CN102626825A

CN102626825A - Laser processing device

Info

Publication number: CN102626825A
Application number: CN2012100208284A
Authority: CN
Inventors: 高桥聪
Original assignee: Disco Corp
Current assignee: Disco Corp
Priority date: 2011-02-03
Filing date: 2012-01-30
Publication date: 2012-08-08
Anticipated expiration: 2032-01-30
Also published as: KR101819074B1; CN102626825B; JP2012161799A; DE102012201419B4; KR20120089593A; DE102012201419A1; JP5804716B2

Abstract

The invention aims to raise processing productivity of a laser processing device. The laser processing device makes an object to be processed (W) kept by a keeping unit performs relative processing feed and index feed and laser processing with a laser irradiation unit. The raise processing device is provided with a control unit which performs the following control: performing relative processing feed between the keeping unit and a laser irradiation head (31) of the laser irradiation unit; performing laser processing on an object to be processed by irradiating the object to be processed (W) by laser lights; stopping a processing feed unit when laser lights exceed the object to be processed (W); and operating an index feed unit by reduction time needed by stopping processing feed. The following laser processing can be performed by utilizing the reduction time of processing feed, thus the time needed by index feed is substantially zero, which can improve laser processing productivity.

Description

Laser processing device

Technical field

The present invention relates to through the relatively move laser processing device of the Laser Processing of carrying out machined object of the laser radiation unit that makes the holding unit that keeps machined object and irradiating laser light.

Background technology

Be formed with the wafer of a plurality of devices such as IC, LSI, LED through cutting apart that preset lines is divided and on the surface; To cutting apart after preset lines irradiating laser light implements grouping Processing or machined; Cut off along cutting apart preset lines; Each device is cut apart thus, as (for example with reference to patent documentations 1,2) such as various electronic equipments.

The laser radiation unit that the laser processing device that the wafer illumination laser beam is carried out Laser Processing has the holding unit that keeps machined object and machined object irradiating laser light that this holding unit kept is implemented to process; Through holding unit and laser radiation unit are relatively moved in processing direction of feed (X-direction) and index feed direction (Y direction), can implement the processing of expectation and cut apart each device (for example with reference to patent documentation 3) the preset lines of cutting apart of wafer.

Laser processing device is when making holding unit and laser radiation unit carry out moving back and forth of relative processing feeding; Going to the road and returning the road both sides and can both carry out laser radiation; Compare and use, have advantage of high processing efficiency owing to only can work as the situation of the topping machanism that folk prescription processes when mobile with the relation of bite direction of rotation.

Patent documentation 1: japanese kokai publication hei 10-305420 communique

Patent documentation 2: No. 3408805 communique of japanese

Patent documentation 3: TOHKEMY 2010-284671 communique

But; Through concentrator (irradiation head) 1 is cut apart preset lines irradiating laser light and cuts apart the preset lines process finishing from this and stop with regard to the processing feeding is slowed down; During stopping fully, offside (overrun) can take place, so this part correspondingly spends the extra time until the processing feeding.In addition, processing is after feeding stops, and cuts apart preset lines and also spended time of the index feed that carries out for what the position alignment that makes concentrator then will be processed.For example, spend at about 1 second time of offside cost, index feed under the situation of time of about 0.5, whenever carry out 1 and cut apart preset lines processing, beyond process time, also need about 1.5 seconds extra time.Therefore for for example having 300 wafers of cutting apart preset lines, beyond process time, need 450 seconds time, thereby hope further to enhance productivity.

Summary of the invention

The present invention researches and develops in view of the above problems, and problem of the present invention is in laser processing device, to realize the further raising of productivity ratio.

According to the present invention a kind of laser processing device is provided, this laser processing device comprises: holding unit, and it keeps machined object; Laser beam irradiation unit, it implements Laser Processing to the machined object illuminating laser beam that this holding unit kept; The processing feed unit, it makes this holding unit and this laser beam irradiation unit relatively process feeding; The index feed unit, it makes this holding unit and this laser beam irradiation unit relatively carry out index feed; And control module; It makes this processing feed unit action and makes this holding unit and this laser beam irradiation unit relatively process feeding; To machined object illuminating laser beam that this holding unit kept and machined object is carried out Laser Processing; The moment that surpasses the edge of machined object at laser beam stops the action of this processing feed unit, utilizes from the action halt instruction of this processing feed unit to stop required deceleration time this index feed unit is moved implementing index feed to processing feeding.

In the present invention; Control module is controlled; Make that cutting apart preset lines to 1 is finishing in the deceleration time that the processing feeding stops fully, to carry out index feed concurrently with this deceleration from Laser Processing; Be in to utilize and begin deceleration time to cut apart the state that preset lines is carried out Laser Processing to ensuing, therefore can make the required time of index feed in fact is 0, can improve the productivity ratio of Laser Processing.

Description of drawings

Fig. 1 is the stereogram of an example of expression laser processing device.

Fig. 2 is the vertical view of expression machined object one example.

Fig. 3 is cut apart the stereogram that preset lines implement the state of Laser Processing of expression to machined object.

Fig. 4 is the vertical view of the relative position relationship change between expression irradiation head and the machined object.

Symbol description

1: laser processing device

2: holding unit 20: maintenance face 21: fixed part

3: the Laser Processing unit

30: housing 31: irradiation head

4: the processing feed unit

40: ball-screw 41: guide rail 42: motor 43: sliding part

5: the index feed unit

50: ball-screw 51: guide rail 52: motor 53: base

6: control module

10: wall portion

W: workpiece W1: surface

L11-L13, L21-L23: cut apart preset lines A-F: the end

31a-31f: irradiation head position

100: be with 101: frame 102: device

The specific embodiment

The structure of 1 laser processing device

The laser processing device of representing among Fig. 11 is that machined object (workpiece) the W irradiating laser light that the 3 pairs of holding units 2 are kept from the laser radiation unit comes workpiece W is implemented the device of processing.

Holding unit 2 is by constituting like the lower part: the maintenance face 20 that attracts to keep workpiece W; With fixed part 21, as shown in the figure its fixed through the frame 101 with 100 holding workpieces W.Fixed part 21 has the anchor clamps 210 of pushing frame 101 from the top.

Holding unit 2 is supported to through processing feed unit 4 and can moves in processing direction of feed (X-direction), and be supported to through index feed unit 5 can with respect to X-direction flatly the index feed direction (Y direction) of quadrature move.Processing feed unit 4 is controlled through control module 6 with index feed unit 5.

Processing feed unit 4 is configured on the flat base 53, by constituting like the lower part: the ball-screw 40 with axle center of X-direction; The pair of guide rails 41 that disposes abreast with ball-screw 40; The pulse motor 42 that is connected with an end of ball-screw 40; With sliding part 43, the nut of the inside that it is not shown and ball-screw 40 screw togather, and the bottom sliding-contact is in guide rail 41.This processing feed unit 4 constitutes: under the control of control module 6, driven by pulse motor 42 ball-screw 40 is rotated, follow in this sliding part 43 and slide and holding unit 2 is moved along X-direction in guide rail 41 upper edge X-directions.

Holding unit 2 is supported to through index feed unit 5 and can moves along Y direction with processing feed unit 4.Index feed unit 5 is by constituting like the lower part: the ball-screw 50 with axle center of Y direction; The pair of guide rails 51 that disposes abreast with ball-screw 50; The pulse motor 52 that is connected with an end of ball-screw 50; With base 53, the nut of the inside that it is not shown and ball-screw 50 screw togather, and the bottom sliding-contact is in guide rail 51.This index feed unit 5 constitutes: under the control of control module 6, driven by pulse motor 52 ball-screw 50 is rotated, follow in this base 53 and slide and holding unit 2 and processing feed unit 4 are moved along Y direction in guide rail 51 upper edge Y directions.

Laser radiation unit 3 has the housing 30 that is fixed in wall portion 10 and is fixed in the irradiation head 31 of housing 30 leading sections.Irradiation head 31 has the vertically function of irradiating laser light.In housing 30, take in: laser oscillator, repetition rate setup unit, pulse width adjustment unit and the energy adjustment unit of vibrate YAG laser or YVO4 laser.

And; The laser processing device 1 of Fig. 1 is such structure: processing feed unit 4 makes holding unit 2 move along X-direction and Y direction with index feed unit 5; And laser radiation unit 3 does not move; But so long as holding unit 2 and laser radiation unit 3 are relatively along X-direction processing feeding and along the structure of Y direction index feed; Then be not limited to the example of Fig. 1, for example can also be holding unit 2 along the structure that X-direction moves, laser radiation unit 3 moves along Y direction, also can be holding unit 2 not to be moved and structure that laser radiation unit 3 is moved along X-direction and Y direction.

The control of 2 Laser Processings

At the surperficial W1 of workpiece W shown in Figure 2, through horizontal cut apart preset lines L11, L12, L13 ... Cut apart longitudinally preset lines L21, L22, L23 ... Divide and form a plurality of devices 102.And, will cut apart preset lines below and abbreviate line as.

The two ends coordinate of respectively cutting apart preset lines in the X-Y coordinate system is discerned through control module 6 in advance.For example, the end A of line L11, the coordinate of B are respectively with (x1, y1), (x2, y1) expression, and the end C of line L12, the coordinate of D are respectively with (x3, y2), (x4, y2) expression, and the end E of line L13, the coordinate of F are respectively with (x5, y3), (x6, y3) expression.As shown in Figure 3, when control module 6 makes workpiece W that holding unit 2 kept move back and forth along X1 direction and X2 direction based on these coordinate informations to each line irradiating laser light 310.

This Laser Processing can be processed as follows: to the surface of workpiece W assemble to workpiece W have the laser beam of absorbefacient wavelength and form groove excision processing, to the inside of workpiece W assemble to workpiece W have light transmission wavelength laser beam and form the machined of metamorphic layer in inside.

Excision processing is for example processed with following conditions.

Light source: YAG laser or YVO 4 laser

Wavelength: 355nm

Focal point diameter: Φ 1 μ m

Average output: 5W

Repetition rate: 100kHz

Sweep speed: 100mm/s

On the other hand, process with following conditions in the machined.

Light source: YAG laser or YVO 4 laser

Wavelength: 1064nm

Focal point diameter: Φ 1 μ m

Average output: 1W

Repetition rate: 100kHz

Sweep speed: 400mm/s

Below, the control that relatively moves of workpiece W and irradiation head 31 describes during to Laser Processing workpiece W.Below the applicable excision processing of processing and the machined of explanation both.

(1) first step

For example press line L11, L12, L13 ... Order be in following state when carrying out Laser Processing: index feed unit 5 shown in Figure 1 is moved, make the Y coordinate of Y coordinate y1 and irradiation head 31 of line L11 consistent, irradiation head 31 is positioned on the extended line of line L11.

Then; Under the control of control module 6, make 4 actions of processing feed unit; Holding unit 2 is moved along X-direction, as shown in Figure 4 thus, make holding unit 2 and laser radiation unit 3 relatively process feeding along the X1 direction; The moment that is positioned at as the irradiation head position 31a that just goes up the position of end A at irradiation head 31 begins the irradiation of laser beam, and A processes as machining starting point with the end.Make the processing feed speed constant in the processing, the prolonged exposure laser beam moves to the irradiation head position 31b that just goes up the position as end B up to irradiation head 31.

(2) second steps

The process finishing of online L11, irradiation head 31 surpass the moment of workpiece W, stop from irradiation head 31 irradiating laser light, under the control of control end member 6, make to process feed unit 4 actions and the processing feeding is stopped.Holding unit 2 slows down through processing feed unit 4, but from the below through irradiation head position 31b to stopping to want spended time fully.For example stop to spend about 1 second fully from reducing speed now.

(3) the 3rd steps

Utilize the processing feeding to stop required deceleration time, make 5 actions of index feed unit in the meantime, as shown in Figure 4, make holding unit 2 and laser radiation unit 3 index feed relatively, make irradiation head 31 be positioned at the top of line L12.That is, index feed carries out with the processing feeding concurrently.For example, as shown in Figure 4 if this index feed spent for 0.5 second, irradiation head 31 arrived irradiation head position 31c with this 0.5 second, then, moved to irradiation head position 31d with remaining 0.5 second through the processing feeding.The walk help starting position of the processing feeding when irradiation head position 31d is processing line L12.

Usually, because the required required time of time ratio index feed of deceleration of processing feeding will be grown, therefore in the deceleration of processing feeding, can accomplish the index feed of ensuing line processing usefulness, can make the required time of index feed in fact is 0.

Next, return the first step, make 4 actions of processing feed unit carry out Laser Processing line L12.Opposite direction moved when at this moment, processing feed unit 4 made holding unit 2 along the X2 direction, promptly with processing line L11.And the moment of just going up the position that is positioned at end C at irradiation head 31 begins irradiating laser light, during arriving the irradiation head position 31e that is just going up the position as end D, is carrying out Laser Processing.

Next, in second step, the moment that irradiation head 31 surpasses workpiece W stops from irradiation head 31 irradiating laser light, under the control of control module 6, makes 4 actions of processing feed unit and stops to process feeding.Between the deceleration period of holding unit 2, through the 3rd step index feed and processing feeding are carried out concurrently, irradiation head 31 moves to irradiation head position 31f, and then, in the remaining processing feeding time, irradiation head 31 moves to irradiation head position 31g.And, and then return the first step, with the walk help starting position same processing line L13 of irradiation head position 31g as the processing feeding.After also repeatedly first to the 3rd the step.

Like this, repeatedly first to the 3rd step, when being moved back and forth, holding unit 2 carries out Laser Processing to institute is wired.After the processing of horizontal line all finishes, holding unit 2 is revolved turn 90 degrees, also first to the 3rd step was carried out Laser Processing repeatedly to line longitudinally.

As stated; Control module 6 makes when 1 Laser Processing of cutting apart preset lines finishes and in the deceleration time that the processing feeding stops fully, carries out index feed concurrently with this deceleration; Be in to utilize and begin deceleration time to cut apart the state that preset lines is carried out Laser Processing ensuing; Therefore can make in fact that the required time of index feed is 0, can improve the productivity ratio of Laser Processing.In the control in the past that deceleration spent for 1 second, index feed spent for 0.5 second of processing feeding; When for example processing has 300 workpiece of cutting apart preset lines; Outside the required time of processing, to waste 450 second time; And the present invention can realize the further raising of productivity ratio with shortening for 300 seconds the time.

Claims

1. laser processing device, it comprises:

Holding unit, it keeps machined object;

Laser beam irradiation unit, it implements Laser Processing to the machined object illuminating laser beam that this holding unit kept;

The processing feed unit, it carries out relative processing feeding to this holding unit and this laser beam irradiation unit;

The index feed unit, it carries out relative index feed to this holding unit and this laser beam irradiation unit; With

Control module; It moves this processing feed unit and this holding unit and this laser beam irradiation unit is carried out relative processing feeding; To machined object illuminating laser beam that this holding unit kept and machined object is carried out Laser Processing; The moment that surpasses the edge of machined object at laser beam; The action of this processing feed unit is stopped, utilizing from the action halt instruction of this processing feed unit to process feeding stop required deceleration time this index feed unit moved implement index feed.