CN102581114B - Wafer blanking production equipment and processing method - Google Patents
Wafer blanking production equipment and processing method Download PDFInfo
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- CN102581114B CN102581114B CN 201210075650 CN201210075650A CN102581114B CN 102581114 B CN102581114 B CN 102581114B CN 201210075650 CN201210075650 CN 201210075650 CN 201210075650 A CN201210075650 A CN 201210075650A CN 102581114 B CN102581114 B CN 102581114B
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Abstract
The invention discloses production equipment, which comprises a base, an uncoiler, a leveling machine, a Y-axis swinging platform, an X-axis servo feeder and a pressure machine. The production equipment is characterized in that the uncoiler, the leveling machine and the X-axis servo feeder are all fixed on a swinging frame; the servo feeder is positioned at one end of the swinging frame close to the pressure machine; and the uncoiler and the leveling machine are fixed at the other end of the swinging frame. The S-type processing method comprises the following steps: processing a first wafer; keeping belting X-coordinate unchanged and performing wafer production once when each the increasing of the Y-coordinate is more than or equal to square root of twelve times r (r is the diameter of the wafer blanking); and performing wafer production once when each the decreasing of the Y-coordinate is more than or equal to square root of twelve times r. The M-type processing method comprises the following steps: processing the back-side wafer, increasing of the X-coordinate by deltax relative to a previous wafer, and increasing the Y-coordinate by deltay, wherein deltax is more than or equal to r, and deltay is more than or equal to square root of three times r; and processing the front-side wafer, wherein the X-coordinate is decreased while the Y-coordinate is increased. According to the equipment and the method provided by the invention, effectively and quickly processing the wafer blanking is realized, not only the raw materials are fully utilized, but also the work efficiency is also improved, the material utilization ratio can be improved by over 5-7 percent, and therefore, the equipment and the method is very suitable for medium and small batch production.
Description
Technical field
The present invention relates to a kind of wafer blanking production equipment and processing method, in particular, relate in particular to wafer blanking production equipment and processing method that a kind of coiled strip is completed continuously to disk production.
Background technology
Metal disk blanking operation is the basic process of the work piece production such as five metals cooker, auto parts, pot body closing end, light fixture, electric machine rotor, need to expend a large amount of manpower and materials produces, how saving cost, raising efficiency and quality, is all producer's problems of concern.The mode of production that recent year manufacturer is popular is the blanking of first coiled strip being cut sth. askew, more manually sheet material is taken and carried out wafer blanking on punch press that operating efficiency and materials rate are all lower; And owing to being manual work, there is serious hidden danger aspect personal security.
Summary of the invention
The present invention is in order to overcome the shortcoming of above-mentioned technical problem, the wafer blanking production equipment and the processing method that provide a kind of coiled strip to complete continuously to disk production.
Wafer blanking production equipment of the present invention, the uncoiler that has comprised the basis of fixing and supporting role, coiled strip is supported, be used for levelling machine that coiled strip flattens, the Y-axis oscillating platform that can move along the foundation width direction, order about the X-axis servo feeder that the band material moves along the foundation length direction and the forcing press of realizing disk processing, its special feature is: described Y-axis oscillating platform comprises swing frame, support roller and orders about band and expect that swing frame is arranged on the basis rotationally along the servo drive of foundation width direction swing; Uncoiler, levelling machine and X-axis servo feeder all are fixed on swing frame, and servo feeder is positioned at an end of close forcing press on swing frame, and uncoiler and levelling machine are fixed in the other end of swing frame.
Fixing and the support of whole feed system is realized on the basis, and uncoiler, levelling machine are realized uncoiling and the smoothing of coiled strip; Forcing press is realized the production of corresponding wafer blanking by mould.Swing frame is arranged on the basis rotationally, and support roller is realized the support to swing frame, guarantees that swing frame moves in horizontal plane; The servo drive of Y-axis carries out precise positioning to the motion of swing frame and controls.Servo feeder realizes that the band material is along the motion of foundation length direction (X-axis); Uncoiler, levelling machine and servo feeder all are arranged on oscillating platform, are conducive to guarantee precision and the stationarity of feeding feeding.By the common driving effect of X-Y diaxon servo drive, realized motion and accurate locate of band material in plane of living in, then by the die of press punching press, can effectively carry out wafer blanking production.
Wafer blanking production equipment of the present invention is provided with bearing spider on described basis, is provided with the floating bearing that matches with bearing spider on swing frame, and uncoiler and levelling machine are positioned at the top of bearing spider; Described servo drive orders about swing frame by sprocket wheel chain draw-gear and rotates; Support roller is positioned at the below of swing frame, is used for guaranteeing that swing frame is in level all the time.By coordinating of support roller and floating bearing, realized that swing frame rotates stably in level.Uncoiler and levelling machine are positioned at the top of floating bearing, can reduce rotary inertia, improve the response that swings, and realize the high speed feeding of Y-axis.
Wafer blanking production equipment of the present invention, also be provided with feeding device on basis near the uncoiler place, this feeding device comprises coiled strip carriage, moving body, realizes the material loading guide rail of coiled strip horizontal movement and realizes lifting apparatus and the drive motors that coiled strip moves up and down.By feeding device, can effectively and quickly coiled strip be loaded on uncoiler.
Wafer blanking production equipment of the present invention also is provided with material-supporting device between servo feeder and forcing press; This material-supporting device comprises two bearing that is rotationally connected and carriages, and described carriage is connected by hydraulic cylinder with bearing; The end of carriage rotates and is provided with and the care feed tray that matches with material, and this care feed tray also is connected with carriage by cylinder.In the process that wafer blanking is produced, in the process of servo feeder and the motion of servo drive rotating band material, the band material that is positioned on press bench very easily is scratched, and orders about on care feed tray by cylinder and moves, and has avoided contacting of band material and work top.In the process of mold exchange, by the driving of hydraulic cylinder, order about carriage turns and the band material significantly can be lifted, formed larger die change space.
Wafer blanking production equipment of the present invention also comprises palletizing system that wafer blanking is automatically collected, the waste disposal system that clout is cut off and the mold changing systems of realizing the forcing press quickly replacing mould.Palletizing system is used for the disk that the piling punching press is good and is convenient to carrying, and the waste disposal system scrap belt that punching press is complete cuts off and processes.
S type disk processing method of the present invention is established servo feeder and is ordered about band material and move along the advance and retreat of foundation length direction and move for X-direction, and it is that Y direction is moved that oscillating platform orders about the swing along the foundation width direction that the band material carries out; And the radius of establishing wafer blanking is r, its special feature is, described processing method comprises the following steps: the first wafer blanking processing of a. the first row, order about by servo feeder and oscillating platform the below that the band material moves to die of press, process first wafer blanking with the form near band material one side (being made as the A side) edge, and the coordinate of establishing this wafer blanking is (0,0); B. the first row wafer blanking processing, the coordinate of retainer belt material X-axis is constant, the every increase of Y coordinate 〉=
Apart from the time carry out a blanking production, until cut to the edge of band material opposite side (being made as the B side), complete the processing of the first row wafer blanking; C. the second first wafer blanking processing of row, utilize servo feeder to order about the band material and advance on X-axis 〉=r, utilize oscillating platform to order about the band material to successively decrease on Y-axis 〉=
Distance, carry out the processing of the second first wafer blanking of row; D. the second row wafer blanking processing, the coordinate of retainer belt material X-axis is constant, and the Y coordinate often successively decreases 〉=
Apart from the time carry out a blanking production, until cut to the edge of band material A side, complete the second row wafer blanking processing; E. repeating step a, b, c and d are until the wafer blanking completion of processing.
M type disk processing method of the present invention is established servo feeder and is ordered about band material and move along the advance and retreat of foundation length direction and move for X-direction, and it is that Y direction is moved that oscillating platform orders about the swing along the foundation width direction that the band material carries out; And the radius of establishing wafer blanking is r, it is characterized in that, described processing method comprises the following steps: a. the first wafer blanking processing, order about by servo feeder and oscillating platform the below that the band material moves to die of press, process first wafer blanking with the form near band material one side (being made as the A side) edge, and the coordinate of establishing this wafer blanking is (0,0); B. rear side wafer blanking processing, the X-axis coordinate increases with respect to the X-axis coordinate of last wafer blanking
,
〉=r; The Y-axis coordinate increases with respect to the Y-axis coordinate of last wafer blanking
,
〉=
, utilize forcing press to carry out wafer blanking processing; C. front side wafer blanking processing, the X-axis coordinate reduces with respect to the X-axis coordinate of last wafer blanking
, the Y-axis coordinate increases with respect to the Y-axis coordinate of last wafer blanking
, utilize forcing press to carry out wafer blanking processing; D. repeating step b and c, be with the edge of expecting opposite side (being made as the B side) until be machined to; E. repeating step b and c are until the wafer blanking completion of processing.
In above-mentioned S type or M type disk processing method, when displacement was got minimum of a value, adjacent two wafer blankings were just tangent, and for the workpiece that guarantees to produce has qualified size, displacement should be more greatly; The narrowest place that makes clout between adjacent disk is 1～3mm, and optimum value is chosen as 2mm.Described coordinate is the centre coordinate of wafer blanking.
The invention has the beneficial effects as follows: wafer blanking production equipment of the present invention, order about by setting the servo feeder that the band material moves along the foundation length direction, and order about the band material at the oscillating platform of foundation width direction swing, realize the motion of band material in two dimensional surface, realized the processing of wafer blanking effectively and quickly; S type of the present invention or M type disk processing method, the processing sequence by rational deployment disk position and reasonable layout wafer blanking on the band material had both taken full advantage of raw material, had also effectively improved operating efficiency.Can carry out the Automatic Optimal stock layout by the stock layout control program, use coiled strip to carry out the metal disk punching production, replace coiled material first to cut into slices and held again the technique that sheet stock carries out punching production, reduced production process, labour intensity and potential safety hazard have been reduced, spillage of material in the time of also can not producing monolithic production can improve the above stock utilization of 5-7%; The special forcing press of making makes the metal disk speed of production reach per minute more than 40; Adopt simultaneously quick mold change systems, product specification conversion rapidly, in being fit to very much, small lot batch manufacture.
Description of drawings
Fig. 1 is the main TV structure schematic diagram of production equipment of the present invention;
Fig. 2 is the plan structure schematic diagram of production equipment of the present invention;
Fig. 3 is the main TV structure schematic diagram that in production equipment of the present invention, match with oscillating platform in the basis;
Fig. 4 is the plan structure schematic diagram that in production equipment of the present invention, match with oscillating platform in the basis;
Fig. 5 is the structural representation of material-supporting device in production equipment of the present invention;
Fig. 6 is the principle schematic of S type disk processing method in the present invention;
Fig. 7 is the principle schematic of M type disk processing method in the present invention;
Fig. 8 processes the layout structure schematic diagram of 3 wafer blankings along the width of band material under S type disk processing method;
Fig. 9～Figure 12 is the schematic diagram when processing wafer blanking layout shown in Figure 8.
In figure: 1 feeding device, 2 uncoilers, 3 levelling machines, 4 servo feeders, 5 oscillating platforms, 6 material-supporting devices, 7 forcing presses, 8 mold changing systems, 9 palletizing systems, 10 waste disposal systems, 11 bases, 12 material loading guide rails, 13 drive motors, 14 bearing spiders, 15 floating bearings, 16 support rollers, 17 servo drives, 18 sprocket wheel chain draw-gears, 19 bearings, 20 hydraulic cylinders, 21 cylinders, 22 care feed trays, 23 carriages, 24 material punching mould tools, 25 lifting apparatus, 26 swing frames, 27 band material supports.
The specific embodiment
The invention will be further described below in conjunction with accompanying drawing and embodiment.
As depicted in figs. 1 and 2, provided the structural representation of wafer blanking production equipment of the present invention, it comprises feeding device 1, uncoiler 2, levelling machine 3, servo feeder 4, oscillating platform 5, material-supporting device 6, forcing press 7, mold changing systems 8, palletizing system 9, waste disposal system 10, basis 11.Fixing and supporting role are played in shown basis, and oscillating platform 5 is arranged on basis 11 rotationally, realize that the band material is along the swing of foundation width direction.Uncoiler 2 is used for the support of coiled strip, and levelling machine 3 realizes that the band material is transported to servo feeder 4 after smoothing processing step to launching the flattening of rear band material.Servo feeder 4 realization band material move along the foundation length direction, and forcing press 7 is realized the processing of wafer blanking; Material-supporting device 6 is realized the retainer effect in the process of producing between forcing press 7 and servo feeder 4.Mold changing systems 8, palletizing system 9 and waste disposal system 10 all match with forcing press 7, realize respectively quickly replacing mould, the wafer blanking automatic stacking is transported and processes timely processing remaining band material.
As shown in Figure 3 and Figure 4, provided oscillating platform 5 and basis 11 structural representations that coordinate, oscillating platform 5 comprises swing frame 26, bearing spider 14, floating bearing 15, support roller 16, servo drive 17, sprocket wheel chain draw-gear 18; Bearing spider 14 is arranged on the basis, and the right-hand member of swing frame 26 matches with bearing spider 14 by floating bearing 15, effectively swing frame 26 is fixed on basis 11.Support roller 16 is arranged on the below in swing frame 26 left sides, in the process of oscillating platform motion, guarantees that swing frame 26 is in level all the time.Servo drive 17 is arranged on the left end of swing frame 26, realizes effective driving to swing frame 26 by sprocket wheel chain draw-gear 18.Uncoiler 2 and levelling machine 3 all are arranged on the swing frame 26 of floating bearing 15 tops, in order to guarantee the firm support of uncoiler 2 and levelling machine 3 and reduce rotary inertia.Servo feeder 4 is fixedly installed on the left end of swing frame 26; In the process that swing frame 26 rotates, uncoiler 2, levelling machine 3 and servo feeder 4 are all being followed motion together, have effectively realized the movement of band material in two dimensional surface to be processed.
Shown feeding device 1 is arranged on the basis at close uncoiler 2 places, and it comprises moving body, lifting apparatus 25, drive motors 13 and material loading guide rail 12.Material loading guide rail 12 is fixed on basis 11, helps to realize moving body motion in the horizontal direction; Lifting apparatus 25 is realized the motion of coiled strip carriage in vertical direction.Drive motors 13 realizes that car body moves.
As shown in Figure 5, provided the structural representation of material-supporting device 6, it comprises bearing 19, hydraulic cylinder 20, cylinder 21, care feed tray 22 and carriage 23; Shown bearing 19 is rotationally connected with carriage 23, and the hydraulic cylinder 20 that moves through of carriage 23 and bearing 19 drives.Care feed tray 22 is arranged on the top of carriage 23 rotationally, and the cylinder 21 that moves through of care feed tray 22 drives.When wafer blanking was produced, the band material was very easily scratched by the work top of forcing press 7; During the moving belt material, order about by cylinder 21 and moving after care feed tray 22 will be with material to hold up, can effectively avoid the scuffing with material.More during mold exchange, need larger space at forcing press 7, by the driving of 20 pairs of carriages 23 of hydraulic cylinder, band can be expected significantly jack-up, be convenient to the quick-replaceable of mould.
Wherein, uncoiler 2 is the bilateral supporting way, in order to receiving coil, and supports whole operation process.Levelling machine 3 comprises that material send machine, clamping force adjusting device, straightener roll, lash adjusting device and drive unit; Can effectively smooth sheet material.Servo feeder 4 comprises material feeder, clamping force adjusting device, drive unit etc., realizes the sizing feed of X-axis.
Oscillating platform 5 rotates along the center of floating bearing 15, it can be defined as Y direction motion, make swing flat 5 under servo drive system drives around an initial point teeter.Oscillating platform 5 can be controlled by PLC and servo-control system, after suitably programming, determines its position coordinates, with servo feeder 4 cooperatings, realizes reaching higher stock utilization with the optimal layout of motor stamping line of centres angle 60 degree.Under electric control system was controlled, servo drive system drive sprocket chain traction device moved back and forth, and drives swing frame and swing the location centered by floating bearing, coordinated the servo feeder work on platform, realized the optimal layout blanking of circular material.
Forcing press 7 can and couple together each several part by turnbuckle by 2 or 3 modular cell formations.Slide block adopts the heavy duty guide rail guiding.Closed height is regulated and is adopted motor reducer to drive, and drives the punching press of strong gear drive with flywheel, realizes the automatic press blanking with the signal instruction that pneumatic friction clutch coordinates feeder to send here.Special pressure machine 7 also can adopt the Driven by Hydraulic Cylinder slide block, realizes the punching press function.Mold changing systems 8 can adopt displacement dolly, hydraulic lifting track and mould rack, can easily mould be moved in and out the pressing machine die district; Adopt fast fixture fast with mold cramping, to realize quick die change.Palletizing system 9 is used for the good disk of piling punching press and is convenient to carrying, transporting from the conveyer belt of forcing press the disk that comes is transported by one group of horizontal chain, enter chain conveyor, it is controlling the edge of disk, be sent to the center of disk stacking, chain trails by pneumatic means, and disk is vertically fallen on disk buttress position, avoids and last disk scratch.When the disk code was counted to the piling sheet of setting, two buttress positions whirligig expected that with code pallet shifts out the buttress position automatically, facilitates handling.Simultaneously another yard material pallet rotates on the buttress position and proceeds piling, and equipment also is provided with interim palletizing apparatus, carries out interim piling when the transposition of material buttress, guarantees that production line do not shut down, and keeps normal punching press.
As you know, circle and circle are cut mutually, and the utilization rate of band material just can be higher; For realizing efficient blanking punching press, the feed direction of polar coordinate mode must be converted to X-Y vertical axis coordinate, could realize that a plurality of round circles are tangent, and we are by setting up Mathematical Modeling and formula, computing has realized this conversion through stock layout, has reached the effect of optimal layout.
As shown in Figure 6, provided the principle schematic of S type disk processing method in the present invention, being with expects to move along the advance and retreat of foundation length direction moves for X-direction if servo feeder orders about, and oscillating platform orders about band and expects that the swing along the foundation width direction of carrying out is that Y direction is moved; And the radius of establishing wafer blanking is r, its special feature is, described processing method comprises the following steps: the first wafer blanking processing of a. the first row, order about by servo feeder and oscillating platform the below that the band material moves to die of press, process first wafer blanking with the form near band material one side (being made as the A side) edge, and the coordinate of establishing this wafer blanking is (0,0); B. the first row wafer blanking processing, the coordinate of retainer belt material X-axis is constant, the every increase of Y coordinate 〉=
Apart from the time carry out a blanking production, until cut to the edge of band material opposite side (being made as the B side), complete the processing of the first row wafer blanking; C. the second first wafer blanking processing of row, utilize servo feeder to order about the band material and advance on X-axis 〉=r, utilize oscillating platform to order about the band material to successively decrease on Y-axis 〉=
Distance, carry out the processing of the second first wafer blanking of row; D. the second row wafer blanking processing, the coordinate of retainer belt material X-axis is constant, and the Y coordinate often successively decreases 〉=
Apart from the time carry out a blanking production, until cut to the edge of band material A side, complete the second row wafer blanking processing; E. repeating step a, b, c and d are until the wafer blanking completion of processing.
As shown in Figure 7, provided the principle schematic of M type disk processing method in the present invention, being with expects to move along the advance and retreat of foundation length direction moves for X-direction if servo feeder orders about, and oscillating platform orders about band and expects that the swing along the foundation width direction of carrying out is that Y direction is moved; And the radius of establishing wafer blanking is r, it is characterized in that, described processing method comprises the following steps: a. the first wafer blanking processing, order about by servo feeder and oscillating platform the below that the band material moves to die of press, process first wafer blanking with the form near band material one side (being made as the A side) edge, and the coordinate of establishing this wafer blanking is (0,0); B. rear side wafer blanking processing, the X-axis coordinate increases with respect to the X-axis coordinate of last wafer blanking
,
〉=r; The Y-axis coordinate increases with respect to the Y-axis coordinate of last wafer blanking
,
〉=
, utilize forcing press to carry out wafer blanking processing; C. front side wafer blanking processing, the X-axis coordinate reduces with respect to the X-axis coordinate of last wafer blanking
, the Y-axis coordinate increases with respect to the Y-axis coordinate of last wafer blanking
, utilize forcing press to carry out wafer blanking processing; D. repeating step b and c, be with the edge of expecting opposite side (being made as the B side) until be machined to; E. repeating step b and c are until the wafer blanking completion of processing.
In above-mentioned S type or M type disk processing method, when displacement was got minimum of a value, adjacent two wafer blankings were just tangent, and for the workpiece that guarantees to produce has qualified size, displacement should be more greatly; The narrowest place that makes clout between adjacent disk is that 2mm is a kind of better selection.
As shown in Figure 8, provided the layout structure schematic diagram of processing 3 wafer blankings under S type disk processing method along the width of band material; As seen it first carries out wafer blanking processing to the both sides of band material, reprocesses the wafer blanking of middle part., provided and processed the schematic diagram that claims to shown in Figure 12 as Fig. 9.
In Fig. 9, the distance between the center of the center of material punching mould tool 24 and floating bearing 15 is L.Wanting number in the figure is that 1 wafer blanking zone moves under mould, and the band material all should move on X-axis and Y direction.As shown in figure 10, can be first move by 5 pairs of band material of pendulum rotating moving platform, make label be 1 wafer blanking center and mold center line be with the length direction of expecting parallel.Then, as shown in figure 11, then by servo feeder 4 with label be 1 wafer blanking move to mould under, starting pressure machine 7 can be completed label and be the processing of 1 wafer blanking.
As shown in figure 12, by rotating certain angle, can be with label 2 wafer blanking move to mould under, starting pressure machine 7 can be completed label and be the processing of 2 wafer blanking.At the routing motion by servo feeder 4 and oscillating platform 5, can be the processing of 3 wafer blanking to label.
The present invention compares with the existing mode of production, can improve the production work efficiency, reduces cost of labor, can improve the stock utilization more than 7% simultaneously, can bring huge economic benefit.
The present invention carries out X-Y axle bidirectional feeding according to control system in the course of the work, guarantees that the band material of sending into forcing press can be optimized the stock layout punching press, has improved stock utilization and operating efficiency.
Claims (9)
1. wafer blanking production equipment, the basis (11) that has comprised fixing and supporting role, uncoiler (2) to the coiled strip support, be used for the levelling machine (3) that coiled strip flattens, the Y-axis oscillating platform (5) that can move along the foundation width direction, order about the X-axis servo feeder (4) that band material moves along the foundation length direction and the forcing press (7) of realizing disk processing, it is characterized in that: described Y-axis oscillating platform comprises swing frame (26), support roller (16) and order about the servo drive (17) that band material swings along the foundation width direction, swing frame is arranged on the basis rotationally, uncoiler, levelling machine and X-axis servo feeder all are fixed on swing frame, and servo feeder is positioned at an end of close forcing press on swing frame, and uncoiler and levelling machine are fixed in the other end of swing frame.
2. wafer blanking production equipment according to claim 1, it is characterized in that: be provided with bearing spider (14) on described basis (11), be provided with the floating bearing (15) that matches with bearing spider on swing frame (26), uncoiler (2) and levelling machine (3) are positioned at the top of bearing spider; Described servo drive (17) orders about swing frame by sprocket wheel chain draw-gear (18) and rotates; Support roller (16) is positioned at the below of swing frame (26), is used for guaranteeing that swing frame is in level all the time.
3. wafer blanking production equipment according to claim 1 and 2, it is characterized in that: also be provided with feeding device (1) on the basis (11) that close uncoiler (2) is located, this feeding device comprises coiled strip carriage, moving body, realizes the material loading guide rail (12) of coiled strip horizontal movement and realizes lifting apparatus (25) and the drive motors (13) that coiled strip moves up and down.
4. wafer blanking production equipment according to claim 1 and 2, is characterized in that: also be provided with material-supporting device (6) between servo feeder (4) and forcing press (7); This material-supporting device comprises two bearings that are rotationally connected (19) and carriage (23), and described carriage is connected by hydraulic cylinder with bearing; The end of carriage rotates and is provided with and the care feed tray (22) that matches with material, and this care feed tray also is connected with carriage by cylinder (21).
5. wafer blanking production equipment according to claim 1 and 2 is characterized in that: also comprise palletizing system (9) that wafer blanking is collected automatically, the waste disposal system (10) that clout is cut off and the mold changing systems (8) of realizing forcing press (7) quickly replacing mould.
6. S type disk processing method based on wafer blanking production equipment claimed in claim 1, if it is the X-direction motion that servo feeder (4) orders about the advance and retreat motion of basis, band material edge (11) length direction, oscillating platform (5) orders about band and expects that the swing along the foundation width direction of carrying out is that Y direction is moved; And the radius of establishing wafer blanking is r, it is characterized in that, described processing method comprises the following steps:
A. the first wafer blanking processing of the first row, order about by servo feeder and oscillating platform the below that the band material moves to forcing press (7) mould, process first wafer blanking with the form near band material one side (being made as the A side) edge, and the coordinate of establishing this wafer blanking is (0,0);
B. the first row wafer blanking processing, the coordinate of retainer belt material X-axis is constant, the every increase of Y coordinate 〉=
Apart from the time carry out a blanking production, until cut to the edge of band material opposite side (being made as the B side), complete the processing of the first row wafer blanking;
C. the second first wafer blanking processing of row, utilize servo feeder to order about the band material and advance on X-axis 〉=r, utilize oscillating platform to order about the band material to successively decrease on Y-axis 〉=
Distance, carry out the processing of the second first wafer blanking of row;
D. the second row wafer blanking processing, the coordinate of retainer belt material X-axis is constant, and the Y coordinate often successively decreases 〉=
Apart from the time carry out a blanking production, until cut to the edge of band material A side, complete the second row wafer blanking processing;
E. repeating step a, b, c and d are until the wafer blanking completion of processing.
7. S type disk processing method according to claim 6, it is characterized in that: between described adjacent two wafer blankings, the narrowest place of clout is 1～3mm.
8. M type disk processing method based on wafer blanking production equipment claimed in claim 1, if it is the X-direction motion that servo feeder (4) orders about the advance and retreat motion of basis, band material edge (11) length direction, oscillating platform (5) orders about band and expects that the swing along the foundation width direction of carrying out is that Y direction is moved; And the radius of establishing wafer blanking is r, it is characterized in that, described processing method comprises the following steps:
A. the first wafer blanking processing, order about by servo feeder and oscillating platform the below that the band material moves to forcing press (7) mould, process first wafer blanking with the form near band material one side (being made as the A side) edge, and the coordinate of establishing this wafer blanking is (0,0);
B. rear side wafer blanking processing, the X-axis coordinate increases with respect to the X-axis coordinate of last wafer blanking
,
〉=r; The Y-axis coordinate increases with respect to the Y-axis coordinate of last wafer blanking
,
〉=
, utilize forcing press to carry out wafer blanking processing;
C. front side wafer blanking processing, the X-axis coordinate reduces with respect to the X-axis coordinate of last wafer blanking
, the Y-axis coordinate increases with respect to the Y-axis coordinate of last wafer blanking
, utilize forcing press to carry out wafer blanking processing;
D. repeating step b and c, be with the edge of expecting opposite side (being made as the B side) until be machined to;
E. repeating step b and c are until the wafer blanking completion of processing.
9. M type disk processing method according to claim 8, it is characterized in that: between described adjacent two wafer blankings, the narrowest place of clout is 1～3mm.
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| CN104923683A (en) * | 2014-11-09 | 2015-09-23 | 惠州市仨联自动化设备有限公司 | Large deflection punch line |
| CN107552664A (en) * | 2017-09-04 | 2018-01-09 | 安徽省宁国市东波紧固件有限公司 | A kind of back-up ring process equipment of automatic yaw blanking |
| CN109702357A (en) * | 2019-01-29 | 2019-05-03 | 大族激光科技产业集团股份有限公司 | A kind of laser processing disk method and system |
| CN111729987A (en) * | 2020-06-12 | 2020-10-02 | 长春佰业优钢材配送有限公司 | Automatic deflection blanking system |
| CN112122480A (en) * | 2020-09-11 | 2020-12-25 | 浙江南柯泰金属制品有限公司 | Metal gasket composite stamping production line |
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| JPS59120023A (en) * | 1982-12-28 | 1984-07-11 | 小田 康夫 | Shifted contact point of legs |
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| GB9421406D0 (en) * | 1994-10-21 | 1994-12-07 | Platarg Engineering Limted | Drive for blanking press roll feed |
| CN2868491Y (en) * | 2005-11-20 | 2007-02-14 | 浙江龙文机械有限责任公司 | Crank press die cutting device |
| CN201164879Y (en) * | 2008-03-08 | 2008-12-17 | 楼建军 | Automatic sheet punching apparatus |
| CN102335806A (en) * | 2010-07-16 | 2012-02-01 | 欧朋达科技(深圳)有限公司 | Mobile phone shield plate forming method and process equipment |
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Effective date of registration: 20190515 Address after: 223814 A8, 8 laser Industrial Park, Yongjin Road, Sucheng Economic Development Zone, Suqian, Jiangsu. Patentee after: Jiangsu Huagong Blue Sky Intelligent Technology Co., Ltd. Address before: 250021 No. 18-21 Lashan Road, Shizhong District, Jinan City, Shandong Province Patentee before: Jinan Songheng Machinery Co., Ltd. |
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