ITO conducting film insulation course place in sensing area then forms metal and builds bridge or ITO bridge formation; Lay metal wire or ITO conducting film at shielding layer lower surface, one end of metal wire or ITO conducting film connects the ITO inductive layer near shielding layer, and the other end of metal wire or ITO conducting film extends to the formation binding district, a certain edge of transparency carrier, with transmission signal.
Preferably, the lower surface of described conductive layer is compounded with a protective clear layer, and described protective clear layer is fitted by an adhesive coating and display panel.
Beneficial effect of the present invention is, described capacitance type touch-control panel is while the substrate saving the contact panel be laid in traditionally between cover plate and display panel, ITO inductive layer directly contacts with transparency carrier, the adhesion of ITO inductive layer is promoted greatly, product yield is improved, be conducive to production control cost and time, be beneficial to the thin type design of electronic product.
Accompanying drawing explanation
Fig. 1 shows the section of structure of touching display screen of the prior art.
Fig. 2 to Fig. 5 is the processing procedure figure of first embodiment of the invention.Wherein,
Fig. 2 shows the syndeton sectional view of transparency carrier and ITO inductive layer in the first embodiment.
Fig. 3 shows the syndeton sectional view of transparency carrier in the first embodiment, ITO inductive layer and shielding layer.
Fig. 4 shows the syndeton sectional view of transparency carrier in the first embodiment, ITO inductive layer, shielding layer and insulation course.
Fig. 5 shows the syndeton sectional view of transparency carrier in the first embodiment, ITO inductive layer, shielding layer, insulation course and conductive layer.
Fig. 6 shows the section of structure of the first embodiment.
Fig. 7 shows the section of structure of the second embodiment.
Fig. 8 shows the section of structure of the 3rd embodiment.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be further described in detail:
Described capacitance type touch-control panel comprises transparency carrier 100, ITO inductive layer 101, shielding layer 102, insulation course 103 and a conductive layer 104.
Particularly, Fig. 2 to Fig. 6 shows processing procedure figure and the section of structure of the first embodiment of described capacitance type touch-control panel, and as shown in Figures 2 to 6, described transparency carrier 100 has the lower surface of a tangibly upper surface and a compound;
The ITO inductive layer 101 being compound in described transparency carrier 100 lower surface comprises multiple ITO inductive layer, the periphery of described ITO inductive layer 101 lower surface is compounded with described shielding layer 102, the region of the non-crested of lower surface of ITO inductive layer 101 is sensing area, and the touching that sensing area is subject to transparency carrier 100 upper surface produces capacity effect and exports induced signal;
Lower surface compound one insulation course 103 of multiple ITO inductive layers in the same direction, wherein the party's each ITO inductive layer is upwards interconnected;
Described conductive layer 104 is compound in the lower surface of shielding layer 102 and the lower surface of insulation course 103, and this conductive layer 104 has metal wire 104a; The ITO inductive layer of different directions is connected by the metal wire 104a being laid in insulation course 103 lower surface in sensing area, and insulation course 103 place of described metal wire 104a in sensing area correspondingly forms metal and build bridge; The metal wire 104a via hole 201 run through on shielding layer 102 being positioned at shielding layer 102 lower surface extends to the formation binding district, a certain edge of transparency carrier 100, with transmission signal.The metal wire 104a of above-mentioned formation conductive layer 104 is also interchangeable makes ITO material, as ITO conducting film, like this, the ITO inductive layer of different directions is connected by the ITO conducting film being laid in insulation course 103 lower surface in sensing area, and insulation course 103 place of described ITO conducting film in sensing area correspondingly forms ITO and build bridge; The ITO conducting film via hole 201 run through on shielding layer 102 being positioned at shielding layer 102 lower surface extends to the formation binding district, a certain edge of transparency carrier 100, with transmission signal;
The lower surface of described conductive layer 104 is fitted by an adhesive coating and a display panel 106.Preferably, the lower surface of described conductive layer 104 is compounded with a protective clear layer 105, and described protective clear layer 105 is fitted by an adhesive coating and display panel 106.
Described transparency carrier 100 (as shown in Figure 2), can be glass, glue shell etc., there is the lower surface of a upper surface that can touch and a compound, this transparency carrier 100 is through special processing, such as antireflection (AR) process, anti-dazzle (AG) process, anti-fingerprint (AS) process, antifog (AF) process etc., make substrate have in above-mentioned characteristic one or more.
Described ITO inductive layer 101 (as shown in Figure 3) is directly compound in the lower surface of transparency carrier 100 by coating process, adopt traditional coating, exposure, development, etching technique to be processed into.
Described shielding layer 102 (as shown in Figure 3), a black matrix" district or the coating having bridging effect, be compound in the lower surface of ITO inductive layer 101 and be in the periphery of transparency carrier 100, adopt traditional typography or the lower surface periphery compound one black matrix" coating at ITO inductive layer 101, this shielding layer 102 is positioned at the top of conductive layer 104, cause signal wire can not show surface in transparency carrier 100 outward, thus beautify the outward appearance of Trackpad.Wherein, sensing area is the mesozone beyond removing shielding layer 102 region.
Described insulation course 103, be laid in the lower surface of the ITO inductive layer of (such as Y-axis) in a direction, mutually overlapped by the ITO inductive layer of (such as X-axis) on other direction with metal wire 104a or ITO conducting film to facilitate, the ITO inductive layer wherein in this direction (such as Y-axis) is interconnected.
In sensing area, metal wire 104a or ITO conducting film (see Fig. 5) are by insulation course 103, the ITO inductive layer of (such as X-axis) on same direction is connected with each other, form metal to build bridge or ITO bridge formation at insulation course 103 place, wherein the composition of metal wire 104a is Mu/Al/Mu.As shown in Figure 5, shielded area lower surface lays by via hole 201 a certain edge that metal wire 104a or ITO conducting film extend to transparency carrier 100, and the ITO inductive layer in shielded area and being interconnected of the ITO inductive layer in sensing area utilize metal wire 104a or ITO conducting film to be come by via hole 201; Capacitive sensing signal is sent in extraneous processor by metal wire 104a or ITO conducting film.
Wherein, the laying mode being positioned at the conductive layer 104 of shielding layer 102 lower surface is both sides alternative expressions, also can be monolateral laying mode.
Described protective clear layer 105 (see Fig. 6) is one transparent, colourless, strong adhesion, photo-resistance material hard material, and display panel 106 fits together by an adhesive coating and described protective clear layer 105.This protective clear layer 105 also can omit, and directly uses adhesive coating (as OCA glue) and display panel 106 to fit together.
Said structure constitutes the first embodiment of the present invention, and the ITO inductive layer in sensing area is interconnected in one direction, other direction is built bridge by metal or the connection of ITO bridge formation; The ITO inductive layer of sensing area is communicated with by via hole 201 metal wire 104a or ITO conducting film with the ITO inductive layer of shielded area, and the formation binding district, a certain edge that shielded area laying metal wire 104a or ITO conducting film extend to transparency carrier 100 transmits signals in extraneous processor.When there being finger to touch at the upper surface of transparency carrier 100, ITO inductive layer 101 can produce capacity effect in the position of corresponding finger touch, and capacity effect signal to be sent in microprocessor to process through the signal wire at edge, reaches the effect of touch.
Fig. 7 shows the section of structure of the second embodiment of described capacitance type touch-control panel, and as shown in Figure 7, described transparency carrier 100 has the lower surface of a tangibly upper surface and a compound;
The ITO inductive layer 101 being compound in described transparency carrier 100 lower surface comprises multiple ITO inductive layer, the periphery of described ITO inductive layer 101 lower surface is compounded with described shielding layer 102, the region of the non-crested of lower surface of ITO inductive layer 101 is sensing area, and the touching that sensing area is subject to transparency carrier 100 upper surface produces capacity effect and exports induced signal;
Lower surface compound one insulation course 103 of multiple ITO inductive layers in the same direction, wherein the party's each ITO inductive layer is upwards interconnected;
Described conductive layer 104 is compound in the lower surface of shielding layer 102 and the lower surface of insulation course 103, and this conductive layer 104 has metal wire 104a; The ITO inductive layer of different directions is connected by the metal wire 104a being laid in insulation course 103 lower surface in sensing area, and insulation course 103 place of described metal wire 104a in sensing area correspondingly forms metal and build bridge; The conducting resinl 104b via hole 201 run through on shielding layer 102 being positioned at shielding layer 102 lower surface extends to the formation binding district, a certain edge of transparency carrier 100, with transmission signal.The metal wire 104a of above-mentioned formation conductive layer 104 is also interchangeable makes ITO material, as ITO conducting film, like this, the ITO inductive layer of different directions is connected by the ITO conducting film being laid in insulation course 103 lower surface in sensing area, and insulation course 103 place of described ITO conducting film in sensing area correspondingly forms ITO and build bridge; The conducting resinl 104b via hole 201 run through on shielding layer 102 being positioned at shielding layer 102 lower surface extends to the formation binding district, a certain edge of transparency carrier 100, with transmission signal;
The lower surface of described conductive layer 104 is fitted by an adhesive coating and a display panel 106.Preferably, the lower surface of described conductive layer 104 is compounded with a protective clear layer 105, and described protective clear layer 105 is fitted by an adhesive coating and display panel 106.
Described transparency carrier 100, can be glass, glue shell etc., have the lower surface of a upper surface that can touch and a compound.This transparency carrier 100 is through special processing, such as antireflection (AR) process, anti-dazzle (AG) processes, and anti-fingerprint (AS) processes, antifog (AF) process etc., make transparency carrier 100 have in above-mentioned characteristic one or more.
Described ITO inductive layer 101 is directly compound in the lower surface of transparency carrier 100 by coating process, adopt traditional coating, exposure, development, etching technique to be processed into.
Described shielding layer 102 is a black matrix" district or the coating having bridging effect, be compound in the lower surface of ITO inductive layer 101 and be in transparency carrier 100 periphery, adopt traditional typography or the lower surface periphery compound one black matrix" coating at ITO inductive layer 101, this shielding layer 102 is positioned at the top of conductive layer 104, cause signal wire can not show in transparency carrier 100 surface outward, thus beautify the outward appearance of Trackpad.Wherein, sensing area is the mesozone beyond removing shielding layer 102 region.
Described insulation course 103 is laid in the lower surface of the ITO inductive layer of (such as Y-axis) in a direction, mutually overlapped by the ITO inductive layer of (X-axis) on other direction with metal wire 104a or ITO conducting film to facilitate, the ITO inductive layer wherein in this direction (such as Y-axis) is interconnected.
In sensing area, metal wire 104a or ITO conducting film (see Fig. 7) are by insulation course 103, the ITO inductive layer of (X-axis) on same direction is connected with each other, form metal to build bridge or ITO bridge formation at insulation course 103 place, wherein the material of metal wire 104a is Mu/Al/Mu.As shown in Figure 7, being interconnected of the ITO inductive layer in the ITO inductive layer of shielded area and sensing area lays metal wire 104a by via hole 201 or ITO conducting film has come; Lay by via hole a certain edge that black conductive glue 104b (see Fig. 7) extends to transparency carrier 100 at the lower surface of shielding layer 102, capacitive sensing signal is sent in extraneous processor by conductive layer 104 simultaneously.
Wherein, the laying mode of the black conductive glue 104b of shielding layer 102 lower surface is both sides alternative expressions, also can be monolateral laying mode.
Described protective clear layer 105 is one transparent, colourless, and strong adhesion, the hard material of photo-resistance material, display panel 106 fits together by an adhesive coating and described protective clear layer 105.This protective clear layer 105 also can omit, and directly fits together with OCA glue and display panel 106.
Said structure constitutes the second embodiment of the present invention, it can thus be appreciated that: in sensing area ITO induction zone be in one direction be communicated with, other direction is built bridge by metal or ITO build bridge be interconnected; In sensing area, the ITO inductive layer of ITO inductive layer and shielded area also lays metal wire 104a by via hole 201 or ITO conducting film links together, and the lower surface of shielding layer 102 is laid conducting resinl 104b by via hole 201 and formed binding district to a certain edge of transparency carrier 100 and transmit signals in extraneous processor.When there being finger to touch at the upper surface of transparency carrier 100, ITO induction zone can produce capacity effect in the position of corresponding finger touch, and capacity effect signal to be sent in microprocessor to process through the signal line at edge, reaches the effect of touch.
Fig. 8 shows the section of structure of the 3rd embodiment of described capacitance type touch-control panel, and as shown in Figure 8, described transparency carrier 100 has the lower surface of a tangibly upper surface and a compound;
The ITO inductive layer 101 being compound in described transparency carrier 100 lower surface comprises multiple ITO inductive layer, the periphery of described ITO inductive layer 101 lower surface is compounded with described shielding layer 102, the region of the non-crested of lower surface of ITO inductive layer 101 is sensing area, and the touching that sensing area is subject to transparency carrier 100 upper surface produces capacity effect and exports induced signal;
Lower surface compound one insulation course 103 of multiple ITO inductive layers in the same direction, wherein the party's each ITO inductive layer is upwards interconnected;
Described conductive layer 104 is compound in the lower surface of shielding layer 102 and the lower surface of insulation course 103, and this conductive layer 104 has metal wire 104a; The ITO inductive layer of different directions is connected by the metal wire 104a being laid in insulation course 103 lower surface in sensing area, and insulation course 103 place of described metal wire 104a in sensing area correspondingly forms metal and build bridge; Lay metal wire 104a at shielding layer 102 lower surface, one end of metal wire 104a connects the ITO inductive layer near shielding layer 102, and the other end of metal wire 104a extends to the formation binding district, a certain edge of transparency carrier 100, with transmission signal.The metal wire 104a of above-mentioned formation conductive layer 104 is also interchangeable makes ITO material, as ITO conducting film, like this, the ITO inductive layer of different directions is connected by the ITO conducting film being laid in insulation course 103 lower surface in sensing area, and insulation course 103 place of described ITO conducting film in sensing area correspondingly forms ITO and build bridge; Lay ITO conducting film at shielding layer 102 lower surface, one end of ITO conducting film connects the ITO inductive layer near shielding layer 102, and the other end of ITO conducting film extends to the formation binding district, a certain edge of transparency carrier 100, with transmission signal;
The lower surface of described conductive layer 104 is fitted by an adhesive coating and a display panel 106.Preferably, the lower surface of described conductive layer 104 is compounded with a protective clear layer 105, and described protective clear layer 105 is fitted by an adhesive coating and display panel 106.
Described transparency carrier 100 (as shown in Figure 8), can be glass, glue shell etc., have the lower surface of a upper surface that can touch and a compound.This transparency carrier 100 is through special processing, such as antireflection (AR) process, anti-dazzle (AG) processes, and anti-fingerprint (AS) processes, antifog (AF) process etc., make transparency carrier 100 have in above-mentioned characteristic one or more.
Described ITO inductive layer 101 (as shown in Figure 8), is directly compound in the lower surface of transparency carrier 100 by coating process, adopt traditional coating, exposure, development, etching technique to be processed into.ITO inductive layer 101 periphery is shielding layer 102, and the touching that sensing area is subject to transparency carrier 100 upper surface produces capacity effect and exports induced signal.
Described shielding layer 102 (as shown in Figure 8), a black matrix" district or the coating having bridging effect, be compound in transparency carrier 100 lower surface periphery, adopt traditional typography or the lower surface periphery compound one black matrix" coating at transparency carrier 100, this shielding layer 102 is positioned at the top of conductive layer 104, cause edge signal line can not show in transparency carrier 100 surface outward, thus beautify the outward appearance of Trackpad.
Described insulation course 103 is laid in the lower surface of (such as Y-axis) ITO inductive layer in a direction, mutually overlapped by the ITO inductive layer of (X-axis) on other direction with metal wire 104a or ITO conducting film to facilitate, the ITO inductive layer wherein in this direction (such as Y-axis) is interconnected.
In sensing area, at insulation course 103 lower surface composite metal wire 104a or ITO conducting film (see Fig. 8), the ITO inductive layer of (such as X-axis) on same direction overlap joint is got up, form metal to build bridge or ITO bridge formation at insulation course 103 place, wherein the material of metal wire 104a is Mu/Al/Mu.Shielded area lower surface lays conductive layer 104, conductive layer 104 one end connects the ITO inductive layer of sensing area marginal portion, the other end of conductive layer 104 is then deployed to a certain edge of transparency carrier 100, and capacitive sensing signal is sent in extraneous processor by this conductive layer 104.The metal wire 104a of conductive layer 104 is very thin in addition, is black matrix" and is positioned at the top of conductive layer 104 due to shielding layer 102, so signal wire can not show in transparency carrier 100 surface, has beautified the outward appearance of Trackpad outward.
Wherein, it is both sides alternative expressions that the conductive layer 104 of shielding layer 102 lower surface lays mode, also can be monolateral laying mode.
Described protective clear layer 105 (see Fig. 8) is one transparent, colourless, and strong adhesion, the hard material of photo-resistance material, display panel 106 fits together by an adhesive coating and described protective clear layer 105.In addition, this protective clear layer 105 also can omit, and directly uses adhesive coating (as OCA glue) and display panel 106 to fit together.
Said structure constitutes the 3rd embodiment of the present invention, it can thus be appreciated that: the ITO inductive layer of sensing area is be communicated with in one direction, other direction is built bridge by metal or ITO builds bridge and is interconnected; Metal wire 104a or ITO conducting film link together by laying for the ITO inductive layer of sensing area and shielded area ITO inductive layer, lays a certain edge that metal wire 104a or ITO conducting film extend to transparency carrier 100 and form binding district and transmit signals in extraneous processor in shielded area.When there being finger to touch at the upper surface of substrate, ITO induction zone can produce capacity effect in the position of corresponding finger touch, and capacity effect signal to be sent in microprocessor to carry out position process through the conductive layer 104 at edge, reaches the effect of touch.
Be only preferred embodiment of the present invention in sum, be not used for limiting practical range of the present invention.Namely all equivalences done according to the content of the present patent application the scope of the claims change and modify, and all should belong to technology category of the present invention.
Claims (5)
1. a capacitance type touch-control panel, is characterized in that: comprise a transparency carrier, an ITO inductive layer, a shielding layer, an insulation course and a conductive layer; Wherein,
Described transparency carrier has the lower surface of a tangibly upper surface and a compound;
Described ITO inductive layer is compound in the lower surface of described transparency carrier by coating process, described ITO inductive layer comprises multiple ITO inductive layer, the periphery of described ITO inductive layer lower surface is compounded with described shielding layer, the region of the non-crested of lower surface of ITO inductive layer is sensing area, and the touching that sensing area is subject to transparency carrier upper surface produces capacity effect and exports induced signal;
Lower surface compound one insulation course of multiple ITO inductive layers in the same direction, wherein the party's each ITO inductive layer is upwards interconnected;
Be compound in described shielding layer is connected different directions ITO inductive layer with the conductive layer of insulation course lower surface, this conductive layer extends to the binding district of a certain edge formation for transmission signal of transparency carrier, and the party's described ITO inductive layer is upwards communicated with to get up by described conductive layer; Further,
The lower surface of described conductive layer is fitted by an adhesive coating and a display panel;
In described sensing area, the described ITO inductive layer on same direction is connected with each other by described insulation course by described conductive layer, is formed build bridge at described insulation course place.
2. capacitance type touch-control panel according to claim 1, is characterized in that: described conductive layer has metal wire or ITO conducting film; The ITO inductive layer of different directions is connected by the metal wire or ITO conducting film being laid in the insulation course lower surface in sensing area, and described metal wire or the ITO conducting film insulation course place in sensing area correspondingly forms metal and builds bridge or ITO bridge formation; Be positioned at a certain edge that the metal wire of shielding layer lower surface or the ITO conducting film via hole run through on shielding layer extend to transparency carrier and form binding district, with transmission signal.
3. capacitance type touch-control panel according to claim 1, is characterized in that: described conductive layer has metal wire or ITO conducting film; The ITO inductive layer of different directions is connected by the metal wire or ITO conducting film being laid in the insulation course lower surface in sensing area, and described metal wire or the ITO conducting film insulation course place in sensing area forms metal and builds bridge or ITO bridge formation; The conducting resinl via hole run through on shielding layer being positioned at shielding layer lower surface extends to the formation binding district, a certain edge of transparency carrier, with transmission signal.
4. capacitance type touch-control panel according to claim 1, is characterized in that: described conductive layer comprises metal wire or ITO conducting film; The ITO inductive layer of different directions is connected by the metal wire or ITO conducting film being laid in the insulation course lower surface in sensing area, and described metal wire or the ITO conducting film insulation course place in sensing area then forms metal and builds bridge or ITO bridge formation; Lay metal wire or ITO conducting film at shielding layer lower surface, one end of metal wire or ITO conducting film connects the ITO inductive layer near shielding layer, and the other end of metal wire or ITO conducting film extends to the formation binding district, a certain edge of transparency carrier, with transmission signal.
5. capacitance type touch-control panel as claimed in any of claims 1 to 4, is characterized in that: the lower surface of described conductive layer is compounded with a protective clear layer, and described protective clear layer is fitted by an adhesive coating and display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210105057.9A CN102662548B (en) | 2012-04-11 | 2012-04-11 | A kind of capacitance type touch-control panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210105057.9A CN102662548B (en) | 2012-04-11 | 2012-04-11 | A kind of capacitance type touch-control panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102662548A CN102662548A (en) | 2012-09-12 |
| CN102662548B true CN102662548B (en) | 2015-09-09 |
Family
ID=46772051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210105057.9A Expired - Fee Related CN102662548B (en) | 2012-04-11 | 2012-04-11 | A kind of capacitance type touch-control panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102662548B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103729078B (en) * | 2012-10-10 | 2018-08-07 | 宸鸿科技(厦门)有限公司 | Touch screen and its manufacturing method |
| CN103324342B (en) * | 2013-06-07 | 2016-08-17 | 业成光电（深圳）有限公司 | Touch control display apparatus |
| CN104503617B (en) * | 2014-12-26 | 2017-10-13 | 合肥鑫晟光电科技有限公司 | Border structure and its manufacture method, the touch-screen and display device of touch-screen |
| CN107368215B (en) * | 2017-06-01 | 2020-12-01 | 昆山龙腾光电股份有限公司 | Touch panel, preparation method thereof and display device |
| CN107632731B (en) | 2017-09-15 | 2021-01-26 | 京东方科技集团股份有限公司 | Touch panel manufacturing method and touch panel |
| CN107908304B (en) * | 2017-09-29 | 2021-06-01 | 信利（惠州）智能显示有限公司 | Wiring method of touch wire |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201174007Y (en) * | 2008-03-18 | 2008-12-31 | 宸鸿光电科技股份有限公司 | Capacitive touching control panel |
| CN101866248A (en) * | 2009-04-16 | 2010-10-20 | 义隆电子股份有限公司 | Two-layer circuit board structure for capacitive touch pad and manufacturing method thereof |
| CN101989160A (en) * | 2009-08-07 | 2011-03-23 | 铼宝科技股份有限公司 | Capacitive touch panel |
| CN202584085U (en) * | 2012-04-11 | 2012-12-05 | 长沙宇顺触控技术有限公司 | Capacitive touch control panel |
-
2012
- 2012-04-11 CN CN201210105057.9A patent/CN102662548B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201174007Y (en) * | 2008-03-18 | 2008-12-31 | 宸鸿光电科技股份有限公司 | Capacitive touching control panel |
| CN101866248A (en) * | 2009-04-16 | 2010-10-20 | 义隆电子股份有限公司 | Two-layer circuit board structure for capacitive touch pad and manufacturing method thereof |
| CN101989160A (en) * | 2009-08-07 | 2011-03-23 | 铼宝科技股份有限公司 | Capacitive touch panel |
| CN202584085U (en) * | 2012-04-11 | 2012-12-05 | 长沙宇顺触控技术有限公司 | Capacitive touch control panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102662548A (en) | 2012-09-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201174007Y (en) | Capacitive touching control panel | |
| JP3153971U (en) | Touchpad | |
| CN102662548B (en) | A kind of capacitance type touch-control panel | |
| CN102023770B (en) | Capacitive touch panel module and manufacturing method thereof | |
| US20180210575A1 (en) | Touch screen, method for manufacturing touch screen, and touch display device | |
| WO2014063580A1 (en) | Touch panel | |
| CN203414931U (en) | Touch control panel | |
| CN103294263B (en) | Touch display device and display device | |
| TWM348999U (en) | Capacitive touch panel | |
| CN203643976U (en) | Touch control panel | |
| TW201516779A (en) | Touch panel | |
| CN104656990B (en) | Touch module and its manufacture method | |
| CN103257748A (en) | Touch panel and manufacturing method thereof | |
| CN104699359A (en) | Self-adhesive flexible capacitive touch screen | |
| CN202453846U (en) | Touch device | |
| CN202033552U (en) | Touch type liquid crystal display screen | |
| CN102236482B (en) | Capacitive touch structure, manufacturing method thereof and touch equipment | |
| CN202584085U (en) | Capacitive touch control panel | |
| KR20150145211A (en) | Window For Touch Panel And Touch Window Having It | |
| CN103500043A (en) | Antifouling OGS touch screen needless of bridging and forming method thereof | |
| CN102750061A (en) | Capacitive touch screen based on carbon nanotube sensor | |
| CN204360348U (en) | Contact panel | |
| CN204155249U (en) | Capacitive touch screen | |
| TWI531945B (en) | Touch display device and touch device | |
| CN204203916U (en) | Cover sheet and contact panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150909 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |