CN102532995A - Baked Film And Method For Producing The Same, Conveyance Carrier And Method For Producing The Same - Google Patents

Baked Film And Method For Producing The Same, Conveyance Carrier And Method For Producing The Same Download PDF

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Publication number
CN102532995A
CN102532995A CN2011103038505A CN201110303850A CN102532995A CN 102532995 A CN102532995 A CN 102532995A CN 2011103038505 A CN2011103038505 A CN 2011103038505A CN 201110303850 A CN201110303850 A CN 201110303850A CN 102532995 A CN102532995 A CN 102532995A
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CN
China
Prior art keywords
film
manufacture
recess
hole portion
filming
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CN2011103038505A
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Chinese (zh)
Inventor
冲和宏
作山弘
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Fujifilm Corp
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Fujifilm Corp
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Publication date
Priority claimed from JP2010222015A external-priority patent/JP2012079826A/en
Priority claimed from JP2011208740A external-priority patent/JP2012091161A/en
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN102532995A publication Critical patent/CN102532995A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007After-treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/12Stencil printing; Silk-screen printing
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paints Or Removers (AREA)

Abstract

The invention provides a baked film and a method for producing the same, a conveyance carrier and a method for producing the same. The method for producing the baked film comprises a coating film forming process, wherein a liquid coating containing at least polydimethyl siloxane composition with the average thickness thereof 10 pa*s-200 pa*s at a temperature below 25 DEG is printed on a screen substrate so as to form the coating film with the average thickness thereof 100mum or more; and a coating film sintering process. The method for producing the conveyance carrier comprises a hole or recess forming process, wherein at least one part of the substrate is formed with a hole or a recess. The hole or the recess is used for placing the printing mask of a printing silk screen. The printing of the silk screen containing the coating liquid of the above polydimethyl siloxane composition comprises the coating film forming process and the coating film sintering process.

Description

Burn till film and method of manufacture thereof and delivery vehicles and method of manufacture thereof
Technical field
It is good to the present invention relates to thickness homogeneous and surface smoothing property, for example is suitable for burning till film and burning film forming method of manufacture of conductive film, insulating film, adhesive film etc.
The present invention relates to be used to carry the delivery vehicles of substrates such as flexible print circuit board and the method for manufacture of delivery vehicles.
Background technology
Burn film forming coating fluids (printing ink) as being used to make conductive film, insulating film, adhesive film etc., for example, prepare through inorganic particulate is dispersed in the vehicle that dissolving resin obtains in solvent.And, through silk screen printing or dip coated method etc. behind the coating fluid of coating preparation on the substrate, through dry, burn till, make and burn till film.
Recently, follow miniaturized, the high performance of electronic component, the level that requires of the film forming physicals of burning that forms through silk screen printing, dip coated method is uprised.
For example, in the delivery vehicles of flexible print circuit board substrates such as (FPC), in order to ensure in the space of production scene, preferably vertical placement substrate is managed when FPC is installed, and requires the demand in the production scene of higher binding property and so on to increase.
In the method for manufacture of the delivery vehicles of existing substrate, have following problem: in order to expose four jiaos of aluminium base, with masking tape aluminium coating substrate four jiaos carry out the scraper plate coating through one piece of one piece of handwork, and spended time is produced rate variance.
In addition, the coating fluid that contains the vehicle that ethyl cellulose dissolved obtains in solvent is easy to generate following problem: contain the solvent after the coating state film be called as and ooze out or the increase (increase of surface covered) of the sagging mobile size that causes or dry and result from the softening of resin and filming of producing sagging etc. when burning till.
In addition, there is following problem in the coating fluid that contains the vehicle that dissolving vinyl resin and polyvinyl butyral resin obtain in solvent: because leveling characteristics is poor, binding property is strong excessively, and therefore, the coating fluid wire drawing is also extended, and therefore, operation property is poor.
In addition, motion have a kind of coating fluid that contains the dimethyl silicone polymer composition containing that comprises YSR 3286 at least (for example, with reference to TOHKEMY 2009-292970 communique, TOHKEMY 2009-147353 communique, and No. 4438896 communique of patent).But there is following problem in this coating fluid that comprises dimethyl silicone polymer composition containing: stringiness is strong, and when silk screen printing, with respect to moving of squeegee, the version that leaves of silk screen postpones film coated surface roughen thus.
Therefore; Present situation is that following burning till film and burn film forming method of manufacture preferably is provided rapidly; Leveling characteristics after the film forming coating of said burning is excellent and be difficult for producing oozing out of filming or sagging and sagging etc. dry and filming when burning till, and thickness homogeneous and dimensional precision are high.
The flexible print circuit board that electronic component is installed (FPC) of semi-conductor etc. is the substrate of film like, therefore, as far as monomer, is easy to generate distortion or warpage etc.Therefore; Under the situation of the installation of carrying out electronic component on the FPC, medicine cleaning, plasma treatment; Generally speaking; Use has bonding coat on substrate the anchor clamps that are called delivery vehicles carry out (for example, with reference to japanese kokai publication hei 7-22795 communique, TOHKEMY 2004-71863 communique and TOHKEMY 2004-158477 communique).
When on such delivery vehicles, FPC being set, having on the FPC under the situation of electronic components such as mounted semi-conductor, its part becomes protuberance and hinders FPC is set on delivery vehicles.Therefore, need on delivery vehicles, form hole portion in advance and miss protuberance.But delivery vehicles becomes the stepped construction of the different differing materials of material and the hardness of substrate and bonding coat, therefore, exists in when forming hole portion, cracks on any in substrate and bonding coat and problem such as fold.For example, at the substrate that uses metal such as aluminium as delivery vehicles, use under the situation of softish organic materials as the bonding coat of delivery vehicles such as silicone resin, both physical property difference is big, therefore is difficult to form hole portion.And then, there is following problem: on the bonding coat of delivery vehicles,, therefore, make the yield rate variation of delivery vehicles in case the rubbish or the grinding medicament (oil) that adhere to when forming hole portion just are difficult for taking off.
Summary of the invention
The object of the present invention is to provide leveling characteristics after coating excellent and be difficult for producing oozing out of filming or sagging, and dry and filming when burning till is sagging etc., what thickness homogeneous and dimensional precision were high burns till film and burns film forming method of manufacture.
The method of manufacture that the object of the present invention is to provide high-quality delivery vehicles and can make the delivery vehicles of this delivery vehicles efficiently; Said delivery vehicles not on substrate the rubbish when residual formation hole portion or recess, grind medicament (oil), or coating fluid non-cohesive in the hole inside of portion or recess.
In order to solve said problem; The inventor etc. concentrate on studies, and the result finds that containing the dimethyl silicone polymer composition containing and the viscosity under 25 ℃ that comprise YSR 3286 at least through preparation is the coating fluid of 10Pas~200Pas; Lower stringiness; Form filming more than the mean thickness 100 μ m through silk screen printing, promote levelling thus, thereby can access the level and smooth film that burns till.
In addition, in order to solve said problem, the inventor etc. concentrate on studies; The result finds, formation needs on delivery vehicles hole portion or recess are not after forming coating layer on the substrate; But before the coating coating fluid; On substrate, form hole portion or recess, after removing rubbish, grinding medicament (oil), to the hole portion of substrate or carry out silk screen printing beyond the recess; Can make efficiently thus coating fluid non-cohesive in the hole inside (wall) of portion or recess, the high-quality delivery vehicles of the rubbish when not residual formation hole portion or recess, oil.
The present invention is based on the inventor and waits the said opinion that obtains to accomplish, and as the method that is used to solve said problem, is described below.That is:
< 1>the film forming method of manufacture of a kind of burning; It is characterized in that, comprise following operation: contain the dimethyl silicone polymer composition containing that comprises YSR 3286 at least and be that the coating fluid of 10Pas~200Pas forms the formation operation of filming of filming more than the mean thickness 100 μ m in the viscosity under 25 ℃ in silk screen printing on the substrate; And; Burn till said firing process of filming.
< 2>like the film forming method of manufacture of above-mentioned < 1>described burning, wherein, the mean thickness of filming is below the above 150 μ m of 100 μ m.
< 3>like the film forming method of manufacture of each described burning in above-mentioned < 1 >~< 2 >, wherein, the viscosity D of coating fluid under 25 ℃ and the mean thickness T that films satisfy following formula: 1≤T/D≤25.
< 4>like the film forming method of manufacture of each described burning in above-mentioned < 1 >~< 3 >, it is characterized in that coating fluid contains inorganic particulate.
< 5>like the film forming method of manufacture of each described burning in above-mentioned < 1 >~< 4 >, wherein, substrate is an aluminium base.
< 6>like the film forming method of manufacture of each described burning in above-mentioned < 1 >~< 4 >, wherein, substrate is a heat-resistant resin film.
< 7>a kind of film that burns till is characterized in that, the said film that burns till is made through the film forming method of manufacture of each described burning in above-mentioned < 1 >~< 6 >.
< 8>described in above-mentioned < 7 >, burn till film, wherein, burn till film and be in conductive film, insulating film and the adhesive film any.
< 9>a kind of method of manufacture of delivery vehicles is characterized in that, comprises following operation: the hole portion or the recess formation operation that form hole portion or recess at least a portion of substrate; After said hole portion or recess were covered with the mask that is arranged at the silk screen version, silk screen printing contained the coating fluid of the dimethyl silicone polymer composition containing that comprises YSR 3286 at least and forms the formation operation of filming of filming; And; Burn till said firing process of filming.
<10>like the method for manufacture of above-mentioned<9>described delivery vehicles, wherein, the surface-area B of the surface-area A of hole portion or recess and the mask that is arranged at the silk screen version of this hole portion of covering or recess satisfies following formula: B/A>=0.9~1.1.
<11>like the method for manufacture of each described delivery vehicles in above-mentioned<9 >~<10 >, wherein, the surface-area A of hole portion or recess and the surface-area B of the mask that is arranged at the silk screen version of this hole portion of covering or recess satisfy following formula: B/A>=1~1.05.
< 12>like the method for manufacture of each described delivery vehicles in above-mentioned < 9 >~< 11 >, wherein, the planeform of hole portion or recess is any in toroidal and the square shape.
< 13>like the method for manufacture of each described delivery vehicles in above-mentioned < 9 >~< 12 >, wherein, comprise: after forming hole portion or recess on the substrate, the substrate matting of cleaning this substrate.
< 14>a kind of delivery vehicles, wherein, said delivery vehicles is made through the method for manufacture of each described delivery vehicles in above-mentioned < 9 >~< 13 >.
According to the present invention; Can provide to solve existing problem, leveling characteristics after coating is excellent and be difficult for generating oozing out of filming or sagging, and sagging etc. and the thickness homogeneous and high the burning till film and burn film forming method of manufacture of dimensional precision of dry and filming when burning till.
According to the present invention; High-quality delivery vehicles that can solve existing problem and the method for manufacture that can make the delivery vehicles of this delivery vehicles expeditiously can be provided; Said delivery vehicles, not on substrate the rubbish when residual formation hole portion or recess and grind medicament (oil) or coating fluid non-cohesive in the hole inside of portion or recess.
Embodiment
(burn till film and burn film forming method of manufacture)
The film forming method of manufacture of burning of the present invention comprises film formation operation and firing process, and the operation that also comprises other as required forms.
The film that burns till of the present invention is made through the film forming method of manufacture of above-mentioned burning of the present invention.
Below, through the film forming method of manufacture of burning of the present invention is described, also can the film forming detailed content of clear and definite burning of the present invention.
< film and form operation >
Above-mentionedly film that to form operation following: contain the dimethyl silicone polymer composition containing that comprises YSR 3286 at least and be that the coating fluid of 10Pas~200Pas forms filming more than the mean thickness 100 μ m in the viscosity under 25 ℃ in silk screen printing on the substrate.
" substrate "
Not special restriction such as the shape of aforesaid substrate, structure, size can be selected according to purpose is suitable, for example, as above-mentioned shape, can enumerate: membranaceous, sheet etc.As said structure, can enumerate single layer structure, stepped construction etc.As above-mentioned size, can be according to suitable selections such as purposes.
As aforesaid substrate, not special restriction can be selected according to purpose is suitable, for example can enumerate: glass substrate, synthetic resins system film (sheet material), metal substrate, ceramic substrate etc.On aforesaid substrate, can carry out pre-treatment such as medicine processing, plasma treatment, ion plating method, sputtering method, gas-phase reaction method, vacuum vapour deposition such as silane coupling agent according to expectation.
As above-mentioned glass substrate, for example can enumerate: blank glass, backboard glass, silica dioxide coating backboard glass etc.
As above-mentioned synthetic resins system film, for example can enumerate: polyethylene terephthalate (PET) film, polyarylester film, polyetherketone film, polyetherimde films, polycarbonate membrane, poly (ether sulfone) film, polyester film, acrylic resin film, vinyl chloride resin film, aromatic polyamide resin film, polyamidoimide film, polyimide film etc.Wherein, heat-resistant resin film such as preferred especially polyimide film.
As above-mentioned ceramic substrate, for example can enumerate: aluminum oxide, sialon (sialon), zirconium white, aluminium nitride AlN, silicon nitride, silit, titanium nitride etc.
As said metal substrates, for example can enumerate: aluminium base, copper base, ni substrate, iron substrate, stainless steel substrate etc.Wherein, good from light weight, cheapness and processibility, uncorruptible aspect is considered, preferred especially aluminium base.
As the thickness of aforesaid substrate, not special restriction can be selected according to purpose is suitable, but preferred 100 μ m~5mm, more preferably 500 μ m~3mm.
" coating fluid "
Above-mentioned coating fluid contains the dimethyl silicone polymer composition containing that comprises YSR 3286 at least, and the composition that contains inorganic particulate and then contain other as required forms.
-dimethyl silicone polymer composition containing-
Above-mentioned dimethyl silicone polymer composition containing is to be obtained by be hydrolyzed reaction and the condensation reaction of silicate modified YSR 3286 with terminal through silicate compound.
--silicate compound--
Above-mentioned silicate compound is the oligopolymer of the metal alkoxide made with silicon (Si), is to have siloxanes (Si-O-Si-) skeleton and import the compound that alkoxyl group (RO) forms at side chain at main chain.At this, can enumerate as (R) of the moieties of alkoxyl group (RO): methyl, ethyl, propyl group etc.Above-mentioned silicate compound has easily and the water reaction properties.
Above-mentioned silicate compound is the oligopolymer of metal alkoxide, and is therefore big than the molecular weight of metal alkoxide, so difficult volatilization.Therefore, when above-mentioned silicate compound hydrolysis, can further be suppressed at above-mentioned end by the volatilization of the high low molecular weight polyorganosiloxane of volatility contained in the silicate modified YSR 3286.In addition, above-mentioned silicate compound has high chemical reactivity, can successfully carry out condensation reaction.
As the kind of above-mentioned silicate compound, for example can enumerate: methyl silicate, ethyl silicate, propyl group silicate etc.Consider preferred ethyl silicate from the stability of quality and the aspect of security.Being that purpose is used under the situation of methyl silicate, need implement the processing of evaporable methyl alcohol reliably to improve reactivity.
Above-mentioned silicate compound is by [Chemical formula 1]: SinO (n-1)(RO) 2 (n+1)(R=alkyl, n=4~16) expression, in addition, end can be by [Chemical formula 2]: SinO by silicate modified YSR 3286 (n-1)(RO) 2 (n+1)(OSi (CH 3) 2) m(RO) 2 (n+1)SinO (n-1)(R=alkyl, n=416, m>50) expression.
Above-mentioned silicate compound is preferably 3 aggressiveness~12 aggressiveness.Above-mentioned silicate compound is when being lower than 3 aggressiveness, and the effect of the characteristic that has of silicate tails off sometimes, when surpassing 12 aggressiveness, sometimes because the viscosity of silicate compound uprises and when synthetic, is difficult to operates.
--terminal--by silicate modified YSR 3286
Above-mentioned end is with above-mentioned silicate compound the end of YSR 3286 to be carried out modification to handle and form by silicate modified YSR 3286, is to instigate that to have the silicate modified YSR 3286 of silanol group at two ends be the organoalkoxysilane partial condensate reaction of alkoxyl group and the material that obtains with have hydrolyzable functional group in the one or both sides of main chain.
Above-mentioned end is compared by silicate modified YSR 3286 with common end by silicate modified YSR 3286, has very high functional group concentration.In addition; Terminal high by the condensation reaction property of silicate modified YSR 3286 and above-mentioned silicate compound; Therefore, end can successfully be carried out condensation reaction, solidifies and carry out polymkeric substanceization by organoalkoxysilane partial condensate contained in the silicate modified YSR 3286.
Above-mentioned end is used the material of weight-average molecular weight in the scope below 100000 more than 5000 by silicate modified YSR 3286.
Among the present invention, will have above-mentioned silicate compound and above-mentioned end and be hydrolyzed and condensation reaction by the mixture of silicate modified YSR 3286.
Above-mentioned silicate compound is easy hydrolysis in the presence of water, and therefore, the intramolecular alkoxyl group of silicate compound becomes reactive high silanol group (OH yl).
On the other hand, above-mentioned end similarly through being hydrolyzed, is become silanol group (be also referred to as silanol modification) in the existence of water by silicate modified YSR 3286.
The two silanol group; Have hyperergy, simultaneously, have similar reactivity; Therefore; Be hydrolyzed by the mixture of silicate modified YSR 3286 through having above-mentioned silicate compound and above-mentioned end, can not accelerate the cohesion of silanol, carry out smoothly with above-mentioned end by the condensation reaction of silicate modified YSR 3286.Thus, above-mentioned end also is incorporated in the reaction product (dimethyl silicone polymer composition containing) by low molecular weight polyorganosiloxane contained in the silicate modified YSR 3286.
That is, through hydrolysis reaction and condensation reaction, low molecular weight polyorganosiloxane becomes the part of the material that constitutes dimethyl silicone polymer composition containing, becomes the amount denier that does not exist with monomeric form or exist with monomeric form.Therefore, low molecular weight polyorganosiloxane can not volatilize from dimethyl silicone polymer composition containing or the volatile quantity denier.
Above-mentioned silicate compound (A) and above-mentioned end are preferred in the scope below 10 more than 0.1 in mol ratio (A/B) by the cooperation ratio of silicate modified YSR 3286 (B).The righttest cooperation ratio is counted about 1 with mol ratio (A/B).
Above-mentioned dimethyl silicone polymer composition containing is a benchmark with this righttest cooperation ratio; Requiring under the situation of flexibility, preferably increasing above-mentioned end by silicate modified YSR 3286 (B), opposite; Requiring under the situation of high firmness, preferably increasing above-mentioned silicate compound (A).
But as far as above-mentioned dimethyl silicone polymer composition containing, under the situation that increases above-mentioned silicate compound (A), mol ratio (A/B) surpasses at 10 o'clock, and then the volatile component of low molecular weight polyorganosiloxane increases.The amount that to be low molecular weight polyorganosiloxane exist with monomeric form increases, and therefore, produces contraction and filmization when solidifying, according to circumstances problem such as cracks, and can not bring into play effect of the present invention.On the other hand; Above-mentioned mol ratio (A/B) is lower than at 0.1 o'clock; Sometimes above-mentioned silicate compound (A) and above-mentioned end can not successfully be carried out by the hydrolysis reaction of silicate modified YSR 3286 (B) and condensation reaction; The result becomes uncured state, and residual low molecular weight polyorganosiloxane can not be brought into play effect of the present invention.
-inorganic particulate-
As above-mentioned inorganic particulate, not special restriction can be selected according to purpose is suitable, can enumerate electroconductibility inorganic particulate, insulativity inorganic particulate etc.Wherein, can use a kind separately, also can be with also using more than 2 kinds.
When adding above-mentioned electroconductibility inorganic particulate, can give and burn till film conductivity, when adding above-mentioned insulativity particle, can give and burn till the film insulativity.
As above-mentioned electroconductibility inorganic particulate, for example can enumerate: particles such as electroconductive oxide such as conductive carbon such as conductive carbon black, conductive carbon graphite or electroconductibility titanium oxide, conductive tin oxide, electroconductive zinc oxide, electroconductibility permanent white, electroconductibility barium titanate, electroconductibility potassium titanate.
As above-mentioned insulativity inorganic particulate, for example can enumerate: particles such as aluminum oxide, silicon oxide, lime carbonate, talcum, clay, silica glass, aluminosilicate glass, sheet mica, zirconium white, mullite, sialon, saponite, forsterite, trichroite, beryllium oxide, silicon nitride.
The not special restriction of content in the above-mentioned coating fluid of above-mentioned inorganic particulate can be selected preferred 10 quality %~90% quality according to purpose is suitable.
-other composition-
As other above-mentioned composition, for example can enumerate: thermal polymerization, solvent, particle dispersion agent etc.
As above-mentioned thermal polymerization, for example can enumerate various organo-peroxides etc.As above-mentioned organo-peroxide, for example can enumerate: ketone peroxide, diacyl peroxide, hydrogen peroxide, dialkyl peroxide, ketal peroxide, alkyl super-acid ester, peroxycarbonates etc.Wherein, consider preferred especially dialkyl peroxide from the aspect of catalyst activity.As above-mentioned dialkyl peroxide; For example can enumerate: cyclohexanone peroxide, 1, two (peroxo-of the uncle's hexyl) pimelinketone of 1-, hydrogen phosphide cumene, Di Cumyl Peroxide 99, Lucidol, di-isopropyl superoxide, ditertiary butyl peroxide, uncle's hexyl peroxo-sec.-propyl monocarbonate, tert-butyl hydroperoxide-2-ethylhexanoate etc.
In addition, also above-mentioned solvent can be comprised, but when not comprising solvent, the drying after the coating can be omitted, so preferred.
The viscosity of above-mentioned coating fluid is 10Pas~200Pas, preferred 40Pas~100Pas, more preferably 20Pas~80Pas down at 25 ℃.When above-mentioned viscosity is lower than 10Pas; Sometimes the film that forms is because weight and capillary influence produce mobile; Particularly become the film of uneven thickness one, when surpassing 200Pas, be difficult to cause the levelling after the coating sometimes owing to the moistening expansion of coated film end; Therefore, become the transfer printing of the mesh of silk screen when silk screen printing or at the concavo-convex directly residual inhomogenous film that produces from when version of silk screen.
The viscosity of above-mentioned coating fluid for example can wait through rheometer, Brookfield viscometer, oscillatory viscometer and measure.
The viscosity of above-mentioned coating fluid for example can be through changing coating fluid composition, mixture ratio etc. adjust.
" silk screen printing "
As above-mentioned silk screen printing, not special restriction can be selected according to purpose is suitable, for example, coating fluid is poured in the frame, and the limit adds flanging with the plate of the doctor-like that is called as squeegee to the inner face of silk screen version moves squeegee.Follow moving of squeegee, coating fluid is through squeegee and pressurized, extrudes from the peristome point-like ground of the mesh that is arranged at the silk screen version, films in substrate surface formation.Coating fluid has flowability to a certain degree, therefore, if place point-like film the complanation of then filming (levelling).Therefore, in silk screen print method, be provided with usually and after printing, place the operation that (printed patterns) certain hour of filming carries out levelling.
The silk screen version that is used for silk screen printing usually can be through will spreading over frame by the wire screen that metals such as washing macromolecular compounds such as Telon, nylon, stainless steel constitutes, and the part beyond the printed patterns in this wire cloth is used a version film that is made up of resist etc. to cover (filler) and formed.
The mean thickness of filming that forms through silk screen printing for example can be through changing the distance of silk screen version and substrate, and the angle of squeegee etc. is adjusted.
" filming "
Containing above-mentioned dimethyl silicone polymer composition containing and the viscosity under 25 ℃ in silk screen printing on the substrate is that the coating fluid of 10Pas~200Pas forms and films.
Above-mentioned mean thickness of filming is more than the 100 μ m, below the above 250 μ m of preferred 100 μ m, more preferably below the above 150 μ m of 100 μ m.When above-mentioned mean thickness is lower than 100 μ m, influenced by the concavo-convex of substrate, be difficult to cause the smoothing of filming through levelling; Therefore; Form to produce concavo-convex planar film or to show the material of coated film of function few, therefore, the degradation of coated film.
Method such as above-mentioned mean thickness of filming for example can used thickness meter (micro gauge), laser type extensometer or measure through calculating by the variation of the gross weight of the carrier before and after the coating and surface covered.
Among the present invention, satisfying above-mentioned coating fluid on the basis of the range of viscosities under 25 ℃ and the average thickness range of filming, the viscosity of preferred coating fluid satisfies certain relation with the mean thickness of filming.That is, viscosity D (Pas) and the mean thickness T (μ m) that film of above-mentioned coating fluid under 25 ℃ preferably satisfies following formula 1≤T/D≤25, more preferably satisfies 1.2≤T/D≤15, most preferably 1.5≤T/D≤8.
Above-mentionedly satisfy above-mentioned scope than (T/D), thus the leveling characteristics after can obtaining being coated with excellent and be difficult for producing oozing out of filming and when sagging, dry and sagging etc. and the thickness homogeneous of filming in when burning till and dimensional precision high burn till film.
<burning till engineering >
Above-mentioned firing process is with forming the operation of filming and burning till that forms in the operation above-mentioned filming.
Above-mentioned condition of burning till, method etc., not special restriction can suit to select from known method; Preferred 180 ℃~300 ℃ of firing temperature; More preferably 200 ℃~260 ℃, preferred 120 minutes~600 minutes of firing time, more preferably 150 minutes~480 minutes.
In addition, preferred drying coated coating fluid before above-mentioned burning till, as this exsiccant condition, not special restriction can be selected according to purpose is suitable, for example about 50 ℃~100 ℃ dry about 10 minutes~60 minutes down.
More than the preferred 100 μ m of the film forming mean thickness of the burning that obtains, more preferably 100 μ m~250 μ m.
< purposes >
Through the film forming method of manufacture manufacturing of burning of the present invention burn till film can be preferably used as conductive film, insulating film, and adhesive film in any.
As above-mentioned conductive film, for example can be used for conductive films such as flexible electrical electroluminescent devices (OLED), touch-screen, touch panel, organic tft, driving mechanism, transmitter, Electronic Paper, flexible light control material, solar cell etc.
As above-mentioned insulating film, for example can be used for insulating films such as semi-conductor, organic tft, transmitter etc.
As above-mentioned adhesive film, for example can be used for the delivery vehicles of substrates such as FPC substrate, the stationary platen that the stationary platen that laser processing is used, mechanical workout are used etc.
(method of manufacture of delivery vehicles and delivery vehicles)
The method of manufacture of delivery vehicles of the present invention comprises hole portion or recess formation operation, film formation operation, firing process, comprises the substrate matting, also comprises other operation as required.
Delivery vehicles of the present invention is to make through the method for manufacture of delivery vehicles of the present invention.
Below, the explanation of the method for manufacture through delivery vehicles of the present invention also can show the detailed content of delivery vehicles of the present invention.
< hole portion or recess form operation >
It is the operation that forms hole portion or recess at least a portion of substrate that above-mentioned hole portion or recess form operation.
" substrate "
As aforesaid substrate, can use with above-mentioned burner membrane and burn the same substrate of film forming method of manufacture.
The thickness of aforesaid substrate and above-mentioned burner membrane and to burn film forming method of manufacture identical.
The shape of above-mentioned hole portion or recess, size, quantity etc.; Not special restriction; Can select according to purpose is suitable; For example, as the planeform of above-mentioned hole portion or recess, can enumerate: toroidal, elliptical shape, triangular shape, square shape, square shape, oblong-shaped, pentagon shape etc.Wherein, consider special circular shape, square shape from the easness of processing, the aspect of working accuracy.
As the size of above-mentioned hole portion or recess, not special restriction can be selected according to purposes is suitable.
As the quantity of above-mentioned hole portion or recess, not special restriction can be selected according to purpose is suitable, for example, is preferably 1~10.
Above-mentioned hole portion is meant the communicating pores that connects substrate.
Above-mentioned recess is meant the part more low-lying than substrate surface.
Among the present invention, above-mentioned hole portion and above-mentioned recess also can mix existence.
As the formation method of above-mentioned hole portion or recess, not special restriction can be selected according to purpose is suitable, for example can enumerate: through mechanical workouts such as lathes, utilize CO 2The processing of laser etc. etc.
<substrate matting >
The aforesaid substrate matting is the operation of after forming hole portion or recess on the substrate, cleaning this substrate.
As above-mentioned cleaning; As long as can clean the rubbish of wet goods processing aid and generation; Just not special restriction; Can select according to purpose is suitable, for example can enumerate: in scavenging solution the method for dipping substrate, on substrate spray Cleaning for High Capacity liquid method, use the directly method etc. of wiping such as hyperacoustic method, brush.
< film and form engineering >
Above-mentioned filming forms operation for after covering the hole portion or recess of above-mentioned substrate formation with the mask that is arranged at the silk screen version, and silk screen printing contains the coating fluid of the dimethyl silicone polymer composition containing that comprises YSR 3286 at least and forms the operation of filming.
" coating fluid "
Above-mentioned coating fluid contains the dimethyl silicone polymer composition containing that comprises YSR 3286 at least, also contains other composition as required and forms.
-dimethyl silicone polymer composition containing-
As above-mentioned dimethyl silicone polymer composition containing, can use with above-mentioned burner membrane and burn the same compsn of film forming method of manufacture.
-other composition-
As above-mentioned other composition, for example can enumerate: thermal polymerization, solvent, inorganic particulate, particle dispersion agent etc.
As above-mentioned thermal polymerization, with above-mentioned burner membrane and to burn film forming method of manufacture identical.
Also have, also can comprise above-mentioned solvent, but when not comprising above-mentioned solvent, can omit the drying after the coating, so preferably.
The viscosity of above-mentioned coating fluid and above-mentioned burner membrane and to burn film forming method of manufacture identical.
" silk screen printing "
As above-mentioned silk screen printing, with above-mentioned burner membrane and to burn film forming method of manufacture identical.
Above-mentioned silk screen version is provided with the hole portion of covered substrate or the mask of recess.And above-mentioned silk screen printing can be carried out after covering above-mentioned hole portion or recess with the mask that is arranged at the silk screen version.
The surface-area A of above-mentioned hole portion or recess and the surface-area B of the mask that is arranged at the silk screen version that covers above-mentioned hole portion or recess preferably satisfy following formula: B/A >=0.9~1.1; Coating fluid is attached on the wall of hole portion the time; In order to prevent easily during using delivery vehicles because B/A >=1~1.05 is more preferably satisfied in abrasion and peel off generation rubbish.
Through the mean thickness of filming that above-mentioned silk screen printing forms, for example can adjust through changing the silk screen version and the distance of substrate, the angle of squeegee etc.
" filming "
Among the present invention, after covering above-mentioned hole portion or recess with the mask that is arranged at the silk screen version, silk screen printing contains the coating fluid of the dimethyl silicone polymer composition containing that comprises YSR 3286 at least and forms and film.
Above-mentioned mean thickness of filming and measuring method and above-mentioned burner membrane and to burn film forming method of manufacture identical.
< firing process >
As above-mentioned firing process and burn film forming mean thickness, with above-mentioned burner membrane and to burn film forming method of manufacture identical.
< purposes >
The delivery vehicles of the method for manufacture manufacturing through delivery vehicles of the present invention for example can be widely used in that the installation, the medicine that on flexible print circuit board (FPC), carry out electronic component clean, isochronous temporary transient fixing, the stationary platen that laser processing is used of plasma treatment, the stationary platen that mechanical workout is used etc.
Embodiment
Below, embodiments of the invention are described, but the present invention is not limited to these embodiment.
(embodiment A 1)
<burning film forming making >
The preparation of-coating fluid-
[composition of dimethyl silicone polymer composition containing]
Silicate compound (ethyl silicate 40, Tama Chemicals Co., Ltd.'s system) ... 1.5 mass parts
Terminal by silicate modified YSR 3286 (Arakawa Chemical Industries, Ltd.'s system, weight-average molecular weight about 30,000) ... 48.0 mass parts
The water that the dimethyl silicone polymer composition containing of above-mentioned composition is dripped necessary amount in hydrolyzing process and condensation operation mixes.Then, be cooled to room temperature through about 30 minutes while stirring, obtain coating fluid.
-silk screen printing-
Use the coating fluid of preparation, the silk screen printing condition through shown in following forms filming of mean thickness 130 μ m on the aluminium base of mean thickness 1.5mm.
[silk screen printing condition]
Use the stainless steel throwing half tone of the #100 μ m mesh of 3D processing.The size of the mesh part of silk screen printing is the square of width 100mm, length 100mm.Used printing press uses the LS-150TVA type of the accurate Industrial Co., Ltd of New Long system.The squeegee that uses is urethanes system, the cone angle of 60 ° on band in the bight.The distance of silk screen version and aluminium base is made as 4mm.
Squeegee pressure is that 0.2MPa, the amount of being pressed into are that 0.5mm, print speed are the scraper that 150mm/sec, scraper use band sword rubber.
-burn till-
The coated film that forms is put into firing furnace (Espec corporate system, constant temperature Clean bench PVH222), under 220 ℃, burnt till 4 hours.Thus, make the film that burns till of embodiment A 1.
Then, as follows, the viscosity of the coating fluid of mensuration embodiment A 1 and the mean thickness of filming.The result is shown in table 1.
In addition, as follows to the film of making in the embodiment A 1 that burns till, carry out bonding evaluation (1), and the bonding evaluation (2) of flexible print circuit board of surface smoothing property, flexible print circuit board.The result is shown in table 1.
< viscosity of coating fluid >
Use rich reining in to fly to simulate viscometer HB2 25 ℃ of viscosity of measuring coating fluid down.
< mean thickness of filming >
Use Mitutoyo corporate system digital display dial gauge (543 series) on the workplatform; Measure the central part of filming that coating forms and by this central part up and down obliquely apart from 9 thickness of locating of filming of 20mm; Utilize the arithmetic mean of these coating thicknesses, obtain the mean thickness of filming.
< surface smoothing property >
The film forming surface smoothing property of burning that visual observation is made is estimated with following benchmark.
[metewand]
◎: the surface is very level and smooth, does not recognize concavo-convex
Zero: can partly observe very weak concavo-convex from the teeth outwards
△: can be observed from the teeth outwards very weak concavo-convex, but still in usage range
*: can be observed strong concavo-convex from the teeth outwards
< the bonding evaluation (1) of flexible print circuit board >
The flexible print circuit board that the digital camera of the 4cm * 4cm that on polyimide film, forms is used is adhered to the film forming surface of burning of making; Stretch along parallel direction from the teeth outwards with the load of 100g, have or not departing from of generation flexible print circuit board and peel off with following benchmark evaluation.
[metewand]
Zero: do not produce departing from and peeling off of flexible print circuit board
*: produce departing from and peeling off of flexible print circuit board
< the bonding evaluation (2) of flexible print circuit board >
The digital camera same as described above of band parts such as transistor is paid behind the film forming surface of burning that makes with the flexible print circuit board subsides; Vertically erect, have or not because the departing from and peel off of the flexible print circuit board that the influence of the deadweight of flexible print circuit board causes with following benchmark evaluation.
[metewand]
Zero: do not produce departing from and peeling off of flexible print circuit board
*: produce departing from and peeling off of flexible print circuit board
(embodiment A 2~A6)
<burning film forming making >
In the embodiment A 1, change as follows " preparation of coating fluid " in addition, is likewise made the film that burns till of embodiment A 2~A6 with embodiment A 1.
The preparation of-coating fluid-
Through changing silicate compound and the terminal viscosity of being adjusted coating fluid by the time of the ratio of mixture of silicate modified YSR 3286, hydrolyzing process and condensation operation in the embodiment A 1.
Then, likewise measure viscosity and the mean thickness of filming of the coating fluid of embodiment A 2~A6 with embodiment A 1.The result is shown in table 1.
In addition, with embodiment A 1 bonding evaluation (1), and the bonding evaluation (2) of flexible print circuit board that film carries out surface smoothing property, flexible print circuit board of burning till likewise to making among embodiment A 2~A6.The result is shown in table 1.
(embodiment A 7)
-burn film forming making-
In the embodiment A 2, the aluminium base of the thickness 1.5mm in the silk screen printing is changed to the polyimide substrate of thickness 100 μ m, in addition, likewise make the film that burns till of embodiment A 7 with embodiment A 2.
In addition, likewise burn till bonding evaluation (1), and the bonding evaluation (2) of flexible print circuit board that film carries out surface smoothing property, flexible print circuit board with embodiment A 1 to what embodiment A 7 was made.The result is shown in table 1.
(embodiment A 8)
-burn film forming making-
In embodiment A 1; Use coating fluid; Said coating fluid is to add Titanium particles (Ishihara Sangyo Kaisha, Ltd.'s system, Tipaque CR-90) to make it be 10 quality % with respect to dimethyl silicone polymer composition containing, mixes obtaining while stirring; In addition, likewise make the film that burns till of embodiment A 8 with embodiment A 1.
In addition, likewise burn till bonding evaluation (1), and the bonding evaluation (2) of flexible print circuit board that film carries out surface smoothing property, flexible print circuit board with embodiment A 1 to what embodiment A 8 was made.The result is shown in table 1.
(Comparative examples A 1)
<burning film forming making >
In the embodiment A 2, change as follows " silk screen printing condition " in addition, is likewise made the film that burns till of Comparative examples A 1 with embodiment A 2.
-silk screen printing-
[silk screen printing condition]
The squeegee that uses is urethanes, 70 ° of cone angles of band in the bight.The distance of silk screen version and aluminium base is made as 4mm.
Then, likewise measure the mean thickness of filming of Comparative examples A 1 with embodiment A 1.The result is shown in table 1.
In addition, with embodiment A 1 bonding evaluation (1), and the bonding evaluation (2) of flexible print circuit board that film carries out surface smoothing property, flexible print circuit board of burning till likewise to making among the comparative example A1.The result is shown in table 1.
(Comparative examples A 2)
<burning film forming making >
In the embodiment A 2, change as follows " silk screen printing condition " in addition, is likewise made the film that burns till of Comparative examples A 2 with embodiment A 2.
-silk screen printing-
[silk screen printing condition]
The squeegee that uses is urethanes, 70 ° of cone angles of band in the bight.The distance of silk screen version and aluminium base is 2mm.
Then, likewise measure the mean thickness of filming of Comparative examples A 2 with embodiment A 1.The result is shown in table 1.
In addition, with embodiment A 1 bonding evaluation (1), and the bonding evaluation (2) of flexible print circuit board that film carries out surface smoothing property, flexible print circuit board of burning till likewise to making among the comparative example A2.The result is shown in table 1.
(Comparative examples A 3~A4)
<burning film forming making >
In the embodiment A 1, change as follows " preparation of coating fluid " in addition, is likewise made the film that burns till of Comparative examples A 3~A4 with embodiment A 1.
The preparation of-coating fluid-
Through silicate compound and the terminal viscosity of recently being adjusted coating fluid by the mixing of silicate modified YSR 3286 that changes embodiment A 1.
Then, likewise measure viscosity and the mean thickness of filming of the coating fluid of Comparative examples A 3~A4 with embodiment A 1.The result is shown in table 1.
In addition, with embodiment A 1 bonding evaluation (1), and the bonding evaluation (2) of flexible print circuit board that film carries out surface smoothing property, flexible print circuit board of burning till likewise to making among comparative example A3~A4.The result is as shown in table 1.
[table 1-1]
Figure BSA00000588068200191
[table 1-2]
Figure BSA00000588068200192
Result by table 1 can know; When Comparative Examples A 1~A8 and Comparative examples A 1~A4; Contain the dimethyl silicone polymer composition containing that comprises YSR 3286 at least and be that the coating fluid of 10Pas~200Pas forms filming more than the mean thickness 100 μ m in silk screen printing on the substrate in the viscosity under 25 ℃; Film through burning till this; Can make the leveling characteristics that keeps good, simultaneously, in the time of can preventing silk screen printing film ooze out or sagging, and sagging etc. and the thickness homogeneous of dry and filming when burning till and surface smoothing property good burn till film.
Through the film forming method of manufacture manufacturing of burning of the present invention to burn till the leveling characteristics of film after coating excellent and be difficult for producing oozing out of filming or sagging; And high in sagging etc. and the thickness homogeneous and the dimensional precision of dry and filming when burning till, therefore, can be used as conductive film, insulating film, and adhesive film in any be used for various uses; For example; Can be widely used in delivery vehicles such as FPC substrate, the stationary platen that laser processing is used, the stationary platen that mechanical workout is used etc.
(Embodiment B 1)
< making of delivery vehicles >
The preparation of-coating fluid-
[composition of dimethyl silicone polymer composition containing]
Silicate compound (ethyl silicate 40, Tama Chemicals Co., Ltd.'s system) ... 1.5 mass parts
Terminal by silicate modified YSR 3286 (Arakawa Chemical Industries, Ltd.'s system, weight-average molecular weight about 30,000) ... 48.0 mass parts
The water that the dimethyl silicone polymer composition containing of above-mentioned composition is dripped necessary amount in hydrolyzing process and condensation operation mixes.Then, be cooled to room temperature through about 30 minutes while stirring and obtain coating fluid.
The processing of-aluminium base-
Preparation is at width 110mm, and length 110mm at random is provided with the aluminium base of communicating pores of the toroidal of the 5 diameter 5mm of place on the aluminium base of thickness 1.5mm.
-silk screen printing-
Use the coating fluid of Embodiment B 1,, form filming of mean thickness 120 μ m on the aluminium base of communicating pores being provided with through the silk screen printing condition shown in following.
[silk screen printing condition]
Use the stainless steel throwing half tone of the #100 μ m mesh of 3D processing.The size of the mesh part of silk screen printing is the square of width 100mm, length 100mm.
With in the formation of aluminium base the part of communicating pores be not coated with the mode of coating fluid, on the silk screen version, being arranged on planeform corresponding to the identical diameter 5mm in the position of the communicating pores of substrate is the mask of toroidal.
In this Embodiment B 1, the surface-area A of hole portion is 19.625/19.625=1 with the area of the surface-area B of the mask of this hole portion of covering than (B/A).
The printing press that uses uses the LS-150TVA type of the accurate Industrial Co., Ltd of New Long system.The squeegee that uses is urethanes, 60 ° of cone angles of band in the bight.The distance of silk screen version and aluminium base is made as 4mm.
Squeegee pressure is that 0.2MPa, the amount of being pressed into are that 0.5mm, print speed are 150mm/sec, the scraper of sword rubber is with in use as scraper.
-burn till-
The coated film that forms is put into firing furnace (Espec corporate system, constant temperature clean bench PVH222), under 220 ℃, burnt till 4 hours.Thus, make the delivery vehicles of Embodiment B 1.
(Embodiment B 2)
The making of-delivery vehicles-
In the Embodiment B 1, be that the diameter of the mask of toroidal is made as 5.2mm, in addition, likewise make the delivery vehicles of Embodiment B 2 with Embodiment B 1 with the planeform of the communicating pores of the toroidal of covering diameter 5mm.
In this Embodiment B 2, the surface-area A of hole portion is 21.2264/19.625=1.08 with the area of the surface-area B of the mask of this hole portion of covering than (B/A).
(Embodiment B 3)
The making of-delivery vehicles-
In the Embodiment B 1, be that the diameter of the mask of toroidal is made as 5.1mm, in addition, likewise make the delivery vehicles of Embodiment B 3 with Embodiment B 1 with the planeform of the communicating pores of the toroidal of covering diameter 5mm.
In this Embodiment B 3, the surface-area A of hole portion is 20.41785/19.625=1.04 with the area of the surface-area B of the mask of this hole portion of covering than (B/A).
(Embodiment B 4)
The making of-delivery vehicles-
In the Embodiment B 1, be that the diameter of the mask of toroidal is made as 4.8mm, in addition, likewise make the delivery vehicles of Embodiment B 4 with Embodiment B 1 with the planeform of the communicating pores of the toroidal of covering diameter 5mm.
In this Embodiment B 4, the surface-area A of hole portion is 18.0864/19.625=0.92 with the area of the surface-area B of the mask of this hole portion of covering than (B/A).
(Embodiment B 5)
The making of-delivery vehicles-
In the Embodiment B 1, carry out spot-facing through recess and be processed in that to form planeform on the aluminium base be the communicating pores of toroidal, in addition, likewise make the delivery vehicles of Embodiment B 5 with Embodiment B 1 to the toroidal of degree of depth 0.5mm, diameter 5mm.
In this Embodiment B 5, the surface-area A of recess is 19.625/19.625=1 with the area of the surface-area B of the mask that covers this recess than (B/A).
(Embodiment B 6)
The making of-delivery vehicles-
In the Embodiment B 1; The length that one side, 5 places at random is set on aluminium base is that the planeform of 5mm is foursquare communicating pores; One edge lengths of the foursquare mask that covers this foursquare communicating pores is made as 5mm, in addition, likewise makes the delivery vehicles of Embodiment B 6 with Embodiment B 1.
In this Embodiment B 6, the surface-area A of hole portion is 25/25=1 with the area of the surface-area B of the mask of this hole portion of covering than (B/A)
(comparative example B1)
The making of-delivery vehicles-
In the Embodiment B 1, use the aluminium base that communicating pores is not set, use not have the silk screen version of mask; After carrying out silk screen printing; The planeform that 5 place's diameters at random are set are 5mm is the communicating pores of toroidal, in addition, likewise makes the delivery vehicles of comparative example B1 with Embodiment B 1.
< visual valuation of hole portion or recess and result >
The hole portion of the delivery vehicles of visual observation Embodiment B 1~B6 and comparative example B1 or recess and periphery thereof.Be shown in these results following in the lump.
As far as Embodiment B 1~B3, the big problem that does not have the coating layer of hole portion to overflow does not produce rubbish yet.In addition, even the repeated use under the installation exercise of FPC group is also no problem.But known, if relatively accurate, known to Embodiment B 1, the departing from of aligned position adjustment during silk screen printing causes having some overflowing, and more preferably the surface area ratio of hole portion covers the little Embodiment B 2 and the Embodiment B 3 of surface-area of the mask of this hole portion.
As far as Embodiment B 4, observe coating layer slightly and overflow to the inboard of hole portion, because the repeated use under the installation exercise of FPC group, so produce some peeling off.
As far as Embodiment B 5, the big problem that does not have the coating layer of recess to overflow does not produce rubbish yet.Even it is also no problem under the installation exercise of FPC group, to reuse.
In addition, shown in embodiment B6, even the planeform of hole portion is a square, the big problem that does not yet have the coating layer of hole portion to overflow does not produce rubbish yet.
Relative therewith, as far as comparative example B1, do not observe to the overflowing of the inboard of hole portion, but spread all over hole portion around produce the small gauffer of the stress influence when being considered to hole portion and forming, can observe weak concavo-convex.In the installation exercise of FPC group, produce floating of the FPC that is considered to concavo-convex cause.In addition, the rubbish that adds man-hour is attached on the coating layer.
The delivery vehicles of the method for manufacture manufacturing through delivery vehicles of the present invention for example can be widely used in that the installation, the medicine that on flexible print circuit board (FPC), carry out electronic component clean, isochronous temporary transient fixing, the stationary platen that laser processing is used of plasma treatment, the stationary platen that mechanical workout is used etc.

Claims (14)

1. one kind is burnt film forming method of manufacture, it is characterized in that, comprises:
The formation operation of filming, it contains the dimethyl silicone polymer composition containing and the viscosity under 25 ℃ that comprise YSR 3286 at least in silk screen printing on the substrate is the coating fluid of 10Pas~200Pas, forms above the filming of mean thickness 100 μ m; With
Firing process, it burns till said filming.
2. the film forming method of manufacture of burning according to claim 1, wherein,
The mean thickness of filming is below the above 150 μ m of 100 μ m.
3. the film forming method of manufacture of burning according to claim 1, wherein,
The viscosity D of coating fluid under 25 ℃ and the mean thickness T that films satisfy following formula: 1≤T/D≤20.
4. the film forming method of manufacture of burning according to claim 1, wherein,
Coating fluid contains inorganic particulate.
5. the film forming method of manufacture of burning according to claim 1, wherein,
Substrate is an aluminium base.
6. the film forming method of manufacture of burning according to claim 1, wherein,
Substrate is a heat-resistant resin film.
7. one kind is burnt till film, it is characterized in that,
The said film that burns till is to make through the film forming method of manufacture of following burning, and the film forming method of manufacture of said burning comprises:
The formation operation of filming, it contains the dimethyl silicone polymer composition containing and the viscosity under 25 ℃ that comprise YSR 3286 at least in silk screen printing on the substrate is the coating fluid of 10Pas~200Pas, thereby forms above the filming of mean thickness 100 μ m; With
Firing process, it burns till said filming.
8. the film that burns till according to claim 7, wherein,
Burn till film and be in conductive film, insulating film and the adhesive film any.
9. the method for manufacture of a delivery vehicles is characterized in that, comprises:
Hole portion or recess form operation, and its at least a portion at substrate forms hole portion or recess;
The formation operation of filming, it is after covering said hole portion or recess with the mask that is arranged at the silk screen version, and silk screen printing contains the coating fluid of the dimethyl silicone polymer composition containing that comprises YSR 3286 at least, films thereby form; With
Firing process, it burns till said filming.
10. the method for manufacture of delivery vehicles according to claim 9, wherein,
The surface-area A of hole portion or recess and the surface-area B of the mask that is arranged at the silk screen version of this hole portion of covering or recess satisfy following formula: B/A >=0.9~1.1.
11. the method for manufacture of delivery vehicles according to claim 10, wherein,
The surface-area A of hole portion or recess and the surface-area B of the mask that is arranged at the silk screen version of this hole portion of covering or recess satisfy following formula: B/A >=1~1.05.
12. the method for manufacture of delivery vehicles according to claim 9, wherein,
The planeform of hole portion or recess is any in toroidal and the square shape.
13. the method for manufacture of delivery vehicles according to claim 9 wherein, comprises:
After forming hole portion or recess on the substrate, the substrate matting of cleaning this substrate.
14. a delivery vehicles is characterized in that,
Said delivery vehicles is to make through the method for manufacture of following delivery vehicles, and the method for manufacture of said delivery vehicles comprises:
Hole portion or recess form operation, and its at least a portion at substrate forms hole portion or recess;
The formation operation of filming, it is after covering said hole portion or recess with the mask that is arranged at the silk screen version, and silk screen printing contains the coating fluid of the dimethyl silicone polymer composition containing that comprises YSR 3286 at least, films thereby form; With
Firing process, it burns till said filming.
CN2011103038505A 2010-09-30 2011-09-28 Baked Film And Method For Producing The Same, Conveyance Carrier And Method For Producing The Same Pending CN102532995A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108007480A (en) * 2017-11-24 2018-05-08 苏州大学 The preparation method of flexible sensor
CN112469493A (en) * 2018-06-08 2021-03-09 大尼克株式会社 Liquid moisture absorbent
CN116056805A (en) * 2020-08-21 2023-05-02 Agc株式会社 Substrate with coating film, method for forming coating film, and method for producing substrate with coating film

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108007480A (en) * 2017-11-24 2018-05-08 苏州大学 The preparation method of flexible sensor
CN112469493A (en) * 2018-06-08 2021-03-09 大尼克株式会社 Liquid moisture absorbent
TWI810310B (en) * 2018-06-08 2023-08-01 日商達尼庫股份有限公司 Liquid hygroscopic agent and method for manufacturing electronic device
CN112469493B (en) * 2018-06-08 2023-12-19 大尼克株式会社 liquid moisture absorbent
CN116056805A (en) * 2020-08-21 2023-05-02 Agc株式会社 Substrate with coating film, method for forming coating film, and method for producing substrate with coating film
CN116056805B (en) * 2020-08-21 2024-05-10 Agc株式会社 Substrate with coating film, method for forming coating film, and method for producing substrate with coating film

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