CN102608872A - Absorption stage, placing stage and exposure apparatus - Google Patents
Absorption stage, placing stage and exposure apparatus Download PDFInfo
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- CN102608872A CN102608872A CN2012100155925A CN201210015592A CN102608872A CN 102608872 A CN102608872 A CN 102608872A CN 2012100155925 A CN2012100155925 A CN 2012100155925A CN 201210015592 A CN201210015592 A CN 201210015592A CN 102608872 A CN102608872 A CN 102608872A
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- 238000010521 absorption reaction Methods 0.000 title claims abstract description 160
- 230000007246 mechanism Effects 0.000 claims abstract description 225
- 238000001179 sorption measurement Methods 0.000 claims abstract description 171
- 230000009471 action Effects 0.000 claims description 57
- 238000012423 maintenance Methods 0.000 claims description 29
- 230000008859 change Effects 0.000 claims description 19
- 238000003384 imaging method Methods 0.000 claims description 18
- 230000003287 optical effect Effects 0.000 description 30
- 230000003028 elevating effect Effects 0.000 description 28
- 238000010586 diagram Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 210000000078 claw Anatomy 0.000 description 9
- 230000005855 radiation Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 238000012937 correction Methods 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 8
- 238000007667 floating Methods 0.000 description 8
- 230000010354 integration Effects 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 241000270295 Serpentes Species 0.000 description 5
- 210000001015 abdomen Anatomy 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000008093 supporting effect Effects 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000021615 conjugation Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 210000004932 little finger Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/38—Clamped connections, spring connections utilising a clamping member acted on by screw or nut
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B39/00—Locking of screws, bolts or nuts
- F16B39/02—Locking of screws, bolts or nuts in which the locking takes place after screwing down
- F16B39/12—Locking of screws, bolts or nuts in which the locking takes place after screwing down by means of locknuts
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G7/00—Overhead installations of electric lines or cables
- H02G7/20—Spatial arrangements or dispositions of lines or cables on poles, posts or towers
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention provides an absorption stage, wherein workpieces can be held in a flat state without increasing the working time and lowering the product accuracy. When the absorption stage (40) is in use, a workpiece (22) are held on a flat loading surface (40b). The workpiece (22) is exposed to light so as to be imaged as a predetermined mask pattern, wherein the absorption stage comprises a fixed adsorption mechanism (60) capable of absorbing the workpiece (22) to fix the workpiece (22) relative to the flat loading surface (40b); a plane adsorption mechanism (70) capable of enabling the workpiece (22) to abut against the loading surface (40b) and provided with a plurality of planar adsorption holes (71) opened on the loading surface (40b).
Description
Technical field
The present invention relates to absorptive table that substrates such as tellite and crystal liquid substrate (back literary composition is called workpiece) is kept through absorption and the exposure device that loads this absorptive table.
Background technology
Photoetching process is widely used in various fields; Utilize exposure device; Surface at the workpiece that has applied photosensitive materials such as photoresist; Set mask graph is made public, on substrate, form mask graph through etching procedure then, tellite and crystal liquid substrate etc. also uses exposure device manufacturing.In this exposure device, utilize projecting lens, make the exposure photoimaging that sees through the mask that is formed with set figure on the surface of workpiece, thereby set mask graph is formed on the workpiece.Known a kind of absorptive table in this exposure device, this absorptive table keeps workpiece through suction type, makes the exposure photoimaging in the position (for example, the referenced patent document 1) of the expectation of surface of the work.
On the absorptive table of original exposure device, be provided with as the substrate grain-clamping table of mounting table and run through through hole and pin-receiving moving up and down and the sucker that is formed with holes.On this absorptive table; Bringing in of pin-receiving so that the putting surface from the substrate grain-clamping table stretches out accepted by the next workpiece of carrying arm conveyance; Carrying arm is retreated; Then pin-receiving is reduced, thereby be placed on this workpiece on the putting surface of substrate grain-clamping table, thereby can utilize the mode of this workpiece of sucker absorption to keep this workpiece.
(prior art document)
(patent documentation 1) TOHKEMY 2004-186681 communique
This exposure device is by the imaging of exposure light mask graph to be formed on the workpiece, thereby the relative imaging surface of workpiece that requires to remain on the putting surface is smooth state.Yet, in the absorptive table in above-mentioned past, only be that the substrate that is placed on high surface accuracy adsorbs, thereby, be difficult to (be also referred to as uneven and warpage the deflection that workpiece occurs under the state that is supported by pin-receiving.No matter still be on the part on the whole).For this reason, general consider to take following structure, adsorb by sucker again after promptly making workpiece become flat condition by the workpiece on a plurality of claws pushing putting surfaces.
But, if constitute like this, claw is stretched out on the workpiece that is placed on the loading end and put into, so just cause mask graph to form the increase of needed time (working ability); In addition, may make the surface of the work scratch by a plurality of claw pushing workpiece, the action of claw also possibly make workpiece be infected with dust.And then, there is the possibility that causes the product precision to reduce owing to above-mentioned situation.
Summary of the invention
The present invention In view of the foregoing proposes just, and its purpose is to provide a kind of and can cause the activity duration to increase and the reduction of product precision and can keep the absorptive table of workpiece with smooth state.
Invention described in the technical scheme 1 relates to a kind of absorptive table; Workpiece is remained on the smooth putting surface; Exposure light is made set mask graph exposure by imaging on this workpiece; It is characterized in that, comprising: fixing adsorbing mechanism, adsorbable said workpiece and the attitude of the said relatively putting surface of said workpiece is fixed; The plane adsorbing mechanism; Adsorbable said workpiece and make the face and the said putting surface butt of said workpiece; Said plane adsorbing mechanism has a plurality of plane adsorption holes of on said putting surface, offering; Any one outer rim lighted towards said putting surface from the said putting surface is progressively utilized the absorption action of said plane adsorption hole.
Invention described in the technical scheme 2 is characterised in that; In the absorptive table described in the technical scheme 1; Said plane adsorbing mechanism has a plurality of absorption subregions on said putting surface; Respectively adsorb at this and to have at least 1 said plane adsorption hole in subregion, and respectively adsorb the absorption action that divisional unit carries out said each plane adsorption hole according to said.
Invention described in the technical scheme 3 is characterised in that; In the absorptive table described in technical scheme 1 or 2; Said fixedly adsorbing mechanism has at least 2 fixedly adsorption sections on said putting surface, this each fixedly can be adsorbed onto on the said workpiece with its upper surface the adsorption section.
Invention described in the technical scheme 4 is characterised in that; In the absorptive table described in the technical scheme 3; Said each fixedly adsorbing said workpiece under the state that keeps the adsorption section, and the upper surface of said fixedly adsorption section can change the position along the direction of said putting surface.
Invention described in the technical scheme 5 is characterised in that; In the absorptive table described in the technical scheme 3; Also has lifter pin that said relatively putting surface is advanced and retreat along the orthogonal directions of said putting surface freely, that the upper end has adsorption plane; Under said each state that fixedly adsorption section can be stretched out along said orthogonal directions from said putting surface in the upper surface that makes said fixedly adsorption section; Said workpiece absorption is kept, and keep under the state of said workpiece in absorption, the upper surface of said fixedly adsorption section and said putting surface can become same surface level.
Invention described in the technical scheme 6 is characterised in that; In the absorptive table described in technical scheme 1 or 2; Said plane adsorbing mechanism towards the circumference of said putting surface, utilizes the absorption action of said each plane adsorption hole from the center of said putting surface in order.
Invention described in the technical scheme 7 is characterised in that; In the absorptive table described in technical scheme 1 or 2; Said plane adsorbing mechanism utilizes the absorption action of said each plane adsorption hole in order from the edge portion of the said putting surface direction towards the center of passing said putting surface.
Invention described in the technical scheme 8 is characterised in that; In the absorptive table described in technical scheme 1 or 2; Except said structure; Said plane adsorbing mechanism utilizes the absorption action of ensuing said plane adsorption hole according to the adsorbed state that adsorbs the said plane adsorption hole of action.
Invention described in the technical scheme 9 is characterised in that; In the absorptive table described in technical scheme 1 or 2; Said plane adsorbing mechanism is set the order that the absorption of said each plane adsorption hole is moved according to the deflection of the said workpiece that is kept by said fixedly adsorbing mechanism.
Invention described in the technical scheme 10 is a kind of position of the reference plane as far as the said relatively exposure photoimaging of said workpiece and the mounting table that attitude is controlled, and it is characterized in that, is employed in the absorptive table described in technical scheme 1 or 2.
The exposure device of technical scheme 11 is characterised in that, is employed in the absorptive table described in technical scheme 1 or 2.
Can know according to absorptive table of the present invention; Because plane adsorbing mechanism any lighting the outward edge and adsorb action in order from the putting surface; So; Even workpiece has deflection the outside (outer rim) that the workpiece that is caused by this deflection floats to putting surface is dodged, thereby, can workpiece be adsorbed on the smooth putting surface aptly.Thus, can make workpiece be smooth state absorption and maintenance.
In addition, because said plane adsorbing mechanism can attract (vacuumizing) through a plurality of plane adsorption holes of on putting surface, offering, make workpiece become smooth state, thereby absorptive table can prevent the reduction of product precision.
And; Because said plane adsorbing mechanism can attract (vacuumizing) through a plurality of plane adsorption holes of on putting surface, offering; Make workpiece reach smooth state, thereby, if workpiece is placed on the putting surface; Then can attract (vacuumizing) by each plane adsorption hole at once, form the needed time (working ability) thereby can shorten mask graph.
Except said structure; The plane adsorbing mechanism has a plurality of absorption subregions on said putting surface; In each absorption subregion, have at least 1 plane adsorption hole, and carry out the absorption action of each plane adsorption hole according to each absorption divisional unit, thereby; Can in the adsorbing mechanism of plane, be used to carry out the control that absorption is moved, can make workpiece reach flat condition with simple structure according to the absorption subregion.
Except said structure; Because fixedly adsorbing mechanism has at least 2 fixedly adsorption sections on putting surface; Should be fixedly the adsorption section can be adsorbed onto on the said workpiece with its upper surface, thereby, can adsorb the variation that maintenance prevents the workpiece attitude with fixing adsorption structure through simple structure.
Except said structure; Each fixedly keeps under the state of workpiece in the adsorption section in absorption; Fixedly the upper surface of adsorption section can be along the direction displacement of putting surface, thereby, can keep the attitude of workpiece always; And the action of absorption stage by stage through bringing by the plane adsorbing mechanism, the workpiece that causes because of deflection is floated be easy to dodge laterally.
Except said structure; Also has lifter pin that relative putting surface is advanced and retreat along the orthogonal directions of putting surface freely, that the upper end has adsorption plane; Each fixedly can make under the state that fixedly stretch out along said orthogonal directions from putting surface the upper surface of adsorption section the adsorption section; Said workpiece absorption is kept, and keep under the state of workpiece in absorption, can making fixedly, the upper surface and the putting surface of adsorption section become same surface level; Thereby, can prevent when and lifter pin between the load that applies to workpiece when the hold mode of workpiece shifted.
In addition, can keep the attitude of workpiece always, workpiece undisturbedly is being placed on the putting surface.
Except said structure; The plane adsorbing mechanism from the center of putting surface towards the circumference of putting surface; Progressively utilize the absorption action of plane adsorption hole, thereby, can prevent further that workpiece from floating the skew that causes; Can keep more reliably thus always by fixing adsorbing mechanism each fixedly the adsorption section absorption and definite position and attitude realizes the workpiece planarization.
Except said structure; The plane adsorbing mechanism is from the edge portion of the putting surface direction towards the center of passing putting surface; Progressively utilize the absorption action of plane adsorption hole, thereby, the workpiece that is caused by deflection is floated to the opposing party's edge portion dodge; Can workpiece suitably be adsorbed on the smooth putting surface thus, can workpiece be adsorbed maintenance under smooth state.
Except said structure; The plane adsorbing mechanism is complied with ensuing plane adsorption hole and fixed absorption action according to the adsorbed state that adsorbs the plane adsorption hole of action, thereby; Formerly row has carried out the position (plane adsorption hole) of absorption action; After being adsorbed on workpiece on the putting surface in a suitable manner, can utilizing ensuing plane adsorption hole to adsorb action again, thereby can further realize the workpiece planarization.
Except said structure; Plane adsorbing mechanism basis is by the fixedly deflection of the workpiece of adsorbing mechanism maintenance; Order to the absorption of each plane adsorption hole is moved is set; Thereby, can be according to the workpiece deflection fixed order and carry out the absorption action of each plane adsorption hole, can make workpiece further realize planarization.
In the mounting table that has adopted above-mentioned absorptive table, because workpiece is reached smooth state with very high degree of precision on absorptive table, thereby the position that workpiece is made public with respect to the projection optical system of exposure device is positioned at correct position.
In the exposure device that has adopted above-mentioned absorptive table, workpiece is realized planarization with very high degree of precision on absorptive table, mask graph is exposed on the workpiece by rights.
Description of drawings
Fig. 1 is that medelling representes that the application invents the key diagram of the structure of related exposure device 10.
Fig. 2 is the stereographic map that the structure of mounting table 30 is represented in medelling.
Fig. 3 is the sectional view that the I-I line along Fig. 2 obtains.
Fig. 4 is the stereographic map same with Fig. 2, is illustrated in the situation of base member 31 in the mounting table 30, two Y axle driving mechanisms 32, y-axis shift moving part 33, two X axle driving mechanisms 34 and two X axle moving members 35.
Fig. 5 is the stereographic map same with Fig. 2, is illustrated in the situation that has increased XY adjustment plate 36 and linking part (51,52,53,54) among Fig. 4 again.
Fig. 6 is the key diagram that is used to explain the position relation of two X axle moving members 35, XY adjustment plate 36 and each linking part (51,52,53,54).
Fig. 7 is the stereographic map that the structure of the 1st linking part 51 is represented in medelling.
Fig. 8 is the stereographic map that the structure of the 2nd linking part 52 is represented in medelling.
Fig. 9 is the stereographic map that the structure of the 3rd linking part 53 is represented in medelling.
Figure 10 is the stereographic map that the structure of the 4th linking part 54 is represented in medelling.
Figure 11 is the stereographic map same with Fig. 2, is illustrated in the situation that has increased each Z axle driving mechanism 37 among Fig. 5 again.
Figure 12 is the stereographic map same with Fig. 3, is expressed as the structure of explanation Z axle driving mechanism 37A and its periphery of driving body is amplified.
Figure 13 is the stereographic map that the structure of elevating mechanism 39 is represented in medelling.
Figure 14 is the block diagram of the functional structure of expression mounting table 30.
Figure 15 is the stereographic map that the peripheral structure of suction disc 40 is represented in medelling, representes the state that each lifter pin 39b stretches out towards the top of putting surface 40b.
Figure 15 A is the stereographic map same with Figure 15, and expression will be amplified by the scope of surrounding at the single-point dot-and-dash line shown in Figure 15.
Figure 16 and Figure 15 are the stereographic map that the peripheral structure of suction disc 40 is represented in medelling equally, represent that each lifter pin 39b is pulled to the state of the below of putting surface 40b.
Figure 17 is a medelling front view of watching suction disc 40 from the top.
Figure 18 and Figure 17 are the front view that is used to explain 3 absorption dividing regions (77～79) equally.
Figure 19 is a medelling stereographic map of watching suction disc 40 from rear side.
Figure 20 and Figure 17 are the front view that is used to explain the direction of carrying out other routine absorption action equally.
Description of reference numerals:
10 exposure devices
22 workpiece
30 mounting tables
The 39b lifter pin
40 (as absorptive table) suction disc
The 40b putting surface
60 fixing adsorbing mechanisms
61 (as fixing adsorption section) flange adsorption section
70 plane adsorbing mechanisms
71 plane adsorption holes
Embodiment
Below, invent the embodiment of related mounting table 30 with reference to description of drawings the application.
(embodiment)
At first, describe for the summary structure that has adopted the application to invent the exposure device 10 of related mounting table 30.Fig. 1 is the key diagram of structure of exposure device 10 that medelling representes to invent as the application an example of related exposure device.Exposure device 10 is as shown in Figure 1, has in regular turn from exiting side along optical axis direction: light source 11, Cold Mirrors 12, exposure shutter 13, ultraviolet BPF. 14, integration lens 15, collimation lens 16, level crossing 17, mask platform 18, mask blind area portion 19, projecting lens 20, multiplying power correction portion 21 and mounting table 30 (projection exposure platform).The exposure gloss of this exposure device 10 is with ultraviolet ray.
Cold Mirrors 12 sees through the infrared ray of the infrared spectral range among the light that shines, and reflects the light of other wavelength coverage, thereby can from incident light, isolate the infrared ray of infrared spectral range.Thus, from the emergent light that light source 11 sends, after separating the infrared ray of infrared spectral range, advance towards exposure shutter 13 or ultraviolet BPF. 14 by Cold Mirrors 12.
With regard to said exposure shutter 13, can freely come in and go out on the light path (afterwards stating illumination path) of ultraviolet BPF. 14 at Cold Mirrors 12, thereby can with from the emergent light of Cold Mirrors 12 reflection see through and blocking between switch.This exposure shutter 13 is dodged from light path, then as the back is said can be with workpiece 22 exposures; If be positioned on the light path, the exposure of the workpiece of stating after then making 22 stops.
Ultraviolet ray among the light that ultraviolet ray BPF. 14 only allows to shine sees through.In the present embodiment, by allow wavelength be the mercury of 365nm spectrum line, be that the i tape bandpass filter that the i line sees through constitutes.Thereby, by the emergent light of Cold Mirrors 12 reflection, only stay near the light (actual be the wavelength coverage of i line high-intensity light) of the wavelength coverage of ultraviolet ray (i line) through ultraviolet BPF. 14, and advance towards integration lens 15.
The light that collimation lens 16 will go into to shine is as directional light (light beam) outgoing.Thereby, become the equally distributed emergent light of illumination through integration lens 15, become directional light down and advance in collimation lens 16 effect to level crossing 17, reflect by this level crossing 17 and advance towards mask platform 18.
According to foregoing; In exposure device 10; From the light path of light source 11 and process Cold Mirrors 12, exposure shutter 13, ultraviolet BPF. 14, integration lens 15, collimation lens 16 and level crossing 17, as the illuminating optical system performance function that is used for by ultraviolet ray (i line) the irradiation mask 18a that uses as exposure light.
Between said mask platform 18 and projecting lens 20, be provided with mask blind area portion 19.Mask blind area portion 19 is arranged on the light path through the emergent light of mask 18a free to advance or retreatly; For make among the mask graph of mask 18a, only be the mask graph of desired regions suitably be formed on be placed on mounting table 30 after state on the workpiece 22, and mask blind area portion 19 mask graphs according to mask 18a suitably are inserted on the light path.
Projecting lens 20 is used for making public rightly and after on the mounting table 30, stating on the workpiece 22 being formed on figure on the mask 18a, and the appropriate change multiple and being formed on that remains on the figure (below be also referred to as mask graph) of the mask 18a on the mask platform 18 be positioned over mounting table 30 after state the surface of workpiece 22.That is to say that as imaging surface, this imaging surface and mask 18a form the position relation of conjugation to projecting lens 20 aspect optics with the surface of the workpiece under the state that is positioned over mounting table 30 22.As stated, in exposure device 10, ultraviolet ray (i line) is as exposure light, thereby projecting lens 20 can carry out the high precision aberration correction to ultraviolet ray (i line).Thereby by incident, then projecting lens 20 can be formed on the mask graph of mask 18a the imaging surface (afterwards stating on the workpiece 22) on the mounting table 30 rightly as if the emergent light that has seen through mask 18a.
Between projecting lens 20 and mounting table 30, be provided with multiplying power correction portion 21.According to the strain of after placing on the mounting table 30, stating workpiece 22, multiplying power correction portion 21 makes the mask graph distortion on the imaging surface that is formed on the mounting table 30.This multiplying power correction portion 21 is through making along being orthogonal to multiplying power appropriate change on the face of light path, on any direction, makes mask graph distortion in the imaging surface.Multiplying power correction portion 21 can realize through following structure, that is: this structure example as constitute with the optical axis of projecting lens 20 mutually the mode of quadrature insert several glass plates and make the structure of the suitably crooked or rotation of each glass plate.
Like this; In exposure device 10; Mask blind area portion 19, projecting lens 20 and multiplying power correction portion 21 play a role as projection optical system; In said projection optical system, the ultraviolet ray that the conduct exposure light that passes from the mask 18a that is formed with set figure is used images in the imaging surface (afterwards stating on the workpiece 22) on the mounting table 30 as mask graph.
This workpiece 22 forms according to following mode, on silicon chip, glass substrate or tellite etc., applies or attach the photosensitive materials such as photoresist that occur light reaction for ultraviolet ray (i line).Thereby workpiece 22 can utilize the irradiation of ultraviolet ray (i line) to make public.
In exposure device 10; Emergent light from light source 11 outgoing in illuminating optical system passes through Cold Mirrors 12, ultraviolet BPF. 14, integration lens 15, collimation lens 16 and level crossing 17; Transmit to mask platform 18, thereby ultraviolet ray capable of using (i line) is likewise shone the mask 18a that remains on the mask platform 18.So, in exposure device 10, utilize effect as mask blind area portion 19, projecting lens 20 and the multiplying power correction portion 21 of projection optical system, the mask graph that utilizes ultraviolet ray (i line) to obtain suitably is formed on the mounting table 30.In view of the above, in exposure device 10, workpiece 22 is positioned over the suitable position (attitude) along imaging surface, mask graph is made public rightly on workpiece 22.The position of workpiece 22 relative these mask graphs, be workpiece 22, can adjust (aligning) on imaging surface through the workpiece 22 that is kept by mounting table 30 is suitably moved with respect to position via the mask 18a of projection optical system.
The mounting table 30 that in the exposure device that the present invention relates to 10, is adopted has 31,2 Y axle driving mechanisms 32 of base member, moving 34,2 the X axle moving device 35 of 33,2 X axle driving mechanisms of device of y-axis shift, 36,3 Z axle driving mechanisms 37 of XY adjustment plate, Z axial adjustment plate 38, elevating mechanism 39 and suction disc 40 like Fig. 2 and shown in Figure 3.
2 Y axle driving mechanisms 32 are located at the end positions along X-direction at the upper surface of base member 31 shown in Fig. 2 to Fig. 4.The moving device 33 of 32 pairs of y-axis shifts of said two Y axle driving mechanisms applies along the driving force of the Y direction of base member 31.The moving device 33 of this y-axis shift is in central authorities and has the tabular of through hole 33a, along the reference plane setting.
Each Y axle driving mechanism 32 all be with after state the same structure of X axle driving mechanism 34, have Y axle retaining element 32a, a pair of base side Y axle guide member 32b, omit illustrated Y axle movable element and a pair of moving device side Y axle guide member.At the upper surface of base member 31, Y axle retaining element 32a arranges formation along Y direction with the mode that different magnetic poles adjoins each other with a plurality of permanent magnets, thereby constitutes so-called electromagnetic path.Two base side Y axle guide member 32b form with paired setting of the mode of clamping Y axle retaining element 32a, and extend along Y direction at the upper surface of base member 31.The a pair of moving device side Y axle guide member (not shown) of said two base side Y axle guide member 32b and the lower surface (back side) that is arranged on the moving device 33 of y-axis shift, together chimeric sliding freely along bearing of trend (Y direction).Omit the lower surface (back side) of illustrated Y axle movable element at the moving device 33 of y-axis shift, with and the mutual opposed mode of Y axle retaining element 32a be arranged on this between the moving device side Y axle guide member (not shown).At this Y axle movable element (not shown) but in accommodate the coil of impressed current.
For each Y axle driving mechanism 32, suitably act between Y axle movable element (not shown) and the Y axle retaining element 32a through making the attraction repulsive force that causes by magnetic force, thereby the moving device of the y-axis shift that is fixed with Y axle movable element 33 is moved along Y direction.And in the present embodiment, Y direction plays a role as the 1st direction along reference plane, and two Y axle driving mechanisms 32 play a role as the 1st driving mechanism, and the moving device 33 of y-axis shift plays a role as the 1st slip device.In addition, for the y-axis shift that detects in base member 31 moves the position of device 33, and be provided with position detecting element (omitting diagram).In addition, for two Y axle driving mechanisms 32, both synchro control so that the moving device 33 of single y-axis shift move.
In mounting table 30; Drive control part 43 (with reference to Figure 14) through the portion of setting within it; The impressed current that synchro control applies two Y axle movable elements (not shown); Make the attraction repulsive force that effect is caused by magnetic force between two Y axle movable elements and the two Y axle retaining element 32a, thereby cause that the moving device 33 of the y-axis shift that is fixed with two Y axle movable elements moves.At this moment, owing in drive control part 43, utilize the attraction repulsive force that causes by magnetic force to move, thereby, carrying out servocontrol according to the detected positional information of position detecting element (not shown), can suitably move towards the moving target position of having set.The moving device 33 of y-axis shift is provided with 2 X axle driving mechanisms 34.
2 X axle driving mechanisms 34 are set at the end positions along Y direction of the upper surface of the moving device 33 of y-axis shift.The X axle moving device 35 (35A, 35B) of 34 pairs of correspondences of said each X axle driving mechanism applies the driving force of the X-direction of pointing to the moving device 33 of y-axis shift.Said two X axle moving device 35 are tabular that length equates substantially, at the first-class height of Z-direction (upper-lower position), dispose along the X axle.
Each X axle driving mechanism 34 has X axle retaining element 34a, a pair of base side X axle guide member 34b, X axle movable element 34c and a pair of moving device side X axle guide member 34d.At the upper surface of the moving device 33 of y-axis shift, X axle retaining element 34a arranges formation along X-direction with the mode that different magnetic poles adjoins each other with a plurality of permanent magnets, thereby constitutes so-called electromagnetic path.Two base side X axle guide member 34b form with paired setting of the mode of clamping X axle retaining element 34a, and extend along X-direction at the upper surface of the moving device 33 of y-axis shift.Said two base side X axle guide member 34b and a pair of moving device side X axle guide member 34d that is arranged on the lower surface (back side) of X axle moving device 35, together chimeric sliding freely along bearing of trend.X axle movable element 34c is at the lower surface (back side) of X axle moving device 35, with the mutual opposed mode of X axle retaining element 34a (with reference to figure 3) to be set.But in this X axle movable element 34c, accommodate the coil of impressed current.
Said 2 X axle driving mechanisms 34, wherein a side (being called 34A when describing separately) is provided with the mode corresponding to X axle moving device 35A; The opposing party's (being called 34B when describing separately) is provided with the mode corresponding to X axle moving device 35B.That is, X axle driving mechanism 34A makes the X axle moving device 35A in order to make a side move and be provided with along X-direction, and X axle movable element 34c is arranged on the lower surface of X axle moving device 35A; In addition, X axle driving mechanism 34B is that X axle movable element 34c is arranged on the lower surface of X axle moving device 35B for the X axle moving device 35B that makes the opposing party moves and is provided with along X-direction.
Each X axle driving mechanism 34 acts between X axle movable element 34c and the X axle retaining element 34a through making the attraction repulsive force that is caused by magnetic force, thereby the X axle moving device 35 (35A or 35B) by correspondence is moved along X-direction.And; In the present embodiment; X-direction as playing a role along reference plane and the 2nd direction that be orthogonal to the 1st direction, is played a role each X axle driving mechanism 34 as the 2nd driving mechanism, each X axle moving device 35 is played a role as the 2nd slip device.In order to detect each the X axle moving device 35A on the moving device 33 of said y-axis shift, the position of 35B, omit illustrated position detecting element and be provided with.In addition; In the present embodiment; The reference position of the drive controlling that will be undertaken by two X axle driving mechanisms 34 (towards moving of X-direction) is defined as: the middle position that is positioned at the scope that X axle moving device 35A and X axle moving device 35B can move along the X axle; And its state is at X axle moving device 35A and the X axle moving device 35B upper surface at the moving device 33 of y-axis shift, arrange along Y direction and form (with reference to figure 4 etc.).
In mounting table 30; Drive control part 43 (with reference to Figure 14) through the portion of setting within it; Control the impressed current of carrying to each X axle movable element 34c respectively; Make the attraction repulsive force generation effect in a suitable manner between X axle movable element 34c and X axle retaining element 34a that causes by magnetic force, move separately or integrally thereby make by the fixing X axle moving device 35 (35A or 35B) of X axle movable element 34c.At this moment, utilizations caused by magnetic force in drive control part 43 attraction repulsive force carries out because this moves, thereby, carry out servocontrol according to the detected positional information of position detecting element (not shown), with suitably mobile to the moving target position of having set.XY adjustment plate 36 is provided with (with reference to figure 5) with the mode that is erected between said 2 X axle moving device 35.
Herein; As shown in Figure 6; On XY adjustment plate 36, the position that connects the 1st linking part 51 is plate side the 1st supporting-point Sb1, and the position that connects the 2nd linking part 52 is plate side the 2nd supporting-point Sb2; The position that connects the 3rd linking part 53 is plate side the 3rd supporting-point Sb3, and the position that connects the 4th linking part 54 is plate side the 4th supporting-point Sb4.In addition, on X axle moving device 35A, the position that connects the 1st linking part 51 is moving device side the 1st supporting-point Ss1, and the position that connects the 3rd linking part 53 is moving device side the 3rd supporting-point Ss3.And on X axle moving device 35B, the position that connects the 2nd linking part 52 is moving device side the 2nd supporting-point Ss2, and the position that connects the 4th linking part 54 is moving device side the 4th supporting-point Ss4.In the present embodiment, watch from Z axle forward, each supporting-point (Sb1, Sb12, Sb3, Sb4) on the XY adjustment plate 36 disposes according to depicting foursquare mode as.
For the 1st linking part 51; It is on same straight line that plate side the 1st supporting-point Sb1 and moving device side the 1st supporting-point Ss1 watch from Z axle forward one side; And X axle moving device 35A and XY adjustment plate 36 are linked together by following mode; That is: allow X axle moving device 35A and XY adjustment plate 36 under the state that relative position relation has been fixed, rotate relatively around the reference axis Ba that passes 2 supporting-point Sb1, Ss1.In the present embodiment; The 1st linking part 51 is as shown in Figure 7, has the concatenating group part 51a that is fixed on that X axle moving device 35A goes up and extends along Z-direction and the rotating part 51c being provided with respect to the mode of the elongated end part 51b rotation of this concatenating group part 51a.This concatenating group part 51a is cylindric, and the central shaft of stipulating it is along the Z axle.Rotating part 51c is the surrounded ring-type of elongated end part 51b with concatenating group part 51a, and centers on the central shaft of concatenating group part 51a, and elongated end part 51b rotates freely relatively.And the rotating part 51c of the 1st linking part 51 is fixed on the XY adjustment plate 36.
In the 1st linking part 51; Because concatenating group part 51a and rotating part 51c can be around the central shaft rotations of concatenating group part 51a; Thereby; Both allowed to be provided with the relative rotation around central shaft of X axle moving device 35A with the XY adjustment plate 36 that is provided with rotating part 51c of concatenating group part 51a, and also X axle moving device 35A and XY had been adjusted plate 36 and link together.Thereby in the 1st linking part 51, the central shaft of concatenating group part 51a is reference axis Ba, and the center of concatenating group part 51a is moving device side the 1st supporting-point Ss1, and the center of rotating part 51c is plate side the 1st supporting-point Sb 1.
The 2nd linking part 52 links up X axle moving device 35B and XY adjustment plate 36 according to following mode; That is: not only allow plate side the 2nd supporting-point Sb2 and moving device side the 2nd supporting-point Ss2 relative position to be changed, rotate (with reference to figure 6 etc.) relatively but also allow X axle moving device 35B and XY adjustment plate 36 to center on the Z axle towards the 3rd direction along X-Y plane.Said the 2nd linking part 52 is as shown in Figure 8 to have: be fixed on that X axle moving device 35B goes up and the concatenating group part 52a that extends along Z-direction; Can be with respect to the binding rotating part 52b of this concatenating group part 52a rotation; The track retaining part 52c of end face fixed thereon; Remain on the track 52d on this track retaining part 52c slidably; With the mounting portion 52e that is fixed on this track 52d.Said concatenating group part 52a be cylindric and its central shaft along the Z axle.Link rotating part 52b and be diameter dimension than smaller cylindric of concatenating group part 52a, be arranged on concatenating group part 52a concentric position on.Said binding rotating part 52b can rotate around the central shaft of concatenating group part 52a freely.Track retaining part 52c to be can keeping track 52d to the mode that following the 3rd direction is slided, the 3rd direction be along the direction of X-Y plane and with X axle (the 2nd direction) and Y axle (the 3rd direction) direction of oblique relatively.It is upwardly extending shaft-like and be fixed on mounting portion 52e the 3rd side that track 52d is.Mounting portion 52e is cylindric and is fixed on the XY adjustment plate 36.Thereby track 52d is fixed to through mounting portion 52e on the XY adjustment plate 36.In the present embodiment; On XY adjustment plate 36; The bearing of trend of track 52d i.e. the 3rd direction; Be consistent, and then be that the foursquare diagonal line described by each supporting-point (Sb1, Sb2, Sb3, Sb4) is consistent with the direction of this part straight line that plate side the 2nd supporting-point Sb2 and plate side the 1st supporting-point Sb1 are linked up.Thereby the 3rd direction all has the angle of 45 degree with respect to X axle (the 2nd direction) and Y axle (the 1st direction).In addition,, in the present embodiment, can adjust plate 36 with respect to XY and fix, also can fix with respect to X axle moving device 35B for the 3rd direction.
In the 2nd linking part 52; Track 52d and track retaining part 52c can relatively move towards the 3rd direction; And, but link rotating part 52b and concatenating group part 52a also winding be equipped with this track retaining part 52c binding rotating part 52b central shaft and rotate relatively.Thereby; The 2nd linking part 52 not only allows the X axle moving device 35B that is provided with concatenating group part 52a towards the 3rd direction relative position to be changed with the XY adjustment plate 36 that is provided with track 52d (mounting portion 52e); Also allow X axle moving device 35B and XY adjustment plate 36 to rotate relatively, and X axle moving device 35B and XY adjustment plate 36 are linked up around the central shaft of concatenating group part 52a (linking rotating part 52b).Thereby in the 2nd linking part 52, the center of concatenating group part 52a is moving device side the 2nd supporting-point Ss2, and the center of track 52d (mounting portion 52e) is plate side the 2nd supporting-point Sb2.The 2nd linking part 52 is provided with by following mode; That is: plate side the 2nd supporting-point Sb2 and moving device side the 2nd supporting-point Ss2 are separately positioned on X axle moving device 35B and the XY adjustment plate 36; And when X axle moving device 35A and X axle moving device 35B are positioned at the reference position of drive controlling, make plate side the 2nd supporting-point Sb2 watch be located along the same line (central shaft of the center of track 52d (central shaft of mounting portion 52e) and concatenating group part 52a becomes consistent) from Z axle forward one side with moving device side the 2nd supporting-point Ss2.
The 3rd linking part 53 links up X axle moving device 35A and XY adjustment plate 36 according to following mode; That is: not only allow plate side the 3rd supporting-point Sb3 and moving device side the 3rd supporting-point Ss3 relative position to be changed, rotate (with reference to figure 6 etc.) relatively but also allow X axle moving device 35A and XY adjustment plate 36 to center on the Z axle towards direction along X-Y plane.Said the 3rd linking part 53 is as shown in Figure 9 to have: be fixed on the 1st track 53a on the X axle moving device 35A; The 1st track retaining part 53b that keeps the 1st track 53a slidably; Be fixed on the fixed head part 53c on the 1st track retaining part 53b; Be fixed on the 2nd track retaining part 53d on this fixed head part 53c; Remain on the 2nd track 53e of the 2nd track retaining part 53d slidably; Be fixed on the turning axle part 53f on the 2nd track 53e; The rotating part 53g that is provided with mode with the rotation of this turning axle part 53f relatively.Said the 1st track 53a be along Y direction extend shaft-like.The 1st track retaining part 53b keeps the 1st track 53a with the mode of sliding along bearing of trend.Fixed head part 53c is shaft-like, is provided with the 1st track retaining part 53b in its lower face side, is provided with the 2nd track retaining part 53d in upper surface side simultaneously, and the position relation of the 1st track retaining part 53b and the 2nd track retaining part 53d is fixed.The 2nd track retaining part 53d keeps the 2nd track 53e with the mode of sliding along X-direction.The 2nd track 53e be along X-direction extend shaft-like, on its bearing of trend, slide freely and be maintained on the 2nd track retaining part 53d.Turning axle part 53f is cylindric, and central shaft is fixed on the 2nd track 53e along the Z axle.Rotating part 53g is the ring-type that turning axle part 53f is centered on, and can rotate freely around the central shaft of turning axle part 53f.And rotating part 53g is fixed on the XY adjustment plate 36.
In the 3rd linking part 53; The 1st track 53a and the 1st track retaining part 53b can relatively move to Y direction; And the 2nd track retaining part 53d and the 2nd track 53e can relatively move to X-direction; And turning axle part 53f and rotating part 53g rotate around the central shaft that is arranged on the turning axle part 53f on the 2nd track 53e relatively.Thereby; The 3rd linking part 53 links up X axle moving device 35A and XY adjustment plate 36 according to following mode; That is: the X axle moving device 35A that not only allows to be provided with the 1st track 53a changes relative position with the XY adjustment plate 36 that is provided with rotating part 53g towards the direction along X-Y plane, but also allows X axle moving device 35A and the central shaft that XY adjustment plate 36 centers on turning axle part 53f to rotate relatively.Thereby in the 3rd linking part 53, the center of the 1st track 53a is moving device side the 3rd supporting-point Ss3, and the center of rotating part 53g is plate side the 3rd supporting-point Sb3.Said the 3rd linking part 53 is provided with by following mode; That is: plate side the 3rd supporting-point Sb3 and moving device side the 3rd supporting-point Ss3 are separately positioned on X axle moving device 35A and the XY adjustment plate 36; And when X axle moving device 35A and X axle moving device 35B are positioned at the reference position of drive controlling, make plate side the 3rd supporting-point Sb3 watch be located along the same line (straight line along the Z axle becomes consistent the central shaft of turning axle part 53f with the center of passing the 1st track 53a) from Z axle forward one side with moving device side the 3rd supporting-point Ss3.Promptly; Watch the 3rd linking part 53 from forward one side of Z axle; Interval between plate side the 3rd supporting-point Sb3 and moving device side the 3rd supporting-point Ss3 does not change (with distance maintaining in set size), can make plate side the 3rd supporting-point Sb3 and moving device side the 3rd supporting-point Ss3 produce change towards the relative position along the direction of X-Y plane.
The 4th linking part 54 links up X axle moving device 35B and XY adjustment plate 36 according to following mode; That is: not only allow plate side the 4th supporting-point Sb4 and moving device side the 4th supporting-point Ss4 relative position to be changed, rotate (with reference to figure 6 etc.) relatively but also allow X axle moving device 35B and XY adjustment plate 36 to center on the Z axle towards direction along X-Y plane.Said the 4th linking part 54 is shown in figure 10 to have: be fixed on the 1st track 54a on the X axle moving device 35B; The 1st track retaining part 54b that keeps the 1st track 54a slidably; Be fixed on the fixed head part 54c on the 1st track retaining part 54b; Be fixed on the 2nd track retaining part 54d on this fixed head part 54c; Remain on the 2nd track 54e of the 2nd track retaining part 54d slidably; Be fixed on the turning axle part 54f on the 2nd track 54e; The rotating part 54g that is provided with mode with the rotation of this turning axle part 54f relatively.Said the 1st track 54a be along X-direction extend shaft-like.The 1st track retaining part 54b keeps the 1st track 54a with the mode of sliding along bearing of trend.Fixed head part 54c is shaft-like, is provided with the 1st track retaining part 54b in its lower face side, is provided with the 2nd track retaining part 54d in upper surface side simultaneously, and the position relation of the 1st track retaining part 54b and the 2nd track retaining part 54d is fixed.The 2nd track retaining part 54d keeps the 2nd track 54e with the mode of sliding along Y direction.The 2nd track 54e be along Y direction extend shaft-like, on its bearing of trend, slide freely and be maintained on the 2nd track retaining part 54d.Turning axle part 54f is cylindric, and central shaft is fixed on the 2nd track 54e along the Z axle.Rotating part 54g is the ring-type that turning axle part 54f is centered on, and can rotate freely around the central shaft of turning axle part 54f.And rotating part 54g is fixed on the XY adjustment plate 36.
In the 4th linking part 54; The 1st track 54a and the 1st track retaining part 54b are relatively moved towards X-direction; And the 2nd track retaining part 54d and the 2nd track 54e are relatively moved towards Y direction; And, rotating part 54g and turning axle part 54f are rotated around the central shaft that is arranged on the turning axle part 54f on the 2nd track 54e relatively.Thereby; For the 4th linking part 54; On one side be not only to allow to be arranged on the X axle moving device 35B on the 1st track 54a and the XY adjustment plate 36 that is arranged on the rotating part 54g changes relative position towards the direction along X-Y plane; Also allow around the relative rotation of the central shaft of turning axle part 54f, another side links up X axle moving device 35B and XY adjustment plate 36.Thereby in the 4th linking part 54, the center of the 1st track 54a is moving device side the 4th supporting-point Ss4, and the center of rotating part 54g is plate side the 4th supporting-point Sb4.Said the 4th linking part 54 is provided with by following mode; That is: plate side the 4th supporting-point Sb4 and moving device side the 4th supporting-point Ss4 are separately positioned on X axle moving device 35A and the XY adjustment plate 36; And when X axle moving device 35A and X axle moving device 35B are positioned at the reference position of drive controlling, make plate side the 4th supporting-point Sb4 watch be located along the same line (straight line along the Z axle becomes consistent the central shaft of turning axle part 54f with the center of passing the 1st track 54a) from Z axle forward one side with moving device side the 4th supporting-point Ss4.Promptly; Watch the 4th linking part 54 from forward one side of Z axle; Interval between plate side the 4th supporting-point Sb4 and moving device side the 4th supporting-point Ss4 does not change (with distance maintaining in set size), can make plate side the 4th supporting-point Sb4 and moving device side the 4th supporting-point Ss4 produce change towards the relative position along the direction of X-Y plane.
Thereby, for XY adjustment plate 36, suitably move in base member 31 upper edge Y directions through making the moving device 33 of y-axis shift, can be adjusted at the position on the Y direction; And, together move through making two X axle moving device 35 (35A, 35B) along X-direction, can be adjusted at the position on the X-direction, XY adjustment plate 36 can be freely moves along the direction of X-Y plane thus.In addition; XY adjustment plate 36 is as shown in Figure 6; Through X axle moving device 35A and X axle moving device 35B are suitably moved in base member 31 upper edge X-directions individually, thereby can be that rotation center carries out the adjustment (reference arrow A1) around the rotation attitude of Z axle with reference axis Ba.At this moment; On XY adjustment plate 36; With reference axis Ba is that basic point is rotated the following variation of meeting generation; This variation is plate side the 2nd supporting-point Sb2 and moving device side the 2nd supporting-point Ss2, plate side the 3rd supporting-point Sb3 and moving device side the 3rd supporting-point Ss3 and plate side the 4th supporting-point Sb4 and moving device side the 4th supporting-point Ss4 in the change part along the direction of X-Y plane; Said change part utilizes the 2nd linking part 52 absorbing to the displacement along the X-Y plane direction to the displacement of the 3rd direction and the 3rd linking part 53 and the 4th linking part 54, thereby, can support by two X axle moving device 35 (35A, 35B).In addition; Owing to adopted the structure that in XY adjustment plate 36, only allows the 2nd linking part 52 to carry out displacement, can make the position relation of the relative X axle of X axle moving device 35B moving device 35A set up corresponding one by one around the rotation attitude of reference axis Ba with XY adjustment plate 36 to the 3rd direction.Thereby in the present embodiment, XY adjustment plate 36 plays a role as plane adjustment plate, the effect of two X axle driving mechanisms 34 and two X axle moving device, 35 performance rotary drive mechanisms.
In this XY adjustment plate 36, be provided with 3 support inserting hole 36a, 36b, 36c that are provided with the mode of surrounding the center and the central through hole 36d that is arranged on its central authorities.3 support inserting hole 36a, 36b, 36c and 3 Z axle driving mechanisms 37 are corresponding and establish.Watch from Z axle forward one side; The size regulation of the through hole 36d of central authorities is smaller than the through hole 33a of the moving device 33 of y-axis shift; When X axle moving device 35A and X axle moving device 35B were positioned at the reference position of drive controlling, central through hole 36d was positioned at the center of through hole 33a.
3 Z axle driving mechanisms 37 all are set at XY adjustment plate 36 downsides (rear side) (with reference to figure 1 and Figure 12).Each Z axle driving mechanism 37 is for setting (adjustment) and set in the position of Z-direction and with respect to the inclination of Z axle workpiece 22 (with reference to figure 1).In the present embodiment, 3 Z axle driving mechanisms 37 are shown in figure 11, and 1 (being referred to as 37A when describing separately) is positioned at the top of X axle moving device 35A, and remaining 2 (being referred to as 37B, 37C when describing separately) are positioned at the top of X axle moving device 35B.Said each Z axle driving mechanism 37 is because basic structure equates that thereby following summary structure with regard to Z axle driving mechanism 37A describes and other part is omitted.
Z axle driving mechanism 37A is shown in figure 12 to have: CD-ROM drive motor 37a, transformation component 37b, transmitter shaft 37c, the mobile 37d of bearing portion, the 1st moving part 37e, the 1st guide portion 37f, the 2nd guide portion 37g, the 2nd guiding maintaining part 37h, the 2nd moving part 37i, the 3rd guide portion 37j, the 3rd guiding maintaining part 37k, ball pivot axle 37l, the 37m of globe bearing portion and Z axle moving part 37n.
For CD-ROM drive motor 37a, the drive control part 43 (with reference to Figure 14) of the inside through being arranged on mounting table 30 is suitably controlled impressed current, makes it receive driven in rotation.Adopt step motor among this CD-ROM drive motor 37a.The output shaft of CD-ROM drive motor 37a is connected on the transformation component 37b.Transmitter shaft 37c is connected on the transformation component 37b, changes the rotation motion of CD-ROM drive motor 37a the advance and retreat motion of transmitter shaft 37c on Y direction into.Transmitter shaft 37c be Y direction extend shaft-like, and remain on along Y direction free to advance or retreatly and to move on the 37d of bearing portion.The mobile bearing 37d of portion is being fixed at the back side at XY adjustment plate 36, and this moves the 37d of bearing portion and plays and move booster action from the transmitter shaft 37c of the driving force effect of CD-ROM drive motor 37a output in the Y direction advance and retreat to receiving.
The 1st moving part 37e is fixed on the transmitter shaft 37c.The 1st moving part 37e is the so-called wedge shape that upper surface tilts along X-Y plane, the relative X-Y plane of lower surface, and upper surface keeps by the 1st guide portion 37f sliding freely.The 1st guide portion 37f is on Y direction, extend shaft-like, is fixed on the back side of XY adjustment plate 36.Thereby the 1st moving part 37e can follow transmitter shaft 37c to move and move towards the Y direction advance and retreat towards the advance and retreat on the Y direction.
The 2nd guide portion 37g is along below the 1st moving part 37e and be fixed.The 2nd guide portion 37g be shaft-like and along Y-Z plane and oblique to the Y axle on direction extend.The 2nd guide portion 37g remains on the 2nd guiding maintaining part 37h.The 2nd guiding maintaining part 37h keeps the 2nd guide portion 37g with the mode of on bearing of trend, sliding freely, and the 2nd guiding maintaining part 37h is fixed on the 2nd moving part 37i.
The 2nd moving part 37i is column, has the arm portion 37o that extends along Y week direction.The top lower surface with the 1st moving part 37e of arm portion 37o is parallel.The 2nd guiding maintaining part 37h be fixed on arm portion 37o above.In the 2nd moving part 37i, watch from forward one side of Y axle, the 3rd guide portion 37j is fixed on and the opposite side of the extended side of arm portion 37o.The 3rd guide portion 37j is shaft-like, extends along Z-direction.The 3rd guide portion 37j is maintained on the 3rd guiding maintaining part 37k.The 3rd guiding maintaining part 37k keeps the 3rd guide portion 37j on bearing of trend freely slidably, is fixed on the stretching wall 36e of XY adjustment plate 36.Stretching wall 36e extends towards downside along the Z axle from the back side of XY adjustment plate 36.
Thus; For the 2nd moving part 37i; If the 1st moving part 37e moves along the Y direction advance and retreat; Then be connected on the 1st moving part 37e through the 2nd guide portion 37g and the 2nd guiding maintaining part 37h, thereby, along the channeling direction of the 3rd guide portion 37j and the 3rd guiding maintaining part 37k, be that the Z-direction advance and retreat move.That is, if transmission shaft 37c advances (the 1st moving part 37e separates with CD-ROM drive motor 37a), then the 2nd moving part 37i moves towards the negative direction of Z axle; If transmission shaft 37c retreats (the 1st moving part 37e is near CD-ROM drive motor 37a), then the 2nd moving part 37i moves towards the positive dirction of Z axle.What can realize this motion is each Z axle driving mechanism 37, and this is because each Z axle driving mechanism 37 is so-called wedge mechanisms.For the 2nd moving part 37i and the 3rd guide portion 37j that move along Z-direction advance and retreat, be fixed on the XY adjustment plate 36 and the height on Z-direction is taken as constant stretching wall 36e and the 3rd guiding maintaining part 37k, their bottom is all in the space between X axle moving device 35A and X axle moving device 35B.
Be provided with ball pivot axle 371 on the top of the 2nd moving part 37i.This ball pivot axle 371 extends setting along Z-direction, and elongated end forms spherical (37p).The globular part 37p of ball pivot axle 371 is kept by the 37m of globe bearing portion.The globular part 37p that the 37m of globe bearing portion makes ball pivot axle 371 keeps along its spherical shape sliding freely.Above the 37m of globe bearing portion, be provided with Z axle moving part 37n.Z axle moving part 37n is column.Relative the 2nd moving part 37i of Z axle moving part 37n is around the center of the globular part 37p of ball pivot axle 371 and swing freely.
Thereby; In Z axle driving mechanism 37A; Under the effect of the suitable driven in rotation of CD-ROM drive motor 37a, the 1st moving part 37e moves to the Y direction advance and retreat, then follows the 1st moving part 37e to move to the advance and retreat of Y direction; The 2nd moving part 37i moves to the Z-direction advance and retreat; Thereby for the XY adjustment plate 36 that is mounted through moving the 37d of bearing portion, the 1st moving part 37e and the 3rd guiding maintaining part 37k, the Z axle moving part 37n that is installed on the 2nd moving part 37i through ball pivot axle 371 and the 37m of globe bearing portion moves along the Z-direction advance and retreat.
Each Z axle driving mechanism 37 is set at respectively in each support inserting hole (36a, 36b, 36c) of XY adjustment plate 36 as stated.Particularly; Shown in Figure 11; The Z axle moving part 37n of Z axle driving mechanism 37A is inserted among the support inserting hole 36a, and the Z axle moving part 37n of Z axle driving mechanism 37B is inserted among the support inserting hole 36b, and the Z axle moving part 37n of Z axle driving mechanism 37C is inserted among the support inserting hole 36c.Above Z axle driving mechanism 37 Z axle moving part 37n separately, be provided with the adjustment plate support (37q, 37r, 37s) that is used to support Z axial adjustment plate 38.Thereby in the present embodiment, the Z axle becomes the 4th direction with the reference plane quadrature, and Z axial adjustment plate 38 plays a role as the 4th direction adjustment plate, and each Z axle driving mechanism 37 plays a role as the 4th direction driving mechanism.In addition; In each Z axle driving mechanism 37; CD-ROM drive motor 37a, transformation component 37b, transmitter shaft 37c, the mobile 37d of bearing portion, the 1st moving part 37e, the 1st guide portion 37f, the 2nd guide portion 37g, the 2nd guiding maintaining part 37h, the 2nd moving part 37i, the 3rd guide portion 37j, the 3rd guiding maintaining part 37k, ball pivot axle 37l, the 37m of globe bearing portion and Z axle moving part 37n all play a role as driving body.
As the adjustment plate support 37q on the Z axle moving part 37n that is arranged on Z axle driving mechanism 37A, be cylindric and be fixed on both allocations at the back side of Z axial adjustment plate 38.Promptly; Be arranged on and utilize ball pivot axle 371 and the 37m of globe bearing portion to become on the swing Z axle moving part 37n freely owing to adjusting plate support 37q; So; Adjustment plate support 37q allows the tilt variation of Z axial adjustment plate 38 relative X-Y planes on one side, one side support Z axial adjustment plate 38 with both allocations.And adjustment plate support 37q plays a role as the 1st support of the 4th direction driving mechanism.
The adjustment plate support 37r that on the Z axle moving part 37n of Z axle driving mechanism 37B, is provided with; Has long guideway; And guide rail is kept by the guide rail maintaining part at the back side that is arranged on Z axial adjustment plate 38 (omitting diagram) slidably, thereby is connected to the back side of Z axial adjustment plate 38.This guide rail is provided with according to following mode, that is: the axis of the adjustment plate support 37q of Z axle driving mechanism 37A (Z axle moving part 37n) is positioned on the bearing of trend of guide rail, in other words extends to said axis.Adjustment plate support 37r is set on the swing Z axle moving part 37n freely utilizing ball pivot axle 371 to become with the 37m of globe bearing portion; This adjustment plate support 37r allows the tilt variation of Z axial adjustment plate 38 relative X-Y planes on one side, on one side with along the bearing of trend of the guide rail mode of the displacement back side of supporting Z axial adjustment plate 38 freely.And adjustment plate support 37r is that the 2nd support of the 4th direction driving mechanism plays a role.
Be arranged on the adjustment plate support 37s on the Z axle moving part 37n of Z axle driving mechanism 37C, be cylindric and be connected to the back side of Z axial adjustment plate 38 freely slidably.Promptly; Adjustment plate support 37s is set on the swing Z axle moving part 37n freely utilizing ball pivot axle 371 to become with the 37m of globe bearing portion; This adjustment plate support 37s allows the tilt variation of Z axial adjustment plate 38 relative X-Y planes on one side, Yi Bian support Z axial adjustment plate 38 freely movably.And adjustment plate support 37s is that the 3rd support of the 4th direction driving mechanism plays a role.
As shown in Figure 2, Z axial adjustment plate 38 is to place the plate-shaped member that workpiece 22 (with reference to figure 1) is adsorbed the suction disc 40 of maintenance.Z axial adjustment plate 38 is height of adjusting Z-direction through each Z axle driving mechanism 37 of driven in synchronism.In addition, through driving each Z axle driving mechanism 37 in a suitable manner individually, thereby can adjust the tilt variation of Z axial adjustment plate 38 relative X-Y planes.At this moment; In Z axial adjustment plate 38; The position that the adjustment plate support 37q of Z axle driving mechanism 37A is fixed is as basic point; The change part at the interval separately that causes by the difference in height of the adjustment plate support 37s of the adjustment plate support 37r of this adjustment plate support 37q, Z axle driving mechanism 37B and Z axle driving mechanism 37C; Displacement and the displacement on adjustment plate support 37s at bearing of trend through at the guide rail on the adjustment plate support 37r absorb, thereby, can utilize each Z axle driving mechanism 37 to support.In addition; In Z axial adjustment plate 38; Owing to adopted the adjustment plate support 37r that only allows Z axle driving mechanism 37B along the structure that changes the position on the bearing of trend of guide rail; So be used as basic point to the position that the adjustment plate support 37q to Z axle driving mechanism 37A fixes, can prevent to rotate around the Z axle.
As shown in Figure 3, in Z axial adjustment plate 38, be provided with tool microscope 41 and ultrasonic sensor 42.Tool microscope 41 is fixed on the inner peripheral portion that omits illustrated central inserting hole 38a with ultrasonic sensor 42.Tool microscope 41, extends in the central through hole 36d of space between X axle moving device 35A and X axle moving device 35B and XY adjustment plate 36 towards the below from central inserting hole 38a.Tool microscope 41 is to be used for microscope that the reference position of the Z axial adjustment plate 38 relative with the projection optical system of exposure device 10 (XY adjusts plate 36) is adjusted; Z axial adjustment plate 38 being fixed through central inserting hole 38a is under the state of reference attitude, and the optical axis of tool microscope 41 is consistent with the Z axle.So-called " reference attitude of Z axial adjustment plate 38 " is meant: become the equal state of height by each Z axle driving mechanism 37 (adjustment plate support (37q, 37r, 37s)) supporting, that is to say that base member 31 is as the state of benchmark along X-Y plane.Tool microscope 41 disposes according to following mode; That is: the optical axis of tool microscope 41 becomes consistent with the optical axis of the projection optical system of exposure device 10; From watching with the direction of X-Y plane quadrature, the position of Z axial adjustment plate 38 (XY adjusts plate 36) is as the reference position.In addition, be adsorbed at workpiece 22 and remained on 40 last times of suction disc, workpiece 22 regulations are along reference plane, thereby tool microscope 41 can also be used to be equipped with the position along Z-direction (highly) of the Z axial adjustment plate 38 of suction disc 40.
Like Fig. 2 and shown in Figure 3, elevating mechanism 39 (with reference to figure 2 and Fig. 3) is arranged on the below of Z axial adjustment plate 38.Elevating mechanism 39 is used to make the workpiece 22 (with reference to figure 1) on the suction disc 40 to move along Z-direction.Elevating mechanism 39 is shown in figure 13, has lifting pedestal 39a, a plurality of lifter pin 39b, drive division 39c, lifter pin the 1st 39d of attraction portion (with reference to Figure 14) and lifter pin the 2nd 39e of attraction portion (with reference to Figure 14) up and down.Lifting pedestal 39a utilizes drive division 39c up and down with to the Z-direction frame parts that keeps of the mode of changing position freely.The diagram of drive division 39c is omitted up and down, and the upper surface of drive division 39c is fixed on the back side of Z axial adjustment plate 38 up and down.Thereby; For lifting pedestal 39a, not only for due to the inclination of Z axial adjustment plate 38 relative X-Y planes, from watching with the direction of the plate face quadrature of Z axial adjustment plate 38; Through drive division 39c up and down, the position (position on the Z axle) of XY adjustment plate 36 relative Z axial adjustment plates 38 is freely to change.Each lifter pin 39b is arranged on the said lifting pedestal 39a.
Each lifter pin 39b is the cartridge that stretches out along Z axle forward one side from lifting pedestal 39a, is provided with lifter pin adsorption plane 39f in the upper end.This lifter pin adsorption plane 39f forms by having flexible material, is the bowl shape of opening wide the top (with reference to figure 15A etc.).Following content diagram is omitted, and each lifter pin 39b is connected (with reference to Figure 14) with lifter pin the 1st 39d of attraction portion or lifter pin the 2nd 39e of attraction portion.Said lifter pin the 1st 39d of attraction portion or lifter pin the 2nd 39e of attraction portion are communicated to their inner space from the base end part of each lifter pin 39b of correspondence, vacuumize thereby can vacuumize and remove this space.In said each lifter pin 39b; Be placed under the state on the lifter pin adsorption plane 39f at workpiece 22 (with reference to figure 1); Utilize lifter pin the 1st 39d of attraction portion or lifter pin the 2nd 39e of attraction portion that volume inside is vacuumized, thereby workpiece 22 (with reference to figure 1) absorption is kept.In the present embodiment, on lifting pedestal 39a, at 2 lifter pin 39b of internal configurations (being also referred to as lifter pin 39b1); Externally dispose 4 lifter pin 39b (being also referred to as lifter pin 39b2), lifter pin the 1st 39d of attraction portion is connected with 2 lifter pin 39b1, and lifter pin the 2nd 39e of attraction portion is connected (with reference to Figure 14) with 4 lifter pin 39b2.Thereby, in elevating mechanism 39, can vacuumize 2 lifter pin 39b 1 and 4 lifter pin 39b2 respectively.
Each lifter pin 39b can pass the pin inserting hole 38b (with reference to figure 3 etc.) that is arranged on the Z axial adjustment plate 38 and be arranged on the pin inserting hole 40a (with reference to figure 3 and Figure 15 A etc.) on the suction disc 40, stretches out towards the top of suction disc 40 (afterwards stating putting surface 40b).Said elevating mechanism 39 carries drive control parts 43 (with reference to Figure 14) control of putting platform 30 inside by being arranged on.This drive control part 43 is shown in figure 14; Can control 32,2 X axle driving mechanisms 34 of 2 Y axle driving mechanisms, each Z axle driving mechanism 37, elevating mechanism 39, after fixedly adsorbing mechanism 60 and the plane adsorbing mechanism 70 stated, can obtain from after the attitude stated obtain the detection signal that mechanism 44 sends.In elevating mechanism 39; At each lifter pin 39b under the state that stretches out above the suction disc 40 (with reference to Figure 15); (with reference to figure 1) adsorbs maintenance to the workpiece on the upper surface that is placed on each lifter pin 39b 22; After this lifting pedestal 39a is reduced, pull to suction disc 40 1 sides (with reference to Figure 16) to each lifter pin 39b, thereby can be placed on the workpiece 22 that absorption keeps on the suction disc 40 (afterwards stating putting surface 40b).
Like Figure 15 and shown in Figure 16, suction disc 40 is rectangle tabular, is formed for the putting surface 40b of place work piece 22 (with reference to figure 1) at the smooth upper surface that forms of high precision.Suction disc 40 is set according to following mode, promptly becomes under the state of reference attitude at Z axial adjustment plate 38, and putting surface 40b is along reference plane (X-Y plane).Fixedly adsorbing mechanism 60 and plane adsorbing mechanism 70 are arranged in the suction disc 40.
For fixing adsorbing mechanism 60, when the putting surface 40b that will be placed on suction disc 40 by the workpiece 22 (with reference to figure 1) that elevating mechanism 39 (each lifter pin 39b) absorption keeps goes up, can not cause the variation of attitude, the stationkeeping of relative putting surface 40b is kept.Said fixedly adsorbing mechanism 60 has fixedly a plurality of flanges adsorption section 61 of adsorption section of conduct.Shown in Figure 15 A, this flange adsorption section 61 is separately positioned on respectively adsorbs in the recess 40c, saidly respectively adsorbs recess 40c so that the recessed mode of putting surface 40b is arranged on the suction disc 40.Each flange adsorption section 61 is tubular, and the upper end is as flange adsorption plane 61a, thus can through after the effect of the flange attraction portion (62～65 (with reference to Figure 14)) that states, keep workpiece 22 (with reference to figure 1) with flange adsorption plane 61a absorption.Is adsorbing under the state that keeps workpiece 22 said each flange adsorption section 61; Flange adsorption plane 61a (holding position) can be along changing the position on the direction of putting surface 40b; And, under the state that the orthogonal directions along putting surface 40b (Z-direction) stretches out from putting surface 40b at flange adsorption plane 61a (holding position), can keep workpiece 22 absorption; And under the state that workpiece 22 absorption is kept, can make flange adsorption plane 61a (holding position) and putting surface 40b become same surface level.Each flange adsorption section 61 forms by having flexible resin material, and formation is along the cartridge unit of the snake abdomen shape of orthogonal directions (Z-direction) extension of putting surface 40b.
Said flange adsorption section 61 is provided with 12 altogether like Figure 15 and shown in Figure 16, and promptly each limit along putting surface 40b respectively is provided with 3 on each limit, is divided into 4 groups according to each limit.Below, when describing flange adsorption section 61 with regard to each group, for convenience, n group flange adsorption section 61A, 61B, 61C, the 61D (n is meant 1～4 integer) of being referred to as shown in figure 17.That is, the 1st group of flange adsorption section 61A, the 2nd group of flange adsorption section 61B, the 3rd group of flange adsorption section 61C, the 4th group of flange adsorption section 61D have 3 flange adsorption sections 61 respectively.
Each flange adsorption section 61 is connected with the illustrated flange attraction portion of omission (62～65 (with reference to Figure 14)).Said flange attraction portion (62～65) is communicated to its volume inside from the base end part of each corresponding with it flange adsorption section 61, and can vacuumize and remove this space and vacuumize.(with reference to figure 1) is placed under the state of flange adsorption plane 61a at workpiece 22, will be evacuated by flange attraction portion (62～65) in each flange adsorption section 61 volume inside, thereby can adsorb and keep workpiece 22 (with reference to figure 1).In addition; With regard to each flange adsorption section 61; It is made into the cartridge with flexible snake abdomen shape; Thereby not only its flange adsorption plane 61a (holding position) can be along displacement on the direction of putting surface 40b, and can shrink along the Z axle is folding through the attraction of flange attraction portion (62～65).In the present embodiment, as stated, shrink through folding each flange adsorption section 61, can make flange adsorption plane 61a (holding position) and putting surface 40b be positioned at same surface level.
In the present embodiment; Shown in figure 14, flange the 1st attraction portion 62 connects the 1st group of flange adsorption section 61A, and flange the 2nd attraction portion 63 connects the 2nd group of flange adsorption section 61B; Flange the 3rd attraction portion 64 connects the 3rd group of flange adsorption section 61C, and flange the 4th attraction portion 65 connects the 4th group of flange adsorption section 61D.Thereby, for fixing adsorbing mechanism 60, can respectively each n group flange adsorption section 61A, 61B, 61C, 61D (n is meant 1～4 integer) be evacuated.Utilize a plurality of flanges adsorption section 61 (at least 2) workpiece 22 is adsorbed and to keep, thereby can prevent the change of the attitude of workpiece 22.Herein, so-called " attitude of workpiece 22 " is to represent with the relative tilt on X, Y, Z-direction on workpiece 22 relative datum planes.In addition; With regard to the flange adsorption plane 61a (holding position) of each flange adsorption section 61 change position along the direction of putting surface 40b; Do not receive self of workpiece 22 that absorption keeps as long as do not act on along the power of the direction of putting surface 40b; Moving direction and inconsistent and keep elasticity then, thereby do not make the workpiece 22 that adsorbed maintenance along moving on the direction of X-Y plane.Thus; For fixing adsorbing mechanism 60; The holding position of each the flange adsorption section 61 that had both allowed workpiece 22 absorption are kept is along changing the position on the direction of putting surface 40b, but also can the edge and the direction of putting surface 40b quadrature, to putting surface 40b one side shifting.Thereby fixedly adsorbing mechanism 60 can be placed on the putting surface 40b receiving the workpiece 22 that adsorbs maintenance apart with putting surface 40b.
Omitting hole, illustrated plane attraction portion (73～75 (with reference to Figure 14)) is connected with each plane adsorption hole 71.In the rear side of suction disc 40, hole, plane attraction portion (73～75 (with reference to Figure 14)) and corresponding each plane adsorption hole 71 are communicated with, and can vacuumize and remove this volume inside and vacuumize.In each plane adsorption hole 71; Workpiece 22 (with reference to figure 1) is being placed under the state on the putting surface 40b; Utilize hole, plane attraction portion (73～75 (with reference to Figure 14)) that volume inside is vacuumized, thereby can remain on workpiece 22 (with reference to figure 1) absorption on the putting surface 40b.In the present embodiment; Because each plane adsorption hole 71 is arranged on endless groove 72A～endless groove 72G; Thereby; Vacuumized by hole, plane attraction portion (73～75 (with reference to Figure 14)) by each plane adsorption hole 71, endless groove 72A～endless groove 72G can remain on workpiece 22 (with reference to figure 1) absorption on the putting surface 40b.Thus, suction disc 40 plays a role as following absorptive table, i.e. this absorptive table utilization is adsorbing mechanism 60 and plane adsorbing mechanism 70 fixedly, can workpiece 22 (with reference to figure 1) absorption be remained on the putting surface 40b.
Each endless groove 72 is shown in figure 18, is divided into inboard endless groove 72A～endless groove 72C, the endless groove 72D～endless groove 72F of centre and such three groups of the endless groove 72G ( reference numbers 77,78,79) in the outside.Thereby; Be provided with 3 the plane hole attraction portion (73,74,75 (with reference to Figure 14)) corresponding with each group; Plane the 1st hole attraction portion 73 connects inboard endless groove 72A～endless groove 72C; Endless groove 72D～endless groove 72F in the middle of plane the 2nd hole attraction portion 74 connects, plane the 3rd hole attraction portion 75 connects the endless groove 72G in the outside.Rear side at suction disc 40 is formed with a plurality of suction chambers 76 (with reference to Figure 19) to be used for connection.
Shown in figure 19, each suction chamber 76 forms according to following mode, that is: the back side of suction disc 40 constitutes concavity, and comes shutoff by the concavity position that flank is divided by omitting illustrated seal member.Said each suction chamber 76 has inboard suction chamber 76A, encircle the suction chamber 76B of this inboard suction chamber 76A and encircle 4 suction chamber 76C on each limit.Diagram has been omitted following content; Suction chamber 76A is communicated with each plane adsorption hole 71 (with reference to Figure 18 etc.) on endless groove 72A～endless groove 72C; Suction chamber 76B is communicated with each plane adsorption hole 71 (with reference to Figure 18 etc.) on endless groove 72D～ endless groove 72F, and 4 suction chamber 76C are communicated with each plane adsorption hole 71 (with reference to Figure 18 etc.) on the endless groove 72G.In addition, diagram has been omitted following content, and plane the 1st hole attraction portion 73 connects suction chamber 76A, and plane the 2nd hole attraction portion 74 connects suction chamber 76B, and plane the 3rd hole attraction portion 75 connects suction chamber 76C (with reference to Figure 14).
Thereby; Plane adsorbing mechanism 70 is shown in figure 18, utilizes plane the 1st hole attraction portion 73 (with reference to Figure 14) to vacuumize, thereby; Can be each the plane adsorption hole 71 that passes through suction chamber 76A (with reference to Figure 19) and be communicated with it, with being evacuated in endless groove 72A～endless groove 72C.At this moment; Endless groove 72A～endless groove 72C adjoins each other on putting surface 40b and surrounds the center; So; In the set zone till the peripheral position that plays endless groove 72C from the center of putting surface 40b (regulation is the 1st absorption subregion 77), can be with being evacuated between putting surface 40b and the workpiece that is placed on it 22.Thus; For plane adsorbing mechanism 70; The 1st hole attraction portion 73 vacuumizes through the plane, thereby can be with the collaborative work of workpiece 22 by itself and putting surface 40b, and absorption remains on from the center of putting surface 40b and plays in the 1st absorption subregion 77 till the peripheral position of endless groove 72C.Equally; For plane adsorbing mechanism 70, the 2nd hole attraction portion 74 vacuumizes through the plane, process suction chamber 76B and each the plane adsorption hole 71 that is communicated with it; With being evacuated in endless groove 72D～endless groove 72F; Thereby, can be with the collaborative work of workpiece 22 by itself and putting surface 40b, in the 2nd absorption subregion 78 till absorption remains on from the outside of the 1st absorption subregion 77 to the peripheral position of endless groove 72F.In addition, same, for plane adsorbing mechanism 70; The 3rd hole attraction portion 75 vacuumizes through the plane; Through 4 suction chamber 76C and each the plane adsorption hole 71 that is communicated with it, with being evacuated in the endless groove 72G, thereby; Can be with the collaborative work of workpiece 22 by itself and putting surface 40b, in the 3rd absorption subregion 79 till absorption remains on from the outside of the 2nd absorption subregion 78 to the peripheral position of endless groove 72G.
In addition; In the present embodiment; Be arranged in elevating mechanism 39, fixing each attraction portion (39d, 39e, 62～65,73～75) of adsorbing mechanism 60 and plane adsorbing mechanism 70, diagram is omitted, by single vacuum pump, interconnective a plurality of pipe arrangement and the valve mechanism that is arranged in each pipe arrangement constitute with it; Make said valve mechanism suitably carry out on-off action, vacuumize thereby can vacuumize and remove to each attraction portion.The action of this plane adsorbing mechanism 70 and elevating mechanism 39, the fixedly action of adsorbing mechanism 60 all are (with reference to the Figure 14) that under the control of the drive control part 43 of the inside that is arranged on mounting table 30, carry out.The back is elaborated to this control.
In mounting table 30, (with reference to figure 1) adsorbs maintenance for the workpiece 22 on the upper surface that is placed on each the lifter pin 39b that stretches out to the top of suction disc 40, through the action of elevating mechanism 39, workpiece 22 absorption remained on the suction disc 40.After this; In mounting table 30; According to the attitude of the workpiece 22 that keeps by suction disc 40 absorption, make the imaging surface (reference plane) of the projection optical system of workpiece 22 1 edge exposure devices 10 form suitable attitude, Yi Bian be placed on the suitable position of relative projection optical system.Particularly; On base member 31; The moving device 33 of two y-axis shifts is suitably moved along X-direction along Y direction and two X axle moving device 35 (35A, 35B); Thereby,, position and the rotation attitude along the X-Y plane that are arranged on the workpiece 22 on the XY adjustment plate 36 are adjusted through suction disc 40, Z axial adjustment plate 38 and each Z axle driving mechanism 37.In addition; Utilize the position of each Z axle driving mechanism 37 supportings through appropriate change, thereby to being arranged on the position in Z-direction (highly) of the workpiece 22 on the XY adjustment plate 36 through suction disc 40 and Z axial adjustment plate 38 and adjusting with respect to the degree of tilt of X-Y plane.Thus, can mask graph suitably be exposed on the workpiece 22.
Next, referring to figs. 1 to Figure 19, to utilize elevating mechanism 39, fixedly adsorbing mechanism 60 and plane adsorbing mechanism are adsorbed the operation that remains on suction disc 40 (putting surface 40b) with workpiece 22 with smooth state and describe.In addition, as stated, this operation is (with reference to the Figure 14) that utilizes the drive control part 43 of the inside be arranged on mounting table 30 to carry out.In addition, in Fig. 2, Fig. 3 and Figure 15 to Figure 18,, the diagram of workpiece 22 is omitted for the ease of understanding structure and action.
Be placed on the workpiece 22 (with reference to figure 1) on the putting surface 30, its diagram is omitted, under the state that keeps by conveyance hand (carrying arm) by conveyance to suction disc 40.This conveyance hand is known structure, can adsorb maintenance with the mode of the holding workpieces 22 from the below, can keep this hold mode always.Can utilize ultrasonic sensor 42 (with reference to figure 3) whether detect workpiece 22 by conveyance hand (carrying arm) conveyance to suction disc 40.
If workpiece 22 is transported on suction disc 40, then shown in figure 15, on mounting table 30, elevating mechanism 39 makes each lifter pin 39b stretch out and each lifter pin adsorption plane 39f abutted to the back side of workpiece 22 to the top of suction disc 40 (putting surface 40b).Then; Elevating mechanism 39 is by utilizing vacuumizing of lifter pin the 1st attraction portion 39d (with reference to Figure 14); Near the central authorities by 2 lifter pin 39b1 absorption maintenance workpiece 22; Then utilize vacuumizing of lifter pin the 2nd 39e of attraction portion (with reference to Figure 14), near 4 bights by 4 lifter pin 39b2 absorption maintenance workpiece 22.Thus, elevating mechanism 39 can kept the attitude that absorption remains on the workpiece 22 on the conveyance hand (not shown) always, by each lifter pin 39b (lifter pin adsorption plane 39f) absorption and maintenance workpiece 22.In addition, in the exposure device 10 of present embodiment,, obtain the attitude that mechanism 44 obtains workpiece 22 by attitude in that workpiece 22 absorption are remained under the state on the conveyance hand (not shown).After this, shown in figure 16, elevating mechanism 39 pulls to suction disc 40 1 sides with each lifter pin 39b, and the back side of flange adsorption plane 61a that makes each lip shape adsorption section 61 is against the back side that receives the workpiece 22 that absorption keeps.
In mounting table 30, like Figure 16 and shown in Figure 17, in fixing adsorbing mechanism 60, utilize vacuumizing of each flange attraction portion 62～65 (with reference to Figure 14), and keep workpiece 22 by each lip shape adsorption section 61 (flange adsorption plane 61a) absorption.After this, the absorption that elevating mechanism 39 will utilize lifter pin 39b to cause keeps removing, and draws in each lifter pin 39b in the suction disc 40.In fixing adsorbing mechanism 60; Proceed to utilize vacuumizing of each flange attraction portion 62～65; Keeping under the state of workpiece 22 in absorption always; Each flange adsorption section 61 is shunk (folding) always and arrived following highly place, that is: become same plane at this height upper flange adsorption plane 61a (holding position) and putting surface 40b.Thus, in fixing adsorbing mechanism 60, can be on one side under keeping the attitude that is adsorbed the workpiece 22 that remains in the elevating mechanism 39, keep by each lip shape adsorption section 61 absorption, on one side workpiece 22 is placed on the putting surface 40b.In addition, although fixedly adsorbing mechanism 60 has taked to divide into groups to be divided into the structure that n organizes flange adsorption section 61A, 61B, 61C, 61D (n is meant 1～4 integer), yet in the present embodiment, they also can together carry out all absorption actions.
After this, in mounting table 30, carry out the stage by stage absorption action fixed according to plane adsorbing mechanism 70.Plane adsorbing mechanism 70 is shown in figure 18, in the present embodiment, at first, utilizes vacuumizing of plane the 1st hole attraction portion 73 (with reference to Figure 14), carries out the absorption maintenance of workpiece 22 at the 1st absorption subregion 77 of putting surface 40b.Thus, in plane adsorbing mechanism 70, can be to be adsorbed under the attitude that remains on the workpiece 22 in the fixing adsorbing mechanism 60 keeping on one side, workpiece 22 be adsorbed on 1st of putting surface 40b adsorb subregion 77 on one side.Next, in plane adsorbing mechanism 70, utilize vacuumizing of plane the 2nd hole attraction portion 74 (with reference to Figure 14), carry out the absorption maintenance of workpiece 22 at the 2nd absorption subregion 78 of putting surface 40b.Then, in plane adsorbing mechanism 70, utilize vacuumizing of plane the 3rd hole attraction portion 75 (with reference to Figure 14), carry out the absorption maintenance of workpiece 22 at the 3rd absorption subregion 79 of putting surface 40b.Through the fixed absorption stage by stage action according to this plane adsorbing mechanism 70, workpiece 22 is being kept always and is being adsorbed the attitude that remains on the workpiece 22 in the fixing adsorbing mechanism 60, becomes smooth state and is attracted on the putting surface 40b (suction disc 40).Describe in the face of this content down.
In some cases, workpiece 22 deflection occurred under the state that remains on the elevating mechanism 39 (each lifter pin 39b).No matter on the whole still partially so-called " deflection " is meant:, as long as flat workpiece 22 self limpens and all thinks, also can be meant uneven or warpage.This deflection meeting hinders the projection optical system of exposure device 10 that mask graph is carried out normal exposure; Thereby; Preferably under the state of having eliminated deflection, remain on putting surface 40b (suction disc 40), promptly remain on the putting surface 40b (suction disc 40) making workpiece 22 be smooth state.
As stated, in plane adsorbing mechanism 70, be the 1st absorption subregion 77 that workpiece 22 is adsorbed on smooth putting surface 40b at first.Its reason is, is adsorbed under the state that remains on the fixing adsorbing mechanism 60 at workpiece 22, and the deflection of central sagging that kind appears bending in workpiece 22 owing to own wt.Thus, workpiece 22 is intactly kept absorption and is remained on the attitude on the fixing adsorbing mechanism 60, is attracted on the putting surface 40b near its central authorities and becomes smooth.After this, plane adsorbing mechanism 70 is being kept the absorption at the 1st absorption subregion 77 always, workpiece 22 is adsorbed on the 2nd absorption subregion 78 of putting surface 40b.So; On workpiece 22; To be adsorbed on the putting surface 40b near the mode towards the outside of the radiating direction central authorities of at first absorption; Thereby, make near floating dodging for the middle mind-set radiation direction outside central authorities of the workpiece 22 that causes by deflection, thereby be attracted to putting surface 40b near the position that is surrounded the central authorities (zone that is equivalent to the 2nd absorption subregion 78) upward and become smooth.At this moment; Be fixed each flange adsorption section 61 absorption of adsorbing mechanism 60 of workpiece 22 keep; Yet; Said each flange adsorption section 61 forms the cartridge unit with flexible snake abdomen shape, allows flange adsorption plane 61a (holding position) along changing the position on the direction of putting surface 40b, thereby utilizes each flange adsorption section 61 to adsorb maintenance can not have problems.After this, plane adsorbing mechanism 70 is being kept the absorption at the 1st absorption subregion 77 and the 2nd absorption subregion 78 always, workpiece 22 is adsorbed on the 3rd absorption subregion 79 of putting surface 40b like this.So; Workpiece 22 near the central authorities of being adsorbed at first with and outside again outside the radiation direction; Be attracted on the putting surface 40b; So as the center, floating to the radiation direction outside of the workpiece 22 that caused by deflection dodged, thus near the position that is surrounded the central authorities (zone that is equivalent to the 3rd absorption subregion 79) is attracted to putting surface 40b and goes up and become smooth.That is to say, be the outer peripheral edges portion of playing the radiation direction outside from the center of putting surface 40b in the present embodiment, adsorbs action in order.
Thus, utilize suction disc 40 that the attitude of the workpiece 22 that is kept by conveyance hand (not shown) absorption is changed, and can make workpiece 22 keep smooth state to adsorb (absorption keeps) on putting surface 40b.
The mounting table 30 of present embodiment under the state that is kept by conveyance hand (not shown) absorption, obtains the attitude that mechanism 44 (with reference to Figure 14) obtains workpiece 22 by attitude as stated.As stated, even through elevating mechanism 39 and fixing adsorbing mechanism 60 and become smooth state by plane adsorbing mechanism 70, the attitude of the workpiece 22 that is obtained can not change.For this reason; In mounting table 30; According to keep by suction disc 40 absorption behind the workpiece 22, obtain the attitude of the workpiece 22 that mechanism 44 (with reference to Figure 14) obtains by attitude again; The moving device 33 of two y-axis shifts is suitably moved along X-direction along Y direction, X axle moving device 35 (35A, 35B); On one side change the bearing position of each Z axle driving mechanism 37, thereby the position that the projection optical system of utilizing exposure device 10 is made public to workpiece 22 is positioned on the reference plane as the imaging surface of projection optical system with suitable state.Thus, utilize exposure device 10 suitably mask graph to be made public on workpiece 22.
Like this; Because plane adsorbing mechanism 70 adsorbs subregion 79 at the 1st interior absorption subregion 77 through the 2nd absorption subregion 78 courts the 3rd from comprising the center at putting surface 40b; Point to outer rim and adsorb action successively; Even produce under the situation of deflection, the floating towards the radiation direction outside of workpiece 22 that is caused by this deflection dodged, thereby workpiece 22 is adsorbed onto on the smooth putting surface 40b at workpiece 22.Thereby, can make workpiece 22 keep smooth state to adsorb maintenance as the suction disc 40 of platform involved in the present invention.
In addition, in suction disc 40, plane adsorbing mechanism 70 attracts (vacuumizing) to make workpiece 22 become smooth state through a plurality of planes adsorption hole 71 that is opened in putting surface 40b, thereby, can prevent the reduction of product precision.Why do like this; Its reason is: for example with claw workpiece 22 is pressed against on the putting surface 40b and become under the situation of structure of smooth state having adopted; Can make the galled spots of workpiece 22 by claw; The action of claw makes workpiece 22 be infected with dust, thereby has the possibility that causes the product precision to reduce.
And; In suction disc 40; Plane adsorbing mechanism 70 attracts (vacuumizing) to make workpiece 22 become smooth state through a plurality of planes adsorption hole 71 that is opened in putting surface 40b, thereby, in case workpiece 22 is placed on the putting surface 40b; Then can utilize the attraction (vacuumizing) of each plane adsorption hole 71 at once, can shorten mask graph and form the needed time (working ability).Why do like this; Its reason is: for example with claw workpiece 22 is pressed against on the putting surface 40b and become under the situation of structure of smooth state having adopted; Claw is stretched out on the workpiece that is placed on 40b on the loading end 22 and put into, this is to cause mask graph to form the principal element that the needed time (working ability) increases.
Because making by floating of causing of deflection, plane adsorbing mechanism 70 dodges to the outside of the 3rd absorption subregion 79 of rectangular shape; So can discrete workpieces 22 float; Thereby; Suction disc 40 can keep position and the attitude that has been determined through the fixing absorption of each flange adsorption section 61 of adsorbing mechanism 60 always, realizes planarization.Especially in the present embodiment; Because making floating from the center of putting surface 40b of workpiece 22 dodges to the radiation direction outside; So can avoid in workpiece 22 floats, bringing out secund; Thereby, can come keeping position and the attitude that has been determined through the fixing absorption of each flange adsorption section 61 of adsorbing mechanism 60 always, keep more reliably and realize planarization.
Because plane adsorbing mechanism 70 is provided with a plurality of absorption subregions (77～79 in the foregoing description); So can adsorb the control that subregion is used to adsorb action according to difference; Thereby suction disc 40 can make workpiece 22 become smooth state with simple control.
Because as each plane adsorption hole 71 of plane adsorbing mechanism 70, being distributed in the Zone Full of putting surface 40b, thereby suction disc 40 both can make workpiece 22 further keep smooth state, can keep workpiece 22 absorption again.
Because in plane adsorbing mechanism 70; The a plurality of planes adsorption hole 71 that is opened in putting surface 40b is communicated with by endless groove 72; Thereby suction disc 40 can not make the burden of each hole, plane attraction portion (73～75 (with reference to Figure 14)) increase, and can adsorb workpiece 22 in the wide zone on putting surface 40b.
Because it (is endless groove 72A～72G) in the above-described embodiments that plane adsorbing mechanism 70 is provided with a plurality of endless grooves 72; Thereby suction disc 40 can form a plurality of absorption subregions (being 77～79 in the above-described embodiments) with at least 1 the plane adsorption hole 71 that is positioned on the putting surface 40b with simple structure.
Because it (be endless groove 72A～72G) in the above-described embodiments, thereby suction disc 40 can adsorb action from the center of putting surface 40b towards the radiation direction outside successively with simple structure that plane adsorbing mechanism 70 is provided with a plurality of endless grooves 72.
In suction disc 40; Keeping under the state of workpiece 22 with 61 absorption of a plurality of flanges adsorption section in the fixing adsorbing mechanism 60; Allow flange adsorption plane 61a (holding position) along changing the position on the direction of putting surface 40b; Thereby keeping the attitude and the action of absorption stage by stage of workpiece 22 through utilizing plane adsorbing mechanism 70 to adopt always, thereby, can avoid occurring influencing the situation of dodging of floating of the workpiece 22 that causes by deflection to the radiation direction outside.
Letting under flange adsorption plane 61a (holding position) state that the orthogonal directions along putting surface 40b (Z-direction) stretches out from putting surface 40b; Fixedly each flange adsorption section 61 of adsorbing mechanism 60 can keep workpiece 22 absorption; Thereby; And elevating mechanism 39 between when carrying out the transfer of absorption hold mode of workpiece 22, suction disc 40 can prevent the situation that load imposes on workpiece 22.
Because can be with each the flange adsorption section 61 in the fixing adsorbing mechanism 60; Letting under flange adsorption plane 61a (holding position) state that the orthogonal directions along putting surface 40b (Z-direction) stretches out from putting surface 40b; Workpiece 22 is adsorbed maintenance; And under the state that workpiece 22 absorption is kept; Can make flange adsorption plane 61a (holding position) and putting surface 40b become same surface level, thereby suction disc 40 can intactly be kept the attitude of workpiece 22 and undisturbedly workpiece 22 is placed on the putting surface 40b.
Through a plurality of flanges adsorption section 61; Fixedly the workpiece 22 of the state that kept by each lifter pin 39b absorption of elevating mechanism 39 of 60 pairs of adsorbing mechanisms adsorbs maintenance; Thereby; Suction disc 40 can be kept the attitude of having adsorbed the workpiece 22 that keeps by elevating mechanism 39 always, workpiece 22 absorption are kept.
In suction disc 40; Plane adsorbing mechanism 70 adsorbs maintenance by 71 pairs of a plurality of planes adsorption holes by fixing each flange adsorption section 61 adsorbed workpiece that keeping 22 of adsorbing mechanism 60; Thereby; Can keep attitude that workpiece 22 keeping by 60 absorption of fixing adsorbing mechanism always, be that workpiece 22 is adsorbed the attitude that remains on the elevating mechanism 39, workpiece 22 is adsorbed maintenance.
In suction disc 40, elevating mechanism 39 utilizes a plurality of lifter pin 39b that the workpiece 22 that the absorption by conveyance hand (not shown) keeps is adsorbed maintenance, thereby, can keep workpiece 22 always and be adsorbed the attitude that remains on the conveyance hand, workpiece 22 is adsorbed maintenance.
In suction disc 40; Fixedly each flange adsorption section 61 of adsorbing mechanism 60 forms by having flexible resin material; And constitute the cartridge unit of the snake abdomen shape that extends along the orthogonal directions (Z-direction) of putting surface 40b, thereby, can be with simple structure; Keep in absorption making flange adsorption plane 61a (holding position) along changing the position on the direction of putting surface 40b under the state of workpiece 22; And, under the state that the orthogonal directions along putting surface 40b (Z-direction) stretches out from putting surface 40b at flange adsorption plane 61a (holding position), can keep workpiece 22 absorption; And can under the state that workpiece 22 absorption is kept, make flange adsorption plane 61a (holding position) and putting surface 40b become same surface level.
In suction disc 40, ultrasonic sensor 42 is used to differentiate whether workpiece 22 is adsorbed maintenance (placement) above suction disc 40, thereby, can not receive height (position on the Z axle) restriction on the suction disc 40 to detect whether workpiece 22 is arranged.
Because workpiece 22 is in smooth state with very high degree of precision on suction disc 40, so exposure device 10 can suitably be exposed to mask graph on the workpiece 22.
In exposure device 10; Utilize attitude to obtain the attitude that mechanism 44 (with reference to Figure 14) obtains by the workpiece 22 under conveyance hand (not shown) the absorption hold mode; And according to keeping workpiece 22 backs by suction disc 40 absorption, obtaining the attitude of the workpiece 22 that mechanism 44 obtains by attitude again; The moving device 33 of two y-axis shifts is suitably moved along X-direction along Y direction, X axle moving device 35 (35A, 35B); Change position on one side by each Z axle driving mechanism 37 supporting; Thereby the position that the projection optical system of utilizing exposure device 10 is made public to workpiece 22 is positioned on the reference plane as the imaging surface of projection optical system with suitable state, forms the needed time (working ability) thereby can shorten mask graph.
Thereby suction disc 40 (absorptive table) involved in the present invention can not cause the increase of activity duration and the reduction of product precision, and can keep workpiece 22 with smooth state.
In addition, in the above-described embodiments, for being illustrated as one of the absorptive table that the present invention relates to routine suction disc 40; Yet, be not limited to the foregoing description, also following such absorptive table; Workpiece is remained on the smooth putting surface, and exposure light is made set mask graph exposure by imaging on this workpiece, it is characterized in that; Comprise: fixing adsorbing mechanism, adsorbable said workpiece and the attitude of the said relatively putting surface of said workpiece is fixed, plane adsorbing mechanism; Adsorbable said workpiece and make the face and the said putting surface butt of said workpiece; Said plane adsorbing mechanism has a plurality of plane adsorption holes of on said putting surface, offering, and any one outer rim lighted towards said putting surface from the said putting surface is complied with said plane adsorption hole and fixed absorption action in order.
In addition; In the above-described embodiments, adsorb the structure of action successively although adopted plane adsorbing mechanism 70 on putting surface 40b, to be divided into 3 absorption subregions 77～79, be not limited to the foregoing description; If any one outer rim lighted towards putting surface from the putting surface 40b; Comply with each plane adsorption hole 71 in order and fixed absorption action, the floating of workpiece that is caused by deflection dodged laterally, thereby also the absorption subregion can be set.In addition; The implication of so-called " any one outer rim lighted towards putting surface from the putting surface 40b " is meant: as described in the above-mentioned embodiment; 40b is taken as rectangular shape as putting surface; If a bit is the center of putting surface 40b arbitrarily, the interval of then representing to start at from this center from little finger of toe to big (from the radiation direction of center); If any is near the bight of putting surface 40b arbitrarily, then shown in arrow A among Figure 20 2, diagonal is pointed in expression; If any is near the portion of the limit of putting surface 40b arbitrarily, then shown in arrow A among Figure 20 3, limit portion is in opposite directions pointed in expression.
And; In the above-described embodiments; The structure of adsorbing action although adopted plane adsorbing mechanism 70 on putting surface 40b, to be divided into 3 absorption subregions 77～79 according to the order of the 1st absorption subregion the 77, the 2nd absorption subregion the 78, the 3rd absorption subregion 79; But be not limited to the foregoing description, if any one outer rim lighted towards putting surface from the putting surface 40b, adsorb the words of action in order; The direction of then adsorbing the number of subregion (but having 1 plane adsorption hole 71 at least) and adsorbing action can suitably be set (for example, set according to the trend of the deflection that occurs in the workpiece 22 etc.).
In the above-described embodiments, in plane adsorbing mechanism 70 each plane adsorption hole 71 (72A～72G) is communicated with to get up, but is not limited to the foregoing description, and said each endless groove 72 also can be set by a plurality of endless grooves 72.
In the above-described embodiments; In plane adsorbing mechanism 70, being concentric shape, to be provided with a plurality of endless grooves 72 (be 72A～72G) in the above-described embodiments; But be not limited to the foregoing description; Be communicated with as long as said endless groove is used in a plurality of planes adsorption hole 71 that forms the absorption subregion, then the shape of endless groove and number can suitably be set.
In the above-described embodiments, the structure of employing is in plane adsorbing mechanism 70, adsorbs action according to the order of the 1st absorption subregion the 77, the 2nd absorption subregion the 78, the 3rd absorption subregion 79.But, also can take following structure, that is: according to the adsorbed state of the absorption subregion that carried out the absorption action, carry out the absorption action of ensuing absorption subregion.It can be realized through following mode; For example; In Figure 14, represent with double dot dash line; The adsorbed state that the adsorbed state that can obtain respectively to adsorb subregion is set is obtained mechanism 45, according to obtain from this adsorbed state output signal that mechanism 45 sends, promptly adsorb whether suitable content, drive control part 43 (with reference to Figure 14) carries out suitable drive controlling to each hole, plane attraction portion 73,74,75 (with reference to Figure 14).Said adsorbed state is obtained mechanism 45, through the pressure variation in each plane adsorption hole 71, each hole, plane attraction portion 73,74,75 or each suction chamber 76 is detected, reaches realization with simple structure.Under the situation that adopts such structure; Formerly row adsorbs in the absorption subregion of action; After workpiece 22 suitably is adsorbed on the putting surface 40b, carries out the absorption action in ensuing absorption subregion again, thereby can make workpiece 22 flat condition especially suitable.
In the above-described embodiments; The structure that has adopted is: in plane adsorbing mechanism 70, putting surface 40b is divided into concentric 3 absorption subregions 77～79, and adsorbs action according to the order of the 1st absorption subregion the 77, the 2nd absorption subregion the 78, the 3rd absorption subregion 79.Yet; With any lighting the outward edge and adsorb action in order from putting surface 40b as under the prerequisite; Also can adopt following structure; That is: be divided into any absorption subregion to putting surface 40b, and remain on the deflection of the workpiece 22 on the fixing adsorbing mechanism 60, suitably be set in and respectively adsorb the order that subregion adsorbs action according to conveyance hand (not shown), elevating mechanism 39 or absorption.In this case; Maybe can be that at least 2 absorption subregions are divided putting surface 40b to comprise putting surface 40b in interior mode; Even maybe can be divided into from the interval of the center of putting surface 40b identical, at least 2 absorption subregions also inequality in the position of X-direction and/or Y direction.In addition, can use attitude to obtain mechanism 44 (with reference to Figure 14) or the optical system (not shown) that is used for the pin adjustment of illuminating optical system detects the deflection of workpiece 22.Under situation about constituting like this, can be according to the position and the directivity of the deflection of workpiece 22, through drive control part 43 (with reference to Figure 14) to carrying out suitable drive controlling with each corresponding hole, plane attraction portion of absorption subregion, thereby can realize.Under the situation that adopts such structure, the absorption action according to subregion is respectively adsorbed in the deflection of workpiece 22 in order can make workpiece 22 flat condition especially suitable.It is the same doing the situation of utilizing a plurality of planes adsorption hole 71 to adsorb action in order with the absorption subregion is not set like this.
In the above-described embodiments, although fixedly be provided with 6 flange adsorption sections 61 in the adsorbing mechanism 60, this is not limited to the foregoing description, considers also to have at least 2 flange adsorption sections 61 from the angle of the attitude of keeping workpiece 22.
In the above-described embodiments; In fixing adsorbing mechanism 60; The absorption action that can utilize 4 n group flange adsorption section 61A, 61B, 61C, 61D (n is meant 1～4 integer) to handle together, yet, also can be according to the deflection of the workpiece 22 of reality and the deflection trend of workpiece 22; Adsorb action successively, therefore be not limited to the foregoing description.
In the above-described embodiments; Fixedly each flange adsorption section 61 of adsorbing mechanism 60 forms by having flexible resin material, and constitutes the cartridge unit of the snake abdomen shape that extends along the orthogonal directions (Z-direction) of putting surface 40b, yet; As long as can realize following content; Take other structure example also to be fine so, that is: keep to make flange adsorption plane 61a (holding position) along changing the position on the direction of putting surface 40b under the state of workpiece 22 in absorption like adsorption hole that the flange adsorption plane is set on the spheroid of the hollow of elastically deformable and the attraction hole that vacuumizes usefulness; And; Letting under flange adsorption plane 61a (holding position) state that the orthogonal directions along putting surface 40b (Z-direction) stretches out from putting surface 40b, can keep workpiece 22 absorption, and under the state that workpiece 22 absorption is kept; Can make flange adsorption plane 61a (holding position) and putting surface 40b become same surface level, therefore be not limited to the foregoing description.
More than based on embodiment to absorptive table of the present invention, use the mounting table of this absorptive table and use its exposure device to be illustrated; Yet; Concrete structure is not limited to said embodiment, only otherwise break away from purport of the present invention, allows the change that designs or appends etc.
Claims (11)
1. an absorptive table remains on the smooth putting surface workpiece, and exposure light is made set mask graph exposure by imaging on this workpiece, it is characterized in that,
Comprise:
Fixing adsorbing mechanism, adsorbable said workpiece and the attitude of the said relatively putting surface of said workpiece is fixed,
The plane adsorbing mechanism, adsorbable said workpiece and make the face and the said putting surface butt of said workpiece,
Said plane adsorbing mechanism has a plurality of plane adsorption holes of on said putting surface, offering, and any one outer rim lighted towards said putting surface from the said putting surface is utilized the absorption action of said plane adsorption hole in order.
2. absorptive table according to claim 1 is characterized in that,
Said plane adsorbing mechanism has a plurality of absorption subregions on said putting surface, respectively adsorb at this to have at least 1 said plane adsorption hole in subregion, and respectively adsorb the absorption action that divisional unit carries out said each plane adsorption hole according to said.
3. absorptive table according to claim 1 and 2 is characterized in that,
Said fixedly adsorbing mechanism has at least 2 fixedly adsorption sections on said putting surface, this each fixedly can be adsorbed onto on the said workpiece with its upper surface the adsorption section.
4. absorptive table according to claim 3 is characterized in that,
Said each fixedly the adsorption section is under the state that absorption of said workpiece is kept, the upper surface of said fixedly adsorption section can change the position along the direction of said putting surface.
5. absorptive table according to claim 3 is characterized in that,
Also have lifter pin that said relatively putting surface is advanced and retreat along the orthogonal directions of said putting surface freely, that the upper end has adsorption plane,
Under said each state that fixedly adsorption section can be stretched out along said orthogonal directions from said putting surface in the upper surface that makes said fixedly adsorption section; Said workpiece absorption is kept; And under the state of the said workpiece of absorption maintenance, the upper surface of said fixedly adsorption section and said putting surface can become same surface level.
6. absorptive table according to claim 1 and 2 is characterized in that,
Said plane adsorbing mechanism towards the circumference of said putting surface, utilizes the absorption action of said each plane adsorption hole from the center of said putting surface in order.
7. absorptive table according to claim 1 and 2 is characterized in that,
Said plane adsorbing mechanism utilizes the absorption action of said each plane adsorption hole in order from the edge portion of the said putting surface direction towards the center of passing said putting surface.
8. absorptive table according to claim 1 and 2 is characterized in that,
Said plane adsorbing mechanism utilizes the absorption action of ensuing said plane adsorption hole according to the adsorbed state that adsorbs the said plane adsorption hole of action.
9. absorptive table according to claim 1 and 2 is characterized in that,
Said plane adsorbing mechanism is set the order that the absorption of said each plane adsorption hole is moved according to the deflection of the said workpiece that is kept by said fixedly adsorbing mechanism.
10. mounting table, the position and the attitude that the said relatively exposure light of said workpiece are carried out to the reference plane of picture are controlled, it is characterized in that,
Adopt the absorptive table described in the claim 1 or 2.
11. an exposure device is characterized in that, is employed in the absorptive table described in claim 1 or 2.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-010902 | 2011-01-21 | ||
| JP2011010902A JP2012151418A (en) | 2011-01-21 | 2011-01-21 | Suction stage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102608872A true CN102608872A (en) | 2012-07-25 |
Family
ID=46526342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100155925A Pending CN102608872A (en) | 2011-01-21 | 2012-01-18 | Absorption stage, placing stage and exposure apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2012151418A (en) |
| KR (1) | KR20120085195A (en) |
| CN (1) | CN102608872A (en) |
| TW (1) | TW201303514A (en) |
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| CN105652601A (en) * | 2014-11-28 | 2016-06-08 | 佳能株式会社 | Holding device, lithography apparatus, and method for manufacturing item |
| US9740109B2 (en) | 2014-11-28 | 2017-08-22 | Canon Kabushiki Kaisha | Holding device, lithography apparatus, and method for manufacturing item |
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| CN108074848A (en) * | 2016-11-10 | 2018-05-25 | 致茂电子(苏州)有限公司 | Gasket, stacked wafer structure, absorption type mobile device and wafer moving method |
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Also Published As
| Publication number | Publication date |
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| KR20120085195A (en) | 2012-07-31 |
| TW201303514A (en) | 2013-01-16 |
| JP2012151418A (en) | 2012-08-09 |
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Application publication date: 20120725 |