CN102569029B - 通过沿预定路径移动的写入喷嘴将粘合剂图案施布到基底上的方法 - Google Patents
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Abstract
通过沿预定路径移动的写入喷嘴将粘合剂图案施布到基底上的方法。写入喷嘴沿由预定数量的N条线形成的序列线(12)从该序列线(12)的起点(A)移动到该序列线(12)的终点(F),以将粘合剂图案写入到基底(1)上。序列线(12)的线(7-11)的数量是N=5。五条线(7-11)的起点和终点形成总共六个节点(A-F),第一节点(A)形成序列线(12)的起点,而第六节点(F)形成序列线(12)的终点。线(7-11)中的每条仅被写入喷嘴通过一次。起点(A)、第三节点(C)、第四节点(D)以及终点(F)形成大致矩形的四边形(13)的顶点。
Description
技术领域
本发明涉及通过沿预定路径移动的写入喷嘴将粘合剂图案施布到基底上的方法。
背景技术
当在基底上安装半导体芯片时,半导体芯片与基底通过粘合剂粘合在一起。环氧粘合剂经常用作粘合材料。通过可具有一个或多个出口开口的固定喷嘴,或通过可沿预定路径移动的写入喷嘴,将粘合剂施加到基底上。施布到基底上的粘合剂的轮廓称为粘合剂图案。
在小型半导体芯片情况中,即尺寸在1x1毫米量级内的半导体芯片,根据现有技术使用的粘合剂图案是点状或交叉形状。在矩形半导体芯片情况中,根据现有技术经常使用的粘合剂图案已知为双Y。双Y被布置成使得4个Y臂点朝向矩形的角部。图1示出了实践中的图示。在该图片中,粘合剂的颜色是黑色。图1的左半部示出以双Y3形式施加到基底的粘合剂图案2;右半部分示出了粘合到双Y3的半导体芯片4(假片)。粘合剂在半导体芯片的粘合过程中被压缩并从中央部向外流动。目的是弄湿半导体芯片4的整个底侧,使得在半导体芯片4与基底1之间不产生空气隙。图1的右半部分中的图片示出粘合剂5通常如何完全封围半导体芯片4。
通过沿预定路径引导的写入喷嘴以双Y3将粘合剂施布到基底1上。图2示出该路径。双Y3由五个直部分构成。当写入双Y3时,五个部分中的至少四个部分需要被通过两次,即,路径由九条直线6形成的系列线构成,写入喷嘴连续通过该九条直线。线6被通过的方向由箭头的尖端示出。路径的起点S和终点P通常位于连接两个单独的Y的各臂的直线部分。在图2所示实施例中,写入喷嘴的路径在起点S处开始并沿源自起点S的虚线延伸,然后沿其它线延伸直到终点R,最后通过在终点R处结束的虚线。虽然九条单独的线形成连续的序列线,但为图示清楚起见,将它们显示为彼此偏移。
本发明基于减少当安装矩形半导体芯片时将粘合剂施布到基底上所需的时间的目的。
发明内容
根据本发明,通过沿序列线移动写入喷嘴来将粘合剂图案写入在基底上,序列线由预定数量N=5的线形成。五条线的起点和终点形成总共六个节点A至F,第一节点A形成序列线的起点,而第六节点F形成序列线的终点。写入喷嘴从起点A开始沿第一线移动到第二节点B,然后沿第二线移动到第三节点C,然后沿第三线移动到第四节点D,然后沿第四线移动到第五节点E,并且然后沿第五线移动到终点F,从而每条线仅被通过一次。起点A、第三节点C、第四节点D以及终点F形成大致矩形的四边形的顶点。写入喷嘴还可沿相反方向移动。
优选地,所述节点A-F相对于所要粘合到基底上的半导体芯片的位置由下面特征确定:
-半导体芯片呈现的表面区域是矩形,所述矩形由两条长边和两条短边定界限,并可再分成4x4相同大小的矩形局部区域;
-所述第一节点位于指定有标记1的局部区域内;
-所述第二节点位于指定有标记2的局部区域内;
-所述第三节点位于指定有标记3的局部区域内;
-所述第四节点位于指定有标记4的局部区域内;
-所述第五节点位于指定有标记5的局部区域内;
-所述第六节点位于指定有标记6的局部区域内;
其中
-指定有标记1、3、4和6的四个局部区域中的每个邻接矩形的一个角,具有标记1和4的所述局部区域邻接第一长边,具有标记3和6的所述局部区域邻接第二长边,具有标记1和3的所述局部区域邻接第一短边,而具有标记4和6的所述局部区域邻接第二短边,沿所述矩形的周界的标记的顺序是1-4-6-3,而具有标记1和6的所述局部区域设置在所矩形的对角线上,且
-具有标记2和5的两个局部区域设置在与具有标记1和6的两个局部区域一样的对角线上,沿所述对角线的标记的顺序为1-2-5-6。
附图说明
包括在说明书中且构成说明书一部分的附图示出了本发明的一个或多个实施例,且与详细说明书一起用于解释本发明的原理和实施例。各视图不按比例。
附图中:
图1示出根据现有技术施加到基底上的粘合剂图案和粘合到粘合剂图案上的半导体芯片;
图2示出用于产生图1的粘合剂图案的写入喷嘴的路径;
图3示出根据本发明的用于产生粘合剂图案的写入喷嘴的路径;
图4示出了解释如何确定写入喷嘴的路径的有利方式的示意图;
图5、6示出基于图4所示的示意图确定的、写入喷嘴的路径的示例,以及
图7示出根据本发明的粘合剂图案和粘合到该粘合剂图案上的半导体芯片。
从现有技术已知图1和图2的主题,并在介绍部分中描述了图1和图2的主题。
具体实施方式
图3示出根据本发明的路径,该路径是由五条线7至11形成的连续序列线12。线7至11的起点和终点产生总共六个节点A至F,节点A是路径的起点,而节点F是路径的终点。写入喷嘴通过线7至11中的每条仅一次,由此以显著缩短的时间产生类似于双Y的粘合剂图案。
根据本发明的序列线12可具有如下特征:
-序列线12的线7至11的数量N是N=5。五条线7至11的起点和终点形成总共六个节点A至F,节点A形成序列线12的起点,而节点F形成序列线12的终点。在节点B至E处改变方向。
-始于起点A,写入喷嘴沿第一线7移动到第二节点B,然后沿第二线8移动到第三节点C,然后沿第三线9移动到第四节点D,然后沿第四线10移动到第五节点E,然后沿第五线11移动到终点F。
-起点A、第三节点C、第四节点D以及终点F形成四边形13的顶点。四边形是大致(即,或多或少)矩形或长斜方形。例如,其可以为平行四边形或矩形,或其也可以具有仅与这些几何形式中的一个的形状近似的形状。
第一线7和第五线11可彼此对准,即,它们可大致位于共同的直线上。第二线8和第三线9围成角度α,第三线9和第四线10围成角度β,其中角度α和β可以是例如0度,但优选地不是0度。
节点A至F相对于所要粘合到基底上的半导体芯片的尺寸的位置优选地根据图4所示的示意图确定。该示意图示出矩形14,矩形14代表由半导体芯片4覆盖的表面区域的俯视图。矩形14包括两条长边16和17,两条短边18和19,以及两条对角线20和21。
节点A至F的位置优选地由下面的方法步骤确定:
-将矩形14的表面分割成4x4同等大小的矩形局部区域15。
-对其中每个包含矩形14的一个角的四个局部区域指定标记1、3、4和6,标记为1和4的局部区域15邻接长边16,标记为3和6的局部区域15邻接长边17,标记为1和3的局部区域15邻接短边18,而标记为4和6的局部区域15邻接短边19。
沿矩形14的周界的标记的顺序是1-4-6-3。标记为1和6的局部区域15位于对角线20上。
-对设置在与具有标记1和6的两个局部区域15一样的对角线20上的两个局部区域15指定标记2和5,沿对角线20的标记的顺序为1-2-5-6。
-将节点A放置在具有标记1的局部区域15内。
-将节点B放置在具有标记2的局部区域15内。
-将节点C放置在具有标记3的局部区域15内。
-将节点D放置在具有标记4的局部区域15内。
-将节点E放置在具有标记5的局部区域15内。
-将节点F放置在具有标记6的局部区域15内。
被指定有标记1至6中的一个的局部区域15显示为灰色背景颜色。
图5和图6示出如何根据本方法将节点A至F放置在标记为1、2、3、4、5和6的局部区域内的两个示例。节点A至F通过序列线12连接。
为了在粘合工艺结束时在所粘合的半导体下方获得最均匀的粘合剂分布,有利地是关注以下情况
-节点A、C、D和F与矩形14的顶点间隔开;
-节点C和D比节点A和F离相应的顶点更远,因为序列线12中仅一条线通向节点A和F,而序列线12中的两条线通向节点C和D;
-一方面,节点B和E不重合而是彼此间隔开;而另一方面,节点B和E之间的距离不是太大,从而防止空气隙;
-序列线12绕设置在节点A和F之间的中部的点转动约180°是不变的。
图7在左半图中示出根据图3所示的路径施加到基底1上的粘合剂图案2,而在右半图中示出粘合到所示粘合剂图案2的半导体芯片。粘合剂5完全包围半导体芯片4。
通过至少一个写入喷嘴写入粘合剂图案,其中该写入喷嘴可至少平行于基底1的表面移动,并被供应来自粘合剂容器的粘合剂,其通常如下:
-将写入喷嘴放置在第一线8的起点A处;
-开始从写入喷嘴递送粘合剂并沿第一线7移动写入喷嘴,并在第一线7的终点处(即节点B处)停止;
-沿第二线8移动写入喷嘴并在节点C处停止写入喷嘴;
-沿第三线9移动写入喷嘴并在节点D处停止写入喷嘴;
-沿第四线10移动写入喷嘴并在节点E处停止写入喷嘴;
-沿第五线11移动写入喷嘴并在终点F处停止写入喷嘴,并停止粘合剂的递送,以及
-提升写入喷嘴,直至递送到基底的粘合剂与写入喷嘴中的粘合剂完全分离。
也可沿相反方向移动写入喷嘴,即,从节点F(作为起点)到节点A(作为终点)。
本发明的优点是:
-写入五条线7至11所需的时间比写入双Y所需的时间显著地短,因为写入喷嘴仅需要加速和制动五次,而在写入双Y时需要加速和制动九次。
-写入喷嘴内的粘合剂与所递送的粘合剂彼此完全断开所经过的时间(称为“收尾时间”)也比双Y中的时间短,因为在写入喷嘴需要移出的路径的终点处供应的粘合剂更少。
-所实现的加工质量与双Y的加工质量相同。
虽然已示出并描述了本发明的实施例和应用,但对本领域的技术人员明显的是,在本公开的帮助下,在不偏离本发明的构思的情况下可以有比上述内容更多的变型。因此,本发明仅由所附权利要求书及其等同物的精神限定。
Claims (2)
1.用于将粘合剂图案施布到基底(1)上的方法,包括:沿由预定数量的N条线形成的序列线(12)将写入喷嘴从所述序列线(12)的起点(A)移动到所述序列线(12)的终点(F)或沿相反方向移动,以将所述粘合剂图案写入到基底(1)上,其特征在于,所述序列线(12)的线(7-11)的数量是N=5,该五条线(7-11)的起点和终点形成总共六个节点(A-F),第一节点(A)形成所述序列线(12)的起点,而第六节点(F)形成所述序列线(12)的终点,所述写入喷嘴从所述起点(A)开始沿第一线(7)移动到第二节点(B),然后沿第二线(8)移动到第三节点(C),然后沿第三线(9)移动到第四节点(D),然后沿第四线(10)移动到第五节点(E),并且然后沿第五线(11)移动到所述终点(F),使得所述线(7-11)中的每条被通过仅一次,且所述起点(A)、所述第三节点(C)、所述第四节点(D)以及所述终点(F)形成大致矩形的四边形(13)的顶点。
2.如权利要求1所述的方法,其特征在于,所述节点(A-F)相对于所要粘合到基底(1)上的半导体芯片(4)的位置由下面特征确定:
-半导体芯片(4)呈现的表面区域是矩形(14),所述矩形(14)由两条长边(16,17)和两条短边(18,19)界定,并且能够再分成4×4相同大小的矩形局部区域(15);
-所述第一节点(A)位于指定有标记1的局部区域(15)内;
-所述第二节点(B)位于指定有标记2的局部区域(15)内;
-所述第三节点(C)位于指定有标记3的局部区域(15)内;
-所述第四节点(D)位于指定有标记4的局部区域(15)内;
-所述第五节点(E)位于指定有标记5的局部区域(15)内;
-所述第六节点(F)位于指定有标记6的局部区域(15)内;
其中
-指定有标记1、3、4和6的四个局部区域(15)中的每个邻接所述矩形(14)的一个角,具有标记1和4的所述局部区域(15)邻接第一长边(16),具有标记3和6的所述局部区域(15)邻接第二长边(17),具有标记1和3的所述局部区域(15)邻接第一短边(18),而具有标记4和6的所述局部区域(15)邻接第二短边(19),沿所述矩形(14)的周界的标记的顺序是1-4-6-3,而具有标记1和6的所述局部区域(15)设置在所述矩形(14)的对角线(20)上,且
-具有标记2和5的两个局部区域(15)设置在与具有标记1和6的两个局部区域(15)一样的对角线(20)上,沿所述对角线(20)的标记的顺序为1-2-5-6。
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