CN102563460A - Light source structure and backlight module - Google Patents
Light source structure and backlight module Download PDFInfo
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- CN102563460A CN102563460A CN2011104240424A CN201110424042A CN102563460A CN 102563460 A CN102563460 A CN 102563460A CN 2011104240424 A CN2011104240424 A CN 2011104240424A CN 201110424042 A CN201110424042 A CN 201110424042A CN 102563460 A CN102563460 A CN 102563460A
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- circuit board
- perforation
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- metal bump
- lead
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Abstract
The invention discloses a light source structure and a backlight module. The light source structure comprises a circuit board, a plurality of light sources, a guide wire and at least one through hole, wherein the light sources are arranged on the circuit board; the guide wire is arranged on the circuit board and is partitioned between the edge of the circuit board and the light source; the through hole is formed in a path of the guide wire and is matched with a metal back plate of the backlight module; at least one slotting structure is arranged on the side edge of the through hole, so that convenience is brought to sleeving; and an exposed head of the guide wire is arranged at the through hole and comprises a conductive matter which is arranged on a side wall opposite to the through hole. The backlight module comprises the metal back plate and the light source structure. Due to the adoption of the light source structure and the backlight module with the light source structure, a good electrostatic discharge protective effect is achieved; and the light source structure can be conveniently assembled on the back plate of the backlight module.
Description
The application is for dividing an application, and the applying date of original application is: on January 19th, 2010; Application number is: 201010002591.8; Denomination of invention is: light-source structure and backlight module
Technical field
The present invention relates to a kind of light-source structure; Particularly, the present invention relates to the light-source structure that a kind of liquid crystal display backlight module uses.
Background technology
(Liquid rystal Display LCD) is widely used on the various electronic products such as computer, TV and mobile phone LCD.Backlight module (backlight module) is one of LCD important composition assembly.The employed light-source structure of backlight module then directly influences the usefulness and the assembly cost of backlight module.
As shown in Figure 1, existing backlight module 80 comprises light-source structure 20 and metal backing 70.Wherein, the assembling contraposition mode of light-source structure 20 and metal backing 70 be on metal backing 70 discounting line 71 as contraposition reference.Adopt this mode to assemble contraposition, the broken line of often using because of contraposition 71 is difficult for identification and personnel assemble deviation, causes light-source structure 20 skews, and then problem such as cause light-source structure 20 electric connecting terminals (not illustrating) loose contact, be difficult for inserting or be prone to come off.
On the other hand, (Electrostatic Discharge, ESD) protection mechanism are attacked the light source 23 on the light-source structure 20 so static discharge often takes place to conventional lighting sources structure 20 no suitable static discharges, cause the damage of light source 23.The above light-source structure 20 and backlight module 80 be designed with improved space.
Summary of the invention
Main purpose of the present invention is to provide a kind of light-source structure, has preferable static discahrge protection effect.
Another purpose of the present invention is to provide a kind of light-source structure, can be assembled in the backboard of backlight module more expediently.
Another object of the present invention is to provide a kind of backlight module, have preferable static discahrge protection effect.
Another object of the present invention is to provide a kind of backlight module, can assemble more expediently.
To achieve these goals, the present invention provides a kind of light-source structure can supply backlight module to use, and light-source structure comprises circuit board, a plurality of light source, lead and at least one perforation.A plurality of light sources are arranged on the circuit board.Lead is arranged on the circuit board, intercepts between the edge and light source of circuit board.At least one perforation is arranged on the path of lead, supplies to use with the metal backing assembly of backlight module.Wherein, lead has in the perforation place appears, and appearing comprises the conducting objects that is arranged at the relative sidewall of perforation.
Metal backing has the metal bump structure, and circuit board comprises flexible circuit board.Circuit board is provided with two flanges in the relative both sides of perforation, protrudes toward perforation is inner from circuit board along the path of lead respectively.Lead extends and to be arranged to the perforation edge, and appears and be arranged at two flanges in the relative sidewall of perforation.When perforation and metal backing assembly, the metal bump structure is arranged in two flanges is bent respectively, is arranged at two flanges and touches the sidewall of metal bump structure in appearing of the relative sidewall of perforation, makes lead form path via the metal bump structure.
Metal backing has the metal bump structure; Circuit board comprises flexible circuit board; The aperture essence of the perforation of circuit board is less than the diameter of metal bump structure, and the metal bump structure is arranged in the circuit board section bending that makes in the perforation around perforation, so that lead forms path via the metal bump structure.
The appear root edge of the perforation that is positioned at circuit board, circuit board can bend when board sleeve is located at the metal bump structure, and the root edge at the perforation place of circuit board can form path with the metal bump structure.The perforation side is provided with at least one structure of cracking, so that sheathed.
Metal backing has the metal bump structure, and circuit board comprises rigid circuit board.When perforation and metal backing assembly, the metal bump structure is arranged in the perforation, appears to touch the sidewall in the metal bump structure, makes lead form path via the metal bump structure.Appear and be arranged at the relative sidewall of perforation with plating mode.
Light-source structure further comprises protective layer, is arranged on this circuit board, and covers lead with the mode that exposure is appeared.Circuit board further has extension, and the extension tail end has pin, and pin is electrically connected with light source.Light source comprises light emitting diode.
To achieve these goals, the present invention also provides a kind of backlight module, comprises metal backing and light-source structure.Metal backing has at least one metal bump structure.Light-source structure comprises circuit board, a plurality of light source, lead and at least one perforation.A plurality of light sources are arranged on the circuit board.Lead is arranged on the circuit board, intercepts between the edge and light source of circuit board.Perforation is arranged on the path of lead, in confession metal bump structure is arranged in, makes circuit board group be assigned in backlight module.Wherein, lead has in the perforation place appears, and appearing is for being arranged at the conducting objects of the relative sidewall of perforation.When the metal bump structure is arranged in the perforation, lead touches the metal bump structure to form path via appearing.
Effect of the present invention is, adopts light-source structure provided by the invention and has the backlight module of this light-source structure, has preferable static discahrge protection effect, and light-source structure, can be assembled in the backboard of backlight module more expediently.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
Fig. 1 is the prior art sketch map;
Fig. 2 is an embodiment of the invention sketch map;
Fig. 3 A to Fig. 3 C is a preferred embodiment sketch map of the present invention;
Fig. 4 A and Fig. 4 B are the different embodiments of the invention sketch map;
Fig. 5 A to Fig. 5 C is the different embodiments of the invention sketch map;
Fig. 6 A and Fig. 6 B have the different embodiment sketch mapes of protective layer for the present invention; And
Fig. 7 has the different embodiment sketch mapes of extension for the present invention.
Wherein, Reference numeral
71 pairs of bit line
100 protective layers
200 light-source structures
210 circuit boards
218 extensions
219 pins
230 light sources
250 leads
251 appear
270 perforations
271 flanges
272 structures of cracking
620 LGPs
660 reflecting plates
700 metal backings
710 metal bump structures
800 backlight modules
The specific embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
Backlight module exploded perspective view as shown in Figure 2, in preferred embodiment, light-source structure 200 of the present invention can supply backlight module 800 to use.Particularly, backlight module 800 comprises light-source structure 200 and metal backing 700, and metal backing 700 has at least one metal bump structure 710, and light-source structure 200 can be by 710 assembly of metal bump structure on metal backing 700.In other words, can use metal bump structure 710, need not use pairs of bit line as shown in Figure 1 71 earlier, can promote the convenience of assembling and reduce deviation to aim at assembling again with light-source structure 200 and metal backing 700 assemblings.Wherein, metal bump structure 710 is arranged at the one side of metal backing 700 with respect to light-source structure 200, and with light-source structure 200 that the position is set is corresponding.Can directly form metal bump structure 710 with the metal extrusion type by metal backing 700, or via welding, welding, lock or paste mode with a bump bond on metal backing 700 as metal bump structure 710.Only the invention is not restricted to this, visual actual demand selects suitable mode to form the metal bump structure.
Fig. 3 A is light-source structure 200 preferred embodiment schematic perspective views of the present invention; Fig. 3 B is the schematic perspective view of light-source structure 200 preferred embodiments of the present invention and metal backing 700 assembly, and Fig. 3 C is the schematic cross-section of light-source structure 200 preferred embodiments of the present invention and metal backing 700 assembly.Shown in Fig. 3 A, light-source structure 200 of the present invention comprises circuit board 210, a plurality of light source 230, lead 250 and at least one perforation 270.Light source 230 is arranged on the circuit board 210.Lead 250 is arranged on the circuit board 210, and lead 250 intercepts between the edge of circuit board 210 and light source 230, and to be preferably like Fig. 3 A be parallelly to extend along the edge.Light source 230 can comprise light emitting diode.Particularly, in the edge of lead 250 relative circuit boards 210 is surrounded on light source 230.Perforation 270 is arranged on the path of lead 250, uses for metal backing 700 assembly of as shown in Figure 2 and backlight module 800, and in metal bump structure 710 was arranged in perforation 270, lead 250 251 touched metal bump structure 710 to form path via appearing.Perforation 270 is preferably in the two ends of circuit board 210 and respectively establishes one, however its quantity and position viewable design demand and difference.Wherein, lead 250 has in perforation 270 places appears 251, appears 251 to comprise the conducting objects that is arranged at the sidewall that perforation 270 faces mutually.Conducting objects comprises the conductive material that has with the identical or different material of lead, can use plating, spot printing or the mode pasted is provided with, the elargol of the sidewall spot printing of for example facing mutually in perforation 270 or the carbon paste band of pasting.
In preferred embodiment, circuit board 210 comprises flexible circuit board.Embodiment shown in Fig. 3 A to Fig. 3 C, circuit board 210 is provided with two flanges 271 in perforation 270 relative both sides, protrudes toward perforation 270 inside from circuit board 210 along the path of lead 250 respectively.Lead 250 is to extend to be arranged to perforation 270 edges, and appears and 251 be arranged at the sidewall that two flanges 271 is faced in perforation 270 mutually.When perforation 270 and metal backing 700 assembly; Metal bump structure 710 is arranged in two flanges 271 is bent respectively; Be arranged at sidewall that two flanges 271 faces in perforation 270 mutually appear 251 touch metal bump structure 710 sidewall, make lead 250 form paths via metal bump structure 710.Circuit board 210 can bend shown in Fig. 3 B and Fig. 3 C when circuit board 210 is sheathed on metal bump structure 710, and the lateral margin at perforation 270 places of circuit board 210 can form path with metal bump structure 710.
Particularly; In the embodiment shown in Fig. 3 A to Fig. 3 C since circuit board 210 be to can be flexible circuit board; And the relative distance essence of two flanges 271 is less than the diameter of metal bump structure 710; Therefore when perforation 270 and metal backing 700 assembly, two flanges 271 can be arranged in the upwards bending of replacing respectively in the perforation 700 because of metal bump structure 710.At this moment; Be arranged at 251 sidewalls that touch metal bump structure 710 of appearing of the sidewall that two flanges 271 faces in perforation 270 mutually; Make lead 250 form paths via metal bump structure 710, and in light source 230 is surrounded on, to intercept the edge and the light source 230 of circuit board 210.Because the static discharge fecund is born in the edge of circuit board 210; Whereby can be when static discharge produces; By being electrically connected of lead 250 and metal bump structure 710; Static is imported ground, reduce 230 rounds static discharges of light source and attack damage, make light-source structure 200 integral body have preferable static discahrge protection effect.
Fig. 4 A is the preferred embodiment schematic perspective view of light-source structure 200 of the present invention, and Fig. 4 B is the preferred embodiment schematic perspective view of light-source structure 200 of the present invention with metal backing 700 assembly.In different embodiment, circuit board 210 is not limited to use flange 271 to replace metal bump structure 710.Shown in Fig. 4 A and Fig. 4 B; Circuit board 210 can be flexible circuit board; The aperture essence of the perforation 270 of circuit board 210 is less than the diameter of metal bump structure 710; Metal bump structure 710 is arranged in the circuit board section bending that makes in the perforation 270 around perforation 270, so that lead 250 forms path via metal bump structure 710.In other words; Metal bump structure 710 is to fill in the perforation 270; Because the aperture essence of the perforation 270 of circuit board 210 is less than the diameter of metal bump structure 710; So can make around the bending of the circuit board section of perforation 270, and be arranged at sidewall that perforation 270 faces mutually appear 251 can touch metal bump structure 710 sidewall, make lead 250 form paths via metal bump structure 710.On the other hand, perforation 270 sides can further be provided with at least one structure 272 of cracking, so that sheathed.Particularly, the structure of cracking 272 can give perforation 270 bigger deformability, so as to ccontaining metal bump structure 710.
Fig. 5 A is the preferred embodiment schematic perspective view of light-source structure 200 of the present invention; Fig. 5 B is the preferred embodiment schematic perspective view of light-source structure 200 of the present invention with metal backing 700 assembly, and Fig. 5 C is the preferred embodiment schematic cross-section of light-source structure 200 of the present invention with metal backing 700 assembly.Shown in Fig. 5 A to Fig. 5 C; In different embodiment; Circuit board 210 is not limited to use soft circuit board, as long as the aperture of the perforation 270 of accurate control circuit board 210, and makes 251 the distance of appearing that is arranged at sidewall that perforation 270 faces mutually be equal to or slightly less than the diameter of metal bump structure 710; Or making metal bump structure 710 adopt up-narrow and down-wide conical design, circuit board 210 also can use rigid circuit board.When perforation 270 during with metal backing 700 assembly, metal bump structure 710 is arranged in the perforation 270, appears 251 to touch in the sidewall of metal bump structure 710, makes lead 250 form paths via metal bump structure 710.Wherein, perforation 270 sides can further be provided with at least one structure 272 of cracking, so that sheathed.Particularly, the structure of cracking 272 can give perforation 270 bigger deformability, so as to ccontaining metal bump structure 710.
Fig. 6 A is the schematic perspective view that light-source structure 200 of the present invention has protective layer 100, and Fig. 6 B has the schematic cross-section of protective layer 100 for light-source structure 200 of the present invention.In the different embodiment shown in Fig. 6 A and Fig. 6 B, light-source structure 200 further comprises protective layer 100, is arranged on the circuit board 210, and covers lead 250 with exposure 251 the mode of appearing, and is not oxidized in order to guardwire 250.In other words; Lead 250 protected seams 100 cover to avoid oxidation, and appearing 251 does not have protected seam 100 to cover, in order to when perforation 270 and metal backing 700 assembly; Metal bump structure 710 is arranged in the perforation 270, and making appears 251 can touch in the sidewall of metal bump structure 710.Wherein, protective layer 100 can be selected from macromolecular material, metal oxide or other suitable material.
Fig. 7 has the schematic top plan view of extension 218 for light-source structure 200 of the present invention.Different embodiment as shown in Figure 7, circuit board 210 further has extension 218, and extension 218 tail ends have pin 219.Particularly, pin 219 is for being arranged at the metallic contact of extension 218 tail ends.Wherein, pin 219 is electrically connected with light source 230, and pin 219 can further connect power supply (not illustrating).In other words, light source 230 can connect power supply by pin 219.What need explanation is that lead 250 does not have with pin 219 and is electrically connected.In this embodiment, lead 250 is to extend along extension 218 edges for parallel like Fig. 7, and when pin 219 connection power supplys, the lead 250 of loop circuit capable plate 210 can reach static discahrge protection effect.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (14)
1. a light-source structure supplies a backlight module to use, and it is characterized in that this light-source structure comprises:
One circuit board;
A plurality of light sources are arranged on this circuit board;
One lead is arranged on this circuit board, and this lead intercepts between the edge and these a plurality of light sources of this circuit board, and this conductor loop is around these a plurality of light sources; And
At least one perforation; Be arranged on the path of this lead; Supply to use with a metal backing assembly of this backlight module, wherein this lead has in this perforation place and appears, and this is appeared and comprises the conducting objects that is arranged at the relative sidewall of this perforation; This perforation side is provided with at least one structure of cracking, so that sheathed.
2. light-source structure according to claim 1; It is characterized in that; This metal backing has a metal bump structure, and this circuit board comprises flexible circuit board, and the aperture of this perforation of this circuit board is less than the diameter of this metal bump structure; This metal bump structure is arranged in this circuit board section bending that makes in this perforation around this perforation, so that this lead forms path via this metal bump structure.
3. light-source structure according to claim 1; It is characterized in that this metal backing has a metal bump structure, this circuit board comprises rigid circuit board; When this perforation and this metal backing assembly; This metal bump structure of this metal backing is arranged in this perforation, and this is appeared and touches the sidewall in this metal bump structure, makes this lead form path via this metal bump structure.
4. light-source structure according to claim 1 is characterized in that, it is characterized in that, this is appeared and is arranged at the relative sidewall of this perforation with plating mode.
5. light-source structure according to claim 1 is characterized in that, further comprises a protective layer, is arranged on this circuit board, and covers this lead to expose this mode of appearing.
6. light-source structure according to claim 1 is characterized in that this circuit board further has an extension, and this extension tail end has a pin, and this pin is electrically connected with these a plurality of light sources.
7. light-source structure according to claim 1 is characterized in that, these a plurality of light sources comprise light emitting diode.
8. a backlight module is characterized in that, comprises:
One metal backing has at least one metal bump structure; And
One light-source structure comprises:
One circuit board;
A plurality of light sources are arranged on this circuit board;
One lead is arranged on this circuit board, and this lead intercepts between the edge and these a plurality of light sources of this circuit board, and this conductor loop is around these a plurality of light sources; And
At least one perforation is arranged on the path of this lead, supplies in this metal bump structure is arranged in; Make this circuit board group be assigned in this backlight module, wherein this lead has in this perforation place and appears, and this is appeared and comprises the conducting objects that is arranged at the relative sidewall of this perforation; When this metal bump structure is arranged in this perforation; This lead is appeared via this and is touched this metal bump structure to form path, and this perforation side is provided with at least one structure of cracking, so that sheathed.；
9. backlight module according to claim 8; It is characterized in that; This circuit board comprises flexible circuit board; The aperture of this perforation of this circuit board is less than the diameter of this metal bump structure, and this metal bump structure is arranged in this circuit board section bending that makes in this perforation around this perforation, so that this lead forms path via this metal bump structure.
10. backlight module according to claim 8; It is characterized in that; This circuit board comprises rigid circuit board, and when this perforation and this metal backing assembly, this metal bump structure is arranged in this perforation; This is appeared and touches the sidewall in this metal bump structure, makes this lead form path via this metal bump structure.
11. backlight module according to claim 8 is characterized in that, this is appeared and is arranged at the relative sidewall of this perforation with plating mode.
12. backlight module according to claim 8 is characterized in that, further comprises a protective layer, is arranged on this circuit board, and covers this lead to expose this mode of appearing.
13. backlight module according to claim 8 is characterized in that, this circuit board further has an extension, and this extension tail end has a pin, and this pin is electrically connected with these a plurality of light sources.
14. backlight module according to claim 8 is characterized in that, this light source comprises light emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104240424A CN102563460B (en) | 2010-01-19 | 2010-01-19 | Light source structure and backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104240424A CN102563460B (en) | 2010-01-19 | 2010-01-19 | Light source structure and backlight module |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010100025918A Division CN101776228B (en) | 2010-01-19 | 2010-01-19 | Light source structure and backlight module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102563460A true CN102563460A (en) | 2012-07-11 |
| CN102563460B CN102563460B (en) | 2013-12-18 |
Family
ID=46409633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104240424A Expired - Fee Related CN102563460B (en) | 2010-01-19 | 2010-01-19 | Light source structure and backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102563460B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102878495A (en) * | 2012-10-12 | 2013-01-16 | 北京京东方光电科技有限公司 | Backlight and manufacturing method and display device for backlight |
| CN103594022A (en) * | 2013-11-21 | 2014-02-19 | 友达光电(厦门)有限公司 | Display device |
| CN109828412A (en) * | 2019-02-28 | 2019-05-31 | 厦门天马微电子有限公司 | Backlight module and display device |
| CN112365796A (en) * | 2020-11-26 | 2021-02-12 | 京东方科技集团股份有限公司 | Backlight module and display device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM263518U (en) * | 2004-07-06 | 2005-05-01 | Au Optronics Corp | Backlight module |
| CN100371802C (en) * | 2006-01-06 | 2008-02-27 | 友达光电股份有限公司 | Light source assembly |
| CN2937824Y (en) * | 2006-06-19 | 2007-08-22 | 黄进华 | Cold cathode tube connection structure of backlight module |
| TWI359314B (en) * | 2006-11-03 | 2012-03-01 | Chimei Innolux Corp | Backlight module and liquid crystal display device |
| CN101435936B (en) * | 2007-11-12 | 2013-06-12 | 群创光电股份有限公司 | Backlight module and display apparatus |
| CN101578006B (en) * | 2008-05-08 | 2012-11-28 | 胜华科技股份有限公司 | Electrostatic defending device of touch panel |
| TWI363216B (en) * | 2008-05-29 | 2012-05-01 | Au Optronics Corp | Liquid crystal display and frame set thereof |
| CN101294670B (en) * | 2008-06-12 | 2010-10-13 | 友达光电股份有限公司 | Backlight module with swapping type light source system |
-
2010
- 2010-01-19 CN CN2011104240424A patent/CN102563460B/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102878495A (en) * | 2012-10-12 | 2013-01-16 | 北京京东方光电科技有限公司 | Backlight and manufacturing method and display device for backlight |
| CN102878495B (en) * | 2012-10-12 | 2016-05-25 | 北京京东方光电科技有限公司 | The preparation method of backlight, backlight and display unit |
| CN103594022A (en) * | 2013-11-21 | 2014-02-19 | 友达光电(厦门)有限公司 | Display device |
| CN109828412A (en) * | 2019-02-28 | 2019-05-31 | 厦门天马微电子有限公司 | Backlight module and display device |
| CN112365796A (en) * | 2020-11-26 | 2021-02-12 | 京东方科技集团股份有限公司 | Backlight module and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102563460B (en) | 2013-12-18 |
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