CN102593077A - Liquid crystal polymer (LCP) encapsulating structure and manufacturing method thereof - Google Patents
Liquid crystal polymer (LCP) encapsulating structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN102593077A CN102593077A CN2011100082597A CN201110008259A CN102593077A CN 102593077 A CN102593077 A CN 102593077A CN 2011100082597 A CN2011100082597 A CN 2011100082597A CN 201110008259 A CN201110008259 A CN 201110008259A CN 102593077 A CN102593077 A CN 102593077A
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- CN
- China
- Prior art keywords
- lcp
- liquid crystal
- resin
- cover plate
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention relates to a liquid crystal polymer (LCP) encapsulating structure, which comprises a cover plate made of a first LCP resin material, and an annular sealing layer formed on the periphery of the cover plate and made of a second LCP resin material, wherein the cover plate and the sealing layer are combined together. A compound LCP cover plate is formed by combining the LCP cover plate and the LCP sealing layer together, so that the problems of complex assembling operation, difficulty in positioning and the like caused by separate use of the cover plate and the sealing layer in the prior art are solved, and the production efficiency and assembly yield are increased.
Description
Technical field
The present invention relates to plastic semiconductor level Hermetic Package technology, a kind of liquid crystal polymer especially wherein (Liquid Crystal Polyester, LCP) encapsulating structure and manufacturing approach thereof.
Background technology
At present, industry is used for the liquid crystal polymer of level Hermetic Package (Liquid Crystal Polyester, LCP) cover plate normally by the LCP material of single type, is not provided with encapsulant on itself.In some cases, the LCP cover plate also can be used with encapsulant.This encapsulant of using that relates to, normally the form with independent preforming ring plate exists.When implementing hermetic seal, be need place it between LCP cover plate and the LCP shell, then the three is linked together.
And this placement operation is to accomplish through manual direct control, and it need use special-purpose absorption instrument just can carry out.This also just makes it use the fit on operation loaded down with trivial details, and inconvenient.And in assembling process, the location of preforming ring plate neither a shirtsleeve operation, is easy to occur the problem of deviations, and this may directly cause original paper to cancel, or brings hidden danger for follow-up use.In addition, the preforming ring plate that is used as encapsulant also needs special independent packing, to prevent damaged before use or distortion.
Summary of the invention
Technical problem to be solved by this invention is an available liquid crystal polymer encapsulated structure, and its each assembly is at the fit on complex operation; And deviations appears in each inter-module easily in the assembling process.
In order to solve the problems of the technologies described above, technical scheme proposed by the invention is:
A kind of liquid crystal polymer encapsulating structure, it includes the cover plate that is made up of a LCP resin material, and is arranged at said cover plate periphery and annular sealing layer that be made up of the 2nd LCP resin material, and said cover plate and sealing layer combine.
Further, in different execution modes, its cover plate and sealing layer combine through moulding technology.
Further, in different execution modes, wherein a LCP resin is a melting range at 330 ℃ ~ 350 ℃ resin.
Further, in different execution modes, wherein the 2nd LCP resin is a melting range at 270 ℃ ~ 290 ℃ resin.
Further, in different execution modes, wherein the 2nd LCP resin is that fusing point is 280 ℃ a resin.
Further, in different execution modes, wherein the first and/or the 2nd LCP resin is filled with carbon dust.
Further, in different execution modes, it also includes the LCP shell that is arranged on said sealing layer below.
Further, in different execution modes, wherein the LCP shell is processed through moulding technology.
Further, another aspect of the present invention, provide a kind of liquid crystal polymer that a kind of manufacturing the present invention relates to (it includes following steps for Liquid Crystal Polyester, the LCP) manufacturing approach of encapsulating structure:
Melting range is processed the LCP cover plate at a LCP resin of 330 ℃ ~ 350 ℃, prepare melting range at 270 ℃ ~ 290 ℃ the 2nd LCP resin;
Carry out the 2nd LCP resin injection moulding at LCP cover plate periphery, form the annular sealing layer that constitutes by the 2nd LCP resin at the periphery of LCP cover plate, and then process the LCP composite decking;
Prepare etched lead frame and melting range fully at 330 ℃ ~ 350 ℃ the 3rd LCP resin, process the LCP shell that constitutes by the 3rd LCP resin through moulding technology and electroplating technology;
LCP composite decking and LCP shell are fitted together formation liquid crystal polymer encapsulating structure.
Further, in different execution modes, use therein the 2nd LCP resin is that fusing point is 280 ℃ a resin.
Further, in different execution modes, the LCP cover plate of wherein being processed by a LCP resin is processed through a LCP resin is carried out molding process.
Further, in different execution modes, wherein carry out the 2nd LCP resin injection moulding, accomplish through molding process at LCP cover plate periphery.
Further, in different execution modes, wherein the 3rd a LCP resin and a LCP resin are same material.
Compared with prior art; The invention has the beneficial effects as follows: the present invention combines LCP cover plate and LCP sealing layer; Form a kind of LCP composite decking, so also just avoided in the prior art, both individualisms use; Problem such as deviation appears in loaded down with trivial details and difficult location of the assembly manipulation that is brought or location easily, thereby enhances productivity and assemble qualification rate.
And for manufacturing approach, LCP cover plate and LCP sealing layer combine through moulding technology, also are more suitable in large-scale production.Further, for the LCP shell in the liquid crystal polymer encapsulating structure, it also adopts the moulding technology manufacturing, also makes the manufacturing of LCP shell be more suitable in large-scale production.Further, the LCP composite decking of more than inciting somebody to action, mentioning and the manufacture of LCP shell combine, and just make the liquid crystal polymer encapsulating structure manufacturing approach that the present invention relates to have higher manufacturing efficient, more are applicable to large-scale production.
Description of drawings
Fig. 1 is the logical construction sketch map of the liquid crystal composite encapsulating structure that the present invention relates to.
Embodiment
Specify embodiment of the present invention below in conjunction with accompanying drawing.
See also shown in Figure 1, a kind of liquid crystal composite encapsulating structure 100 that the present invention relates to, it becomes three-decker substantially.Its superstructure is for having by the LCP cover plate 10 of melting range 330 ℃ ~ 350 ℃ LCP resin formation.Its middle level structure 20 that is provided with down is a loop configuration, and along the periphery setting of cover plate, it is a sealing layer, is to be made up of the 2nd LCP resin of melting range 270 ℃ ~ 290 ℃ (in one embodiment, its fusing point is 280 ℃).Lower floor 30 is the LCP shell.Its cover plate 10 and sealing layer 20, both combine, and form a LCP composite decking.
Further, the present invention also provides a kind of manufacturing approach that is used to make the liquid crystal composite encapsulating structure that the present invention relates to.It mainly comprises two parts: the manufacturing approach of the manufacturing approach of LCP composite decking and LCP shell.
Wherein LCP composite decking manufacturing approach includes following steps:
1. high-melting-point LCP resin is prepared, wherein the melting range of high-melting-point LCP resin: 330 ℃ ~ 350 ℃, and fill carbon dust with painted;
2. molding process 1, processes the LCP cover plate;
3. low melting point LCP resin is prepared, and wherein relates to the melting range of the low melting point LCP resin of using: 270 ~ 290 ℃ (being preferably 280 ℃), and fill carbon dust with painted;
4. molding process 2: carry out the injection moulding of low melting point LCP resin at high-melting-point LCP cover plate periphery;
5. low melting point LCP sealing preforming ring plate forms, and just processes annular sealing layer;
6. scribing;
7. the LCP composite decking is processed.
Wherein LCP shell manufacturing approach includes following steps:
1. not etched lead frame preparation fully;
2. high-melting-point LCP resin is prepared, wherein the melting range of high-melting-point LCP resin: 330 ℃ ~ 350 ℃, and fill carbon dust with painted;
3. molding process 3, and need to reserve the lead-in wire bonding region;
4. metal plating comprises that inner lead bonding district and the Ni of back side pad place/Au electroplates;
5. the unit is cut apart;
6. the LCP shell is processed;
At last, the LCP composite decking is assembled in the LCP shell, accomplishes the liquid crystal composite encapsulating structure that the present invention relates to.
Wherein in LCP composite decking and the LCP shell, relate to all that to use melting range be 330 ℃ ~ 350 ℃ high-melting-point LCP resin, these two kinds of resin with high melting point materials can be same material, also can be same material not, can decide with actual needs, and indefinite.
The above is merely preferred embodiments of the present invention; Protection scope of the present invention is not exceeded with above-mentioned execution mode; In every case those of ordinary skills' equivalence that disclosure is done according to the present invention is modified or is changed, and all should include in the protection range of putting down in writing in claims.
Claims (10)
1. liquid crystal polymer encapsulating structure, it is characterized in that: it comprises the cover plate that is made up of a LCP resin material, and is arranged at said cover plate periphery and annular sealing layer that be made up of the 2nd LCP resin material, said cover plate and sealing layer combine.
2. liquid crystal polymer encapsulating structure according to claim 1 is characterized in that: said cover plate and sealing layer combine through moulding technology.
3. liquid crystal polymer encapsulating structure according to claim 1 is characterized in that: a said LCP resin is a melting range at 330 ℃ ~ 350 ℃ resin.
4. liquid crystal polymer encapsulating structure according to claim 1 is characterized in that: said the 2nd LCP resin is a melting range at 270 ℃ ~ 290 ℃ resin.
5. liquid crystal polymer encapsulating structure according to claim 4 is characterized in that: said the 2nd LCP resin is that fusing point is 280 ℃ a resin.
6. liquid crystal polymer encapsulating structure according to claim 1 is characterized in that: the said first and/or the 2nd LCP resin is filled with carbon dust.
7. liquid crystal polymer encapsulating structure according to claim 1 is characterized in that: it also comprises the LCP shell that is arranged on said sealing layer below.
8. liquid crystal polymer encapsulating structure according to claim 7 is characterized in that: said LCP shell is processed through moulding technology.
9. method of making liquid crystal polymer encapsulating structure as claimed in claim 1, it includes following steps:
Melting range is processed the LCP cover plate at a LCP resin of 330 ℃ ~ 350 ℃, prepare melting range at 270 ℃ ~ 290 ℃ the 2nd LCP resin;
Carry out the 2nd LCP resin injection moulding at LCP cover plate periphery, form the annular sealing layer that constitutes by the 2nd LCP resin at the periphery of LCP cover plate, and then process the LCP composite decking;
Prepare etched lead frame and melting range fully at 330 ℃ ~ 350 ℃ the 3rd LCP resin, process the LCP shell that constitutes by the 3rd LCP resin through moulding technology and electroplating technology;
LCP composite decking and LCP shell are fitted together formation liquid crystal polymer encapsulating structure.
10. the manufacturing approach of liquid crystal polymer encapsulating structure as claimed in claim 9 is characterized in that, wherein carries out the 2nd LCP resin injection moulding at LCP cover plate periphery, accomplishes through moulding technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100082597A CN102593077A (en) | 2011-01-14 | 2011-01-14 | Liquid crystal polymer (LCP) encapsulating structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100082597A CN102593077A (en) | 2011-01-14 | 2011-01-14 | Liquid crystal polymer (LCP) encapsulating structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102593077A true CN102593077A (en) | 2012-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100082597A Pending CN102593077A (en) | 2011-01-14 | 2011-01-14 | Liquid crystal polymer (LCP) encapsulating structure and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN102593077A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107324273A (en) * | 2017-06-12 | 2017-11-07 | 中国电子科技集团公司第五十四研究所 | A kind of method for packing of the MEMS based on LCP multiple-level stack technologies |
| CN108899306A (en) * | 2018-07-13 | 2018-11-27 | 中国电子科技集团公司第五十八研究所 | A kind of integrated circuit plastics seal structure and preparation method thereof |
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| CN1541026A (en) * | 2003-04-23 | 2004-10-27 | ������������ʽ���� | Surface mounting elemctronic element encapsulation |
| CN1556544A (en) * | 2003-12-31 | 2004-12-22 | 贵研铂业股份有限公司 | Preparation method of gastight packaged cover plate for integrated curcuit |
| CN101033383A (en) * | 2006-03-10 | 2007-09-12 | 国家淀粉及化学投资控股公司 | Adhesive composition |
| CN101796121A (en) * | 2007-08-31 | 2010-08-04 | Gs加特克斯公司 | Colored long fiber reinforced pellet and colored resin article manufactured by using the same |
| US20100201003A1 (en) * | 2005-03-02 | 2010-08-12 | Dane Thompson | Packaging Systems Incorporating Thin Film Liquid Crystal Polymer (LCP) and Methods of Manufacture |
-
2011
- 2011-01-14 CN CN2011100082597A patent/CN102593077A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1541026A (en) * | 2003-04-23 | 2004-10-27 | ������������ʽ���� | Surface mounting elemctronic element encapsulation |
| CN1556544A (en) * | 2003-12-31 | 2004-12-22 | 贵研铂业股份有限公司 | Preparation method of gastight packaged cover plate for integrated curcuit |
| US20100201003A1 (en) * | 2005-03-02 | 2010-08-12 | Dane Thompson | Packaging Systems Incorporating Thin Film Liquid Crystal Polymer (LCP) and Methods of Manufacture |
| CN101033383A (en) * | 2006-03-10 | 2007-09-12 | 国家淀粉及化学投资控股公司 | Adhesive composition |
| CN101796121A (en) * | 2007-08-31 | 2010-08-04 | Gs加特克斯公司 | Colored long fiber reinforced pellet and colored resin article manufactured by using the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107324273A (en) * | 2017-06-12 | 2017-11-07 | 中国电子科技集团公司第五十四研究所 | A kind of method for packing of the MEMS based on LCP multiple-level stack technologies |
| CN107324273B (en) * | 2017-06-12 | 2019-02-19 | 中国电子科技集团公司第五十四研究所 | A kind of packaging method of the MEMS device based on LCP multiple-level stack technology |
| CN108899306A (en) * | 2018-07-13 | 2018-11-27 | 中国电子科技集团公司第五十八研究所 | A kind of integrated circuit plastics seal structure and preparation method thereof |
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Application publication date: 20120718 |