CN102532918A - Notebook computer CPU (Central Processing Unit) connector switch device material and manufacturing method thereof - Google Patents
Notebook computer CPU (Central Processing Unit) connector switch device material and manufacturing method thereof Download PDFInfo
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- CN102532918A CN102532918A CN2010105767168A CN201010576716A CN102532918A CN 102532918 A CN102532918 A CN 102532918A CN 2010105767168 A CN2010105767168 A CN 2010105767168A CN 201010576716 A CN201010576716 A CN 201010576716A CN 102532918 A CN102532918 A CN 102532918A
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- switching arrangement
- injection
- switch device
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Abstract
The invention discloses a notebook computer CPU (Central Processing Unit) connector switch device material and a manufacturing method thereof. The manufacturing method comprises the steps of: heating an adhesive and stainless steel micro powder to 130-150 DEG C, and uniformity mixing for 2 hours to form an injection feeding material; adding the injection feeding material to an injection molding machine, and injection-molding in a mold at 120-140 DEG C to obtain a green compact; placing the green compact in a solvent to remove 45-55% of adhesive, then placing in a vacuum sintering furnace, and sintering at 1300-1340 DEG C for densification until the density reaches more than 7.65 g/cm<3>; placing the stainless steel switch device in a heating furnace, and carrying out aging treatment at 440-480 DEG C for 2-4 hours; and then carrying out salt bath nitriding treatment. The switch device designed by the invention has high yield and high hardness, and well satisfies the requirements of high strength and high wearing resistance of a new-generation switch device; and after the adhesive is adjusted, the molding percent of pass is greatly increased.
Description
Technical field
The present invention relates to a kind of cpu connector switching arrangement material, be specially a kind of notebook computer cpu connector switching arrangement material, and the preparation method of this switching arrangement.
Background technology
Along with the fast development of IT technology, people have got used to the computer that uses arithmetic speed more and more faster, get used to that the computer picture is more and more smooth, image quality is clear.And these development all be unable to do without the upgrading of the heart CPU of computer, also be unable to do without the upgrading with the junctor of CPU coupling.
Notebook computer cpu chip i3 of new generation, i5, i7 that Intel releases must be increased to 989 pin connecting terminals with the cpu connector that matees by 479 pin connecting terminals.This has all brought new requirement and challenge to the manufacturing of cpu connector of new generation and the manufacturing of connector switch device.
Than for the 479 pin connecting terminals, the number of contact has increased more than one times for cpu connector 989 pin connecting terminal switching arrangements, and the overall friction that when switch, need bear has also just increased more than one times.Simultaneously, all towards lighting and ultrathin development, this just requires 989 pin cpu connectors to have thinner thickness to the notebook of a new generation, when this just requires switching arrangement thickness attenuation of new generation, has higher intensity and wear resistance.
The switching arrangement of 479 pin cpu connectors can not satisfy the requirement of 989 pin cpu connectors, and at first thickness reduces by 10%, and the friction of bearing double above, thereby require the intensity of switching arrangement to increase more than 1 times, wear resistance increases more than 1 times.That is to say under switching arrangement diminishes the situation of attenuation, also need possess higher performance requriements.Clearly, original switching arrangement working method can not satisfy the requirement of 989 pin cpu connectors.
Summary of the invention
The objective of the invention is for a kind of notebook computer cpu connector switching arrangement material is provided, to solve the problems referred to above of prior art.
Another object of the present invention is for this switching arrangement preparation methods is provided.
The object of the invention can be realized through following technical scheme.
A kind of novel binders, by weight percentage, component and content are:
58 ° of Microcrystalline Wax 40-60%
Sunflower seed oil 10-20%
Ethane-acetic acid ethyenyl resin copolymer 15-30%
Vestolen PP 7052 10-25%
Stearylamide 1-5%.
The preparation method of this novel binders, concrete steps are following:
1) earlier various constituent elements is ready to according to the mass percent weighing;
2) in being heated to 150-180 ℃ kneader, Microcrystalline Wax is melted, add sunflower seed oil and mediate, mediate after 10-15 minute; Add Vestolen PP 7052 and ethene-vinyl acetate copolymer; By the time initiate constituent element was mediated 20-30 minute after melting fully again, added stearylamide at last; After melting fully, mediate and got final product in 3-5 minute.
Described sunflower seed oil is selected from many power board 5L sunflower seed oil.
A kind of notebook computer cpu connector switching arrangement preparation methods, its concrete steps are following: 1) above-mentioned caking agent is heated to 130-150 ℃ with stainless steel micron powder, mixed 2 hours, evenly the back forms the injection feeding;
2) will inject feeding and join the inherent 120-140 ℃ of injection molding green compact in mould of injection moulding machine;
3) green compact are put into the caking agent that solvent is deviate from 45%-55%, put into vacuum sintering furnace again, reach the above density of 7.65 gram/cubic centimetres in 1300-1340 ℃ of sintering densification;
4) again step 3) gained stainless steel switching arrangement is put into process furnace, under 440-480 ℃ of temperature, carried out ageing treatment 2-4 hour;
5) after the cooling, carry out salt Bath Nitriding Treatment again, promptly obtain the stainless steel switching arrangement that surface hardness improves greatly.
Described salt Bath Nitriding Treatment method, concrete steps are: 1) cleaning die, preheating 20-30 minute, temperature was controlled at 300-400 ℃; 2) after preheating is accomplished, charging basket is hung in the nitriding furnace together with mould, before this, salt bath should fully melt and stir in the nitriding furnace, and salt temperature is controlled at 570-580 ℃; 3) after mould was put into, feeding air flow in the nitrogenize salt bath was the air of 6-12L/min; 4) holding temperature of mould is between 500-560 ℃, 3-4 hour; 5) after nitrogenize is accomplished mould hung out and put into dark reason stove and handle, salt temperature is controlled at 320-340 ℃ in the reason stove of depths, and the mould treatment time was controlled at 3-10 minute; 6) mould is hung depths reason stove and hangs in the tank clean.
Described salt bath comprises basic salt, adjustment salt and saline oxide, all can commercially buy.
Because die temperature is higher, after mould got into depths reason stove, salt temperature can be elevated to more than 400 ℃, and can produce a large amount of bubbles this moment, notes preventing that the salt bath foam from overflowing.
Through the cpu connector of new generation 989 pin connecting terminal switching arrangements that the present invention designs, comprehensive finished product rate is high, reaches more than 98%, and hardness is up to more than the HV1000.Well satisfied the HS of switching arrangement of new generation, the requirement of high-wearing feature, and behind the adjustment caking agent, the qualification rate of moulding increases substantially.
Embodiment
Further set forth technical characterstic of the present invention below in conjunction with specific embodiment.
1, preparation novel binders
Earlier various constituent elements are ready to according to the weighing of following table mass percent; In being heated to 150-180 ℃ kneader, Microcrystalline Wax is melted, add sunflower seed oil and mediate, mediate after 10-15 minute; Add Vestolen PP 7052 and ethene-vinyl acetate copolymer; By the time initiate constituent element was mediated 20-30 minute after melting fully again, added stearylamide at last; After melting fully, mediate and got final product in 3-5 minute.
Table 1: the prescription of novel binders embodiment 1-7
2, the preparation of notebook computer cpu connector switching arrangement material
Embodiment 8
1) the M1 caking agent is heated to 130 ℃ with stainless steel micron powder, mixed 2 hours, evenly the back forms the injection feeding; 2) will inject feeding and join the inherent 120 ℃ of injection molding green compact in mould of injection moulding machine; 3) green compact are put into solvent and deviate from 45% caking agent, put into vacuum sintering furnace again, reach the above density of 7.65 gram/cubic centimetres in 1300 ℃ of sintering densifications; 4) again step 3) gained stainless steel switching arrangement is put into process furnace, under 440 ℃ of temperature, carried out ageing treatment 2 hours; 5) after the cooling, carry out salt Bath Nitriding Treatment, promptly obtain the stainless steel switching arrangement that surface hardness improves greatly at 500 ℃.
Embodiment 9
1) the M3 caking agent is heated to 150 ℃ with stainless steel micron powder, mixed 2 hours, evenly the back forms the injection feeding; 2) will inject feeding and join the inherent 140 ℃ of injection molding green compact in mould of injection moulding machine; 3) green compact are put into solvent and deviate from 55% caking agent, put into vacuum sintering furnace again, reach the above density of 7.65 gram/cubic centimetres in 1340 ° of sintering densifications; 4) again step 3) gained stainless steel switching arrangement is put into process furnace, under 480 ℃ of temperature, carried out ageing treatment 4 hours; 5) after the cooling, carry out salt Bath Nitriding Treatment, promptly obtain the stainless steel switching arrangement that surface hardness improves greatly at 560 ℃.
Embodiment 10
1) the M5 caking agent is heated to 140 ℃ with stainless steel micron powder, mixed 2 hours, evenly the back forms the injection feeding; 2) will inject feeding and join the inherent 130 ℃ of injection molding green compact in mould of injection moulding machine; 3) green compact are put into solvent and deviate from 55% caking agent, put into vacuum sintering furnace again, reach the above density of 7.65 gram/cubic centimetres in 1320 ° of sintering densifications; 4) again step 3) gained stainless steel switching arrangement is put into process furnace, under 480 ℃ of temperature, carried out ageing treatment 3 hours; 5) after the cooling, carry out salt Bath Nitriding Treatment, promptly obtain the stainless steel switching arrangement that surface hardness improves greatly at 540 ℃.
Embodiment 11
1) the M7 caking agent is heated to 145 ℃ with stainless steel micron powder, mixed 2 hours, evenly the back forms the injection feeding; 2) will inject feeding and join the inherent 135 ℃ of injection molding green compact in mould of injection moulding machine; 3) green compact are put into solvent and deviate from 50% caking agent, put into vacuum sintering furnace again, reach the above density of 7.65 gram/cubic centimetres in 1330 ° of sintering densifications; 4) again step 3) gained stainless steel switching arrangement is put into process furnace, under 460 ℃ of temperature, carried out ageing treatment 2.5 hours; 5) after the cooling, carry out salt Bath Nitriding Treatment, promptly obtain the stainless steel switching arrangement that surface hardness improves greatly at 530 ℃.
Stainless steel micron and powder feed with this prescription caking agent configuration under same 120-140 ℃ injection temperature, have better flowability, also enough follow-up switching arrangement green compact carry out after the cooling carrying and processing.Prescription with original is compared, and the yield rate of injection stage brings up to 99% by 90%.The efficient of the injection that improves has greatly reduced production cost.
Through such processing, the switching arrangement that novel method is produced, comprehensive finished product rate is high, reaches more than 98%, and hardness is up to more than the HV1000.And the caking agent work in-process of original method is because the thin influence of the wall of part, and integrated yield has only 85%, and hardness HV also has only about 300.Thereby novel method has well satisfied the HS of switching arrangement of new generation, the requirement of high-wearing feature, and behind the adjustment caking agent, the qualification rate of moulding increases substantially, and has satisfied the requirement of cpu connector 989 pin connecting terminal switching arrangements of new generation fully.
Claims (4)
1. novel binders, it is characterized in that: by weight percentage, component and content are:
58 ° of Microcrystalline Wax 40-60%
Sunflower seed oil 10-20%
Ethane-acetic acid ethyenyl resin copolymer 15-30%
Vestolen PP 7052 10-25%
Stearylamide 1-5%.
2. the preparation method of novel binders according to claim 1, it is characterized in that: concrete steps are following:
1) earlier various constituent elements is ready to according to the mass percent weighing;
2) in being heated to 150-180 ° kneader, Microcrystalline Wax is melted, add sunflower seed oil and mediate, mediate after 10-15 minute; Add Vestolen PP 7052 and ethene-vinyl acetate copolymer; By the time initiate constituent element was mediated 20-30 minute after melting fully again, added stearylamide at last; After melting fully, mediate and got final product in 3-5 minute.
3. notebook computer cpu connector switching arrangement preparation methods of using the said sticker of claim 1, it is characterized in that: its concrete steps are following:
1) above-mentioned caking agent is heated to 130-150 ℃ with stainless steel micron powder, mixed 2 hours, evenly the back forms the injection feeding;
2) will inject feeding and join the inherent 120-140 ℃ of injection molding green compact in mould of injection moulding machine;
3) green compact are put into the caking agent that solvent is deviate from 45%-55%, put into vacuum sintering furnace again, reach the above density of 7.65 gram/cubic centimetres in 1300-1340 ° of sintering densification;
4) again step 3) gained stainless steel switching arrangement is put into process furnace, under 440-480 ℃ of temperature, carried out ageing treatment 2-4 hour;
5) after the cooling, carry out salt Bath Nitriding Treatment again, promptly obtain the stainless steel switching arrangement that surface hardness improves greatly.
4. notebook computer cpu connector switching arrangement preparation methods according to claim 3 is characterized in that: described salt Bath Nitriding Treatment, and concrete steps are: 1) cleaning die, preheating 20-30 minute, temperature was controlled at 300-400 ℃; 2) after preheating is accomplished, charging basket is hung in the nitriding furnace together with mould, before this, salt bath should fully melt and stir in the nitriding furnace, and salt temperature is controlled at 570-580 ℃; 3) after mould was put into, feeding air flow in the nitrogenize salt bath was the air of 6-12L/min; 4) holding temperature of mould is between 500-560 ℃, 3-4 hour; 5) after nitrogenize is accomplished mould hung out and put into dark reason stove and handle, salt temperature is controlled at 320-340 ℃ in the reason stove of depths, and the mould treatment time was controlled at 3-10 minute; 6) mould is hung depths reason stove and hangs in the tank clean.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105767168A CN102532918A (en) | 2010-12-07 | 2010-12-07 | Notebook computer CPU (Central Processing Unit) connector switch device material and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105767168A CN102532918A (en) | 2010-12-07 | 2010-12-07 | Notebook computer CPU (Central Processing Unit) connector switch device material and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1685025A (en) * | 2002-07-30 | 2005-10-19 | 威廉·C·斯顿普豪泽 | Hybrid plastisol/hot melt compositions |
| CN1955243A (en) * | 2005-10-26 | 2007-05-02 | 诚泰工业科技股份有限公司 | Reaction polyolefin type hot melt-adhesive |
| CN101134242A (en) * | 2007-10-17 | 2008-03-05 | 中南大学 | Method of producing hard alloy rotatable special-shaped blade |
| CN101871088A (en) * | 2009-04-21 | 2010-10-27 | 上海江凯金属表面处理技术有限公司 | Salt bath formula for treating stainless air conditioning compressor blade by salt bath nitriding treatment and treatment method |
-
2010
- 2010-12-07 CN CN2010105767168A patent/CN102532918A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1685025A (en) * | 2002-07-30 | 2005-10-19 | 威廉·C·斯顿普豪泽 | Hybrid plastisol/hot melt compositions |
| CN1955243A (en) * | 2005-10-26 | 2007-05-02 | 诚泰工业科技股份有限公司 | Reaction polyolefin type hot melt-adhesive |
| CN101134242A (en) * | 2007-10-17 | 2008-03-05 | 中南大学 | Method of producing hard alloy rotatable special-shaped blade |
| CN101871088A (en) * | 2009-04-21 | 2010-10-27 | 上海江凯金属表面处理技术有限公司 | Salt bath formula for treating stainless air conditioning compressor blade by salt bath nitriding treatment and treatment method |
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Application publication date: 20120704 |