CN102610737A - 一种大功率led散热装置 - Google Patents

一种大功率led散热装置 Download PDF

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CN102610737A
CN102610737A CN2012100760392A CN201210076039A CN102610737A CN 102610737 A CN102610737 A CN 102610737A CN 2012100760392 A CN2012100760392 A CN 2012100760392A CN 201210076039 A CN201210076039 A CN 201210076039A CN 102610737 A CN102610737 A CN 102610737A
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heat
radiating device
power led
thermal conductivity
conductivity layer
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熊威
尹键
余舒适
李文清
王跃飞
李国平
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Guangzhou Hongli Tronic Co Ltd
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Guangzhou Hongli Tronic Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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Abstract

本发明公开了一种大功率LED散热装置,包括基座,所述基座上端设置有一用于增加横向导热的高导热层,高导热层上固定有LED芯片和凸透镜胶体,LED芯片通过导线与包裹在所述基座内的焊脚连接,凸透镜胶体与高导热层结合将所述LED芯片及导线密封,基座下端设有鳍形状的散热片。本发明散热装置通过高导热层增加横向导热效率,扩大纵向导热的有效面积,缩短了散热路径,增加了与空气的散热面积,从而明显减少了芯片到空气的热阻,有效降低了发热电子器件的温度,使得大功率LED芯片的稳定性和可靠性得到极大地增强,延长了其使用寿命;并且本发明结构简单,基座采用塑料制成,节约成本,加工方便,提高了产品的安全性能,便于广泛应用。

Description

一种大功率LED散热装置
技术领域
本发明涉及一种散热装置,尤其是一种大功率LED散热装置。
背景技术
LED是一种注入电致发光器件,但目前LED光电转换效率仍然不够高,只有约15%~30%的电能转化为光能输出,其余均转换为热能,这直接导致工作时LED芯片结温上升,引起寿命缩短、热应力集中、芯片发光效率和荧光粉激发效率下降等问题。因此,散热成为制约其发展的一个关键因素。
现有的大功率LED封装散热结构中,LED芯片一般被固定在一散热板上,LED芯片产生的热量先纵向传导至散热板,再通过散热板与空气进行对流和辐射散热。但现有应用产品中散热板结构复杂,工序繁多,增加了LED芯片到空气的热阻,使热量无法有效的传递到空气中。
专利号为201010160082.8的中国发明专利公开了“复合结构石墨散热器及其制备方法”,利用柔性石墨材料的平面方向导热率高的优点与膨胀石墨复合材料高热容性能配合优化了热量传导结构,形成良好的三维散热效果。但是石墨成型的散热器易脆裂、抗弯和抗拉强度低,且石墨为导体,容易产生漏电的危险,在实际应用中会有很大的局限性。
 
发明内容
本发明主要解决的技术问题是:提供一种结构简单、散热性能好、可靠性和安全性能高的大功率LED散热装置。
为解决上述技术问题,本发明所采用的技术方案是:
一种大功率LED散热装置,包括基座,所述基座上端设置有一用于增加横向导热的高导热层,所述高导热层上固定有LED芯片和凸透镜胶体,所述LED芯片通过导线与包裹在所述基座内的焊脚连接,所述凸透镜胶体与高导热层结合将所述LED芯片及导线密封,所述基座下端设有鳍形状的散热片。
进一步作为优选的实施方式,位于凸透镜胶体下方的高导热层区域除了LED芯片的固晶区域外,在高导热层上镀有一用于增加LED芯片出光效率的反射层。
进一步作为优选的实施方式,所述高导热层由具有高导热性能的石墨材料或者金属材料制成,所述高导热层的导热率为400W/mK~2000W/mK。
进一步作为优选的实施方式,所述金属材料为铜或者银。
进一步作为优选的实施方式,所述高导热层的厚度为0.1~0.3mm。
进一步作为优选的实施方式,所述基座为塑料制成。
本发明的有益效果是:本发明采用高导热层来增强LED芯片的横向导热效果,有效扩大了散热装置的纵向传导面积,缩短了散热路径,增加了散热面积,从而明显减少了芯片到空气热阻,有效降低了发热电子器件的温度,使得大功率LED芯片的稳定性和可靠性得到极大地增强,并延长了其使用寿命;进一步,在基座下端设有鳍形状的散热片,可增加空气对流和辐射散热面积。并且本发明结构简单,基座采用塑料制成,降低了成本,加工方便,并提高了产品的安全性能,便于广泛应用。
附图说明
下面结合附图对本发明的具体实施方式作进一步说明:
图1是本发明大功率LED散热装置的结构示意图。
具体实施方式
参照图1,一种大功率LED散热装置,包括基座1,基座1上端设置有一用于增加横向导热的高导热层13,高导热层13上固定有LED芯片2和凸透镜胶体3,LED芯片2通过导线4与包裹在所述基座1内的焊脚12连接,所述凸透镜胶体3与高导热层13结合将所述LED芯片2及导线4密封,所述基座1下端设有鳍形状的散热片11。
在具体实施例中,LED芯片2通过焊接、导热银胶或者其他方式固定在高导热层13上,高导热层13由具有高导热性能的石墨材料或者金属材料制成,高导热层13的导热率为400W/mK~2000W/mK。本发明通过在基座1上端设置高导热层13,增强了散热装置的横向导热,从而避免了LED芯片中央温度骤升,扩大了纵向的散热面积,提高了散热性能。高导热层13可采用具有高导热性能的石墨材料制成,亦可采用金属材料,例如铜、银等制成,以增强散热装置的横向导热能力,优选地,高导热层13的厚度为0.1~0.3mm。
优选地,所述基座1采用塑料制成,由于导热塑料成本低、加工成型方便,而且能保证良好的导热性能,并且避免了采用金属制成的散热片容易漏电的危险,提高了产品的安全性能,亦克服了石墨成型的散热器易脆裂、抗弯和抗拉强度低的缺陷。
优选地,位于凸透镜胶体3下方的高导热层区域除了LED芯片2的固晶区域外,在高度热层13上镀有一用于增加LED芯片2出光效率的反射层14。
以上是对本发明的较佳实施例进行了具体说明,但本发明创造并不限于所述实施例,熟悉本领域的技术人员在不违背本发明精神的前提下还可以做出种种的等同变形或替换,这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (6)

1.一种大功率LED散热装置,包括基座(1),其特征在于:所述基座(1)上端设置有一用于增加横向导热的高导热层(13),所述高导热层(13)上固定有LED芯片(2)和凸透镜胶体(3),所述LED芯片(2)通过导线(4)与包裹在所述基座(1)内的焊脚(12)连接,所述凸透镜胶体(3)与高导热层(13)结合将所述LED芯片(2)及导线(4)密封,所述基座(1)下端设有鳍形状的散热片(11)。
2.根据权利要求1所述的一种大功率LED散热装置,其特征在于:位于凸透镜胶体(3)下方的高导热层区域除了LED芯片(2)的固晶区域外,在高度热层(13)上镀有一用于增加LED芯片(2)出光效率的反射层(14)。
3.根据权利要求2所述的一种大功率LED散热装置,其特征在于:所述高导热层(13)由具有高导热性能的石墨材料或者金属材料制成,所述高导热层(13)的导热率为400W/mK~2000W/mK。
4.根据权利要求3所述的一种大功率LED散热装置,其特征在于:所述金属材料为铜或者银。
5.根据权利要求2所述的一种大功率LED散热装置,其特征在于:所述高导热层(13)的厚度为0.1~0.3mm。
6.根据权利要求2所述的一种大功率LED散热装置,其特征在于:所述基座(1)为塑料制成。
CN2012100760392A 2012-03-21 2012-03-21 一种大功率led散热装置 Pending CN102610737A (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103415138A (zh) * 2013-08-06 2013-11-27 鑫茂电子(昆山)有限公司 一种便于散热的线路板
CN103594614A (zh) * 2012-08-15 2014-02-19 品元企业股份有限公司 光源用芯片(晶片)散热双金属柱
WO2015032256A1 (en) * 2013-09-06 2015-03-12 Yung Pun Cheng Floating heat sink support with copper sheets and led package assembly for led flip chip package
CN113170593A (zh) * 2018-11-22 2021-07-23 华为技术有限公司 一种封装结构、处理器及服务器

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CN102354725A (zh) * 2011-10-29 2012-02-15 华南师范大学 散热基板为类金刚石膜-铜复合材料的大功率发光二极管
CN202523767U (zh) * 2012-03-21 2012-11-07 广州市鸿利光电股份有限公司 一种大功率led散热装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100220483A1 (en) * 2009-03-02 2010-09-02 Everlight Electronics Co., Ltd. Dissipation module for a light emitting device and light emitting diode device having the same
CN102347437A (zh) * 2010-07-30 2012-02-08 欧司朗有限公司 电子发热模块及其制造方法
CN202025797U (zh) * 2011-03-16 2011-11-02 张申雄 一种用于大功率led发光二极管的复铜碳基石墨散热板
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CN102354725A (zh) * 2011-10-29 2012-02-15 华南师范大学 散热基板为类金刚石膜-铜复合材料的大功率发光二极管
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103594614A (zh) * 2012-08-15 2014-02-19 品元企业股份有限公司 光源用芯片(晶片)散热双金属柱
CN103415138A (zh) * 2013-08-06 2013-11-27 鑫茂电子(昆山)有限公司 一种便于散热的线路板
WO2015032256A1 (en) * 2013-09-06 2015-03-12 Yung Pun Cheng Floating heat sink support with copper sheets and led package assembly for led flip chip package
US9379300B2 (en) 2013-09-06 2016-06-28 Yung Pun Cheng Floating heat sink support with copper sheets and LED package assembly for LED flip chip package
CN113170593A (zh) * 2018-11-22 2021-07-23 华为技术有限公司 一种封装结构、处理器及服务器

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Application publication date: 20120725