CN102650827B - Photosensitve resin composition and apply its liquid crystal display - Google Patents
Photosensitve resin composition and apply its liquid crystal display Download PDFInfo
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Abstract
The invention discloses a kind of Photosensitve resin composition and using its liquid crystal display, it is related to the manufacture field of liquid crystal display, the surface smoothness and adhesive force for solving existing Photosensitve resin composition are poor, the problem for causing the display performance of liquid crystal display impacted.Photosensitve resin composition provided in an embodiment of the present invention, as a result of the adhesion promoter that percentage by weight is 0.005%~10%, and the adhesion promoter is the combination of silane coupler and acid esters adhesion promoter, so that the adhesion performance of said composition is lifted, and, as a result of the moistening flatting agent that percentage by weight is 0.01%~2.5% so that the surface smoothness performance of said composition is lifted.Meanwhile, Photosensitve resin composition provided in an embodiment of the present invention also has the advantages that light sensitivity is high, film uniformity is good, mechanical performance and good mechanical performance, mainly for the manufacture of liquid crystal display.
Description
Technical field
The present invention relates to the manufacture field of liquid crystal display, more particularly to Photosensitve resin composition and apply its liquid crystal
Show device.
Background technology
The structure of liquid crystal display is in colored filter substrate and thin film transistor (TFT)（Thin Film Transistor,
TFT）Filling liquid crystal material in the gap of 1-10 μm of the opposed formation of substrate, then with encapsulants such as epoxy resin by its periphery
It is sealed to form, therefore the uniformity of cel-gap is also one of important performance of influence liquid crystal display.To ensure liquid crystal cell
The uniformity in gap, lays chock insulator matter (Spacer) typically in cel-gap.Prepare in recent years the material of chock insulator matter by
Glass, plastics gradually develop to Photosensitve resin composition.
In addition, with the rapid popularization of colour liquid crystal display device, requirement of the people to liquid crystal display color displays is not yet
It is disconnected to improve.While people pursue color reprodubility and contrast high, the visible angle of liquid crystal display also becomes people
Select a Key Performance Indicator of liquid crystal display.To improve the visible angle of liquid crystal display, IPS is mainly used at present
（In-Plane Switching, plane conversion）、FFS（Fringe Field Switching, fringe field switching technology）And
MVA（Multi-Domain Vertical Alignment, pixel segmentation vertical orientation）Technology, wherein, needed in MVA technologies
Protrusion is formed on panel, it makes the liquid crystal molecule in same pixel region obtain multiple orientations as zone restriction devices
Direction, so as to improve the visible angle of liquid crystal display.At present, use Photosensitve resin composition the material for preparing protrusion more.
During above-mentioned chock insulator matter and protrusion is prepared using Photosensitve resin composition, inventor has found existing photosensitive
The surface smoothness and adhesive force of resin combination are poor, so as to have impact on the display performance of liquid crystal display.
The content of the invention
Embodiments of the invention provide a kind of Photosensitve resin composition and apply its liquid crystal display, the photosensitive resin group
Compound has preferable surface smoothness and adhesive force.
To reach above-mentioned purpose, embodiments of the invention are adopted the following technical scheme that：
A kind of Photosensitve resin composition, including：Alkali soluble resin, percentage by weight is 8%~45%；Ethene is unsaturated
Monomer, percentage by weight is 5%~30%；Light trigger, percentage by weight is 0.05%~3.5%；Adhesion promoter, is silicon
The combination of alkane coupling agent and acid esters adhesion promoter, the percentage by weight of the adhesion promoter for 0.005%~
10%；Solvent, percentage by weight is 15%~75%；Moistening flatting agent, percentage by weight is 0.01%~2.5%；Additive,
Percentage by weight is 0%~10%.
A kind of liquid crystal display, including the component being made up of above-mentioned Photosensitve resin composition.
Photosensitve resin composition provided in an embodiment of the present invention and application its liquid crystal display in, as a result of weight
Percentage is 0.005%~10% adhesion promoter, and the adhesion promoter is silane coupler and acid esters attachment
The combination of power accelerator so that the adhesion performance of said composition is lifted；It is 0.01% as a result of percentage by weight
~2.5% moistening flatting agent so that the surface smoothness performance of said composition is lifted.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
Other accompanying drawings are obtained with according to these accompanying drawings.
Fig. 1 is each composition and percentage by weight list in the Photosensitve resin composition of the embodiment of the present invention.
Specific embodiment
Embodiments of the invention provide a kind of Photosensitve resin composition, including：Alkali soluble resin, percentage by weight is 8%
~45%；Ethylene unsaturated monomer, percentage by weight is 5%~30%；Light trigger, percentage by weight be 0.05%~
3.5%；Adhesion promoter, is the combination of silane coupler and acid esters adhesion promoter, the adhesion promoter
Percentage by weight be 0.005%~10%；Solvent, percentage by weight is 15%~75%；Moistening flatting agent, percentage by weight is
0.01%~2.5%；Additive, percentage by weight is 0%~10%.
Embodiments of the invention provide a kind of liquid crystal display again, including the group being made up of above-mentioned Photosensitve resin composition
Part.
Photosensitve resin composition provided in an embodiment of the present invention and application its liquid crystal display in, as a result of weight
Percentage is 0.005%~10% adhesion promoter, and the adhesion promoter is silane coupler and acid esters attachment
The combination of power accelerator so that the adhesion performance of said composition is lifted；It is 0.01% as a result of percentage by weight
~2.5% moistening flatting agent so that the surface smoothness performance of said composition is lifted.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
The composition and percentage by weight of the Photosensitve resin composition of the embodiment of the present invention as shown in figure 1, including：The solvable tree of alkali
Fat A, percentage by weight is 8%~45%；Ethylene unsaturated monomer, percentage by weight is 5%~30%；Light trigger, weight hundred
Divide than being 0.05%~3.5%；Adhesion promoter, is the combination of silane coupler and acid esters adhesion promoter, described
The percentage by weight of adhesion promoter is 0.005~10%；Solvent, percentage by weight is 15%~75%；Moistening flatting agent,
Percentage by weight is 0.01%~2.5%；Additive, percentage by weight is 0~10%, and the Photosensitve resin composition has light sensitivity
It is high, the features such as filming performance is excellent.
Wherein, the percentage by weight of alkali soluble resin is preferably 8%~40%；The percentage by weight of ethylene unsaturated monomer
Preferably 5%~28%；The percentage by weight of light trigger is preferably 0.05%~3.0%；The percentage by weight of adhesion promoter
Preferably 3%~7%；The percentage by weight of solvent is preferably 15%~70%；The percentage by weight of additive is preferably 0.01%~
10%。
Above-mentioned Photosensitve resin composition can be acid number in 100mg KOH/g~350mg KOH/g aromatic acids（Methyl）Third
Olefin(e) acid half ester, or acid number are in 20mg KOH/g~350mg KOH/g and the resin with below formula or with as follows
The composition of the resin of formula：
Wherein, X is methyl or hydrogen atom；R2 is alkyl or alkoxy.
Above-mentioned ethylene unsaturated monomer be aliphatic urethane acrylate, polyether acrylate, acrylate, containing hydroxyl
The polyester acrylate of base, maleimide, phthalimide, 2- hydroxyl -4- phthalimides, hydroxyl
Any one in epoxy resin containing multiple methylbenzene epoxide groups in acid, the acid anhydrides of hydroxyl and main chain, or be two kinds
Combination above.
Above-mentioned light trigger can select radical photoinitiator or cationic photoinitiator, or free radical type light draws
Hair agent and the combination of cationic photoinitiator, it is anti-by base polymerization for making respective components be may occur under the irradiation of ultraviolet light
Answer and/or cationic polymerization.Light trigger can be oxime ester lightlike initiating agent, such as Ciba OXE01, CGI242, Ciba
OXE02 etc.；Can also be α-amido ketone-type photoinitiators, such as 369,379,907；Can also be acylphosphine oxide, benzene second
The amino of three-level containing morpholine and thioether group in ketone system, such as sulfur-bearing acetophenone system photoinitiator molecules, have with thioxanthone compound use
There is collaboration to trigger effect；Light trigger can also be to carry Hydrogen initiator, such as：Fragrant ketone, for example：2- phenyl benzyl -2- diformazans
Base amine -1-（4- morpholine benzyl phenyl）Butanone, benzophenone and its derivative, methyl o-benzoylbenzoate, thioxanthone etc.；Light
Initiator can also be from small molecule salt photoinitiator or luxuriant molysite photoinitiator.Above-mentioned available light trigger can
To be used alone, it is also possible to used after different types of light trigger mixing.
Above-mentioned adhesion promoter is the combination of silane coupler and acid esters adhesion promoter.Wherein, acid ester
Class adhesion promoter can select acidity single functionality acrylate, acid polyfunctional acrylic ester, acidic polyester acrylic acid
The acid such as ester, acid acrylate, acidic methylene acrylate, copolymerizable phosphate, epoxy phosphate ester, acrylic acid-hydroxy methacrylate
Property ester.
Above-mentioned solvent can be acid flux material, basic solvent or neutral flux.Wherein, acid flux material can select：Formic acid, second
Acid, chloroform etc.；Basic solvent can select：Ketone, ester, ether, aromatic hydrocarbon etc.；Neutral flux can select：Aliphatic hydrocarbon, cycloalkane chemical combination
Thing, aromatic hydrocarbon etc..Solvent is specifically as follows：Fatty alcohol, glycol ether, ethyl acetate, MEK, methyl iso-butyl ketone (MIBK), Dan Jia
Base ether glycol ester, gamma-butyrolacton, propionic acid -3- ether ethyl ester, butyl carbitol, butyl carbitol acetate, propane diols list
Methyl ether, propylene glycol monomethyl ether acetate, cyclohexanone, dimethylbenzene, isopropanol or n-butanol.Solvent is preferably propane diols list first
Base ether, propylene glycol monomethyl ether acetate, hexamethylene, butyl carbitol, propionic acid -3- ether ethyl ester, butyl carbitol acetic acid
One of ester and gamma-butyrolacton or two or more combinations.Solvent can be alkane, alkene, alkynes, aldehyde, ketone, ether, ester etc.,
Can be aromatic compound, such as benzene,toluene,xylene, can also be epoxide, aromatic hydrocarbons, halogenated hydrocarbons, aliphatic hydrocarbon,
Silane, siloxanes etc..
Above-mentioned moistening flatting agent is conventional type surfactant, or is response type surfactant active, or is conventional type
The combination of surfactant and response type surfactant active.Wherein, conventional type surfactant includes the organic silicon of conventional class
Surface modifier and fluorine class surface modifier, organic silicon surface modifier include diphenylpolysiloxane, methyl phenyl silicone, have
Machine modified siloxane, fluorinated siloxane etc..Conventional type surfactant is specifically as follows the fluorine carbon wetting stream of fluorine silicon anionic
Flat agent.Fluorine class surface modifier includes：Fluorine carbon moistening flatting agent FSWET-1010；Nonionic fluorinated surfactant, such as：
Megaface470,475,477,550,554 etc..The definition of response type surfactant active is：It is somebody's turn to do after adding such surfactant
Activating agent chemically reacts with coating surface material, so as to play a part of levelling.
Above-mentioned additive is defoamer, light stabilizer, antioxidant etc., can add it is therein one or more.
Below by the composition and its knot of adhesive force and surface smoothness of specific embodiment explanation Photosensitve resin composition
Fruit is evaluated.
Embodiment 1
The percentage by weight of the Photosensitve resin composition each component of the present embodiment be shown in Table 1 in the corresponding row of embodiment one, tool
Body is：Alkali soluble resin, 17%；Ethylene unsaturated monomer, 8%；Light trigger, 0.3%；Adhesion promoter, 0.08%；It is molten
Agent, 74.59%；Moistening flatting agent, 0.01%；Additive, 0.02%.
Embodiment 2
The percentage by weight of the Photosensitve resin composition each component of the present embodiment be shown in Table 1 in the corresponding row of embodiment two, tool
Body is：Alkali soluble resin, 14%；Ethylene unsaturated monomer, 8%；Light trigger, 0.8%；Adhesion promoter, 3.07%；It is molten
Agent, 73.98%；Moistening flatting agent, 0.13%；Additive, 0.02%.
Embodiment 3
The percentage by weight of the Photosensitve resin composition each component of the present embodiment be shown in Table 1 in the corresponding row of embodiment three, tool
Body is：Alkali soluble resin, 20%；Ethylene unsaturated monomer, 12%；Light trigger, 1.2%；Adhesion promoter, 3%；Solvent,
63.42%；Moistening flatting agent, 0.3%；Additive, 0.08%.
Embodiment 4
The percentage by weight of the Photosensitve resin composition each component of the present embodiment be shown in Table 1 in the corresponding row of example IV, tool
Body is：Alkali soluble resin, 20%；Ethylene unsaturated monomer, 15%；Light trigger, 1.5%；Adhesion promoter, 5.1%；It is molten
Agent, 55.45%；Moistening flatting agent, 2.8%；Additive, 0.15%.
Embodiment 5
The percentage by weight of the Photosensitve resin composition each component of the present embodiment be shown in Table 1 in the corresponding row of embodiment five, tool
Body is：Alkali soluble resin, 35%；Ethylene unsaturated monomer, 22%；Light trigger, 2%；Adhesion promoter, 6.05%；Solvent,
31.75%；Moistening flatting agent, 2.2%；Additive, 1%.
Embodiment 6
The percentage by weight of the Photosensitve resin composition each component of the present embodiment be shown in Table 1 in the corresponding row of embodiment six, tool
Body is：Alkali soluble resin, 40%；Ethylene unsaturated monomer, 25%；Light trigger, 2.2%；Adhesion promoter, 8.08%；It is molten
Agent, 20.32%；Moistening flatting agent, 2.2%；Additive, 2.2%.
Embodiment 7
The percentage by weight of the Photosensitve resin composition each component of the present embodiment be shown in Table 1 in the corresponding row of embodiment seven, tool
Body is：Alkali soluble resin, 40%；Ethylene unsaturated monomer, 24%；Light trigger, 2.5%；Adhesion promoter, 8.08%；It is molten
Agent, 18.72%；Moistening flatting agent, 2.4%；Additive, 4.3%.
Embodiment 8
The percentage by weight of the Photosensitve resin composition each component of the present embodiment be shown in Table 1 in the corresponding row of embodiment eight, tool
Body is：Alkali soluble resin, 45%；Ethylene unsaturated monomer, 30%；Light trigger, 3%；Adhesion promoter, 10%；Solvent,
4.5%；Moistening flatting agent, 2.5%；Additive, 5%.
Embodiment 9
The percentage by weight of the Photosensitve resin composition each component of the present embodiment be shown in Table 1 in the corresponding row of embodiment nine, tool
Body is：Alkali soluble resin, 35%；Ethylene unsaturated monomer, 22%；Light trigger, 2%；Adhesion promoter, 13%；Solvent,
18%；Moistening flatting agent, 3.2%；Additive, 6.8%.
Embodiment 10
The percentage by weight of the Photosensitve resin composition each component of the present embodiment be shown in Table 1 in the corresponding row of embodiment ten, tool
Body is：Alkali soluble resin, 7.5%；Ethylene unsaturated monomer, 4.5%；Light trigger, 0.054%；Adhesion promoter, 1.6%；
Solvent, 78.14%；Moistening flatting agent, 0.006%；Additive, 8.2%.
Table 1
Wherein, the ACAZ200 and SB401 in table 1 are alkali soluble resin, and EBE1290N is ethylene unsaturated monomer,
Irgacure379 is light trigger, and A-186 is silane coupling agent, and CD9051 is acid lipid adhesion promoter, and PMA is molten
Agent, Tego Glide432 are conventional type surfactant, and Megaface RS-75 are response type surfactant active.
The last two rows of table 1 are that the surface smoothness of each embodiment of Photosensitve resin composition and the result of adhesive force are commented
Valency, wherein, " Δ " represents that result is same as the prior art, and " O " represents that result is better than prior art, and " X " represents result than existing
Technology is poor.
Be would know that from table 1：In embodiment 9, because the percentage by weight of adhesion promoter is 13%, moistening flatting agent
Percentage by weight be 3.2%, be above specified scope so that surface smoothness and adhesion performance are deteriorated；Embodiment
In 10, because the percentage by weight of moistening flatting agent is 0.006%, less than specified scope, and the weight of adhesion promoter
Percentage is 1.6%, is belonged in specified scope so that surface smoothness degradation, and adhesion performance is excellent；Implement
In example 4, because the percentage by weight of moistening flatting agent is 2.8%, specified scope, therefore surface smoothness performance are exceeded
It is same as the prior art, there is no lifting.
In embodiment 1,3,8, although the percentage by weight of adhesion promoter is belonged in specified scope, but due to
Only with a kind of adhesion promoter（Silane coupling A -186 or acid esters adhesion promoter CD9051）So that it is attached
Put forth effort performance same as the prior art, there is no lifting.
Other embodiments all because employing the moistening flatting agent in specified weight percentage ranges, while using
It is in specified weight percentage ranges, by silane coupler and acid esters adhesion promoter combine it is attached
Adhesion promoter, and cause that surface smoothness and adhesion performance are lifted.
The embodiment of the present invention is by by silane coupler（A-186 in table 1）With acid esters adhesion promoter（Table 1
In CD9051）Composition add in Photosensitve resin composition, significantly improve Photosensitve resin composition and other interlayers
And the adhesive force between substrate（See embodiment 2,4,5,6,7,10）.
In addition, the embodiment of the present invention is preferably used comprising conventional type surfactant（Tego Glide432 in table 1）With
Response type surfactant active（Megaface RS-75 in table 1）Moistening flatting agent, thus, significantly improve coating surface
Wetting flow leveling, so that coating surface flatness is significantly improved（See embodiment 3,5,6,7,8）.
The embodiment of the present invention also provides a kind of liquid crystal display, including the component being made up of above-mentioned Photosensitve resin composition.
The component can be the chock insulator matter of laying in cel-gap, or be the panel for improving the visible angle of liquid crystal display
Upper protrusion, or optical filter, and the component has the surface smoothness and adhesive force for improving.
Photosensitve resin composition provided in an embodiment of the present invention also have light sensitivity is high, film uniformity is good, mechanical performance and
The advantages of good mechanical performance.
The embodiment of the present invention is mainly for the manufacture of liquid crystal display.
The above, specific embodiment only of the invention, but protection scope of the present invention is not limited thereto, and it is any
Those familiar with the art the invention discloses technical scope in, the change or replacement that can be readily occurred in, all should
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be with the scope of the claims
It is accurate.
Claims (17)
1. a kind of Photosensitve resin composition, it is characterised in that including：
Alkali soluble resin, percentage by weight is 8%~45%；
Ethylene unsaturated monomer, percentage by weight is 5%~30%；
Light trigger, percentage by weight is 0.05%~3.5%；
Adhesion promoter, the adhesion promoter is by silane coupler and percentage by weight that percentage by weight is 0.07%
Acid esters adhesion promoter for 3% is constituted；Or, the adhesion promoter is by silicon that percentage by weight is 0.05%
Alkane coupling agent and the acid esters adhesion promoter composition that percentage by weight is 6%；Or, the adhesion promoter is by weight
The acid esters adhesion promoter composition that amount percentage is 0.1% silane coupler and percentage by weight is 1.5%；It is described
Silane coupler is A-186；The acid esters adhesion promoter is CD9051；
Solvent, percentage by weight is 15%~75%；
Moistening flatting agent, percentage by weight is 0.01%~2.5%；
Additive, percentage by weight is 0%~10%；
The alkali soluble resin is aromatic acid (methyl) acrylate half ester of acid number in 100mg KOH/g~350mg KOH/g, or
Person is group of the acid number in 20mg KOH/g~350mg KOH/g, the resin with below formula or the resin with below formula
Compound：
Wherein, X is methyl or hydrogen atom；R2It is alkyl or alkoxy.
2. Photosensitve resin composition according to claim 1, it is characterised in that the percentage by weight of the alkali soluble resin
It is 8%~40%.
3. Photosensitve resin composition according to claim 1, it is characterised in that the weight of the ethylene unsaturated monomer
Percentage is 5%~28%.
4. the Photosensitve resin composition according to claim 1 or 3, it is characterised in that the ethylene unsaturated monomer is
Contain the ring of multiple methylbenzene epoxide groups on acrylate, maleimide, the acid of hydroxyl, the acid anhydrides of hydroxyl and main chain
Any one in oxygen tree fat, or be two or more combinations.
5. Photosensitve resin composition according to claim 4, it is characterised in that the acrylate includes aliphatic poly ammonia
Any one in ester acrylate, polyether acrylate, the polyester acrylate of hydroxyl, or be two or more groups
Close.
6. Photosensitve resin composition according to claim 1, it is characterised in that the percentage by weight of the light trigger is
0.05%~3.0%.
7. the Photosensitve resin composition according to claim 1 or 6, it is characterised in that the light trigger is free radical type
Light trigger, cationic photoinitiator, or radical photoinitiator and cationic photoinitiator combination.
8. Photosensitve resin composition according to claim 1, it is characterised in that the weight percent of the adhesion promoter
Than being 3.07%, 6.05% or 8.08%.
9. the Photosensitve resin composition according to claim 1 or 8, it is characterised in that the acid esters adhesive force promotes
Agent is any one in acid acrylate, acidic methylene acrylate, copolymerizable phosphate.
10. Photosensitve resin composition according to claim 9, it is characterised in that the acid acrylate includes acidity
Any one in single functionality acrylate, acid polyfunctional acrylic ester, acidic polyester acrylate；It is described copolymerizable
Phosphate includes epoxy phosphate ester.
11. Photosensitve resin compositions according to claim 1, it is characterised in that the moistening flatting agent is conventional type table
Face activating agent, or be response type surfactant active, or be conventional type surfactant and the group of response type surfactant active
Close.
12. Photosensitve resin compositions according to claim 1, it is characterised in that the percentage by weight of the solvent is
15%~70%.
13. Photosensitve resin composition according to claim 1 or 12, it is characterised in that the solvent be ketone compounds,
Ester type compound, ether compound, aliphatic compound or aromatic hydrocarbon.
14. Photosensitve resin compositions according to claim 13, it is characterised in that the aliphatic compound includes
Naphthene-based compounds.
15. Photosensitve resin compositions according to claim 1, it is characterised in that the percentage by weight of the additive is
0.01%~10%.
16. Photosensitve resin composition according to claim 1 or 15, it is characterised in that the additive is defoamer, light
One or more in stabilizer or antioxidant.
17. a kind of liquid crystal displays, it is characterised in that including the photosensitive composition as described in any one of claim 1~16
The component that thing is made.
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| TWI495956B (en) * | 2014-01-28 | 2015-08-11 | Daxin Materials Corp | Photosensitive resin composition, electronic element and method of fabricating the same |
| CN108517155B (en) * | 2018-04-27 | 2021-02-26 | 天津梓明涂料制造有限公司 | Water-based crack coating applied to plastic products |
| JP2020076945A (en) * | 2018-09-21 | 2020-05-21 | 旭化成株式会社 | Photosensitive resin composition |
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| CN1971420A (en) * | 2006-11-28 | 2007-05-30 | 京东方科技集团股份有限公司 | Red photoresist combination of color light filter used for LCD device and its application |
| CN101290473A (en) * | 2008-05-26 | 2008-10-22 | 京东方科技集团股份有限公司 | Photosensitive resin composition and method of making the same |
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| CN101963757A (en) * | 2009-07-25 | 2011-02-02 | 比亚迪股份有限公司 | Organic silicon modified alkali soluble photosensitive resin, preparation method thereof and printing ink composition |
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|---|---|---|---|---|
| CN1971420A (en) * | 2006-11-28 | 2007-05-30 | 京东方科技集团股份有限公司 | Red photoresist combination of color light filter used for LCD device and its application |
| CN101290473A (en) * | 2008-05-26 | 2008-10-22 | 京东方科技集团股份有限公司 | Photosensitive resin composition and method of making the same |
| CN101963757A (en) * | 2009-07-25 | 2011-02-02 | 比亚迪股份有限公司 | Organic silicon modified alkali soluble photosensitive resin, preparation method thereof and printing ink composition |
| CN101928541A (en) * | 2010-05-19 | 2010-12-29 | 江苏和成化学材料有限公司 | UV curable adhesive |
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