CN102557470A - 一种音叉型石英晶片的被银方法 - Google Patents

一种音叉型石英晶片的被银方法 Download PDF

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Publication number
CN102557470A
CN102557470A CN2010105902757A CN201010590275A CN102557470A CN 102557470 A CN102557470 A CN 102557470A CN 2010105902757 A CN2010105902757 A CN 2010105902757A CN 201010590275 A CN201010590275 A CN 201010590275A CN 102557470 A CN102557470 A CN 102557470A
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silver
type quartz
quartz wafer
tuning fork
fork type
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喻信东
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Hubei Taijing Electronic Technology Co Ltd
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Hubei Taijing Electronic Technology Co Ltd
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Abstract

本发明涉及到音叉型石英晶片领域,是一种音叉型石英晶片的被银方法。先将切割好的音叉型石英晶片放入下掩模板,盖上掩膜片,晶片不需要被银的部分被掩膜片盖住,需要被银的部分裸露出来,再在掩膜片上盖上上掩膜板,用螺丝固定好上下掩膜板和掩膜片,再将固定好的掩膜板放入真空被银机中,真空被银机工作1个小时后,音叉型石英晶片表面即按要求镀上了银层。由于采用了本技术方案,可以在不需使用强酸的环境下,音叉型石英晶片表面按要求被上银层,减少了环境污染。

Description

一种音叉型石英晶片的被银方法
技术领域
本发明涉及到音叉型石英晶片领域,是一种音叉型石英晶片的被银方法。
背景技术
目前音叉型石英晶片的被银是通过先对音叉晶片用强酸腐蚀,腐蚀后的晶片放入模具,再将模具放入真空被银机中实现晶片的被银。这种方法由于需用到强酸,对环境有污染,并且工人操作起来有安全隐患。
发明内容
本发明的目的是要提供一种不需使用强酸的音叉型石英晶片的被银方法。
本发明的技术方案是:先将切割好的音叉型石英晶片放入下掩模板,盖上掩膜片,晶片不需要被银的部分被掩膜片盖住,需要被银的部分裸露出来,再在掩膜片上盖上上掩膜板,用螺丝固定好上下掩膜板和掩膜片,再将固定好的掩膜板放入真空被银机中,真空被银机工作1个小时后,音叉型石英晶片表面即按要求镀上了银层。
由于采用了上述技术方案,可以在不需使用强酸的环境下,音叉型石英晶片表面按要求被上银层,减少了环境污染。
具体实施方式
下面结合实施例对本发明作进一步的说明。
先将切割好的音叉型石英晶片放入下掩模板,盖上掩膜片,晶片不需要被银的部分被掩膜片盖住,需要被银的部分裸露出来,再在掩膜片上盖上上掩膜板,用螺丝固定好上下掩膜板和掩膜片,再将固定好的掩膜板放入真空被银机中,真空被银机工作1个小时后,音叉型石英晶片表面即按要求镀上了银层。

Claims (1)

1.一种音叉型石英晶片的被银方法,其特征是先将切割好的音叉型石英晶片放入下掩模板,盖上掩膜片,晶片不需要被银的部分被掩膜片盖住,需要被银的部分裸露出来,再在掩膜片上盖上上掩膜板,用螺丝固定好上下掩膜板和掩膜片,再将固定好的掩膜板放入真空被银机中,真空被银机工作1个小时后,音叉型石英晶片表面即按要求镀上了银层。
CN2010105902757A 2010-12-08 2010-12-08 一种音叉型石英晶片的被银方法 Pending CN102557470A (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020109575A1 (en) * 2000-12-11 2002-08-15 Jeong Jun Hwan Ceramic chip-type device having glass coating film and fabricating method thereof
CN2658163Y (zh) * 2003-10-11 2004-11-24 淄博金里电子有限公司 真空式被银机
CN201258356Y (zh) * 2008-09-08 2009-06-17 北京康特电子股份有限公司 一种带镶嵌结构的掩膜夹具
CN101565278A (zh) * 2009-05-08 2009-10-28 浙江大学 筒体式石英晶体的双面溅射被银装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020109575A1 (en) * 2000-12-11 2002-08-15 Jeong Jun Hwan Ceramic chip-type device having glass coating film and fabricating method thereof
CN2658163Y (zh) * 2003-10-11 2004-11-24 淄博金里电子有限公司 真空式被银机
CN201258356Y (zh) * 2008-09-08 2009-06-17 北京康特电子股份有限公司 一种带镶嵌结构的掩膜夹具
CN101565278A (zh) * 2009-05-08 2009-10-28 浙江大学 筒体式石英晶体的双面溅射被银装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
萧治平: "《钟表技术:原理・装配・维修》", 31 July 2008, 中国轻工业出版社 *

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Address after: 441300 Zengdou Economic Development Zone, Suizhou District, Hubei (Hubei Crystal Electronic Technology Co., Ltd.)

Applicant after: Hubei TKD Electronic Technology Co., Ltd.

Address before: 441300 Zengdou Economic Development Zone, Suizhou District, Hubei (Hubei Crystal Electronic Technology Co., Ltd.)

Applicant before: Hubei Taijing Electronic Technology Co., Ltd.

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Application publication date: 20120711