CN102573330B - Circuit board manufacturing method - Google Patents
Circuit board manufacturing method Download PDFInfo
- Publication number
- CN102573330B CN102573330B CN201010602916.6A CN201010602916A CN102573330B CN 102573330 B CN102573330 B CN 102573330B CN 201010602916 A CN201010602916 A CN 201010602916A CN 102573330 B CN102573330 B CN 102573330B
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- CN
- China
- Prior art keywords
- circuit board
- side joint
- joint
- layer
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 35
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 14
- 238000009713 electroplating Methods 0.000 claims abstract description 13
- 238000005530 etching Methods 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000007639 printing Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 210000002469 basement membrane Anatomy 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical group 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a circuit board manufacturing method. The circuit board manufacturing method comprises the following steps of: providing a circuit board which comprises a circuit layer, wherein the circuit layer comprises a plurality of conducting circuits, each conducting circuit sequentially comprises a first circuit section, a first edge connector and a second edge connector, the first edge connector is adjacent to the first circuit section, and the area of the first edge connector is smaller than that of the second edge connector; etching and removing the first circuit section, and correspondingly forming a blank region; forming a conducting carbon layer in a region to which the first blank region corresponds; laminating a covering film on the circuit layer, wherein the covering film is provided with a first window corresponding to the first edge connector and a second edge connector corresponding to the second edge connector; and exposing the first edge connector out of the first window, and exposing the second edge connector out of the second window; and electroplating on the surfaces of the first edge connector and the second edge connector to form an anti-oxidation layer.
Description
Technical field
The present invention relates to circuit board technology field, particularly a kind of circuit board manufacturing method.
Background technology
Along with the development of the collapsible electronic product such as folding cell phone and slide phone, there is flexible printed wiring board (the Flexible PrintedCircuit Board of light, thin, short, little and bent feature, FPCB) be widely used in electronic product, to realize the electric connection between different circuit.In order to obtain the FPCB with the performance of better destroying or force to yield, the performance of destroying or force to yield of improving FPCB basal lamina material used becomes study hotspot.Refer to document ElectricalInsulation Maganize, Volume 5, Issue 1, Jan.-Feb, 1989 Papers:15-23, " Applications of Polyimide Films to the Electrical and ElectronicIndustries in Japan ".
Circuit board, in the position of the external grafting of needs or soldering part, is commonly referred to as finger (Finger) or weld pad (Pad, Land).For preventing finger or weld pad oxidation, reduce contact impedance or increasing resistance to wear, all can be in finger or weld pad electroplating surface one deck chemical property compared with torpescence metal.Client generally can make specification compared with the thickness of torpescence metallized metal coating to chemical property, but can cause current density everywhere to differ because of its bare area of thing to be plated or shape difference in the time electroplating.At present, below general employing, two kinds of modes solve: the first, and low current is electroplated for a long time, with lower electric current more slowly speed electroplate, make deposition rate of metal are slack-off, deposition reduces thickness drop, but electroplating time must lengthen and just can obtain expecting thickness.The second, add a large amount of electroplating additive (leveling agent), though add a large amount of leveling agents to contribute to thickness homogeneity, this additive is organic compound, adds in a large number and use while plating to be plated in coating by bag together.
Summary of the invention
Therefore, be necessary the circuit board manufacturing method of the difference of the deposit thickness that a kind of coating that can adjust different area is provided.
To a kind of circuit board manufacturing method be described with specific embodiment below.
A kind of circuit board manufacturing method, comprise step: provide a circuit board, described circuit board comprises line layer, described line layer comprises several conducting wires, described every conducting wire comprises First Line section, first side joint and Second Edge joint successively, described first side joint is adjacent with described First Line section, and the area of described first side joint is less than the area of Second Edge joint.The etching of described First Line section is removed to corresponding first white space that forms.The region corresponding at described the first white space forms conductive carbon layer.Pressing coverlay on described line layer, described coverlay has the first window corresponding with first side joint and the Second Window corresponding with Second Edge joint, described first side joint exposes from described first window, and described Second Edge joint exposes from described Second Window.And electroplate formation anti oxidation layer at described first side joint and Second Edge joint surface.
In the technical program, there is the different edge connector of multiple sizes on to circuit board time, adopt edge connector taking area maximum as benchmark, the resistance of all the other edge connectors is adjusted.Adjustment mode is that, by one section of conducting wire etching of the near zone of all the other edge connectors, printing one deck conductive carbon layer, to increase the resistance value of edge connector.Reach the thickness of coating uniformity that the edge connector of different area is plated.
Brief description of the drawings
Fig. 1 is the floor map of the circuit board of the formation circuit that provides of the technical program embodiment.
Fig. 2 is the profile of Fig. 1 along II-II line.
Fig. 3 is that the circuit board surface of the formation circuit that provides of the technical program embodiment applies the profile after resist.
Fig. 4 is that the first line areas of the circuit board of the formation circuit that provides of the technical program embodiment is carried out etching work procedure and obtained forming the profile after the first white space.
Fig. 5 is that the removal circuit board surface that the technical program embodiment provides applies the profile after resist ink.
Fig. 6 be the technical program embodiment provide in the thick floor map of the first white space coated with conductive carbon-coating.
Fig. 7 is that Fig. 6 is along VII-VII line profile.
Fig. 8 is the floor map of the first coverlay of providing of the technical program embodiment.
Fig. 9 be the technical program embodiment provide the first coverlay is fitted on circuit board line layer after profile.
Figure 10 be the technical program embodiment provide first side joint and Second Edge joint are electroplated after floor map.
Figure 11 is that Figure 10 is along XI-XI line profile.
Main element symbol description
Circuit board 100
First side joint 101
Second Edge joint 102
First Line section 103
Tertiary circuit section 104
The second part of path 105
Conducting wire 110
Line layer 120
Insulating barrier 130
Product zone 140
Non-product zone 150
Conductive pad 160
Connecting line 161
Resist layer 200
The first white space 210
The first through hole 220
Conductive carbon layer 230
Coverlay 300
First window 301
Second Window 302
The 3rd window 303
The first anti oxidation layer 310
The second anti oxidation layer 320
Embodiment
Circuit board manufacturing method the technical program being provided below in conjunction with multiple drawings and Examples is described in further detail.
Step 1, refers to Fig. 1 and Fig. 2, and a circuit board 100 is provided.
Circuit board 100 can be single sided board, double sided board or multi-layer sheet.In the present embodiment, taking circuit board 100 as single-sided circuit board as example describes.Circuit board 100, for being formed with the circuit board of conducting wire, also comprises 140He Fei product zone, product zone 150, and circuit board 100 comprises line layer 120 and insulating barrier 130.Line layer 120 is positioned at product zone 140, and line layer 120 comprises several conducting wires 110, and every conducting wire 110 comprises the Second Edge joint 102, tertiary circuit section 104, first side joint 101, the second part of path 105 and the First Line section 103 that connect successively.The copper face area that first side joint 101 is exposed is less than the exposed copper face area of Second Edge joint 102.The edge minimum range of the edge in First Line section 103 and first side joint 101 is 5mm to 7mm, and the length that is connected in the second part of path 105 between First Line section 103 and first side joint 101 is 5mm to 7mm.The bearing of trend of setting conducting wire 110 is length direction.In this example, be formed with four conductive pads 160 and several connecting line 161 in non-product zone 150.Conductive pad 160 is connected external power source when electroplating, and connecting line 161 connects 140Nei conducting wire, every product zone 110.In the time that conductive pad 160 is connected in external power source, electric current flows into every conducting wire 110 by connecting line 161.
Can have multiple first side joints 101 in every conducting wire 110, the copper face area that each first side joint 101 is exposed can equate, also can not wait.The copper face area that all first side joints 101 are exposed is less than the exposed copper face area of Second Edge joint 102.And the 5mm to 7mm at the edge of each first side joint 101 all has First Line section 103.First side joint 101 and Second Edge joint 102 can be fingers, and can be also weld pad or other need to plate torpescence metal to prevent and the region of air catalytic oxidation at circuit board surface.In the present embodiment, describe as finger as example taking first side joint 101 and Second Edge joint 102.
Step 2, sees also Fig. 3, Fig. 4 and Fig. 5, and 103 etchings of described First Line section are removed.
First, refer to Fig. 3 and Fig. 4, the line layer of circuit board 100 120 surface printings are formed to resist layer 200, in resist layer 200, there is the first corresponding through hole 220 of First Line section 103 multiple and every conducting wire 110, First Line section 103 on circuit board 100 is exposed from the first through hole 220 of correspondence.
Resist layer 200 also can form by laminating dry film, then before etching work procedure, by exposure, developing procedure, resist layer 200 is processed, form multiple the first through holes 220, the first through hole 220 of the copper layer correspondence in each First Line section 103 is exposed.
Secondly, refer to Fig. 3, Fig. 4 and Fig. 5, the First Line section of exposing from the first through hole 220 103 etchings are removed, the part of First Line section 103 correspondences forms the first white space 210.The shape area of the first white space 210 is identical with the area shape in First Line section 103.
Finally, the resist layer 200 on line layer 120 surfaces is removed.
Step 3, sees also Fig. 5, Fig. 6 and Fig. 7, forms conductive carbon layer 230 in the region of the first white space 210 correspondences.
Form conductive carbon layer 230 at the first white space 210 printing conductive carbon slurries.Length, width and the thickness of conductive carbon layer 230 area is according to actual needs set.Usually, the area of conductive carbon layer 230 is greater than the first white space 210 of its correspondence.In the present embodiment, the length of conductive carbon layer 230 equates with the length (being the length in First Line section 103) of the first white space 210.The concrete numerical value of the width of conductive carbon layer 230 and thickness is relevant with the area of Second Edge joint 102 and first side joint 101.Particularly, in traditional handicraft, in conducting wire 110, be not provided with conductive carbon layer 230, circuit board 100 is articulated in negative electrode, electric current flows in conducting wire 110 from corresponding conductive pad 160 and corresponding connecting line 161 respectively, and flow out circuit board 100 from first side joint 101 and Second Edge joint 102, flow into electroplate liquid, anode and rectifier and form respectively loop and Second Edge joint 102 loops, place at first side joint 101 places., conductive pad 160, connecting line 161, first side joint 101, electroplate liquid, anode and rectifier form independently loop.Conductive pad 160, connecting line 161, Second Edge joint 102, electroplate liquid, anode and rectifier form independently loop.First side joint 101 and Second Edge joint 102 lay respectively at different independent loops.The thickness of coating of the upper formation of first side joint 101 and Second Edge joint 102 is inhomogeneous.Former because in the situation that electric current is equal with voltage, because the area of first side joint 101 and Second Edge joint 102 is unequal, the current density of first side joint 101 and Second Edge joint 102 is unequal, thereby causes the thickness difference of deposition.And after the 103 printing conductive carbon-coatings 230 of First Line section, the electric current that flows into first side joint 101 need to flow into first side joint 101 after conductive carbon layer 230.As the copper face area S of Second Edge joint 102
2copper face area S with first side joint 101
1between pass be S
2=XS
1when (X is greater than 1 number), the voltage applying is U
1, near resistance first side joint 101 is R
1, because the minimum range at the edge of first side joint 101 and the edge of conductive carbon layer 230 is 5mm to 7mm, near resistance calculating first side joint 101 etc. is approximately equal to the resistance R of first side joint 101
02resistance R with conductive carbon layer 230
01sum.Voltage is U
2, the resistance of Second Edge joint is R
2.The current density of first side joint 101 is D
1value is D
1=I
1/ S
1.Can draw D according to Ohm's law
1=U
1/ R
1s
1.The current density of Second Edge joint 102 is D
2, its value is D
2=I
2/ S
2.According to the area relationship of Ohm's law and first side joint 101 and Second Edge joint 102, can draw: D
2=I
2/ XS
1=U
2/ XR
2s
1.In electroplating process, control U
1=U
2time, if want D
1=D
2equate, want R
1=XR
2.Can draw according to law of resistance R=ρ L/S: R
1near resistance is R
1=R
01+ R
02=ρ
01l
01/ S
01+ ρ
02l
02/ S
02, the resistance R of Second Edge joint 102
2=ρ
2l
2/ S
2thereby, can derive and draw, R
01=XR
2-R
02, L
01/ S
01=(XR
2-ρ
02l
02/ S
02)/ρ
01.Wherein, R
01for the resistance of conductive carbon layer 230, ρ
01for the resistivity of conductive carbon layer 230, L
01for the length (being the length in First Line section 103) of conductive carbon layer 230, S
01for the width of conductive carbon layer and the product of thickness; R
02for the resistance of first side joint 101, ρ
02for the resistivity of copper, L
02for the length of first side joint 101, S
02for the width of first side joint 101 and the product of thickness; R
2for the resistance of Second Edge joint 102, ρ
2for the resistivity of copper, ρ
2for the length of Second Edge joint 102, S
2for the width of Second Edge joint 102 and the product of thickness.Wherein, R
2can draw according to the resistivity of the material that Second Edge joint 102 is adopted and length, width and THICKNESS CALCULATION.Coefficient X also can be according to its concrete numerical value of learning of the design of circuit board.Equally, R
02also can be by calculating, ρ
01can learn according to the parameter of the conductive carbon paste adopting L
01learn according to the data of design, according to above-mentioned relation, can calculate the width of conductive carbon layer 230 and the product of thickness.According to the product of the width of conductive carbon layer 230 and thickness, width and the thickness of conductive carbon layer 230 are set, thereby are met the shape of the conductive carbon layer 230 needing.
Step 4, refers to Fig. 8 and Fig. 9, and coverlay 300 is provided, and is pressure bonded to the surface of circuit board line layer 120.
At the interior formation of coverlay 300 first window 301 corresponding with first side joint 101, form the Second Window 302 corresponding with Second Edge joint 102, form three window 303 corresponding with conductive pad 160, and pasted the surface at single-sided circuit board.Make copper face and the conductive pad 160 of first side joint 101, Second Edge joint 102 exposed from first window 301, Second Window 302 and the 3rd window 303 respectively.
The coverlay technique of herein fitting can adopt solder-mask printing ink to replace, on printing screen plate, process the position of corresponding first side joint 101, Second Edge joint 102 and conductive pad 160, makes the copper face of first side joint 101, Second Edge joint 102 and conductive pad 160 exposed.
Step 6, refers to Fig. 9, Figure 10 and Figure 11, electroplates and forms the first anti oxidation layer 310 and the second anti oxidation layer 320 at the electroplating surface of first side joint 101 and Second Edge joint 102.
By accessing external power source at conductive pad 160, electric current flows into conducting wire 110 from the connecting line 161 that is positioned at first side joint 101 1 side conductive pads 160 and correspondence respectively, the conductive carbon layer 230 of flowing through, flow into electroplate liquid from first side joint 101, electroplate loop thereby form one with anode and rectifier.Electric current flows into conducting wire 110 from the conductive pad 160 and the corresponding connecting line 161 that are positioned at Second Edge joint 102 1 sides, flows in electroplate liquid through Second Edge joint 102, forms another loop with anode and rectifier.In electroplating process, control the U that applies electroplating voltage first side joint 101 places
1equal the voltage U at Second Edge joint 102 places
2, the voltage of controlling the extraneous power supply that puts on each conductive pad 160 equates.Make the thickness of the coating of the first anti oxidation layer 310 and the second anti oxidation layer 320 under the adjustment of conductive carbon layer 230 by uniformity.The first anti oxidation layer 310 and the second anti oxidation layer 320 can tin, nickel or other torpescence metals.
In the technical program, there is the different edge connector of multiple sizes on to circuit board time, adopt edge connector taking area maximum as benchmark, the resistance of all the other edge connectors is adjusted.Adjustment mode is that, by one section of conducting wire etching of the near zone of all the other edge connectors, printing one deck conductive carbon layer, to increase the resistance value of all the other edge connectors, to reach the thickness of coating uniformity that the edge connector of different area is plated.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (10)
1. a circuit board manufacturing method, comprises step:
One circuit board is provided, described circuit board comprises line layer, described line layer comprises several conducting wires, every conducting wire comprises First Line section, first side joint and Second Edge joint successively, described first side joint is adjacent with described First Line section, and the area of described first side joint is less than the area of Second Edge joint;
The etching of described First Line section is removed to corresponding first white space that forms;
The region corresponding at described the first white space forms conductive carbon layer;
Pressing coverlay on described line layer, described coverlay has the first window corresponding with first side joint and the Second Window corresponding with Second Edge joint, described first side joint exposes from described first window, and described Second Edge joint exposes from described Second Window; And
Electroplate and form the first anti oxidation layer at described first side joint, form the second anti oxidation layer at the electroplating surface of described Second Edge joint simultaneously.
2. circuit board manufacturing method as claimed in claim 1, is characterized in that, the step that the etching of described First Line section is removed is adopted with the following method:
Surface at described line layer forms resist layer, and described resist layer has first through hole corresponding with First Line section; And
The First Line section etching of exposing from described the first through hole is removed, form the first white space.
3. circuit board manufacturing method as claimed in claim 1, is characterized in that, described every conducting wire also comprises the second part of path, and described the second part of path is connected between first side joint and First Line section, and the length of described the second part of path is 5mm to 7mm.
4. circuit board manufacturing method as claimed in claim 1, is characterized in that, described conductive carbon layer is along the resistance R of conducting wire bearing of trend
02=XR
2-R
01, wherein, X is the ratio of the copper face area of described Second Edge joint and the copper face area of described first side joint, R
2for described Second Edge joint is along the resistance perpendicular to circuit board direction, R
01for first side joint is along the resistance perpendicular to circuit board direction.
5. circuit board manufacturing method as claimed in claim 4, is characterized in that, the length L of described conductive carbon layer
01and perpendicular to the sectional area S of described conducting wire bearing of trend
01meet L
01/ S
01=(XR
2-ρ
02l
02/ S
02)/ρ
01, wherein, ρ
01for the resistivity of described conductive carbon layer, ρ
02for the resistivity of first side joint, L
02for the thickness of described first side joint, S
02for the copper face area of described first side joint, R
2for described Second Edge joint is along the resistance perpendicular to circuit board direction.
6. circuit board manufacturing method as claimed in claim 5, is characterized in that, the length of described conductive carbon layer and described First Line section equal in length.
7. circuit board manufacturing method as claimed in claim 6, it is characterized in that, described circuit board also comprises multiple conductive pads and many connecting lines, described many connecting lines are connected between corresponding conductive pad and first side joint or conductive pad and Second Edge joint, described conductive carbon layer first side joint and and the connecting line that is connected of described first side joint between.
8. circuit board manufacturing method as claimed in claim 7, is characterized in that, in the time electroplating, the voltage of the extraneous power supply of each described conductive pad access equates.
9. circuit board manufacturing method as claimed in claim 8, it is characterized in that, in the time electroplating, connected conductive pad, conductive carbon layer and first side joint and the electroplate liquid corresponding with described conductive carbon layer form galvanic circle successively, successively connected conductive pad and be adjacent the Second Edge joint and electroplate liquid formation galvanic circle that connect.
10. circuit board manufacturing method as claimed in claim 9, is characterized in that, the thickness of described the first anti oxidation layer equals the thickness of the second anti oxidation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010602916.6A CN102573330B (en) | 2010-12-23 | 2010-12-23 | Circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010602916.6A CN102573330B (en) | 2010-12-23 | 2010-12-23 | Circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102573330A CN102573330A (en) | 2012-07-11 |
| CN102573330B true CN102573330B (en) | 2014-08-20 |
Family
ID=46417424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010602916.6A Expired - Fee Related CN102573330B (en) | 2010-12-23 | 2010-12-23 | Circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102573330B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200621104A (en) * | 2004-12-10 | 2006-06-16 | Hon Hai Prec Ind Co Ltd | Method of designing printed circuit board and printed circuit board |
| CN101697666A (en) * | 2009-10-16 | 2010-04-21 | 深圳崇达多层线路板有限公司 | Circuit board plating device and method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6890413B2 (en) * | 2002-12-11 | 2005-05-10 | International Business Machines Corporation | Method and apparatus for controlling local current to achieve uniform plating thickness |
-
2010
- 2010-12-23 CN CN201010602916.6A patent/CN102573330B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200621104A (en) * | 2004-12-10 | 2006-06-16 | Hon Hai Prec Ind Co Ltd | Method of designing printed circuit board and printed circuit board |
| CN101697666A (en) * | 2009-10-16 | 2010-04-21 | 深圳崇达多层线路板有限公司 | Circuit board plating device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102573330A (en) | 2012-07-11 |
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Effective date of registration: 20170306 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee after: Peng Ding Polytron Technologies Inc. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
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Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Co-patentee after: Peng Ding Polytron Technologies Inc. Patentee after: AVARY HOLDING (SHENZHEN) Co.,Ltd. Address before: 518000 Shenzhen Baoan District city Songgang street Chuanyan Luzhen Yan Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
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Granted publication date: 20140820 |
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