CN102606080A - Segmented polycrystalline diamond compact and production method thereof - Google Patents
Segmented polycrystalline diamond compact and production method thereof Download PDFInfo
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- CN102606080A CN102606080A CN2012100780767A CN201210078076A CN102606080A CN 102606080 A CN102606080 A CN 102606080A CN 2012100780767 A CN2012100780767 A CN 2012100780767A CN 201210078076 A CN201210078076 A CN 201210078076A CN 102606080 A CN102606080 A CN 102606080A
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Abstract
The invention discloses a segmented polycrystalline diamond compact and a production method thereof. A hard alloy matrix is divided into two portions for preparation, a composite portion of the hard alloy matrix is compounded with a diamond layer under high-temperature and high-pressure adjustment first, and then a prepared connecting portion of the hard alloy matrix is connected to a compact blank by means of welding. As for polycrystalline diamond compacts with curved lower surfaces, a great quantity of composite portions and connecting portions can be produced once standby by means of pouring molding, so that the defects of low production efficiency and high production cost caused by the fact that only a numerically-controlled machine tool used for turning can be adopted in the prior art. Accordingly, the shape of the lower surface of the polycrystalline diamond compact is more precise, production efficiency is improved, and cost is reduced.
Description
Technical field
The present invention relates to drill bit and make the field, be specifically related to a kind of segmented diamond compact on the bit drills tooth and preparation method thereof that is installed on.
Background technology
Diamond compact is the composite material that a kind of diamond and carbide alloy are formed; Because it had both had the high and good characteristics of abrasion resistance of natural diamond hardness; Simultaneously again with the characteristics that pliability is good and solderability is good of carbide alloy, thereby be widely used on oil drilling, geological prospecting, the coalfield drilling drill bit and industry such as machine tools.Traditional diamond compact mainly is made up of the diamond layer on top and the hard alloy substrate of bottom.Wherein diamond layer is the disk shape, and its upper surface constitutes diamond compact, has hardness height, characteristics that abrasion resistance is good; It is cylindric that hard alloy substrate is, and its soffit constitutes diamond compact and the joint face that bores tooth; The soffit of diamond layer and the upper surface of hard alloy substrate are both bonding surfaces.
In order to strengthen diamond compact and the adhesion of boring tooth; Also bore on the tooth in order can the suffered stress of diamond compact effectively to be passed to simultaneously, present polycrystalline diamond compact bit generally uses the diamond compact of soffit as on-plane surface (like circular arc).Earlier respectively that diamond layer and hard alloy substrate is pre-formed during the production technology of traditional diamond compact, then with prefabricated profiled diamond layer and prefabricated profiled hard alloy substrate compound under HTHP be one.Yet this diamond compact with on-plane surface soffit in process of production; Need to consider following problem: 1, since diamond layer hardness big, can't carry out turning through Digit Control Machine Tool, therefore need the preferential shape that guarantees diamond layer particularly the diamond layer upper surface be the shape of cutwork face; 2, diamond layer and hard alloy substrate are when sintering; Need the assurance top press just can guarantee these two kinds of different materials are closely linked to the application of force of its bonding surface from the hard alloy substrate soffit; Therefore in order to let bonding surface obtain the bigger application of force, the soffit of hard alloy substrate is required to be the plane and can as much as possible the stress of exerting pressure be guided on the bonding surface of diamond layer and hard alloy substrate.
In view of above technological requirement; Soffit is that the diamond compact of circular arc is when making; Needing earlier hard alloy substrate to be processed soffit is the cylindrical of plane; And then with hard alloy substrate and diamond layer under the high-temperature and high-pressure conditions compound be one after, by Digit Control Machine Tool the soffit of diamond compact is lathed required non-planar (like arc surface) more at last.Yet this elder generation is lathed nonplanar mode through Digit Control Machine Tool with the soffit of composite sheet after with the composite sheet global formation, has both needed the turning time of labor; Be difficult to again guarantee that the non-flat surface that each turning goes out can both completely unify; In addition, the wearing and tearing of processing cutter head in turning process are also comparatively severe, processing cost is higher.
Summary of the invention
Technical problem to be solved by this invention provides segmented diamond compact that a kind of efficient is high, cost is low and preparation method thereof.
For addressing the above problem, the present invention realizes through following scheme:
The preparation method of segmented diamond compact comprises the steps:
(1) with the diamond layer of a sheet of diamond particles preparation;
(2) with the composite part of a sheet of carbide alloy preparation, this composite part is the top of hard alloy substrate, and the upper surface of composite part matches with the soffit of diamond layer, the soffit of composite part is the plane;
(3) with the connecting portion of a column of carbide alloy preparation, this connecting portion is the bottom of hard alloy substrate, and the upper surface of connecting portion is that the soffit of plane, connecting portion is a curved surface;
(4) let the upper surface of composite part and the soffit of diamond layer join, and make composite part and diamond layer under high-temperature and high-pressure conditions, be combined into the composite sheet idiosome;
(5) let the upper surface of connecting portion and the soffit of composite part join, and make connecting portion and composite sheet idiosome be welded into the composite sheet body through vacuum diffusion welding.
In the said method, the connecting portion of the composite part of said step (2) and step (3) preferably all adopts carbide alloy to build moulding in advance.
In the said method, preferably add welding protecting agent in the welding process of said step (5).
In the said method, said composite sheet body is preferably whole cylindrical, and this moment, the composite part of diamond layer and hard alloy substrate all was the disk shape, and the connecting portion of hard alloy substrate is cylindric.
In the said method, the soffit of the connecting portion of said hard alloy substrate is preferably hemisphere face.
In the said method, the height of the connecting portion of said hard alloy substrate is more preferably greater than the height of composite sheet idiosome.
The segmented diamond compact comprises the composite sheet body, and this composite sheet body integral body is cylindricality, and mainly is made up of diamond layer and hard alloy substrate.Said hard alloy substrate comprises upper and lower two parts; Wherein: the top of hard alloy substrate be composite part in the form of sheets, the upper surface of this composite part matches with the soffit of diamond layer, the soffit of composite part is the plane; The bottom of hard alloy substrate is that connecting portion is column, and the upper surface of this connecting portion is that the soffit of plane, connecting portion is a curved surface.The upper surface of composite part and the soffit of diamond layer join, and composite part and diamond layer are combined into the composite sheet idiosome under high-temperature and high-pressure conditions; The upper surface of connecting portion and the soffit of composite part join, and connecting portion and composite sheet idiosome are welded into the composite sheet body through vacuum diffusion welding.
In the such scheme, said composite sheet body is preferably cylindrical, and this moment, the composite part of diamond layer and hard alloy substrate all was the disk shape, and the connecting portion of hard alloy substrate is cylindric.
In the such scheme, the soffit of the connecting portion of said hard alloy substrate is best hemisphere face.
In the such scheme, the height of the connecting portion of said hard alloy substrate is more preferably greater than the height of composite sheet idiosome.
Compared with prior art; The present invention has following characteristics: hard alloy substrate is divided into 2 parts prepares; Let hard alloy substrate composite part earlier with diamond layer under HTHP is regulated compound after, the connecting portion with the hard alloy substrate for preparing is connected the composite sheet idiosome through welding manner again; This is for producing the diamond compact that soffit is a curved surface; Can through the mode of building moulding once prepare a large amount of composite parts and connecting portion for use; Thereby can exempt the low and high deficiency of cost of production of production efficiency that original technology can only adopt Digit Control Machine Tool turning to be caused, make that finally the underside shape of diamond compact is more accurate, production efficiency improves and cost reduces.
Description of drawings
Fig. 1 is the sectional view of a kind of segmented diamond compact of the present invention.
Label among the figure: 1, diamond layer; 2, hard alloy substrate; 2-1, composite part; 2-2, connecting portion.
The specific embodiment
A kind of preparation method of segmented diamond compact comprises the steps:
The diamond layer 1 of a sheet of 1 usefulness diamond particles preparation, this method for preparing diamond layer 1 can adopt the preparation method of existing diamond layer 1.
The upper surface of the diamond layer of preparing 1 is that the cutwork face shape of composite sheet body is also similar with prior art, can be plane, sphere or steel helmet shape surface.The shape of the soffit of diamond layer 1 is similar with prior art, can or have the on-plane surface of tongue and groove for all smooth plane or non-smooth surface.
The composite part 2-1 of a sheet of 2 usefulness carbide alloy preparation, this composite part 2-1 is the top of hard alloy substrate 2, the upper surface of composite part 2-1 matches with the soffit of diamond layer 1, the soffit of composite part 2-1 is the plane.
In the present invention, the concrete grammar of composite part 2-1 of preparation hard alloy substrate 2 is the liquid hard alloy to be poured in the mould that has at the bottom of the plane build moulding.The composite part 2-1 of the hard alloy substrate of preparing 2 has a soffit with diamond layer 1 to the upper surface that cooperates, and this surface structure can or have the on-plane surface of tongue and groove for all smooth plane or non-smooth surface.The soffit of composite part 2-1 is then considered welding and recombination process, processes a smooth plane.
The connecting portion 2-2 of a column of 3 usefulness carbide alloy preparation, this connecting portion 2-2 is the bottom of hard alloy substrate 2, the upper surface of connecting portion 2-2 is that the soffit of plane, connecting portion 2-2 is a curved surface.
In the present invention, the concrete grammar of connecting portion 2-2 of preparation hard alloy substrate 2 is the liquid hard alloy to be poured in the mould that has at the bottom of the curved surface build moulding.The upper surface of the connecting portion 2-2 of the hard alloy substrate of preparing 2 is in order to cooperate the lower surface configuration of composite part 2-1; Process a smooth plane; The soffit of connecting portion 2-2 is that the composite sheet body is similar with prior art with the joint face shape of bit drills tooth; Can be for plane, cambered surface or hemisphere face, in the preferred embodiment of the present invention, the soffit of the connecting portion 2-2 of said hard alloy substrate 2 is a hemisphere face.
4 let the upper surface of composite part 2-1 and the soffit of diamond layer 1 join, and make composite part 2-1 and diamond layer 1 under high-temperature and high-pressure conditions, be combined into the composite sheet idiosome; Above-mentioned under HTHP is regulated the compound method that goes out the composite sheet idiosome similar with existing diamond layer 1 with the complex method of hard alloy substrate 2.
5 let the upper surface of connecting portion 2-2 and the soffit of composite part 2-1 join, and make connecting portion 2-2 and composite sheet idiosome be welded into the composite sheet body through vacuum diffusion welding.In order to guarantee the reliable soldering of connecting portion 2-2 and composite sheet idiosome, in welding process of the present invention, also added welding protecting agent.
Because the main effect of hard alloy substrate 2 composite part 2-1 is for can be mutually compound with diamond layer 1 under high-temperature and high-pressure conditions, for the particle infiltration of diamond layer 1; Therefore the height of hard alloy substrate 2 composite part 2-1 need not too high, as long as it highly is slightly larger than the infiltration thickness of diamond particles.In the preferred embodiment of the present invention, the height of the diamond layer 1 of the height of said hard alloy substrate 2 composite part 2-1 equates.The main effect of the connecting portion 2-2 of hard alloy substrate 2 is in order to realize the composite sheet body and to bore being connected of tooth; Therefore in order to guarantee the connection reliability of hard alloy substrate 2, the connecting portion 2-2 height of said hard alloy substrate 2 should be greater than the height of composite part 2-1.And in the preferred embodiment of the present invention, the height H of the connecting portion 2-2 of said hard alloy substrate 2 is greater than the height h of composite sheet idiosome.
The shape that goes out through method for preparing can prepare according to the shape of bit drills tooth; As can be prismatic or cylindrical for polygon; And in the present invention; Said composite sheet body integral body is cylindrical, and this moment, the composite part 2-1 of diamond layer 1 and hard alloy substrate 2 all was the disk shape, and the connecting portion 2-2 of hard alloy substrate 2 is cylindric.
Adopt the prepared a kind of segmented diamond compact of said method, as shown in Figure 1, it comprises the composite sheet body.This composite sheet body integral body is cylindricality, and mainly is made up of diamond layer 1 and hard alloy substrate 2.Said hard alloy substrate 2 comprises upper and lower two parts; Wherein the top of hard alloy substrate 2 be composite part 2-1 in the form of sheets, the upper surface of this composite part 2-1 matches with the soffit of diamond layer 1, the soffit of composite part 2-1 is the plane; The bottom of hard alloy substrate 2 is that connecting portion 2-2 is column, and the upper surface of this connecting portion 2-2 is that the soffit of plane, connecting portion 2-2 is a curved surface.The soffit of the upper surface of composite part 2-1 and diamond layer 1 joins, and composite part 2-1 and diamond layer 1 are combined into the composite sheet idiosome under high-temperature and high-pressure conditions; The soffit of the upper surface of connecting portion 2-2 and composite part 2-1 joins, and connecting portion 2-2 and composite sheet idiosome are welded into the composite sheet body through vacuum diffusion welding.
The shape of above-mentioned composite sheet body can prepare according to the shape of bit drills tooth; As can be prismatic or cylindrical for polygon; And in the present invention; Said composite sheet body integral body is cylindrical, and this moment, the composite part 2-1 of diamond layer 1 and hard alloy substrate 2 all was the disk shape, and the connecting portion 2-2 of hard alloy substrate 2 is cylindric.The upper surface of diamond layer 1 is that the cutwork face shape of composite sheet body is similar with prior art, can be plane, sphere or steel helmet shape surface.The upper surface of the soffit of diamond layer 1 and hard alloy substrate 2 composite part 2-1 constitutes the bonding surface between diamond layer 1 and the hard alloy substrate 2; The shape of this bonding surface is similar with prior art, can be all smooth plane or the non-smooth surface that cooperatively interacts or the on-plane surface with tongue and groove.The soffit of hard alloy substrate 2 connecting portion 2-2 is that the composite sheet body is similar with prior art with the joint face shape of bit drills tooth; Can be plane, cambered surface or hemisphere face; In the present invention, the soffit of the connecting portion 2-2 of said hard alloy substrate 2 is a hemisphere face.
Because the main effect of hard alloy substrate 2 composite part 2-1 is for can be mutually compound with diamond layer 1 under high-temperature and high-pressure conditions, for the particle infiltration of diamond layer 1; Therefore the height of hard alloy substrate 2 composite part 2-1 need not too high, as long as it highly is slightly larger than the infiltration thickness of diamond particles.In the preferred embodiment of the present invention, the height of the diamond layer 1 of the height of said hard alloy substrate 2 composite part 2-1 equates.The main effect of the connecting portion 2-2 of hard alloy substrate 2 is in order to realize the composite sheet body and to bore being connected of tooth; Therefore in order to guarantee the connection reliability of hard alloy substrate 2, the connecting portion 2-2 height of said hard alloy substrate 2 should be greater than the height of composite part 2-1.And in the preferred embodiment of the present invention, the height H of the connecting portion 2-2 of said hard alloy substrate 2 is greater than the height h of composite sheet idiosome.
Claims (10)
1. the preparation method of segmented diamond compact is characterized in that comprising the steps:
(1) with the diamond layer (1) of a sheet of diamond particles preparation;
(2) with the composite part (2-1) of a sheet of carbide alloy preparation, this composite part (2-1) is the top of hard alloy substrate (2), and the upper surface of composite part (2-1) matches with the soffit of diamond layer (1), the soffit of composite part (2-1) is the plane;
(3) with the connecting portion (2-2) of a column of carbide alloy preparation, this connecting portion (2-2) is the bottom of hard alloy substrate (2), and the upper surface of connecting portion (2-2) is that the soffit of plane, connecting portion (2-2) is a curved surface;
(4) let the upper surface of composite part (2-1) and the soffit of diamond layer (1) join, and make composite part (2-1) and diamond layer (1) under high-temperature and high-pressure conditions, be combined into the composite sheet idiosome;
(5) let the upper surface of connecting portion (2-2) and the soffit of composite part (2-1) join, and make connecting portion (2-2) and composite sheet idiosome be welded into the composite sheet body through vacuum diffusion welding.
2. the preparation method of segmented diamond compact according to claim 1 is characterized in that: the composite part (2-1) of said step (2) and the connecting portion (2-2) of step (3) all adopt carbide alloy to build moulding in advance.
3. the preparation method of segmented diamond compact according to claim 1 and 2 is characterized in that: added welding protecting agent in the welding process of said step (5).
4. the preparation method of segmented diamond compact according to claim 1; It is characterized in that: said composite sheet body integral body is cylindrical; This moment, the composite part (2-1) of diamond layer (1) and hard alloy substrate (2) all was the disk shape, and the connecting portion (2-2) of hard alloy substrate (2) is cylindric.
5. the preparation method of segmented diamond compact according to claim 4 is characterized in that: the soffit of the connecting portion (2-2) of said hard alloy substrate (2) is a hemisphere face.
6. the preparation method of segmented diamond compact according to claim 1 is characterized in that: the height (H) of the connecting portion (2-2) of said hard alloy substrate (2) is greater than the height (h) of composite sheet idiosome.
7. the segmented diamond compact comprises the composite sheet body, and this composite sheet body integral body is cylindricality, and mainly is made up of diamond layer (1) and hard alloy substrate (2), it is characterized in that:
Said hard alloy substrate (2) comprises upper and lower two parts; Wherein
The top of hard alloy substrate (2) be composite part (2-1) in the form of sheets, the upper surface of this composite part (2-1) matches with the soffit of diamond layer (1), the soffit of composite part (2-1) is the plane;
The bottom of hard alloy substrate (2) is that connecting portion (2-2) is column, and the upper surface of this connecting portion (2-2) is that the soffit of plane, connecting portion (2-2) is a curved surface;
The soffit of the upper surface of composite part (2-1) and diamond layer (1) joins, and composite part (2-1) is combined into the composite sheet idiosome with diamond layer (1) under high-temperature and high-pressure conditions;
The soffit of the upper surface of connecting portion (2-2) and composite part (2-1) joins, and connecting portion (2-2) is welded into the composite sheet body with the composite sheet idiosome through vacuum diffusion welding.
8. segmented diamond compact according to claim 7; It is characterized in that: said composite sheet body integral body is cylindrical; This moment, the composite part (2-1) of diamond layer (1) and hard alloy substrate (2) all was the disk shape, and the connecting portion (2-2) of hard alloy substrate (2) is cylindric.
9. segmented diamond compact according to claim 8 is characterized in that: the soffit of the connecting portion (2-2) of said hard alloy substrate (2) is a hemisphere face.
10. segmented diamond compact according to claim 7 is characterized in that: the height (H) of the connecting portion (2-2) of said hard alloy substrate (2) is greater than the height (h) of composite sheet idiosome.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012100780767A CN102606080A (en) | 2012-03-22 | 2012-03-22 | Segmented polycrystalline diamond compact and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012100780767A CN102606080A (en) | 2012-03-22 | 2012-03-22 | Segmented polycrystalline diamond compact and production method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1078766A (en) * | 1993-05-03 | 1993-11-24 | 中国地质大学长江钻头公司 | Low temperature electroforming diamond compact and oil bit thereof |
| CN2227735Y (en) * | 1995-04-24 | 1996-05-22 | 河南省科学院河南省计划经济委员会地理研究所 | Compounded ball drilling teeth made of diamond-hard alloy |
| CN2906032Y (en) * | 2005-11-24 | 2007-05-30 | 江汉石油钻头股份有限公司 | Polycrystalline diamond composite sheet with granular gradient |
| US20100236836A1 (en) * | 2007-10-04 | 2010-09-23 | Smith International, Inc. | Thermally stable polycrystalline diamond material with gradient structure |
| CN202510034U (en) * | 2012-03-22 | 2012-10-31 | 周付坤 | Sectional type diamond clad sheet |
-
2012
- 2012-03-22 CN CN2012100780767A patent/CN102606080A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1078766A (en) * | 1993-05-03 | 1993-11-24 | 中国地质大学长江钻头公司 | Low temperature electroforming diamond compact and oil bit thereof |
| CN2227735Y (en) * | 1995-04-24 | 1996-05-22 | 河南省科学院河南省计划经济委员会地理研究所 | Compounded ball drilling teeth made of diamond-hard alloy |
| CN2906032Y (en) * | 2005-11-24 | 2007-05-30 | 江汉石油钻头股份有限公司 | Polycrystalline diamond composite sheet with granular gradient |
| US20100236836A1 (en) * | 2007-10-04 | 2010-09-23 | Smith International, Inc. | Thermally stable polycrystalline diamond material with gradient structure |
| CN202510034U (en) * | 2012-03-22 | 2012-10-31 | 周付坤 | Sectional type diamond clad sheet |
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Application publication date: 20120725 |