CN102622640A - RFID label - Google Patents
RFID label Download PDFInfo
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- CN102622640A CN102622640A CN2011100319460A CN201110031946A CN102622640A CN 102622640 A CN102622640 A CN 102622640A CN 2011100319460 A CN2011100319460 A CN 2011100319460A CN 201110031946 A CN201110031946 A CN 201110031946A CN 102622640 A CN102622640 A CN 102622640A
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- rfid
- glue layer
- drying glue
- rfid label
- label
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Abstract
The invention discloses a pasting structure of an RFID label. The pasting structure of an RFID label comprises coated paper layers, a first non-setting adhesive layer, a preloading layer and a second non-setting adhesive layer which are successively connected, and further comprises an RFID chip, wherein a concave hole structure is provided on the second non-setting adhesive layer, a cross section of the concave hole structure is greater than the cross section of the RFID chip, a cementing agent is injected into the concave hole structure after the RFID chip is placed at a central region in the concave hole structure, and the RFID chip is covered. The concave hole structure is filled with the cementing agent, and an outer surface layer of the concave hole structure is aligned withthe second non-setting adhesive layer. The cementing agent is an epoxy resin cementing agent. The label according to the present invention is characterized in that the label is bonded with a product through both the non-setting adhesive and the epoxy resin cementing agent, even if the RFID label is torn after the non-setting adhesive is softened through a heating method, the chip part has already been bonded firmly with the product through the epoxy resin cementing agent, therefore the label has a strong tamper-evident feature.
Description
Technical field
The present invention relates to a kind of electronic tag, relate in particular to a kind of RFID label with high anti-taking off property.
Background technology
The RFID electronic tag develops towards microminiaturized, lightening direction just day by day; At present in the industry RFID label product generally is need on the false proof product to be bonded in through adhesive sticker and the form that is equipped with base material; As shown in Figure 1, be a kind of antifalsification label structure of utilizing art paper as base material, mainly connect and compose successively by copperplate ply of paper 1, first non-drying glue layer 2, preloading mound 3 and second non-drying glue layer 4; RFID chip 5 is positioned at second non-drying glue layer 4, next-door neighbour's preloading mound 3.This project organization security is lower; If for example non-drying glue layer is heated with hair-dryer; Non-drying glue layer can slowly melt, and the label chip in the non-drying glue layer just can so just reduce the reliability of RFID electronic tag along with base material is taken off together; Generation RFID electronic label chip is lost or is stolen in the circulation of commodities process, causes unnecessary loss.
Summary of the invention
To the problem of above-mentioned existence, the purpose of this invention is to provide a kind of RFID label, can effectively reduce the risk that the RFID label chip is taken off from the false proof product surface of needs, manufacture craft is simple and safe and reliable.
The objective of the invention is to realize through following technical proposals:
A kind of RFID label comprises the copperplate ply of paper, first non-drying glue layer, preloading mound and second non-drying glue layer that connect successively, also comprises the RFID chip; Wherein, On second non-drying glue layer, be provided with a shrinkage pool structure, said shrinkage pool structure xsect is greater than said RFID chip xsect, and the RFID chip is placed in the said shrinkage pool structure after the central region; In said shrinkage pool structure, inject jointing compound, cover said RFID chip.
The sticking structure of above-mentioned RFID label, wherein, said jointing compound fills up said shrinkage pool structure, and its extexine flushes with the said second non-drying glue layer extexine.
The sticking structure of above-mentioned RFID label, wherein, said shrinkage pool structural thickness is identical with the said second non-drying glue layer thickness.
The sticking structure of above-mentioned RFID label, wherein, said RFID chip is close to said preloading mound.
The sticking structure of above-mentioned RFID label, wherein, the said first non-drying glue layer thickness is not identical in bondline thickness with said second.
The sticking structure of above-mentioned RFID label, wherein, said jointing compound is the epoxy gluing agent.
Compared with present technology; Beneficial effect of the present invention is: in the bonding process with RFID label and product; On non-drying glue layer, open a shrinkage pool structure and add the epoxy gluing agent, make it cover the RFID chip fully, it is bonding to make that label passes through adhesive sticker and epoxy gluing agent and product simultaneously; So; After just softening non-drying glue layer with the method for heating at last the RFID label is torn, but RFID chip part has been bonded in together with product through the epoxy gluing agent firmly, has played the well anti-effect of taking off.
Description of drawings
Fig. 1 is the structural representation of RFID label in the conventional art;
Fig. 2 is the structural representation of RFID label of the present invention.
Embodiment
Below in conjunction with schematic diagram and concrete operations embodiment the present invention is described further.
As shown in Figure 2; The sticking structure of RFID label of the present invention comprises successively the copperplate ply of paper that connects 1, first non-drying glue layer 2, preloading mound 3 and second non-drying glue layer 4; First non-drying glue layer, 2 thickness are identical with second non-drying glue layer, 4 thickness; Also comprise RFID chip 5, copperplate ply of paper 1 tightens together through first non-drying glue layer 2 with preloading mound 3.Through in second non-drying glue layer 4 and the bonding process of product, on second non-drying glue layer 4, offer a shrinkage pool structure 41 at RFID chip 5 earlier, shrinkage pool structure 41 xsects are greater than RFID chip 5 xsects; Shrinkage pool structure 41 thickness can be identical with second non-drying glue layer, 4 thickness; Then RFID chip 5 is placed central region in the shrinkage pool structure 41, make RFID chip 5 next-door neighbour's preloading mounds 3, then in shrinkage pool structure 41, click and enter or inject jointing compound 6 with instrument; Until RFID chip 5 is covered fully; Jointing compound 6 must fill up shrinkage pool structure 41, and its extexine flushes with second non-drying glue layer, 4 extexines, at last this RFID label is closely bonded with needing false proof product.Jointing compound 6 is selected the epoxy gluing agent with height cementability for use.So; Just at last with behind softening first non-drying glue layer 2 of the method for heating or second non-drying glue layer 4 this RFID label being torn; But RFID chip 5 parts have been bonded in together with product through epoxy gluing agent 6 firmly, have played the well anti-effect of taking off.
More than specific embodiment of the present invention is described in detail, but the present invention is not restricted to the specific embodiment of above description, it is just as example.To those skilled in the art, any equivalent modifications that this RFID label is carried out with substitute also all among category of the present invention.Therefore, not breaking away from impartial conversion and the modification of having done under the spirit and scope of the present invention, all should contain within the scope of the invention.
Claims (6)
1. RFID label; Comprise the copperplate ply of paper (1), first non-drying glue layer (2), preloading mound (3) and second non-drying glue layer (4) that connect successively; Also comprise RFID chip (5), it is characterized in that, on second non-drying glue layer (4), be provided with a shrinkage pool structure (41); Said shrinkage pool structure (41) xsect is greater than said RFID chip (5) xsect; After RFID chip (5) placed the interior central region of said shrinkage pool structure (41), in said shrinkage pool structure (41), inject jointing compound (6), cover said RFID chip (5).
2. RFID label according to claim 1 is characterized in that, said jointing compound (6) fills up said shrinkage pool structure (41), and its extexine flushes with said second non-drying glue layer (4) extexine.
3. RFID label according to claim 2 is characterized in that, said shrinkage pool structure (41) thickness is identical with said second non-drying glue layer (4) thickness.
4. RFID label according to claim 3 is characterized in that, said RFID chip (5) is close to said preloading mound (3).
5. RFID label according to claim 1 is characterized in that, said first non-drying glue layer (2) thickness is identical with said second non-drying glue layer (4) thickness.
6. according to any described RFID label in the claim 1 to 5, it is characterized in that said jointing compound (6) is the epoxy gluing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100319460A CN102622640A (en) | 2011-01-28 | 2011-01-28 | RFID label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100319460A CN102622640A (en) | 2011-01-28 | 2011-01-28 | RFID label |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102622640A true CN102622640A (en) | 2012-08-01 |
Family
ID=46562549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100319460A Pending CN102622640A (en) | 2011-01-28 | 2011-01-28 | RFID label |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102622640A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103824109A (en) * | 2014-03-12 | 2014-05-28 | 厦门英诺尔信息科技有限公司 | Transfer-prevention and adhesive-residue-free electronic tag of RFID (radio frequency identification device) as well as preparation method of electronic tag |
| CN110382213A (en) * | 2017-05-24 | 2019-10-25 | 宝马股份公司 | Method and RTM mold for labeled fibers reinforced plastics component |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200986778Y (en) * | 2006-12-27 | 2007-12-05 | 上海正伟印刷有限公司 | Adhesive label with RFID chip |
| CN201111115Y (en) * | 2007-12-04 | 2008-09-03 | 吴天文 | Anti-dissembling electronic label |
| CN201237857Y (en) * | 2008-05-21 | 2009-05-13 | 深圳市先施科技有限公司 | Vehicle anti-dismantling electronic label based on anti-counterfeit printing technology |
| CN201417570Y (en) * | 2009-04-28 | 2010-03-03 | 吴军华 | Adhesive radio frequency label manufacturing system |
| CN101727605A (en) * | 2009-12-01 | 2010-06-09 | 中山达华智能科技股份有限公司 | RFID electronic tag preventing peeling off after being adhered on surface of object |
-
2011
- 2011-01-28 CN CN2011100319460A patent/CN102622640A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200986778Y (en) * | 2006-12-27 | 2007-12-05 | 上海正伟印刷有限公司 | Adhesive label with RFID chip |
| CN201111115Y (en) * | 2007-12-04 | 2008-09-03 | 吴天文 | Anti-dissembling electronic label |
| CN201237857Y (en) * | 2008-05-21 | 2009-05-13 | 深圳市先施科技有限公司 | Vehicle anti-dismantling electronic label based on anti-counterfeit printing technology |
| CN201417570Y (en) * | 2009-04-28 | 2010-03-03 | 吴军华 | Adhesive radio frequency label manufacturing system |
| CN101727605A (en) * | 2009-12-01 | 2010-06-09 | 中山达华智能科技股份有限公司 | RFID electronic tag preventing peeling off after being adhered on surface of object |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103824109A (en) * | 2014-03-12 | 2014-05-28 | 厦门英诺尔信息科技有限公司 | Transfer-prevention and adhesive-residue-free electronic tag of RFID (radio frequency identification device) as well as preparation method of electronic tag |
| CN110382213A (en) * | 2017-05-24 | 2019-10-25 | 宝马股份公司 | Method and RTM mold for labeled fibers reinforced plastics component |
| CN110382213B (en) * | 2017-05-24 | 2021-09-17 | 宝马股份公司 | Method and RTM mold for marking fiber reinforced plastic components |
| DE102017208869B4 (en) | 2017-05-24 | 2022-03-03 | Bayerische Motoren Werke Aktiengesellschaft | Process for marking a fiber-reinforced plastic component and the use of an RTM tool to carry out the process |
| US11738524B2 (en) | 2017-05-24 | 2023-08-29 | Bayerische Motoren Werke Aktiengesellschaft | Method for identifying a fiber-reinforced plastic component, and a resin transfer molding (RTM) mold |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120801 |