CN102609060A - Heat abstractor - Google Patents
Heat abstractor Download PDFInfo
- Publication number
- CN102609060A CN102609060A CN2011100219320A CN201110021932A CN102609060A CN 102609060 A CN102609060 A CN 102609060A CN 2011100219320 A CN2011100219320 A CN 2011100219320A CN 201110021932 A CN201110021932 A CN 201110021932A CN 102609060 A CN102609060 A CN 102609060A
- Authority
- CN
- China
- Prior art keywords
- heat abstractor
- air channel
- radiating fin
- heating radiator
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 17
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat abstractor, which comprises a radiator, wherein the radiator comprises several radiating fins, each of the radiating fins has two side faces, a plurality of convex parts and concave parts are arranged on each side face at intervals, and the convex parts and the concave parts form a wave shape on the side faces.
Description
Technical field
The present invention relates to a kind of heat abstractor, refer to the heat abstractor that a kind of radiating efficiency is higher especially.
Background technology
The travelling speed of computing machine is more and more faster now, because the travelling speed of computing machine depends primarily on central processing unit, so the travelling speed of central processing unit is also more and more faster; But integrated circuit electronic package for this type of central processing unit; Travelling speed is fast more, and the heat that its unit interval produces is just many more, if untimely discharge; Will cause that its temperature raises, and causes its fluctuation of service.All in auxiliary its heat radiation of central processing unit mounted on surface one heat abstractor, along with new processor is constantly released, the heat abstractor of its adapted is also in continuous improvement for industry.
See also Fig. 1; It comprises a heating radiator 80 and a fan 90 for a kind of heat abstractor commonly used; This heating radiator 80 comprises a base 81 and some radiating fins 83 that are set in parallel in base 81 tops, and these radiating fins 83 are vertical plate body, forms an air channel 85 between the adjacent in twos radiating fin 83; The base 81 of heating radiator 80 can contact with a heater element 71 of a circuit board 70 and the heat that heater element produces is transmitted on the radiating fin 83; Fan 90 can be installed in radiating fin 83 1 sides and drive the air channel 85 that cold air flows through heating radiator 80, thereby takes away the heat on the radiating fin 83, but the radiating efficiency of above-mentioned heat abstractor is lower.
Summary of the invention
In view of above content, be necessary the heat abstractor that provides a kind of radiating efficiency higher.
A kind of heat abstractor; Comprise a heating radiator, said heating radiator comprises some radiating fins, and each radiating fin comprises two sides respectively; Comprise protuberance and recess that some intervals are provided with on each side respectively, these protuberances and recess form waveform on said side.
Preferably, said protuberance has bigger area of dissipation, and said recess has less area of dissipation.
Preferably, be provided with an air channel between the adjacent in twos radiating fin, said air channel is narrower in the position relative with said protuberance, at the position broad relative with said recess.
Preferably, said heat abstractor also comprises a fan, and said fan is installed in a side in the air channel of said heating radiator.
Preferably, said fans drive cold air flows through said air channel, and cold air is very fast at the flow velocity at the narrower place in said air channel, and is slower at the flow velocity at the broad place in said air channel.
Preferably, a symmetrical rotational symmetry of the said relatively radiating fin in the two sides of said radiating fin.
Preferably, these radiating fins are parallel to each other.
Preferably, said heating radiator also comprise one can with one treat the base of heat dissipation element joint, these radiating fins are arranged on the said base.
Compared to prior art, the radiating fin of heat abstractor of the present invention is set to waveform and has bigger area of dissipation, and radiating efficiency is higher.
Description of drawings
Fig. 1 is the exploded view of existing heat abstractor.
Fig. 2 is the three-dimensional exploded view of an embodiment of heat abstractor of the present invention.
Fig. 3 is the enlarged drawing at the III place of Fig. 2.
Fig. 4 is the three-dimensional assembly diagram of the heat abstractor of Fig. 1.
The main element symbol description
| |
10 |
| |
11 |
| Radiating |
13 |
| The |
131 |
| The |
135 |
| Protuberance | ?136 |
| Recess | ?137 |
| Fan | ?30 |
| Circuit board | ?50 |
| Treat heat dissipation element | ?60 |
Embodiment
Please consult Fig. 2 to Fig. 4 in the lump, a preferred embodiment of heat abstractor of the present invention comprises that a heating radiator 10 and can be installed in a fan 30 of these heating radiator 10 1 sides.
This heating radiator 10 comprises a base 11; The upper surface of base 11 is provided with radiating fin 13, and the lower surface of base 11 can contact with the heat dissipation element 60 (like central processing unit) of treating on the circuit board 50, treats that the heat that heat dissipation element 60 produces is sent on the radiating fin 13 via base 11; These radiating fins 13 are parallel to each other; Each radiating fin 13 comprises two sides 131 respectively, the vertical axis of symmetry symmetry of these two sides 131 relative radiating fins 13, and each side 131 all is set as waveform; It comprises protuberance 136 and recess 137 that some intervals are provided with, helps radiating fin 13 and better dispels the heat thereby corrugated side 131 has bigger area of dissipation.
Be provided with an air channel 135 between the two relative sides 131 of two adjacent radiating fins 13, because the side 131 of 135 both sides, air channel is waveform, air channel 135 some places are narrower; The some places broad; The protuberance 136 of the narrower place corresponding side surface 131 in air channel 135, protuberance 136 has bigger area of dissipation, because air channel 135 is narrower herein; Then wind speed is very fast, can be more efficiently for having 136 heat radiations of larger area protuberance; The recess 137 of the broad place corresponding side surface 131 in air channel 135, recess 137 has less area of dissipation, because air channel 135 broad herein, then wind speed is slower, also can be more efficiently for having recess 137 heat radiations than small size.
Fan 30 be installed on the heating radiator 10 and with a side that is positioned at air channel 135, after this heat abstractor is installed to and treats on the heat dissipation element 60, drive cold air and flow through the air channel 135 between the radiating fin 13; Thereby take away the heat on the radiating fin 13, and because the area of dissipation on the protuberance 136 of radiating fin 13 is bigger, the flow of cold air here is also very fast; Then radiating efficiency is high, and also because the area of dissipation at recess 137 places of radiating fin 13 is little, the flow of cold air here is slower; Radiating efficiency is also higher; And the traditional relatively radiating fin of radiating fin 13 with waveform side 131 has bigger area of dissipation, and radiating efficiency is better, and radiating effect is also better.
Claims (8)
1. heat abstractor; Comprise a heating radiator, said heating radiator comprises some radiating fins, and each radiating fin comprises two sides respectively; It is characterized in that: comprise protuberance and recess that some intervals are provided with on each side respectively, these protuberances and recess form waveform on said side.
2. heat abstractor as claimed in claim 1 is characterized in that: said protuberance has bigger area of dissipation, and said recess has less area of dissipation.
3. heat abstractor as claimed in claim 2 is characterized in that: be provided with an air channel between the adjacent in twos radiating fin, said air channel is narrower in the position relative with said protuberance, at the position broad relative with said recess.
4. heat abstractor as claimed in claim 3 is characterized in that: said heat abstractor also comprises a fan, and said fan is installed in a side in the air channel of said heating radiator.
5. heat abstractor as claimed in claim 4 is characterized in that: said fans drive cold air flows through said air channel, and cold air is very fast at the flow velocity at the narrower place in said air channel, and is slower at the flow velocity at the broad place in said air channel.
6. heat abstractor as claimed in claim 1 is characterized in that: a symmetrical rotational symmetry of the said relatively radiating fin in the two sides of said radiating fin.
7. heat abstractor as claimed in claim 1 is characterized in that: these radiating fins are parallel to each other.
8. heat abstractor as claimed in claim 1 is characterized in that: said heating radiator also comprise one can with one treat the base of heat dissipation element joint, these radiating fins are arranged on the said base.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100219320A CN102609060A (en) | 2011-01-19 | 2011-01-19 | Heat abstractor |
| US13/193,626 US20120181000A1 (en) | 2011-01-19 | 2011-07-29 | Heat dissipation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100219320A CN102609060A (en) | 2011-01-19 | 2011-01-19 | Heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102609060A true CN102609060A (en) | 2012-07-25 |
Family
ID=46489887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100219320A Pending CN102609060A (en) | 2011-01-19 | 2011-01-19 | Heat abstractor |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20120181000A1 (en) |
| CN (1) | CN102609060A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107317557A (en) * | 2017-06-22 | 2017-11-03 | 成都希塔科技有限公司 | The system cooling system of high power power amplifier |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102654790A (en) * | 2011-03-03 | 2012-09-05 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation system |
| CN104684336A (en) * | 2013-11-26 | 2015-06-03 | 讯强电子(惠州)有限公司 | Radiator and manufacturing method thereof |
| CN215264351U (en) * | 2021-07-19 | 2021-12-21 | 中强光电股份有限公司 | Heat dissipation module and projection device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020075653A1 (en) * | 2000-12-19 | 2002-06-20 | Lin Shih-Jen | Heat sink |
| US20040244947A1 (en) * | 2003-05-14 | 2004-12-09 | Inventor Precision Co., Ltd. | Heat sinks for a cooler |
| CN2682474Y (en) * | 2003-12-15 | 2005-03-02 | 智翎股份有限公司 | Cooling fin set |
| CN101078949A (en) * | 2006-05-24 | 2007-11-28 | 富准精密工业(深圳)有限公司 | Radiator |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997027619A2 (en) * | 1996-01-27 | 1997-07-31 | Manfred Diels | Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method |
| US6109345A (en) * | 1997-08-28 | 2000-08-29 | Giacomel; Jeffrey A. | Food preparation and storage device |
| US6470962B1 (en) * | 2001-08-24 | 2002-10-29 | Infortrend Technology Inc. | Retaining tool of heat radiator |
| EP1341230A1 (en) * | 2002-02-27 | 2003-09-03 | Spark Electronic S.R.L. | Heat dissipator for integrated circuits |
| US7004236B2 (en) * | 2003-01-29 | 2006-02-28 | Hon Hai Precision Ind. Co., Ltd. | Fan holder |
-
2011
- 2011-01-19 CN CN2011100219320A patent/CN102609060A/en active Pending
- 2011-07-29 US US13/193,626 patent/US20120181000A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020075653A1 (en) * | 2000-12-19 | 2002-06-20 | Lin Shih-Jen | Heat sink |
| US20040244947A1 (en) * | 2003-05-14 | 2004-12-09 | Inventor Precision Co., Ltd. | Heat sinks for a cooler |
| CN2682474Y (en) * | 2003-12-15 | 2005-03-02 | 智翎股份有限公司 | Cooling fin set |
| CN101078949A (en) * | 2006-05-24 | 2007-11-28 | 富准精密工业(深圳)有限公司 | Radiator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107317557A (en) * | 2017-06-22 | 2017-11-03 | 成都希塔科技有限公司 | The system cooling system of high power power amplifier |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120181000A1 (en) | 2012-07-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120725 |