CN102582206A - Preparation method of copper-clad plate made from nano composite plastic - Google Patents
Preparation method of copper-clad plate made from nano composite plastic Download PDFInfo
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- CN102582206A CN102582206A CN2012100474009A CN201210047400A CN102582206A CN 102582206 A CN102582206 A CN 102582206A CN 2012100474009 A CN2012100474009 A CN 2012100474009A CN 201210047400 A CN201210047400 A CN 201210047400A CN 102582206 A CN102582206 A CN 102582206A
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Abstract
The invention discloses a preparation method of a copper-clad plate made from nano composite plastic. The copper-clad plate comprises a base plate and copper foil on the surface of the base plate, wherein the base plate is made from the nano composite plastic which comprises a plastic matrix and inorganic fillers of nanoscale size dispersed in the plastic matrix, and a nano composite plastic layer and the copper foil are adhered by virtue of an adhesion agent. The preparation method comprises the following steps: A), performing surface roughening on the base plate; B), degreasing and cleaning the surface of the base plate; C), cleaning the surface of the base plate with pure water and then drying the cleaned base plate; D), adding the adhesion agent to the surface of the base plate; and E), adhering the copper foil to the surface of the base plate in a rolling method, thus the copper-clad plate is formed.
Description
Technical field
the present invention relates to a kind of preparation method, relate in particular to a kind of preparation method of copper-clad plate of being processed by nano composite plastics.
Background technology
general PCB printed circuit board baseplate material can be divided into two big types: rigid substrates material and flexible substrate material.The important kind of general rigid substrates material is copper-clad plate.It is with reinforcing material (Reinforeing Material), soaks with the resin adhesive, through oven dry, cutting, be overlapped into blank, is covered with Copper Foil then, with steel plate as mould, in hot press through HTHP be shaped processing and preparation.The prepreg that general multi-layer sheet is used then is the semi-finished product (mostly be glass cloth soak with resin, through drying process) of copper-clad plate in manufacturing process.The sorting technique of copper coated foil plate has multiple.The reinforcing material of general pressing board is different, can be divided into: paper substrate, glass fibre fabricbase, compound base (CEM series), lamination multi-layer sheet base and special material base (pottery, metal-cored base etc.) five big classes.If the resin adhesive difference that pressing board adopted is classified, common paper substrate CCI has: all kinds such as phenolic resins (XPc, XxxPC, FR 1, FR 1 etc.), epoxy resin (FE 1), mylar.Common glass fibre fabricbase CCL has epoxy resin (FR 1, FR 1), and it is the most widely used at present glass fabric base type.Also have other particularity resins (with glass fabric, to gather basic nylon, nonwoven etc. serve as the increase material) in addition: bi-maleimide modified cyanate resin (BT), polyimide resin (PI), diphenylene ether resin (PPO), maleic anhydride imines---styrene resin (MS), poly-cyanate ester resin, vistanex etc.Baseplate material on the PCB wiring board must have physics and chemical characteristic simultaneously, especially be insulating properties and thermal diffusivity, so the special material substrate is applied on the PCB wiring board widely.And the special material substrate is divided into metal species substrate, ceramic-like substrate, heat-resisting plastic substrate and flexible copper-clad paper tinsel plate.Metal species substrate wherein for guarantee and the copper layer between guarantee insulation, therefore between the copper layer, must be provided with a layer insulating, the setting of this layer insulating has not only increased the processing technology difficulty, makes the heat dispersion of copper-clad plate of moulding reduce greatly more.And the higher pliability of the more difficult cost of the moulding of ceramic-like substrate is relatively poor.
Through the combining of engineering plastics and inorganic filler, preparing a kind of coefficient of heat transfer can be greater than 2000W/m in the prior art
2
The polymer composite of K, its radiating effect have reached 10 times of heat dissipation metal material, and it is prepared by insulator simultaneously, meet the effect of copper-clad plate insulation fully.
but in the prior art, owing to lack the technical matters that this kind polymer composite is combined with copper, so can't prepare the copper-clad plate of processing by nano composite plastics.
Summary of the invention
to the problems referred to above, and main purpose of the present invention provides a kind of preparation method of copper-clad plate of being processed by nano composite plastics, can polymer composite be combined into copper-clad plate with copper.
In order to solve an above-mentioned difficult problem; The scheme that the present invention takes is: a kind of preparation method of copper-clad plate of being processed by nano composite plastics; Said copper-clad plate comprises substrate and the Copper Foil that is arranged on this substrate surface, and said substrate is processed by nano composite plastics, and said nano composite plastics comprises plastic substrate and is dispersed in the inorganic filler in the plastic substrate with nano-grade size; Bonding through adhesive between said nano composite plastics layer and the said Copper Foil, it may further comprise the steps:
A) substrate is carried out surface coarsening;
B) degreasing is cleaned the surface of substrate;
C) use pure water to clean to the surface of substrate, and cleaned substrate is dried;
D) on the surface of substrate, add adhesive;
E) method of Copper Foil through roll extrusion pasted on the surface of substrate forms copper-clad plate.
preferably, in steps A) in, the method for substrate being carried out surface coarsening is a sand-blast.
preferably, in steps A) in, the method that substrate is carried out surface coarsening is mixed in mixed acid that other acid form the surface with the activation substrate for substrate being immersed chromic acid or chromic acid.
preferably, in step C), a kind of in the epoxy resin of modified rubber phenolic resins system, modification, the polyimides glue system of said adhesive.
preferably, in step e) also comprise a step F afterwards), step F) verification is carried out in the copper-clad plate that is shaped, the method for verification is to carry out the test of hundred lattice to detect the adhesive force of copper layer and substrate through the 3M adhesive tape.
The present invention adopts above method, has the following advantages:
1, technology is simple, and production cost is low;
2, good product quality, yield rate is high.
The specific embodiment
a kind of copper-clad plate of processing by nano composite plastics; It comprises the nano composite plastics layer and pastes the copper layer at nano composite plastics layer upper surface that nano composite plastics layer forms for being dispersed in the plastic substrate with nano-grade size by inorganic filler.Wherein, the diameter of inorganic filler is 10
-10
~ 10
-6
Rice.Coefficient of heat transfer is greater than 2000W/m
2
K is between thermal conductivity factor 5 ~ 10 W/mK.
The thickness of
nano composite plastics layer is 0.1 ~ 5mm.The thickness of said copper layer is 5-100 μ m.
another kind of copper-clad plate of processing by nano composite plastics; It comprises the nano composite plastics layer and pastes the copper layer on the upper and lower surface of nano composite plastics layer that nano composite plastics layer forms for being dispersed in the plastic substrate with nano-grade size by inorganic filler.Wherein, the diameter of inorganic filler is 10
-10
~ 10
-6
Rice.Coefficient of heat transfer is greater than 2000W/m
2
K is between thermal conductivity factor 5 ~ 10 W/mK.The thickness of nano composite plastics layer is 0.1 ~ 5mm.The thickness of said copper layer is 5-100 μ m.
composite is a kind of heterogeneous solid material that is formed by two or more physics combinations of substances different with chemical property.In composite, common one is continuous phase mutually, is called matrix (Matrix); Another is decentralized photo mutually; Be called supporting material (reinforcement), decentralized photo is distributed in the whole continuous phase with independent phase, has boundary (interface) between the two-phase.
The plastic substrate of
nano composite plastics layer can be in polyamide-based (PA), PET series (PET), epoxy resin (Epoxy Resin), polyimides system (PI), the PPS system a kind of.
nano composite plastics layer inorganic filler be a kind of in carbon element, oxide based, nitride based, the hydroxide system.
nano composite plastics is to be dispersed in the plastic substrate with nano-grade size by inorganic filler to form.Compare with traditional composite, plastic substrate and inorganic filler are being received in the scope compoundly, and interfacial area is very big between two-phase; There is the chemical bond between the interface; Form excellent cohesion, can eliminate the mutually unmatched problem of organic/inorganic, form diverse characteristic and manifest.
nano level material can produce quantum size effect; 1. small-size effect; 2. skin effect; 3. macro quanta tunnel effect; 4. coulomb stops up and quantum tunneling.
can be big through the surface of nano level material; Easy reunion can reduce the surface can; Eliminate surface charge; Weaken surface polarity, with surface coverage modification, mechanochemical modification, theca externa modification, Topically active modification, high-energy surface modification, utilize the precipitation reaction surface modification.Therefore this nano composite plastics layer has the hear resistance raising; Thermal diffusivity significantly improves; Air-breathing property and hygroscopicity are lower; Advantages such as the size coefficient of expansion is lower.
Through evidence, the thermal conductivity factor of several kinds of copper-clad plate common used materials is:
Aluminium base: 0.5 ~ 2.0W/mK;
E type glass fabric substrate:<1 WmK;
FR-4 epocel fabricbase copper-clad plate: 0.5W/mK;
And among the present invention, the thermal conductivity factor of the copper-clad plate of the nano composite plastics layer of employing is greater than 5W/mK, and coefficient of heat transfer can be greater than 2000 W/m
2
K.Therefore, can be applicable to that high heat-radiating substrate uses and because of it is higher than aluminium alloy and ceramic heat-dissipating ability, directly with substrate as radiator, the heat that fast electronic component on the substrate is produced is derived also heat radiation fast.
The density of
this nano composite plastics is low, and is therefore in light weight, and adopt injection moulding machine-shaping, therefore do not have loss basically, and material also can recycle repeatedly, more the environmental protection and saving cost.
A kind of preparation method of copper-clad plate of processing by nano composite plastics; It is characterized in that: said copper-clad plate comprises substrate and the Copper Foil that substrate surface is set; Said substrate is processed by nano composite plastics; Said nano composite plastics comprises plastic substrate and is dispersed in the inorganic filler in the plastic substrate with nano-grade size that bonding through adhesive between said nano composite plastics layer and the said Copper Foil, it may further comprise the steps:
A) substrate is carried out surface coarsening;
B) degreasing is cleaned the surface of substrate;
C) use pure water to clean to the surface of substrate, and cleaned substrate is dried;
D) on the surface of substrate, add adhesive;
E) method of Copper Foil through roll extrusion pasted on the surface of substrate forms copper-clad plate.
are in steps A) in substrate is carried out surface coarsening can adopt sand-blast.Sand-blast is that employing compressed air is power; To spray material (copper ore, quartz sand, diamond dust, iron sand, SEMEN AMOMI LONGILIGULA) high velocity jet to the surface of the work that needs to handle to form the high velocity jet bundle, and the appearance or the shape of the outer surface of surface of the work changed, because abrasive material is to the impact and the shear action of surface of the work; Make the surface of workpiece obtain certain cleannes and different roughness; Therefore the mechanical performance of surface of the work is improved, improved the fatigue resistance of workpiece, increased the adhesive force between it and the coating; Prolong the durability of filming, also helped the levelling and the decoration of coating.
are in steps A) in surface coarsening that substrate is carried out can adopt and substrate is immersed chromic acid or chromic acid mix in mixed acid that other acid form surface with the activation substrate.
are at step B) in degreasing, the surface of substrate is cleaned; Claim oil removing again.Finger is removed the method for grease from waste water, mud or solid waste.The equipment that from waste water, separates grease has oil interceptor and grease removal tank.In addition, it also refers to the process of removal of oil and grease on machine part or the iron product surface.Lubricating oil, antirust oil that grease is stained with during mainly from machined, the oil sealing of lay up period, the antiscuffing paste that remover when molded and grinding and polishing light time are stained with etc.The method of degreasing has: organic solvent degreasing, chemical degreasing, electrochemical degreasing etc.
are at step C) in, use pure water to clean to the surface of substrate, and cleaned substrate is dried.
are at step D) in, a kind of in the epoxy resin of modified rubber phenolic resins system, modification, the polyimides glue system of adhesive.
rubber toughened phenolic aldehyde is modal toughened system.Rubber toughened phenolic resins belongs to physics blending modification, but in various degree grafting or block copolymerization reaction are arranged in solidification process, and the addition of rubber generally is controlled at 6%～15%.In the mixture of solubility and linear phenol-aldehyde resin, add carboxylic acrylonitrile-butadiene rubber; Because of the two keys of the methylol in the resol resin and the butadiene in the acrylonitrile-butadiene rubber, carboxyl react; Make between phenolic resins and the acrylonitrile-butadiene rubber close-coupled by chemical bond; So can improve the mechanical property of phenolic resins, also can improve its hear resistance.Except acrylonitrile-butadiene rubber, contain the rubber of active group, like epoxy radicals liquid butadiene rubber, carboxy acrylic rubber, epoxy carboxyl butyronitrile addition product can plasticizing phenol formaldehydes, and toughening effect is remarkable.
The epoxy resin of
modification is that the adding nano material is a kind of effective method of modifying in epoxy resin.The surperficial non-matching courtyard of nano material is many, and is big with epoxy resin generation physics or chemically combined possibility, strengthened the adhesion at particle and interface, so have enhancing, toughness reinforcing performance.
Polyimides glue is like PI/SiO
2
Nano composite material, its Young's modulus increases, and hot strength and extension at break increase within the specific limits to some extent, SiO
2
Material played not only strengthen but also toughness reinforcing effect, and the thermal coefficient of expansion of PI reduces.Therefore they can be used for preparing the material of high modulus and intensity, high temperature resistant and low thermal coefficient of expansion, are widely used in microelectronic.
are in step e) in, the method for Copper Foil through roll extrusion pasted on the surface of substrate form copper-clad plate.
preferably, in step e) also comprise a step F afterwards), step F) verification is carried out in the copper-clad plate that is shaped, the method for verification is to carry out the test of hundred lattice to detect the adhesive force of copper layer and substrate through the 3M adhesive tape.
The present invention adopts above method, has the following advantages:
1, technology is simple, and production cost is low;
2, good product quality, yield rate is high.
the foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to let the personage who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (5)
1. the preparation method of a copper-clad plate of processing by nano composite plastics; It is characterized in that: said copper-clad plate comprises substrate and the Copper Foil that is arranged on this substrate surface; Said substrate is processed by nano composite plastics; Said nano composite plastics comprises plastic substrate and is dispersed in the inorganic filler in the plastic substrate with nano-grade size that bonding through adhesive between said nano composite plastics layer and the said Copper Foil, it may further comprise the steps:
A) substrate is carried out surface coarsening;
B) degreasing is cleaned the surface of substrate;
C) use pure water to clean to the surface of substrate, and cleaned substrate is dried;
D) on the surface of substrate, add adhesive;
E) method of Copper Foil through roll extrusion pasted on the surface of substrate form copper-clad plate.
2. the preparation method of copper-clad plate of being processed by nano composite plastics according to claim 1 is characterized in that: in steps A) in, the method for substrate being carried out surface coarsening is a sand-blast.
3. the preparation method of copper-clad plate of processing by nano composite plastics according to claim 1; It is characterized in that: in steps A) in, the method that substrate is carried out surface coarsening is mixed in the mixed acid that other acid systems form the surface with the activation substrate for substrate being immersed chromic acid or chromic acid.
4. the preparation method of copper-clad plate of being processed by nano composite plastics according to claim 1 is characterized in that: in step D), a kind of in the epoxy resin of modified rubber phenolic resins system, modification, the polyimides glue system of said adhesive.
5. the preparation method of copper-clad plate of processing by nano composite plastics according to claim 1; It is characterized in that: in step e) also comprise a step F afterwards); Verification is carried out in copper-clad plate to being shaped, and the method for verification is to carry out the test of hundred lattice to detect the adhesive force of copper layer and substrate through the 3M adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100474009A CN102582206A (en) | 2012-02-28 | 2012-02-28 | Preparation method of copper-clad plate made from nano composite plastic |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100474009A CN102582206A (en) | 2012-02-28 | 2012-02-28 | Preparation method of copper-clad plate made from nano composite plastic |
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| CN102582206A true CN102582206A (en) | 2012-07-18 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101224651A (en) * | 2008-02-02 | 2008-07-23 | 徐跃 | Sheet metal and non-metal fiber film compound material |
| CN101670697A (en) * | 2008-09-12 | 2010-03-17 | 财团法人工业技术研究院 | Double-sided metal foil layer laminated board and manufacture method thereof |
-
2012
- 2012-02-28 CN CN2012100474009A patent/CN102582206A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101224651A (en) * | 2008-02-02 | 2008-07-23 | 徐跃 | Sheet metal and non-metal fiber film compound material |
| CN101670697A (en) * | 2008-09-12 | 2010-03-17 | 财团法人工业技术研究院 | Double-sided metal foil layer laminated board and manufacture method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 施利毅: "《纳米材料》", 31 January 2007 * |
| 王增品，姜安玺: "《腐蚀与防护工程》", 30 April 1991 * |
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Application publication date: 20120718 |