CN102540916A - Energy terminal chip - Google Patents
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- CN102540916A CN102540916A CN2010106027601A CN201010602760A CN102540916A CN 102540916 A CN102540916 A CN 102540916A CN 2010106027601 A CN2010106027601 A CN 2010106027601A CN 201010602760 A CN201010602760 A CN 201010602760A CN 102540916 A CN102540916 A CN 102540916A
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Abstract
The invention discloses an energy terminal chip which serves as a control implementation unit for terminal equipment in a universal network. The energy terminal chip comprises at least one micro electro-mechanical system (MEMS) sensor, and at least one of an analog/digital converter, a signal processing and computation module, a control and decision module, an external communication module, a communication port, a control port and a power clock port, which are packaged in a chip shell and respectively formed on a plurality of pipe chips. The energy terminal chip can serve as the control implementation unit for the terminal equipment in the universal network.
Description
Technical field
The present invention relates to a kind of energy terminal chip, relate more specifically to be used for the general energy terminal chip that can net.
Background technology
The comprehensive utilization ratio that improves the energy is one of key that realizes low-carbon economy.The applicant has proposed the general scheme that can net in one Chinese patent application 201010173519.1 and 201010173433.9; To realize the intelligent and information-based of the various energy and material; And coupling utilization, management and the transactional services of multipotency source (polytype energy and/or from the energy in a plurality of geographic position), its in full content combine in this article with way of reference.
General ability net through energy production, storage, application and the energy of regeneration Fourth Ring joint and the coupling of information, forms the real-time collaborative that the time domain region is striden in the energy input and output based on the system energy efficiency technology, realizes the optimization of system's Life cycle and the synergy of energy.The efficiency control system is carried out supply and demand conversion coupling to each energy stream, and cascade utilization, space and time optimization, to reach the system energy efficiency maximization are finally exported a kind of high efficiency smart energy of high-sequential of self-organization.
As the terminal device on the general basis that can net the basic function of above-mentioned Fourth Ring joint is provided, and has comprised the control enforcement unit of self, automatic control function and external communication function are provided.The task that collection of simulant signal, conversion Calculation and control and decision-making are being born in the unit is implemented in the control of terminal device, comprises general ability most basic system sensor of net and actuator.The unit is implemented in the control of terminal device also must satisfy performance requirements such as low-power consumption, low cost, small size, Stability Analysis of Structures, environmental suitability.
Can adopt conventional machinery metering, temperature-sensitive and pressure-sensitive electronic component (below be called " sensitive electronic components ") and control method that the control enforcement unit of terminal device is provided; As comprise stem-winder meter, the ultrasound wave electronic meter meter of radio meter register function, and have auto-switch function household electrical appliance etc.
Yet the phenomenon of precise decreasing in use appears in conventional machinery metering because of mechanical aging, and then causes the loss on the meterage.Mechanical type table and control system in rock gas are example, because comprehensive metering/control loss that the mechanical aging wearing and tearing cause is more than 6%.With medium-scale (1,000,000 family civilian users; 1000 industrial users) be example; Every year is a kind of energy of rock gas only; Because the economic loss that mechanical type metering and control accuracy cause is just near 100,000,000, and As time goes on, can cause the workload of increasing control leakage potential safety hazard and engineering maintenance.
Sensitive electronic components can be used for replacing the machinery metering, can detect various physical parameters (like temperature, concentration, pressure, density etc.) in the net general.Yet, the need of work consumed power of sensitive electronic components, thus the power consumption of unit is implemented in the control that increases above-mentioned terminal device, in the serviceable life of the battery that reduces to comprise in the equipment, has improved the operation and the maintenance cost of equipment.The size of conventional sensitive electronic components is bigger, can not be used for the physical parameter in detected cells territory, and receive the interference from environment easily.And the precision of conventional sensitive electronic components is lower.If hope to improve precision, then cost is too high.With the thermal sensing element is example, and the market price of the thermistor of general precision is about 0.2 yuan, and high-precision PT1K resistance, then the market price is at 20～30 yuans.Therefore, the limitation of aspects such as the size of conventional sensitive electronic components, precision, power consumption has limited its application in general ability terminal.
Can also adopt ultrasonic measuring device can detect various physical parameters in the net general.The principle of work of ultrasonic measuring device is: at first initiatively produce a branch of ultrasound wave; Ultrasound wave is in through measured medium, and characteristics such as its velocity of propagation, direction, phase place change; Through a device that can detect the ultrasonic propagation characteristic, detect above-mentioned variation again, convert the physical quantity that needs at last into.Yet, to the measurement of each physical quantity, all needing several ultrasonic transmission device of extra increase, the cost of ultrasonic transmission device, size, weight, power consumption etc. tend to account for more than 50% of entire equipment, have reduced the cost advantage of product.
In the measurement and control device based on sensitive electronic components of prior art, the simulation perception of physical parameter, digital operation, control are to be handled by different chips respectively with transmission.Various chips provide the interface of sealing, interconnect with the mode of lead, change laggard line number value through A/D and calculate.Yet discrete chip has increased the complicacy and the assembly difficulty of system.The sensitive electronic components of which kind of principle no matter, its surface measurements all compares fragile, is easy to receive the pollution of measurement environment, even in transportation and assembling process, also very easily suffers damage, and its measuring accuracy then can be had a greatly reduced quality, even can influence its serviceable life.And simulating signal receives extraneous electromagnetic interference (EMI) through than long lead the time easily, in order to guarantee reliability of signals, has to strengthen its anti-interference through the method for amplifying signal, has increased power consumption so again.Therefore, discrete chip design is existing relatively poor anti-interference, can not be with high precision, mode long-time running reliably.
Machinery metering, sensitive electronic components and the ultrasonic measuring device of above routine only is applicable to the existing energy network that intelligent degree is lower, structure is single.The control enforcement unit of the general terminal device that can net need adopt sensing and handle a plurality of physical parameters, a large amount of sensitive electronic components of therefore necessary use.The general coupling utilization that can net relates to the multipotency source, and Fourth Ring joint terminal device all should having of intelligence, digitizing, intercouple collaborative and logic and intelligent stream that form to realize energy stream, flow of material, information flow.The type and the quantity of the sensitive electronic components that therefore, adopts in general can the net significantly increase.Conventional machinery metering, sensitive electronic components and ultrasonic measuring device is because volume is big, precision is low, poor anti jamming capability, poor reliability and can not satisfy general demand that can net.
Summary of the invention
The purpose of this invention is to provide a kind of energy terminal chip that can implement the unit as the control of the general terminal device that can net.
According to an aspect of the present invention; A kind of energy terminal chip is provided; The unit is implemented in control as the terminal device in general can the net; Wherein, this energy terminal chip is included at least one the MEMS sensor on a plurality of tube cores that is respectively formed at that encapsulates in the chip carrier, and in A/D converter, signal Processing and computing module, control and decision-making module, external communication module, COM1, control port and the power supply clock port at least one.
Energy terminal chip of the present invention has provided the MEMS sensor and the functional circuit thereof of system in package (SIP), for example A/D converter, signal Processing and computing module, control and decision-making module, external communication module, COM1, control port and power supply clock port.
Technical scheme of the present invention has advantage and effect following:
Advantages such as 1) general ability terminal chip is compared conventional sensitive electronic components based on MEMS device and CMOS technology, and the MEMS device has the precision height, cost is low, power consumption is little, volume is little, in light weight, and incomparable advantage is arranged on mission life and the reliability.Thereby the manufacturing of system and operation and maintenance cost can significantly reduce;
2) modules such as analog sensed, A/D conversion, numerical evaluation and control decision are integrated in the chip; Improved the integrated level of chip greatly, had great importance for the dirigibility that protects the intellectual property, increases product development, the degree of ripeness of accelerating market;
3) based on the SIP encapsulation technology of multi-chip module, be used for to novelty the design process of general ability terminal chip, compare conventional SOC scheme, have incomparable advantages such as investment is little, instant effect, cycle weak point, flexible, the existing technology reusability height of device replacement;
4) in the chip carrier die design process, to the working environment demand at general ability terminal, the protection structure of a um level of design; Not only can hang down protection MEMS sensor more, more can high-level efficiency, construct a stable measurement microenvironment at low cost, compare conventional mechanical processing technique; Precision can improve 2～3 one magnitude; Thereby make that the measurement result of chip is more credible, the terminal structure design is simpler, further accelerates the speed of the product engineeringization and the marketization.And this stabile microenvironment has also improved the stability and the reliability of product from measurement, reduced the operation and the maintenance cost of system.
Description of drawings
Fig. 1 schematically shows the control system that comprises according to energy terminal chip of the present invention.
Fig. 2 schematically shows the structured flowchart according to energy terminal chip of the present invention.
Fig. 3 schematically shows the encapsulation according to energy terminal chip of the present invention.
Embodiment
At first, the term that uses among the application is explained as follows:
" general ability net ": general ability net comprise that transmitted in both directions is general between node can flow to transmit the node that the general virtual pipeline internet framework that can flow links together.Node comprises the system energy efficiency controller, and is connected in other nodes, energy production device, energy storage device, energy source use device and the energy regeneration device of system energy efficiency controller at least one.Wherein, The input and output of the general ability stream of at least one of other nodes of system energy efficiency controller control, energy production device, energy storage device, energy source use device and energy regeneration device, general can stream comprise that energy stream, flow of material, information flow intercouple collaborative and logic and intelligent stream formation.
" general ability key-course ": being positioned at the general bottom that can net, is controlling object with a basic energy production, storage, application and regeneration Fourth Ring joint.Key-course receives the optimization instruction that comes from the upper strata; Comprehensive various local real-time information is controlled various energy devices; The efficiency that realizes energy production in the range of control, storage, application and regeneration Fourth Ring knot system is optimum, and the subsystem operation information is fed back to the upper strata.
" terminal device ": the various device and the machine of energy production, storage, application and regeneration Fourth Ring joint comprise photovoltaic one plate, vacuum collector, gas electricity generator, heat pump, cold storage tank, accumulator, various household electrical appliances, little algae pond etc.Each equipment all possesses automatic control function, can gather local physical message, can accept outside control command.
" MEMS intelligent chip ": based on MEMS (MEMS) technology; The high performance chips that possesses information translation and processing capacity; Can accomplish the conversion between energy/material and the information, have precision height, low in energy consumption, life-span length, stable performance, advantage such as with low cost.
" SIP encapsulation ": system in package, wherein, select appropriate process according to the demand of working environment with the tube core of a plurality of difference in functionality types, in a Chip Packaging, accomplish the function of electric signal interconnection, heat dissipation, mechanical protection and environmental protection.The height of realizing analog acquisition, A/D conversion, calculating judgement and a plurality of functional modules such as control, radio communication through encapsulation is integrated, thereby constructs a system level chip.
Fig. 1 schematically shows the control system that comprises according to energy terminal chip of the present invention.The energy terminal chip 200 that this control system comprises processor 100 and is used for detecting the general physical parameter that can net.Processor 100 receives from energy terminal chip 200 and detects data, obtains to take the accounts information and/or the control data at family through peripheral hardware 300, storage medium 400, RF/IC card 500, and passes through the relevant information of display 600 demonstrations.In addition, this control system also comprises energy management unit 700, is used for each parts power supply to control system.
The function of processor 100 is decided according to concrete scene demand, and usually, processor 100 has the directly related functions of user experience such as display driver, valve control, button processing, external apparatus interface, multimedia recreation.
Each parts of above-mentioned control system can be installed in the product casing, constitute complete product component.Should be noted that control system shown in Figure 1 only is schematic.If the requirement of working environment and heat dissipation is not harsh, can processor 100 be integrated in the energy terminal chip 200, to improve the integrated level of product, simplify product design and assembling.Yet too high integrated level can be in the universality that to a certain degree reduces chip, so should between integrated level and adaptability, obtain a compromise balance.
Fig. 2 schematically shows the structured flowchart according to energy terminal chip of the present invention.This energy terminal chip 200 comprises three MEMS sensor 201-203.The general physical parameter that can net of MEMS sensor 201-203 perception, and produce corresponding analog detection signal, to collect the local heat transfer agent and the operation information of corresponding terminal device.This analog detection signal converts digital signal to and sends signal Processing to and computing module 205 through A/D converter 204, and treated digital signal further sends control and decision-making module 206 to.On the one hand, control and decision-making module 206 report the local heat transfer agent and the operation information of terminal device the system energy efficiency controller of the upper level in general can the net via external communication module 207 and COM1 210.Control and decision-making module 206 are via external communication module 207 and COM1 210 on the other hand; Receive the control information of corresponding terminal device from the system energy efficiency controller of upper level, and via the executive component (not shown) transmitting control commands of control port 208 to terminal device.In addition, this energy terminal chip also comprises power supply clock port 209, obtains supply voltage from the outside to supply with each parts the energy terminal chip.
The MEMS sensor is to detect and calculate through the physical property to one of the working surface measured medium in very among a small circle, and obtains physical property in the whole test environment.MEMS sensor 201-203 among Fig. 2 can be the sensor of measuring different physical, for example temperature sensor, density sensor, flow sensor, concentration sensor, pressure transducer, acceleration transducer etc.
Stabile microenvironment that can reflect measured medium ensemble average level of the need of work of MEMS sensor.In product design in the past, the structure of this microenvironment often through the special processing of measuring cavity is realized, for example increases flow straightening grid or designs special channel size structure.So not only can significantly improve the processing cost of equipment, and the precision of present machining, be difficult to reach the required microenvironment stability of device work.
Because the precision of chip design and the high mature and the CMOS technology nm order of magnitude makes in the chip structure design process of silicon chip level, makes up the cost and the precision of such microenvironment, the incomparable advantage of conventional mechanical processing is arranged all.
Compare with the machine measuring method of routine, the MEMS measuring technique has small size, significant advantages such as wide range, high precision, high-reliability, low-power consumption, low cost.Because chip has been done the seasoned processing of device in process of production, calculating and control accuracy can remain on the higher level always.
As an example, above-mentioned energy terminal chip is implemented the unit as the control of the terminal device of energy production, storage, application and regeneration Fourth Ring joint, carries out following control method.
After beginning, through the intercommunication passage of general ability key-course, energy terminal chip 200 reads the control information of corresponding terminal device from the system energy efficiency controller of upper level.
Further, energy terminal chip 200 is collected the local heat transfer agent and the operation information of corresponding terminal device, and with the information temporary storage of collecting in the storer of this locality.
Further, energy terminal chip 200 is controlled the operational factor of corresponding terminal device according to the control information of reading.
Further, energy terminal chip 200 judges whether it is the suitable operation information opportunity of reporting.
If suitable report operation information opportunity; Then energy terminal chip 200 through general intercommunication passage that can key-course to the system energy efficiency controller report system operation information of upper level; And read the new control information of control through general intercommunication passage that can key-course from the system energy efficiency controller of upper level further, repeat above-mentioned step subsequently then.Report operation information opportunity if not suitable, then energy terminal chip 200 directly reads the new control information of control through general intercommunication passage that can key-course from the system energy efficiency controller of upper level, repeats above-mentioned step subsequently then.
Fig. 3 schematically shows the encapsulation according to energy terminal chip of the present invention; Wherein each parts (only showing three the MEMS sensor 201-203) combination with energy terminal chip shown in Figure 2 is arranged in the same encapsulation, forms system in package (SIP).Also promptly, energy terminal chip of the present invention is integrated in the functions such as sensing, conversion, numerical evaluation, control decision and correspondence with foreign country of the general physical parameter that can net within the encapsulation.
This system in package based on multi-chip module (MCM:Multiple Chip Model), with system level chip (SOC) be diverse a kind of method.
Sip technique a plurality of chips that in same packaging body, superpose particularly can also use the space of vertical direction, thereby have significantly reduced encapsulation volume.The stack of two chips makes the area ratio be increased to 170%, three chip closed assembly can increase to 250%.Sip technique can also shorten the cycle of launch products.Because SIP need not as SOC, to carry out domain level placement-and-routing, thus the time that complicacy that reduces to design, verify and debug and minimizing system realize.Even it is need the local design of changing, also simple easy to be many than SOC.Sip technique can also realize that the Chip Packaging of different process, material forms a system, such as can be with the integrated encapsulation of the chip portfolio of Si, GaAs, InP.Thereby have good compatibility, and can realize the integrated passive element that embeds.Sip technique can also make a plurality of encapsulation integrate, and total solder joint is greatly reduced, and also can significantly reduce encapsulation volume, weight, shortens the adapter path of element, thereby electrical property is improved.
Further, sip technique allows the function of existing chip is added in the system, thereby increases the dirigibility of design, and the existing chip resource is fully utilized.Sip technique not only can be handled digital display circuit, can also be applied to fields such as optical communication, sensor, motion control.
For being used for the general energy terminal chip that can net, hope functions such as integrated MEMS sensor, AD conversion, peripheral hardware driving and digital signal processing.Therefore energy terminal chip of the present invention can use the tube core of the maturation that is used for A/D and digital signal processing owing to adopted sip technique.
As known in the art, the manufacturing process that is used to form MEMS sensor 201-203 is compatible with the manufacturing process that is used to form integrated circuit.Therefore, in sip technique, comprise the MEMS sensor and obtain the method for System on Chip/SoC, the advantage on possessing skills.
The importance of this energy terminal chip 200 is encapsulation.In this encapsulation, similar with the integrated circuit encapsulation, should be the function that the MEMS sensor provides electric signal interconnection, power supply connection, heat dissipation (heat management), mechanical protection and environmental protection.
Can select suitable encapsulating material to be used to provide chip carrier 622 and protection structure 623.Encapsulating material commonly used has metal, pottery and plastics.Metal Packaging and ceramic package are because its good heat conductivity; Advantages such as impermeability is good are often used in the encapsulation of some individual devices, and molded plastic has limited the application of plastic package in some field that sealing property is had relatively high expectations because sealing property is got well inadequately.
In the space in encapsulation, can place getter to remove moisture.Use an amount of getter and plastic package technology just possibly obtain the packaging effect of accurate sealing, thereby when reducing packaging cost, guaranteed the reliability of energy terminal chip 200.
The size of energy terminal chip is more little, and then the requirement of the integrated level of device is high more, and corresponding cost is also high more.Therefore, should take into account the demand of cost and integrated level two aspects.Further, also should consider the demand of working environment, for example impermeability, temperature, humidity, pressure, objectionable constituent corrosion etc.;
The chip carrier 222 of energy terminal chip can be processed by general or special outer casing mold, holds the space of tube core so that required being used to be provided.
The protection structure 223 of ability source chip provides the protection of realization to the MEMS sensor.In encapsulation, transportation, assembling, debugging and the course of normal operation of chip, the MEMS sensor is easy to the impurity in the measured object or produces the stained or destruction of uncertain factor in the line.The size of protection structure 223 is approximately a um magnitude; Make sensitive electronic components away from above-mentioned hazards; Can significantly not increase simultaneously the physical dimension and the weight of entire chip yet; And because this structure is the device of a pure machinery, therefore the electric property for chip does not have any influence.
Although combined specific preferred embodiment to describe the present invention, should be understood that the purport that the present invention comprised is not limited to these concrete embodiment.On the contrary, that purport of the present invention is intended to comprise is all replaceable, modification and equivalent, and these are included in the spirit and scope of accompanying claims.
Claims (5)
1. an energy terminal chip is implemented the unit as the control of the terminal device in general can the net,
Wherein, This energy terminal chip is included at least one the MEMS sensor on a plurality of tube cores that is respectively formed at that encapsulates in the chip carrier, and in A/D converter, signal Processing and computing module, control and decision-making module, external communication module, COM1, control port and the power supply clock port at least one.
2. energy terminal chip according to claim 1, wherein said chip carrier is made up of encapsulating material.
3. energy terminal chip according to claim 2, wherein said chip carrier comprise that also the top that is positioned at the MEMS sensor is used to provide the protection structure of protection.
4. energy terminal chip according to claim 1, wherein said at least one MEMS sensor is selected from temperature sensor, density sensor, flow sensor, concentration sensor, pressure transducer, acceleration transducer.
5. energy terminal chip according to claim 4, wherein said at least one MEMS sensor comprises dissimilar MEMS sensors.
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