CN102588925B

CN102588925B - Wing plate type three-dimensional light-emitting diode (LED) radiator

Info

Publication number: CN102588925B
Application number: CN201210054332.9A
Authority: CN
Inventors: 胡民浩; 高辉
Original assignee: SHAANXI TANGHUA ENERGY CO Ltd
Current assignee: SHAANXI TANGHUA ENERGY CO Ltd
Priority date: 2012-03-05
Filing date: 2012-03-05
Publication date: 2014-06-04
Anticipated expiration: 2032-03-05
Also published as: CN102588925A

Abstract

The invention relates to a wing plate type three-dimensional light-emitting diode (LED) radiator. A mode of installing a chip under the radiator is adopted by a traditional radiator structure of a high-power LED lamp, and the effective heat dissipation substantially relies on the surface area of the radiator. Two layers of thin-plate-shaped cooling fins are arranged, a sheet-shaped heat-conducting piece is clamped between the two cooling fins, an integration LED chip is embedded on one layer of cooling fin, two ends of each cooling fin are provided with turnup pieces which are provided with plump curved surfaces, and the turnup pieces and the curved surfaces on the turnup pieces form a wing-shaped double-layer heat dissipation structure. The turnup pieces arranged at two ends of the cooling fins and the curved surfaces are provided with strip-shaped open grooves, and the edges of two ends of the heat-conducting piece are sealed by sealing heat-conducting glue. The three-dimensional wing plate type heat-conducting piece structure is adopted, the heat dissipation area of the LED chip is increased, the heat-conducting piece is arranged so as to improve heat dissipation efficiency, and the service life of the LED lamp is effectively prolonged.

Description

Flange plate type 3 D stereo LED radiator

Technical field

the invention belongs to LED technical field of lamps, be specifically related to a kind of flange plate type 3 D stereo LED radiator.

Background technology

Light-emitting diodes degree pipe LED, as new generation of green environment protection solid lighting source, has few, photochromic pure, all solid state, a series of advantage such as quality is light, volume is little, environmental protection of power consumption.When LED is luminous, have portion of energy and be converted into heat, therefore can make LED chip temperature raise.And temperature on the service behaviour impact of LED chip greatly, high temperature can cause the photon of chip outgoing to reduce, and colour temperature Quality Down, accelerates chip aging, shortens the serious consequences such as device lifetime.Therefore for guaranteeing that LED normally works, the heat that must be come out distributes timely.At present great power LED chip application is more and more, and great power LED can only be converted into luminous energy by approximately 10% ~ 15% input power according to data, and all the other 85% ~ 90% are converted into heat energy.High-power LED light source is divided into again two types, and one is array distributed great power LED light source, and it is that several LED are carried out to array distribution layout.Another kind is integrated form great power LED light source, will count LEDs integration packaging together.This LED light fixture of two types is because of LED chip layout mode difference, distribution curve flux, take up room and dispel the heat above different.Comparatively speaking, it is light that the light fitting quality that integrated form great power LED light source is made is wanted, and aspect encapsulating material, materials will lack, and luminous intensity distribution aspect also can reach the requirement of street lighting compared with array distributed great power LED light source, is later street lamp development trend.But want difficult because array is compared in heat radiation, the therefore lost of life, becomes a crucial difficult problem that hinders integrated high-power LED light source development.

It is the mode that chip is installed in finned radiator below that traditional high-power LED lamp is top with heat spreader structures, and its efficiently radiates heat depends on radiator surface area substantially.The heat of LED chip mainly relies on base plate of radiator conduction, and is that LED installs the temperature of upper area far above the temperature at radiator edge, because its heat must progressively be conducted to radiator edge by LED chip mounting surface region forever.And main flow radiator all adopts 6063 aluminium, its thermal conductivity is generally no more than 200K/W.Meanwhile, in traditional handicraft, in the middle of radiator and LED chip, be all coated with thermal conductive silicon lipid material, its thermal conductivity is substantially between several K/W and tens K/W.Like this, be just more difficult to make the heat of LED chip to be able to more effectively conduct by radiator.

Summary of the invention

The object of this invention is to provide and a kind ofly can effectively improve the heat dissipation capacity of LED chip, the flange plate type 3 D stereo LED radiator that extends its service life.

The technical solution adopted in the present invention is:

A kind of flange plate type 3 D stereo LED radiator, is provided with integrated LED chip, it is characterized in that:

Described radiator is provided with the fin of two-layer plate-shaped, the lamelliform conducting strip of sandwiched in the middle of two fin;

Described integrated LED chip is embedded in wherein on one deck fin;

The two ends of described fin are provided with turns up sheet, turns up on sheet and is provided with the curved surface of heaving, and turns up sheet and forms wing double-deck radiator structure with the curved surface on it.

Turning up of described fin two ends is provided with bar shaped fluting on sheet and curved surface.

The described sealed heat-conducting glue of conducting strip edges at two ends seals.

The present invention has the following advantages:

1, there is higher radiating efficiency.The heat Quick diffusing that LED chip or large power semiconductor device can be produced, effectively reduces semiconductor devices node temperature, extends the semiconductor devices life-span.

2, save material, reduce costs.Relatively traditional heat-dissipating device structure, it is lighter that efficient 3 D stereo heat spreader structures can do, and saves a large amount of non-ferrous metals, and effectively reduce radiator cost, has good economic benefit and social benefit.

3, the long-life.Traditional heat-dissipating device and chip contact-making surface adopt the materials such as silicone grease mostly, have certain service life.And efficient 3 D stereo radiator adopts high conducting strip to guarantee that radiator contacts with the effective of chip, its stable performance, corrosion-resistant resistance to oxidation, the theoretical life-span is endless.

4, environmental protection.Radiator all material 100% is recyclable, containing noxious material, not free from environmental pollution.

Accompanying drawing explanation

Fig. 1 is structure chart of the present invention.

In figure, 1-fin, 2-conducting strip, 3-seals heat-conducting glue, 4-integrated LED chip.

The specific embodiment

Below in conjunction with the specific embodiment, the present invention will be described in detail.

A kind of flange plate type 3 D stereo LED radiator of the present invention, is applicable to the LED light fixture that single integrated chip is not more than 40W.Radiator is provided with the lamelliform conducting strip 2 of 1, two fin of fin, 1 middle sandwiched of two-layer plate-shaped.Integrated LED chip 4 is embedded in wherein on one deck fin 1.The two ends of fin 1 are provided with turns up sheet, turns up on sheet and is provided with the curved surface of heaving, and turns up sheet and forms wing double-deck radiator structure with the curved surface on it.Turning up of fin 1 two ends is provided with bar shaped fluting on sheet and curved surface.The sealed heat-conducting glue 3 of conducting strip 2 edges at two ends seals.Wing laminal fin 1 has larger area of dissipation, turning up the bar shaped all arranging on sheet and curved surface slots to its booster action that dispels the heat, all fin 1 structure all adopts 1060 pure aluminum materials, 6063 traditional aluminium of its thermal conductivity ratio exceed more than 10%, can more fast the heat of LED chip be conducted.

Claims

1. a flange plate type 3 D stereo LED radiator, is provided with integrated LED chip (4), it is characterized in that:

Described radiator is provided with the fin (1) of two-layer plate-shaped, the lamelliform conducting strip of sandwiched (2) in the middle of two fin (1);

Described integrated LED chip (4) is embedded in wherein on one deck fin (1);

The two ends of described fin (1) are provided with turns up sheet, turns up on sheet and is provided with the curved surface of heaving, and turns up sheet and forms wing double-deck radiator structure with the curved surface on it.

2. flange plate type 3 D stereo LED radiator according to claim 1, is characterized in that:

Turning up of described fin (1) two ends is provided with bar shaped fluting on sheet and curved surface.

3. flange plate type 3 D stereo LED radiator according to claim 1 and 2, is characterized in that:

The described sealed heat-conducting glue of conducting strip (2) edges at two ends (3) seals.