CN102573322A - Non-destructive welding device of micro-PCB (printed circuit board) device - Google Patents
Non-destructive welding device of micro-PCB (printed circuit board) device Download PDFInfo
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- CN102573322A CN102573322A CN 201010621388 CN201010621388A CN102573322A CN 102573322 A CN102573322 A CN 102573322A CN 201010621388 CN201010621388 CN 201010621388 CN 201010621388 A CN201010621388 A CN 201010621388A CN 102573322 A CN102573322 A CN 102573322A
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- heater
- welder
- harm
- miniature pcb
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Abstract
The invention discloses a non-destructive welding device of a micro-PCB (printed circuit board) device. The non-destructive welding device comprises a bottom board, a moving platform which is movably arranged on the bottom board and further used for moving a micro-PCB and a heating device which is fixedly arranged on the bottom board, wherein the heating device is close to one side of the moving platform. The non-destructive welding device disclosed by the invention can solve the follow-up industry process that a device without the resistance to high temperature can not be repair-welded in a device dense region by an electric iron agent, a hot air gun and the like of the PCB, effectively solve the feasibility of a PCB local welding process, reduce the requirements on operation skills of operators and improve operation efficiency and process implementation precision in a breakthrough manner.
Description
Technical field
The present invention relates to a kind of welder, particularly relate to the harmless welder of a kind of miniature PCB device.
Background technology
At present, in the SMT industry, usually need be to the follow-up repair welding of miniature PCB (miniature PCB is meant that thickness is no more than list/two sided pcb of 1 millimeter) top device or adjustment etc.Electric iron or storage heater are normally adopted in the repair welding of existing local device,, hold welding or the dismounting that this kind tool carries out device by hand that is.Yet, in this process, need operating personnel that higher professional skill and experience are arranged.In addition, this kind tool operating efficiency is low, and welding quality also can't guarantee usually.
Along with being soldered miniaturization of devices, and the device of miniature PCB concentrates densification, and the welding method of electric iron is according to playing a role.And miniature PCB goes up a lot of packagings, also can't bear the high temperature of storage heater.Therefore, through existing soldering appliance, can't accomplish the repair welding of the local non-refractory device of miniature PCB at all.
Summary of the invention
The technical problem that the present invention will solve is to realize the defective of the repair welding of the local non-refractory device of miniature PCB for the soldering appliances such as electric iron that overcome prior art, and the miniature PCB device welder of the repair welding of the local non-refractory device that a kind of ability accomplishes miniature PCB accurate, harmlessly is provided.
The present invention solves above-mentioned technical problem through following technical proposals: a kind of miniature PCB device can't harm welder, and its characteristics are that it comprises:
One base plate;
One activity is located on the said base plate and is used for moving the handover platform of said miniature PCB;
One is fixedly arranged on the heater on the said base plate, and said heater is positioned at said handover platform one side.
Preferably, said heater comprises:
One heater; And
One with the affixed molten tin device in end of said heater, the end face of said molten tin device is lower than the plane at said handover platform place.
Preferably, said heater comprises that also one is used for the adjustable locating rack of the said heater of clamping, and the bottom of said adjustable locating rack is fixedly arranged on the said base plate.
Preferably, said heater is an electric iron.
Preferably, the said molten tin device tin pot that is a ccontaining scolding tin.
Preferably, be provided with an operation protection sheet between said heater and the said molten tin device.
Preferably, the bottom of said handover platform is movably equipped with two parallel screw mandrels.
Preferably, two said parallel screw mandrels are fixedly arranged on the said base plate through two fixed blocks respectively.
Preferably, be movably equipped with a feed screw nut on the said parallel screw mandrel, said handover platform and said feed screw nut are affixed.
Preferably, said handover platform is provided with some reference columns that are used for fixing said miniature PCB.
Preferably, the side near said heater is provided with a heat shield on the said handover platform.
Preferably, said base plate is a bakelite plate.
Preferably, said miniature PCB is the single or double printed circuit board that thickness is no more than 1mm.
Positive progressive effect of the present invention is:
1, the invention solves miniature PCB and make the later stage, can't use soldering appliance such as electric iron agent heat gun at the device close quarters, the industry technology of repair welding non-refractory device has solved the feasibility of PCB local welding technology effectively.
2, the present invention adopts molten tinware to carry out localized heating from the bottom to miniature pcb board; Overcome the infeasible and number of drawbacks that the high-density device welding is taken place on the traditional-handwork welding method; Simulated the good result that Reflow Soldering and wave-soldering combine preferably, saved the equipment frock input, satisfied present electron trade preferably high density; Little spacing, the local welding of non-refractory device products is required.
3, the present invention can solve the technology difficult problem that the local device of miniature PCB can't carry out manual dribbleware or disassemble well accurately to the harmless welding of the local device of miniature PCB.
Therefore 4, in addition, the present invention is simple in structure, and low cost of manufacture can be suitable for the welding and the dismounting technology of the local device of PCB of other type of different structure.
5, the present invention has also reduced the requirement to operator's operative skill, on operating efficiency and process implementing precision, breakthrough raising is arranged.
Description of drawings
Fig. 1 is the device partial sectional view of the present invention's one preferred embodiment.
Fig. 2 is that B among Fig. 1 is to view.
Fig. 3 be among Fig. 1 A to the partial structurtes vertical view.
Embodiment
Provide preferred embodiment of the present invention below in conjunction with accompanying drawing, to specify technical scheme of the present invention.
To shown in Figure 3, the present invention provides the local device of a kind of miniature PCB harmless soldering appliance like Fig. 1, comprises that base plate 1, one activity is located on the base plate 1 and is used to place and moves the handover platform 2 of miniature PCB; One is fixedly arranged on the heater 5 of base plate 1 one sides.Heater 5 is near a side of transferring platform 2, and is positioned at the below of transferring plane, platform 2 place.Like this, when miniature PCB moves to heater 5 tops, can pass through the bottom heating of 5 couples of miniature PCB of heater, thereby accomplish the harmless welding of the local device of miniature PCB.
Preferably, heater 5 of the present invention can comprise: a heater 51; One is used for the adjustable locating rack 52 of clamping heater 51, and one be fixed in the end of heater 51 molten tin device 53.Adjustable locating rack 52 is fixedly arranged on the base plate 1.
Further, heater 51 of the present invention can be an electric iron, through a heater base 511 electric iron is erected certain altitude.
Preferably, molten tin device 53 can be a tin pot that is used for the goblet shape of ccontaining scolding tin.
Preferably, the safety in order to operate is provided with a block operations screening glass 54 between heater 51 and molten tin device 53.
Preferably, the bottom of transferring platform 2 is movably equipped with two parallel screw mandrels 4, is movably equipped with a feed screw nut 41 on the parallel screw mandrel 4, and it is affixed with feed screw nut 41 to transfer platform 2.Like this, under the drive of parallel screw mandrel 4, then mobile platform 2 base plate 1 horizontal slip relatively.
Preferably, transfer on the platform 2, on mobile platform 2, also be provided with some reference columns 21 for miniature PCB is fixed on.
Preferably, the side near heater 5 is provided with a heat shield 22 on the handover platform 2.
Fail safe when operating in order to improve, base plate 1 of the present invention is preferably the base plate of bakelite material.
Preferably, miniature PCB of the present invention is that thickness is the list/two sided pcb that is no more than 1mm.Device of the present invention is particularly useful for the harmless welding in part of miniature PCB.
When using device of the present invention, miniature PCB is fixed on the mobile platform 2, and its zone that needs repair welding is suspended on outside the opposite side near heater of mobile platform 2.Move up and down the adjustable locating rack 52 of clamping having heaters 51, be lower than the bottom surface of the PCB that treats the repair welding device, lock heater 51 then until the top that makes the tin pot that is fixed on heater 51 ends.
The heater power supply is to the preheat temperature that needs.
In the tin pot, add scolding tin to fusing, the PCB that device to be welded is housed is positioned over PCB transfers platform 2, place by the weldering device corresponding welding position on PCB, moves and transfer platform 2, makes the zone that needs the repair welding device on the miniature pcb board just in time be in the top of tin pot.
Through heater 51 scolding tin in the tin pot is preheating to certain high temperature; Again the zone of the need repair welding device of miniature PCB is moved to the top of scolding tin; Heat the need repairing device bottom of PCB through the scolding tin of thermosol; Thereby the solder joint of the need repair welding device root above this PCB is dissolved,, can accomplish local repair welding or the dismounting of miniature PCB with tweezers or staff adjustment.
After completion is welded or disassembled, retract PCB in the other direction and transfer platform, then operational sequence finishes.
The present invention adopts molten tinware to carry out localized heating from the bottom to miniature PCB; Overcome the infeasible and number of drawbacks that the high-density device welding is taken place on the traditional-handwork welding method; Simulated the good result that Reflow Soldering and wave-soldering combine preferably, saved the equipment frock input, satisfied present electron trade preferably high density; Little spacing, the local welding of non-refractory device products is required.
Further, the present invention has also reduced the requirement to operator's operative skill, and breakthrough raising is all arranged on operating efficiency and craft precision.
The present invention has also reduced the requirement to operator's operative skill, on operating efficiency and process implementing precision, breakthrough raising is arranged.
In addition, the present invention also is applicable to other various models, size, and thickness is the welding procedure that is no more than the printed circuit board of 1mm.
Though more than described embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, under the prerequisite that does not deviate from principle of the present invention and essence, can make numerous variations or modification to these execution modes.Therefore, protection scope of the present invention is limited appended claims.
Claims (13)
1. a miniature PCB device can't harm welder, it is characterized in that it comprises:
One base plate;
One activity is located on the said base plate and is used for moving the handover platform of said miniature PCB;
One is fixedly arranged on the heater on the said base plate, and said heater is near said handover platform one side.
2. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that said heater comprises:
One heater; And
One with the affixed molten tin device in end of said heater, the end face of said molten tin device is lower than the plane at said handover platform place.
3. miniature PCB device as claimed in claim 2 can't harm welder, it is characterized in that, said heater comprises that also one is used for the adjustable locating rack of the said heater of clamping, and the bottom of said adjustable locating rack is fixedly arranged on the said base plate.
4. miniature PCB device as claimed in claim 2 can't harm welder, it is characterized in that said heater is an electric iron.
5. miniature PCB device as claimed in claim 2 can't harm welder, it is characterized in that the tin pot that said molten tin device is a ccontaining scolding tin.
6. miniature PCB device as claimed in claim 2 can't harm welder, it is characterized in that, is provided with an operation protection sheet between said heater and the said molten tin device.
7. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that the bottom of said handover platform is movably equipped with two parallel screw mandrels.
8. miniature PCB device as claimed in claim 7 can't harm welder, it is characterized in that, two said parallel screw mandrels are fixedly arranged on the said base plate through two fixed blocks respectively.
9. miniature PCB device as claimed in claim 8 can't harm welder, it is characterized in that, be movably equipped with a feed screw nut on the said parallel screw mandrel, said handover platform and said feed screw nut are affixed.
10. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that said handover platform is provided with some reference columns that are used for fixing said miniature PCB.
11. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that the side near said heater on the said handover platform is provided with a heat shield.
12. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that said base plate is a bakelite plate.
13. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that, said miniature PCB is the single or double printed circuit board that thickness is no more than 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010621388 CN102573322A (en) | 2010-12-31 | 2010-12-31 | Non-destructive welding device of micro-PCB (printed circuit board) device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010621388 CN102573322A (en) | 2010-12-31 | 2010-12-31 | Non-destructive welding device of micro-PCB (printed circuit board) device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102573322A true CN102573322A (en) | 2012-07-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010621388 Pending CN102573322A (en) | 2010-12-31 | 2010-12-31 | Non-destructive welding device of micro-PCB (printed circuit board) device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102573322A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107388579A (en) * | 2017-08-21 | 2017-11-24 | 浙江普莱得电器有限公司 | Heat gun |
| CN107624000A (en) * | 2017-09-06 | 2018-01-23 | 国营芜湖机械厂 | A kind of more pin placing components method for dismounting for the maintenance of aircraft electrical plate |
-
2010
- 2010-12-31 CN CN 201010621388 patent/CN102573322A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107388579A (en) * | 2017-08-21 | 2017-11-24 | 浙江普莱得电器有限公司 | Heat gun |
| CN107388579B (en) * | 2017-08-21 | 2023-04-18 | 浙江普莱得电器股份有限公司 | Hot air gun |
| CN107624000A (en) * | 2017-09-06 | 2018-01-23 | 国营芜湖机械厂 | A kind of more pin placing components method for dismounting for the maintenance of aircraft electrical plate |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |