CN102544338A - 发光二极管导线架 - Google Patents

发光二极管导线架 Download PDF

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Publication number
CN102544338A
CN102544338A CN2010105821177A CN201010582117A CN102544338A CN 102544338 A CN102544338 A CN 102544338A CN 2010105821177 A CN2010105821177 A CN 2010105821177A CN 201010582117 A CN201010582117 A CN 201010582117A CN 102544338 A CN102544338 A CN 102544338A
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rubber base
conducting wire
silver coating
metal pin
wire frame
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廖本扬
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2010105821177A priority Critical patent/CN102544338A/zh
Publication of CN102544338A publication Critical patent/CN102544338A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Abstract

本发明关于一种发光二极管导线架，其包括：设有中空功能区的胶座及间隔暴露于功能区内并延伸至胶座的外的若干金属接脚，金属接脚上设有镀银层，在镀银层上设有含有酰胺基团物质组成的结合促进层，可消除金属接脚与胶座之间的间隙，以提高发光二极管导线架的使用寿命。

Description

发光二极管导线架
【技术领域】
本发明涉及一种发光二极管导线架，尤其涉及一种表面黏着型发光二极管导线架。
【背景技术】
发光二极管是一种固态的半导体组件，不同于钨丝灯泡发光原理，属于冷光发光，只需极小电流就可以发光。发光二极管不但具有寿命长、省电、耐用、耐震、牢靠、适合量产、体积小及反应快等优点，更普遍应用在生活中多产品，如：手机、PDA产品的背光源、信息与消费性电子产品的指示灯、工业仪表设备、汽车用仪表指示灯与煞车灯及大型广告广告牌等。
现有的表面黏着型发光二极管导线通常包括胶座、两个金属接脚、发光芯片及二条导线。胶座具有中空状的功能区，金属接脚埋设于胶座中，其中金属接脚部分暴露于功能区底部，部分延伸出胶座相对两侧，并且沿胶座外侧弯折至胶座底面以作为后续制程的接点。在金属接脚表面上设有镀银层，通过镀银层将发光芯片发出的光反射出去。胶座于功能区中形成间隔区块以区隔两金属接脚的极性。发光芯片设置于功能区之后，通过两条导线分别连接发光芯片与两个金属接脚，并于胶座的功能区内覆盖一层可透光的环氧树脂以封装该发光二极管导线架。当对露出于胶座外的金属接脚施加电压即可使发光芯片发光。
但是此发光二极管导线架的胶座与金属接脚之间会产生间隙，容易导致外部环境周围的水气及硫化物沿此间隙扩散到功能区内部，当水气及硫化物共同存在时，水气会加速硫化物把镀银层反应成黑色的硫化银，当镀银层变黑后，发光芯片的光会在镀银层反射率下降的情况下降低亮度，最终会导致发光二极管导线架失效。
请参阅图1所示，揭示了一种改善上述发光二极管导线架，其在金属接脚2′与胶座1′结合的表面设置有若干凹槽20′，通过增加水气通过的路径来延缓镀银层变黑的速度。但是该发光二极管导线架长时间后，镀银层仍会变黑，发光芯片的亮度仍会降低。
因此，确有必要对现有的发光二极管导线架进行改进以克服现有技术的前述缺陷。
【发明内容】
本发明的目的在于提供一种胶座与金属接脚之间消除间隙的发光二极管导线架。
本发明的目的是通过以下技术方案实现的：一种发光二极管导线架，其包括：设有中空功能区的胶座及间隔暴露于功能区内并延伸至胶座的外的若干金属接脚，金属接脚上设有镀银层，在镀银层上设有含有酰胺基团物质组成的结合促进层。
所述含有酰胺基团的物质的化学式为：HSCH2NH2COOH或HSCH2CH(NHCOCH3)(COOH)。所述酰胺基团的物质中具有硫醇基团，硫醇基团内的硫原子与镀银层的银表面结合。所述胶座的树脂成份是聚酰胺，其化学结构中含有酰胺基团。所述镀银层设置在金属接脚的上表面用以反光。所述金属接脚从功能区向胶座外部延伸并弯折至胶座的外胶壁的底部。
相较于现有技术，本发明发光二极管导线架的结合促进层可消除金属接脚与胶座之间的间隙，以防止发光二极管导线架的镀银层变黑，提高发光二极管导线架的使用寿命。
【附图说明】
图1为现有发光二极管导线架的剖视图。
图2为本发明发光二极管导线架的立体图。
图3为沿图2中的A-A线的剖视图。
图4为图3中虚线框A标示部分的局部放大图。
【具体实施方式】
参阅图2所示，本发明为一种表面黏着型发光二极管导线架，其包括绝缘的胶座1及固持于胶座1中的两金属接脚2。
参阅图2至图3所示，胶座1大致呈长方体，通过塑料射出成型于金属接脚2之上。胶座1外侧形成外胶壁11，胶座1中部凹设形成中空状的功能区10，该功能区10为长方形状，其也可为圆形状、椭圆形状或其它多边形状。
金属接脚2埋设于胶座1中，每一金属接脚2均有部分可见于功能区10底部，并通过导线4与放置在其中一个金属接脚2上的发光芯片3连接，每一金属接脚2从功能区10向胶座1外部延伸，并弯折至胶座1的外胶壁11的底部形成弯折部20，该弯折部20低于胶座1的底面以作为后续制程的接点。本发明的金属接脚2是通过铜合金导电金属以冲压成型方式形成，其中将金属接脚2朝向功能区10的表面定义为上表面，与上表面相对的表面定义为下表面。参阅图4所示，在金属接脚2的上表面设有镀银层21，以反射发光芯片3所发出的光，该镀银层21也可以同时设置在金属接脚2的上、下表面。在镀银层21的上面又设有结合促进层22，可减少胶座1及镀银层21之间产生间隙，同时也可以防止外部环境中的水气及硫化物通过胶座1与金属接脚2之间进入功能区10内。所述结合促进层22也可以仅设置在胶座1与金属接脚2的结合处。
在本发明中的结合促进层22由一种含有酰胺基团物质组成，这种含有酰胺基团物质的化学式为：HSCH2NH2COOH或HSCH2CH(NHCOCH3)(COOH)。HSCH2NH2COOH或HSCH2CH(NHCOCH3)(COOH)中具有硫醇基团，硫醇基团会与镀银层21的表面作用，即硫醇基团内的硫原子会与镀银层21的银表面结合，可使镀银层21与结合促进层22之间的结合力增强从而可消除镀银层21与结合促进层22之间的间隙。胶座1常用的树脂成份是聚酰胺，其化学结构中也同样含有酰胺基团，酰胺基团之间的氧原子和氢原子会互相吸引而产生一种氢键作用力，使结合促进层22与胶座1之间具有较强的结合力，可减少胶座1与结合促进层22之间产生间隙使得水气无法进入功能区10内部，从而提高发光芯片3的使用寿命及发光的亮度。
本发明利用金属接脚2表面的结合促进层22及胶座1的酰胺基团物质的特性，以使金属接脚2与胶座1之间具有很强的结合力而无法产生间隙，可防止水气进入功能区10中，因此会使发光二极管导线架的镀银层21不易变黑，提高其使用寿命。
本发明的结合促进层22是由含有酰胺基团物质组成并列出HSCH2NH2COOH和HSCH2CH(NHCOCH3)(COOH)两种较佳的实施方式。但是应当指出其它含有酰胺基团的其它物质同样可达到相似的功效。

Claims (6)

1.一种发光二极管导线架，其包括设有中空功能区的胶座及间隔暴露于功能区内并延伸至胶座之外的若干金属接脚，该金属接脚上设有镀银层，其特征在于：所述镀银层上设有含有酰胺基团物质组成的结合促进层。
2.如权利要求1所述的发光二极管导线架，其特征在于：所述含有酰胺基团的物质的化学式为：HSCH2NH2COOH或HSCH2CH(NHCOCH3)(COOH)。
3.如权利要求1所述的发光二极管导线架，其特征在于：所述酰胺基团的物质中具有硫醇基团，硫醇基团内的硫原子与镀银层的银表面结合。
4.如权利要求1所述的发光二极管导线架，其特征在于：所述胶座的树脂成份是聚酰胺，其化学结构中含有酰胺基团。
5.如权利要求1所述的发光二极管导线架，其特征在于：所述镀银层设置在金属接脚的上表面用以反光。
6.如权利要求1所述的发光二极管导线架，其特征在于：所述金属接脚从功能区向胶座外部延伸并弯折至胶座的外胶壁的底部。
CN2010105821177A 2010-12-10 2010-12-10 发光二极管导线架 Pending CN102544338A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113285003A (zh) * 2021-04-30 2021-08-20 深圳市得润光学有限公司 一种制造led支架的方法以及led支架

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070200130A1 (en) * 2006-02-24 2007-08-30 Behringer Martin R Electronic Device
CN101842891A (zh) * 2007-08-29 2010-09-22 松下电器产业株式会社 布线构件、带有树脂的金属部件和树脂密封半导体装置以及它们的制造方法
CN201638853U (zh) * 2010-01-06 2010-11-17 富士康(昆山)电脑接插件有限公司 发光二极管导线架
CN201638854U (zh) * 2010-02-08 2010-11-17 富士康(昆山)电脑接插件有限公司 发光二极管导线架

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070200130A1 (en) * 2006-02-24 2007-08-30 Behringer Martin R Electronic Device
CN101842891A (zh) * 2007-08-29 2010-09-22 松下电器产业株式会社 布线构件、带有树脂的金属部件和树脂密封半导体装置以及它们的制造方法
CN201638853U (zh) * 2010-01-06 2010-11-17 富士康(昆山)电脑接插件有限公司 发光二极管导线架
CN201638854U (zh) * 2010-02-08 2010-11-17 富士康(昆山)电脑接插件有限公司 发光二极管导线架

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113285003A (zh) * 2021-04-30 2021-08-20 深圳市得润光学有限公司 一种制造led支架的方法以及led支架

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Application publication date: 20120704