CN102661756B - Positioning and pressurizing device of ultrasonic sensor - Google Patents
Positioning and pressurizing device of ultrasonic sensor Download PDFInfo
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- CN102661756B CN102661756B CN201210156659.7A CN201210156659A CN102661756B CN 102661756 B CN102661756 B CN 102661756B CN 201210156659 A CN201210156659 A CN 201210156659A CN 102661756 B CN102661756 B CN 102661756B
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Abstract
The invention discloses a positioning and pressurizing device of an ultrasonic sensor. An upright post is arranged on a base, a sliding groove is arranged on the upright post, a pressure device which can move along the sliding groove is connected in the sliding groove, the pressure device comprises a pressurizing device and a controller, a pressure rod is arranged on the pressurizing device, a positioning tooling is fixed on the lower end surface of the pressurizing device, the positioning tooling comprises a positioning housing, a cavity accommodating the ultrasonic sensor is arranged on the positioning housing, an axial positioning rod is arranged in the cavity, an annular cavity matched with a metal housing of the ultrasonic sensor is formed between the peripheral surface of the positioning rod and the inner wall surface of the positioning housing, a positioning groove is arranged on the axial end surface of the positioning rod, an axial through hole is formed on the positioning rod, and the pressure rod on the pressurizing device extends into the through hole. The positioning and pressurizing device disclosed by the invention can enable the centers of a piezoelectric ceramic plate which is press-mounted, a matching layer and the metal housing to be arranged on the same straight line and ensure that the ultrasonic sensor has proper sensitivity.
Description
Technical field
The present invention relates to ultrasonic sensor technical field, be specifically related to a kind of location pressuring mechanism of ultrasonic sensor.
Background technology
With reference to Fig. 1, it is a kind of 300KHz high frequency ultrasound wave sensor, formed by metal shell 1, piezoelectric ceramic piece 2, matching layer 3 and pcb board 4 etc., by bonding to piezoelectric ceramic piece 2 and matching layer 3, again by bonding to matching layer 3 and metal shell 1, pcb board 4 is bonded on metal shell 1, positive signal 5 lines, negative signal line 6 connecting PCB boards 4 and piezoelectric ceramic piece 2.
Because high-frequency ultrasonic sensor application requires very high to its precision performance, and present stage is all the most original manually assembling, not only efficiency is low for this assembling mode, and in assembling process, when manually piezoelectric ceramic piece 2 being bonded on matching layer 3, the axle center that cannot guarantee piezoelectric ceramic piece 2 and matching layer 3 due to artificial origin is located along the same line, and causes piezoelectric ceramic piece 2 and matching layer 3 bias.And, between piezoelectric ceramic piece 2 and metal shell 1, form resonator cavity 7, in the time of working sensor, piezoelectric ceramic piece 2 vibrates, and resonator cavity produces resonance.Also eccentric when metal shell 1 is bonded on matching layer 3, cause the center in piezoelectric ceramic piece 2 off-resonance chambeies 7.Because above factor exists, after sensor switches on power, occur that piezoelectric ceramic piece 2 vibrates self unbalanced, and cannot produce resonance with resonator cavity, cause signal attenuation, transducer sensitivity reduces.
Summary of the invention
For above-mentioned technical matters, the object of this invention is to provide a kind of location pressuring mechanism of ultrasonic sensor, the present invention can make the center of the piezoelectric ceramic piece that press-fited and matching layer and metal shell on same straight line, guarantees to make ultrasonic sensor possess due sensitivity.
The technical scheme that realizes the object of the invention is as follows:
The location pressuring mechanism of ultrasonic sensor, comprise base, base is provided with column, this column is provided with a chute, in chute, connecting one can be along the pressure apparatus of chute displacement, pressure apparatus is made up of pressue device and controller, pressue device is provided with press rods, on pressue device lower surface, fix a positioning tool, this positioning tool comprises a positioning housing, on positioning housing, there is the cavity that holds ultrasonic sensor, in this cavity, be provided with axial backstay, between the side face of backstay and the internal face of positioning housing, form a ring cavity coordinating with the metal shell of ultrasonic sensor, the axial end of described backstay is provided with locating slot, backstay is provided with axial through hole, press rods on pressue device extend in this through hole.
Adopt such scheme, in the time that needs press-fit sensor, sensor is placed in the groove on base, press the button on controller, the driven by motor bolt rotary of controller, thereby make connecting link to bottom offset, connecting link drives pressue device to bottom offset, pressue device is in the process to bottom offset, and the metal shell of ultrasonic sensor enters into the ring cavity on positioning housing step by step, is slidably matched with ring cavity, like this, by the side wall surface effect of ring cavity, make metal shell obtain location, can displacement.When positioning housing moves down when putting in place, because backstay is to be arranged in cavity on positioning housing, therefore backstay also puts in place thereupon, the piezoelectric ceramic piece of ultrasonic sensor is absorbed in the locating slot on backstay, the bar location thereby piezoelectric ceramic piece is positioned, like this, make piezoelectric ceramic piece, the axle center of matching layer and metal shell is located along the same line, simultaneously because the press rods on pressue device is to be arranged in through hole, press rods is when positioning housing puts in place, piezoelectric ceramic piece is pressed, thereby make piezoelectric ceramic piece, between matching layer and metal shell, obtain required pressure, three is bonded as one under glue effect, avoid the bonding unreliable sensor performance that affects, thereby improve sensor sensitivity with and impedance operator.The location pressuring mechanism of this scheme is fixed, and locating device entirety moves down the bonding parts of sensor is exerted pressure.
Another object of the present invention is to provide a kind of location pressuring mechanism of ultrasonic sensor, this location pressuring mechanism can make the center of the piezoelectric ceramic piece that press-fited and matching layer and metal shell equally on same straight line, guarantees to make ultrasonic sensor possess due sensitivity.
The location pressuring mechanism of ultrasonic sensor, comprise base, base is provided with column, this column is provided with a chute, in chute, connecting one can be along the pressure apparatus of chute displacement, pressure apparatus is made up of the first cylinder and controller, on the lower surface of the first cylinder, fix a positioning tool, this positioning tool comprises a positioning housing, on positioning housing, there is the cavity that holds ultrasonic sensor, in this cavity, be provided with axial backstay, between the side face of backstay and the internal face of positioning housing, form a ring cavity coordinating with the metal shell of ultrasonic sensor, the axial end of described backstay is provided with locating slot, backstay is provided with axial through hole, the piston rod of the first cylinder extend in this through hole.
Adopt such scheme, in the time that needs press-fit sensor, sensor has been placed in the groove on base, press the button on controller, controller makes connecting link to bottom offset, and connecting link drives the first cylinder to bottom offset, and the first cylinder is in the process to bottom offset, the metal shell of ultrasonic sensor enters into the ring cavity on positioning housing step by step, be slidably matched with ring cavity, like this, by the side wall surface effect of ring cavity, make metal shell obtain location, can displacement.When positioning housing moves down when putting in place, because backstay is to be arranged in cavity on positioning housing, therefore backstay also puts in place thereupon, the piezoelectric ceramic piece of ultrasonic sensor is absorbed in the locating slot on backstay, the bar location thereby piezoelectric ceramic piece is positioned, like this, the axle center of piezoelectric ceramic piece, matching layer and metal shell is located along the same line.Make piston rod on the first cylinder to bottom offset by controller, piezoelectric ceramic piece is pressed, thereby make to obtain required pressure between piezoelectric ceramic piece, matching layer and metal shell, three is bonded as one under glue effect.The location pressuring mechanism of this scheme is movable, and the piston rod of the first cylinder can free-extension, thereby when workpiece is press-fited, imposes required pressure.
Accompanying drawing explanation
Fig. 1 is the structural representation of this existing ultrasonic sensor;
Fig. 2 is the three-dimensional structure diagram of the first location pressuring mechanism of the present invention;
Fig. 3 is the sectional structure chart of the first location pressuring mechanism;
Fig. 4 is the circuit block diagram of the first controller;
Fig. 5 is the three-dimensional structure diagram of the second location pressuring mechanism of the present invention;
Fig. 6 is the sectional structure chart of the second location pressuring mechanism;
Fig. 7 is the circuit block diagram of the second controller;
Fig. 8 is the impedance operator schematic diagram after press-fiting after adopting location pressuring mechanism of the present invention to sensor;
Fig. 9 is the sensitivity schematic diagram after press-fiting after adopting location pressuring mechanism of the present invention to sensor;
Embodiment
Embodiment one
With reference to Fig. 2 to Fig. 4, the location pressuring mechanism of ultrasonic sensor of the present invention, comprises base 10, and base is provided with column 11.Base 10 and column 11 are rectangular parallelepiped, and base 10 upper surfaces are provided with groove 10a, and the center of the through hole on center and the backstay of this groove is on same straight line.Column 11 is provided with a chute, and in chute, connecting one can, along the pressure apparatus of chute displacement, be provided with screw rod in described chute.Pressure apparatus is made up of pressue device 12 and controller 13.Pressue device 12 is a discoid body, and pressue device 12 is provided with connecting link 14, and connecting link 14 is positioned on the upper surface of pressue device, and one end of this connecting link is provided with threaded hole, and connecting link 14 is connected with the screw flight in chute by threaded hole.Controller 13 comprises button 130, microcontroller 131, amplifier 132, motor 133.Button 130 is connected to the input end of microcontroller 131, and button 130 makes for sending the signal that moves or move down on pressue device 12, and one end of amplifier 132 connects the output terminal of microcontroller 131, microcontroller.The other end of amplifier is connected with motor, and the signal that amplifier 132 is exported microcontroller 131 amplifies, and motor can be worked.Described screw rod is connected in the output terminal of motor, and electric machine rotation drives bolt rotary, and the screw body forming by screw rod and connecting link 14 drives pressue device 12 upper and lower displacements.Pressue device 12 is provided with press rods 15, and press rods 15 is positioned at the lower surface of pressue device 12.On pressue device lower surface, fix a positioning tool, this positioning tool comprises a positioning housing 16, on positioning housing, there is the cavity that holds ultrasonic sensor, in this cavity, be provided with axial backstay 17, between the side face of backstay and the internal face of positioning housing, form a ring cavity 18 coordinating with the metal shell of ultrasonic sensor, the axial end of described backstay 17 is provided with locating slot 19, backstay is provided with axial through hole 20, and the press rods 15 on pressue device extend in this through hole.
For the mode that makes pressue device upper and lower displacement, also can adopt by the mode of control cylinder makes pressue device along chute upper and lower displacement, concrete structure is: described pressue device 12 is provided with connecting link, this connecting link is slidably fitted in chute, connecting link is connected with the piston rod of a cylinder, and this cylinder is connected with microcontroller by solenoid valve.The switch of controller control solenoid valve, makes the gas in cylinder switch in the above and below of piston, thereby the connecting link on the piston rod of cylinder drive pressue device is along chute upper and lower displacement.
Embodiment two
With reference to Fig. 5 to Fig. 7, the location pressuring mechanism of another kind of ultrasonic sensor of the present invention, comprises base 30, base is provided with column 31, base and column are rectangular parallelepiped, and base upper surface is provided with groove, and the center of the through hole on center and the backstay of this groove is on same straight line.Column 31 is provided with a chute, and in chute, connecting one can be along the pressure apparatus of chute displacement.Pressure apparatus is made up of the first cylinder 32 and controller 33, in chute, be provided with screw rod, the first cylinder of described pressure apparatus is provided with connecting link 320, one end of this connecting link 320 is provided with threaded hole, connecting link is connected with the screw flight in chute by threaded hole, connecting link 320 forms screw body with screw rod, drives connecting link 320 upper and lower displacements by bolt rotary, thereby drives the first cylinder 32 upper and lower displacements.Controller comprises the first button 34, the second button 35, microcontroller 36, amplifier 37, motor 38 and reversing solenoid valve 39, the first button 34 is connected to the input end of microcontroller 36 with the second button 35, one end of amplifier 37 is connected the output terminal of microcontroller 36, and microcontroller 36 is single-chip microcomputer.The other end of amplifier 37 is connected with motor 38, and described screw rod is connected in the output terminal of motor 38, and motor 38 drives bolt rotary.Reversing solenoid valve 39 is connected in the output terminal of microcontroller 36, and the gas of controlling in the first cylinder 32 by reversing solenoid valve 39 switches in the above and below of cylinder cylinder piston, and the piston of the first cylinder also forms corresponding upper and lower displacement state.On the lower surface of the first cylinder 32, fix a positioning tool, this positioning tool comprises a positioning housing 40, on positioning housing 40, there is the cavity that holds ultrasonic sensor, in this cavity, be provided with axial backstay 41, between the side face of backstay and the internal face of positioning housing, form a ring cavity 42 coordinating with the metal shell of ultrasonic sensor, the axial end of described backstay is provided with locating slot 43, the piston rod 45 that backstay is provided with axial through hole 44, the first cylinders extend in this through hole.
In this enforcement, for the mode that makes the first cylinder upper and lower displacement, also can adopt the mode by controlling another the second cylinder to make cylinder along chute upper and lower displacement, concrete structure is: described controller comprises the first button, the second button, microcontroller, the first solenoid valve, the second solenoid valve, the first button and the second button are connected to the input end of microcontroller, the output terminal that is connected respectively microcontroller of the first solenoid valve and the second solenoid valve, the first cylinder is connected with the first solenoid valve, the second cylinder is connected with the second solenoid valve, the cylinder of described pressure apparatus is provided with connecting link, this connecting link is slidably fitted in chute, connecting link is connected with the piston rod of second cylinder.The switch of controller control the first solenoid valve.
Gas in the second cylinder is switched in the above and below of piston, thereby the piston rod band of the second cylinder is dynamically connected, the connecting link of cylinder is along chute upper and lower displacement.
With reference to Fig. 8 and Fig. 9, after adopting location pressuring mechanism of the present invention to press-fit sensor, the sensitivity of sensor with and impedance operator be improved.
Claims (10)
1. the location pressuring mechanism of ultrasonic sensor, it is characterized in that, comprise base, base is provided with column, this column is provided with a chute, in chute, connecting one can be along the pressure apparatus of chute displacement, pressure apparatus is made up of pressue device and controller, pressue device is provided with press rods, on pressue device lower surface, fix a positioning tool, this positioning tool comprises a positioning housing, on positioning housing, there is the cavity that holds ultrasonic sensor, in this cavity, be provided with axial backstay, between the side face of backstay and the internal face of positioning housing, form a ring cavity coordinating with the metal shell of ultrasonic sensor, the axial end of described backstay is provided with locating slot, backstay is provided with axial through hole, press rods on pressue device extend in this through hole.
2. the location pressuring mechanism of ultrasonic sensor according to claim 1, it is characterized in that, described controller comprises button, microcontroller, amplifier, motor, button is connected to the input end of microcontroller, one end of amplifier connects the output terminal of microcontroller, the other end of amplifier is connected with motor, in described chute, be provided with screw rod, described pressue device is provided with connecting link, one end of this connecting link is provided with threaded hole, connecting link is connected with the screw flight in chute by threaded hole, and described screw rod is connected in the output terminal of motor.
3. the location pressuring mechanism of ultrasonic sensor according to claim 1, it is characterized in that, described controller comprises button, microcontroller, described pressue device is provided with connecting link, this connecting link is slidably fitted in chute, connecting link is connected with the piston rod of a cylinder, and this cylinder is connected with microcontroller by solenoid valve.
4. the location pressuring mechanism of ultrasonic sensor according to claim 2, is characterized in that, described microcontroller is single-chip microcomputer.
5. the location pressuring mechanism of ultrasonic sensor according to claim 1, is characterized in that, described base upper surface is provided with groove, and the center of the through hole on center and the backstay of this groove is on same straight line.
6. the location pressuring mechanism of ultrasonic sensor, it is characterized in that, comprise base, base is provided with column, this column is provided with a chute, in chute, connecting one can be along the pressure apparatus of chute displacement, pressure apparatus is made up of the first cylinder and controller, on the lower surface of the first cylinder, fix a positioning tool, this positioning tool comprises a positioning housing, on positioning housing, there is the cavity that holds ultrasonic sensor, in this cavity, be provided with axial backstay, between the side face of backstay and the internal face of positioning housing, form a ring cavity coordinating with the metal shell of ultrasonic sensor, the axial end of described backstay is provided with locating slot, backstay is provided with axial through hole, the piston rod of the first cylinder extend in this through hole.
7. the location pressuring mechanism of ultrasonic sensor according to claim 6, it is characterized in that, described controller comprises the first button, the second button, microcontroller, amplifier, motor and reversing solenoid valve, the first button and the second button are connected to the input end of microcontroller, one end of amplifier connects the output terminal of microcontroller, the other end of amplifier is connected with motor, reversing solenoid valve is connected in the output terminal of microcontroller, in described chute, be provided with screw rod, the first cylinder of described pressure apparatus is provided with connecting link, one end of this connecting link is provided with threaded hole, connecting link is connected with the screw flight in chute by threaded hole, described screw rod is connected in the output terminal of motor.
8. the location pressuring mechanism of ultrasonic sensor according to claim 6, it is characterized in that, described controller comprises the first button, the second button, microcontroller, the first solenoid valve, the second solenoid valve, the first button and the second button are connected to the input end of microcontroller, the first solenoid valve and the second solenoid valve are connected respectively the output terminal of microcontroller, the first cylinder is connected with the first solenoid valve, the second cylinder is connected with the second solenoid valve, the cylinder of described pressure apparatus is provided with connecting link, this connecting link is slidably fitted in chute, connecting link is connected with the piston rod of second cylinder.
9. the location pressuring mechanism of ultrasonic sensor according to claim 7, is characterized in that, described microcontroller is single-chip microcomputer.
10. the location pressuring mechanism of ultrasonic sensor according to claim 6, is characterized in that, described base upper surface is provided with groove, and the center of the through hole on center and the backstay of this groove is on same straight line.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210156659.7A CN102661756B (en) | 2012-05-18 | 2012-05-18 | Positioning and pressurizing device of ultrasonic sensor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210156659.7A CN102661756B (en) | 2012-05-18 | 2012-05-18 | Positioning and pressurizing device of ultrasonic sensor |
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| CN102661756A CN102661756A (en) | 2012-09-12 |
| CN102661756B true CN102661756B (en) | 2014-06-11 |
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| CN201210156659.7A Active CN102661756B (en) | 2012-05-18 | 2012-05-18 | Positioning and pressurizing device of ultrasonic sensor |
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| CN108296154B (en) * | 2017-08-07 | 2023-12-05 | 雷索智能科技(苏州)有限公司 | Ultrasonic vibration mechanism and ultrasonic vibration device |
| CN108953954B (en) * | 2018-08-28 | 2024-02-23 | 南通理工学院 | Recorder for computer graphic image processing |
| CN110553675B (en) * | 2019-09-19 | 2021-03-30 | 嘉兴学院 | Positioning and pressurizing device of ultrasonic sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5025790A (en) * | 1989-05-16 | 1991-06-25 | Hewlett-Packard Company | Graded frequency sensors |
| CN101421591A (en) * | 2006-02-13 | 2009-04-29 | 霍尼韦尔国际公司 | Surface acoustic wave packages and methods of forming same |
| CN202196077U (en) * | 2011-07-19 | 2012-04-18 | 江苏物联网研究发展中心 | High precision ultrasonic sensor |
| CN202630977U (en) * | 2012-05-18 | 2012-12-26 | 常州波速传感器有限公司 | Positioning and pressurizing device for ultrasonic sensor |
-
2012
- 2012-05-18 CN CN201210156659.7A patent/CN102661756B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5025790A (en) * | 1989-05-16 | 1991-06-25 | Hewlett-Packard Company | Graded frequency sensors |
| CN101421591A (en) * | 2006-02-13 | 2009-04-29 | 霍尼韦尔国际公司 | Surface acoustic wave packages and methods of forming same |
| CN202196077U (en) * | 2011-07-19 | 2012-04-18 | 江苏物联网研究发展中心 | High precision ultrasonic sensor |
| CN202630977U (en) * | 2012-05-18 | 2012-12-26 | 常州波速传感器有限公司 | Positioning and pressurizing device for ultrasonic sensor |
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Address after: No.39 Xinggang Road, Zhonglou District, Changzhou City, Jiangsu Province Patentee after: Jiangsu wave speed sensor Co., Ltd Address before: 213022 No. 199 west the Yellow River Road, Xinbei District, Jiangsu, Changzhou Patentee before: BESTAR SENSORTECH Co.,Ltd. |
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