CN102623308A - 化学机械研磨后清洗方法以及化学机械研磨方法 - Google Patents
化学机械研磨后清洗方法以及化学机械研磨方法 Download PDFInfo
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- CN102623308A CN102623308A CN2012100939078A CN201210093907A CN102623308A CN 102623308 A CN102623308 A CN 102623308A CN 2012100939078 A CN2012100939078 A CN 2012100939078A CN 201210093907 A CN201210093907 A CN 201210093907A CN 102623308 A CN102623308 A CN 102623308A
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CN2012100939078A CN102623308A (zh) | 2012-03-31 | 2012-03-31 | 化学机械研磨后清洗方法以及化学机械研磨方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140370696A1 (en) * | 2013-06-13 | 2014-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for forming oxide layer over exposed polysilicon during a chemical mechanical polishing (cmp) process |
CN104742007A (zh) * | 2013-12-30 | 2015-07-01 | 中芯国际集成电路制造(北京)有限公司 | 化学机械研磨装置和化学机械研磨方法 |
CN111863592A (zh) * | 2019-04-29 | 2020-10-30 | 中芯国际集成电路制造(上海)有限公司 | 研磨后清洗方法以及半导体结构的形成方法 |
CN113140446A (zh) * | 2021-04-02 | 2021-07-20 | 杭州中欣晶圆半导体股份有限公司 | 改善lto背封硅片凹坑缺陷的方法 |
Citations (4)
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KR20050066116A (ko) * | 2003-12-26 | 2005-06-30 | 동부아남반도체 주식회사 | 화학기계적 연마장치에서 메가소닉 세정되는 웨이퍼이송유니트 |
CN101661869A (zh) * | 2008-08-25 | 2010-03-03 | 北京有色金属研究总院 | 一种砷化镓晶片抛光后的清洗方法及甩干机 |
CN102064090A (zh) * | 2010-10-15 | 2011-05-18 | 北京通美晶体技术有限公司 | 化合物半导体晶片清洗方法 |
CN102371525A (zh) * | 2010-08-19 | 2012-03-14 | 中芯国际集成电路制造(上海)有限公司 | 抛光装置 |
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- 2012-03-31 CN CN2012100939078A patent/CN102623308A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050066116A (ko) * | 2003-12-26 | 2005-06-30 | 동부아남반도체 주식회사 | 화학기계적 연마장치에서 메가소닉 세정되는 웨이퍼이송유니트 |
CN101661869A (zh) * | 2008-08-25 | 2010-03-03 | 北京有色金属研究总院 | 一种砷化镓晶片抛光后的清洗方法及甩干机 |
CN102371525A (zh) * | 2010-08-19 | 2012-03-14 | 中芯国际集成电路制造(上海)有限公司 | 抛光装置 |
CN102064090A (zh) * | 2010-10-15 | 2011-05-18 | 北京通美晶体技术有限公司 | 化合物半导体晶片清洗方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140370696A1 (en) * | 2013-06-13 | 2014-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for forming oxide layer over exposed polysilicon during a chemical mechanical polishing (cmp) process |
US9711374B2 (en) * | 2013-06-13 | 2017-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for forming oxide layer over exposed polysilicon during a chemical mechanical polishing (CMP) process |
CN104742007A (zh) * | 2013-12-30 | 2015-07-01 | 中芯国际集成电路制造(北京)有限公司 | 化学机械研磨装置和化学机械研磨方法 |
US9950405B2 (en) | 2013-12-30 | 2018-04-24 | Semiconductor Manufacturing International (Beijing) Corporation | Chemical mechanical planarization apparatus and methods |
CN111863592A (zh) * | 2019-04-29 | 2020-10-30 | 中芯国际集成电路制造(上海)有限公司 | 研磨后清洗方法以及半导体结构的形成方法 |
CN111863592B (zh) * | 2019-04-29 | 2023-11-10 | 中芯国际集成电路制造(上海)有限公司 | 研磨后清洗方法以及半导体结构的形成方法 |
CN113140446A (zh) * | 2021-04-02 | 2021-07-20 | 杭州中欣晶圆半导体股份有限公司 | 改善lto背封硅片凹坑缺陷的方法 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140425 |
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Effective date of registration: 20140425 Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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Application publication date: 20120801 |