CN102523690B - Manufacturing method of PCB board with blind slot containing IC foot - Google Patents
Manufacturing method of PCB board with blind slot containing IC foot Download PDFInfo
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- CN102523690B CN102523690B CN201110442661.6A CN201110442661A CN102523690B CN 102523690 B CN102523690 B CN 102523690B CN 201110442661 A CN201110442661 A CN 201110442661A CN 102523690 B CN102523690 B CN 102523690B
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Abstract
The invention discloses a manufacturing method of a PCB board with a blind slot containing an IC foot. A blind slot is opened on a PCB second core plate and a window is arranged on a prepreg, wherein the position and the size of the window corresponds to the position and the size of the blind slot; a PCB first core plate, the PCB second core plate and the prepreg are localized by tack holes and rivet holes; and a riveter is used to fix the PCB first core plate, the PCB second core plate and the prepreg by rivets as well as stitching is carried out. Compared with the prior art, the technology employed in the invention enables the method to have the following beneficial effects: a problem of inaccurate localization that occurs during manufacturing of an IC foot in a blind slot of a PCB board and is caused by movement between the prepreg and the core plate or the core plates when manual rivet is carried out can be solved; therefore, deviation of the IC foot in the blind slot of the PCB board can be avoided; and product qualities can be enhanced.
Description
Technical field
The present invention relates to PCB manufacture technology field, what be specifically related to is the pcb board manufacture method that a kind of blind slot contains IC pin.
Background technology
Along with the universal and extensive use of electronic product, the production of pcb board and manufacturing technology are also constantly updated and are developed.For adapting to produce the demand of different electronic products, the pcb board of designed manufacture develops into doubling plate or multi-layer sheet by lamina.And in PCB manufacture process, need through hole to realize the connection between each internal layer circuit, through hole is processed to form by rig conventionally, its requirement on machining accuracy is higher, and also need through processing such as heavy copper, plating after being drilled to through hole, in through hole, form conductive layer, thereby realize the connection between each internal layer circuit.
For multi-layer sheet, weld onboard different IC chips, achieving different functions is the common application mode of current electronic product, but in some electronic products because the aesthetics to PCB surface is had relatively high expectations, and IC chips welding is onboard, can produce relief, affect the attractive in appearance of whole product, therefore need to offer in the circuit board blind slot, whole IC chip is placed in to blind slot, avoid it to expose, affect the attractive in appearance of product.
But in the time that the multiple-plate pressing of reality is made, owing to being subject to prepreg and central layer, and the factor impact such as positional accuracy between multi-layer sheet, what IC chip was corresponding with wiring board in blind slot needs welding position, has deviation, i.e. symmetrical IC pin off normal in blind slot, will cause like this IC chips welding bad, or in the time carrying out wave-soldering, easily there is the problem of failure welding or rosin joint, affect the quality of product.
Summary of the invention
For this reason, the object of the present invention is to provide a kind of blind slot to contain the pcb board manufacture method of IC pin, when solving in current pcb board blind slot that IC pin is made, the IC pin off normal problem easily occurring.
For achieving the above object, the present invention is mainly by the following technical solutions:
Blind slot contains a pcb board manufacture method for IC pin, comprising:
PCB the first central layer, PCB the second central layer and train wheel bridge, lower plate are carried out to sawing sheet processing, make PCB the first central layer, PCB the second central layer and train wheel bridge, lower plate be of a size of 285mm*225mm;
To the processing of holing of train wheel bridge, lower plate, PCB the first central layer, PCB the second central layer, aperture of each brill, a corner location place corresponding on train wheel bridge, lower plate, PCB the first central layer, PCB the second central layer is 2.5mm Ping nail hole, and a rivet hole that aperture is 3.2mm is respectively bored at other three corner location places;
Drilling blind hole processing on PCB the first central layer, PCB the second central layer forms the blind hole that aperture is 1.0mm on PCB the first central layer, forms the blind hole that aperture is 0.6mm on PCB the second central layer;
PCB the first central layer is sunk to copper, panel plating processing, IC graphic making, PCB the second central layer is sunk to copper, panel plating processing, graphic making, and mill out the blind slot of a 40mm*30mm on PCB the second central layer, and make this blind slot penetrate whole PCB the second central layer;
Choose the prepreg that is of a size of 285mm*225mm, and open with above-mentioned blind slot correspondence position the window that a size is 40.3mm*30.3mm on this prepreg, and boring an aperture at the corner location place of this prepreg is 2.5mm Ping nail hole, a rivet hole that aperture is 3.2mm of the each brill in other three corner location places;
The first central layer and the second central layer are carried out to brown processing, again PCB the first central layer is placed on lower plate, and make the first core layer corner Ping nail hole and the corresponding coincidence in hole site of lower plate Shang Ping nail, then prepreg is covered on PCB the first central layer, make prepreg Shang Ping nail hole and PCB the first central layer Shang Ping nail corresponding coincidence in hole site, afterwards PCB the second central layer is placed on prepreg, make equally PCB the second central layer Shang Ping nail hole and the corresponding coincidence in hole of prepreg Shang Ping nail, and make blind slot on PCB the second central layer and the corresponding coincidence of window on prepreg, finally train wheel bridge is placed on PCB the second central layer, make PCB the second central layer Shang Ping nail hole and the corresponding coincidence in hole of train wheel bridge Shang Ping nail,
By train wheel bridge, lower plate, Ping nail, above-mentioned PCB the first core layer, prepreg, PCB the second central layer are carried out to riveter nail afterwards, take down train wheel bridge, lower plate Ji Ping nail, carry out again pressing and make pcb board, afterwards to this pcb board hole, operation is made after heavy copper, plate electricity, outer-layer circuit.
Wherein said PCB the first central layer is made up of pcb board L1 layer and pcb board L2 layer, and PCB the second central layer is made up of pcb board L3 layer and pcb board L4 layer.
Wherein the PCB of wanted pressing the first central layer, PCB the second central layer are folded in advance, and carried out upper Ping nail, and the pcb board after upper Ping nail is put on lower plate, then cover train wheel bridge and carry out riveter nail, beat after rivet, Qu Chu Ping nail, train wheel bridge, lower plate, then carry out pressing.
The rivet hole position of wherein said train wheel bridge, lower plate is also milled with the rectangle of 50mm*30mm, carries out riveter nail while being convenient to pressing.
Wherein said prepreg is the prepreg that do not flow.
The present invention offers blind slot on PCB the second central layer, the window corresponding with this blind slot position is set on prepreg, the size of window increases 0.3mm on the basis of blind slot size, then PCB the first central layer, PCB the second central layer and prepreg Tong Guo Ping nail hole, rivet hole are positioned, finally by rivet driver, above-mentioned PCB the first central layer, PCB the second central layer and prepreg are fixed by rivet, and carried out pressing.Compared with prior art, the present invention has avoided because produce movement between prepreg and central layer or central layer and central layer in the time that manually riveter is followed closely, and then in the pcb board blind slot causing IC pin make time, and the inaccurate problem in location occurring, and IC off normal problem in the pcb board blind slot producing has improved the quality of product.
Brief description of the drawings
Fig. 1 is the pcb board structural representation that blind slot of the present invention contains IC pin.
Identifier declaration in figure: lower plate 1, Ping nail hole 101, rivet hole 102, rivet groove 103, PCB the first central layer 2, pcb board L1 layer 201, pcb board L2 layer 202, blind hole 203, rivet hole 204, Ping nail hole 205, prepreg 3, window 301, rivet hole 302, PCB the second central layer 4, pcb board L3 layer 401, pcb board L4 layer 402, blind slot 403, rivet hole 404, Ping nail hole 405, train wheel bridge 5, rivet hole 501, Ping nail hole 502, rivet groove 503.
Embodiment
For setting forth thought of the present invention and object, below in conjunction with the drawings and specific embodiments, the present invention is described further.
The present invention is to provide the pcb board manufacture method that a kind of blind slot contains IC pin, mainly solve in current manufacture method because produce movement between prepreg and central layer or central layer and central layer in the time that manually riveter is followed closely, and be subject to the factor impacts such as positional accuracy between multi-layer sheet, what IC chip was corresponding with wiring board in blind slot needs welding position, there is deviation, cause IC chips welding bad, even cannot weld, or in the time carrying out wave-soldering, easily there is the problem of failure welding or rosin joint, affect the quality of product.
Shown in Figure 1, Fig. 1 is the pcb board structural representation that blind slot of the present invention contains IC pin.The present invention is to provide the pcb board manufacture method that blind slot contains IC pin, its concrete mode is as follows:
First PCB the first central layer 2, PCB the second central layer 4 and train wheel bridge 5, lower plate 1, prepreg 3 are carried out to sawing sheet processing, making PCB the first central layer 2, PCB the second central layer 4 and train wheel bridge 5, lower plate 1 size, prepreg 3 is 285mm*225mm;
Wherein PCB the first central layer 2 comprises pcb board L1 layer 201 and pcb board L2 layer 202; PCB the second central layer 4 comprises pcb board L3 layer 401 and pcb board L4 layer 402; Described prepreg 3 is the prepreg that do not flow, and its amount of flow is little.
To train wheel bridge 5, lower plate 1, PCB the first central layer 2, PCB the second central layer 4, prepreg 3 processing of holing, at train wheel bridge 5, lower plate 1, PCB the first central layer 2, PCB the second central layer 4, aperture of each brill, a corner location place corresponding on prepreg 3 is 2.5mm Ping nail hole, the Aperture deviation in Gai Ping nail hole of Qie is no more than 0.02mm, a rivet hole that aperture is 3.2mm of the each brill in other three corner location places, and train wheel bridge 5, the rivet hole 501 of lower plate 1, 102 outsides are respectively arranged with the rectangle rivet groove 503 of a 50mm*30mm, rivet groove 103.
Drilling blind hole processing on PCB the first central layer 2, PCB the second central layer 4 forms the blind hole 203 that aperture is 1.0mm on PCB the first central layer 2, on PCB the second central layer 4, forms the blind hole that aperture is 0.6mm;
PCB the first central layer 2 is carried out to IC graphic making, heavy copper, panel plating, blind hole plug resin treatment, make to form copper layer in blind hole 203, between pcb board L1 layer 201 and pcb board L2 layer 202, can form conducting by blind hole 203 and connect.
PCB the second central layer 4 is carried out to graphic making, and mill out the blind slot 403 of a 40mm*30mm on PCB the second central layer 4, and make this blind slot 403 penetrate whole PCB the second central layer 4;
On prepreg 3, open with above-mentioned blind slot 403 corresponding positions the window 301 that a size is 40.3mm*30.3mm, and boring an aperture at the corner location place of this prepreg 3 is 2.5mm Ping nail hole, a rivet hole 302 that aperture is 3.2mm of the each brill in other three corner location places; Window 301 sizes are that 40.3mm*30.3mm is slightly larger than the blind slot of above-mentioned 40mm*30mm 403, so that follow-up prepreg 3 while flowing, is unlikely to blind slot 403 regions to produce and block.
By PCB the first central layer 2, prepreg 3 pre-fold corresponding to PCB the second central layer 4, make PCB the first central layer 2 Shang Ping nail holes 205 and PCB the second central layer 4 Shang Ping nail corresponding coincidences in hole 405, the rivet hole 204 on PCB the first central layer 2 overlaps with the rivet hole 302 of prepreg 3 and with on PCB the second central layer 4, rivet hole 404 is corresponding, and make window 301 on prepreg 3 and the corresponding coincidence of blind slot 403 on PCB the second central layer 4, then the Hang Shang Ping nail of Jin, Suo Shu Ping nail is followed closely for Zhuan Yong Ping, its diameter is 2.5mm, length is 3.0mm, the chassis of Ping nail is of a size of: 15mm*20mm, and by the PCB of pre-poststack the first central layer 2, prepreg 3 is placed on lower plate 1 with PCB the second central layer 4, and make the first central layer 2 corner Ping nail holes 205 and the lower plate 1 Shang Ping nail hole 101 corresponding coincidences in position, then on PCB the second central layer 4, cover train wheel bridge 5, and make the rivet hole position 501 on train wheel bridge 5 corresponding with the rivet hole 404 on PCB the second central layer 4, be convenient to riveter nail, make train wheel bridge 5 Shang Ping nail holes 502 and the second central layer 4 Shang Ping nail corresponding coincidences in hole 405.
By train wheel bridge 5 and lower plate 1, PCB the first central layer 2, prepreg 3 are clamped with PCB the second central layer 4 afterwards, carry out riveter nail by rivet driver according to above-mentioned rivet hole, and when riveter nail, need to be with hand by upper lower plate by tightly preventing off normal; Beating after rivet, getting out Ping nail and carry out pressing, and drilling through hole and rear operation making.
More than that the pcb board manufacture method that a kind of blind slot provided by the present invention is contained to IC pin is described in detail, applied specific case herein structural principle of the present invention and execution mode are set forth, above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention meanwhile.
Claims (4)
1. blind slot contains a pcb board manufacture method for IC pin, it is characterized in that comprising:
PCB the first central layer, PCB the second central layer and train wheel bridge, lower plate are carried out to sawing sheet processing, make PCB the first central layer, PCB the second central layer and train wheel bridge, lower plate be of a size of 285mm*225mm;
To the processing of holing of train wheel bridge, lower plate, PCB the first central layer, PCB the second central layer, aperture of each brill, a corner location place corresponding on train wheel bridge, lower plate, PCB the first central layer, PCB the second central layer is 2.5mm Ping nail hole, and a rivet hole that aperture is 3.2mm is respectively bored at other three corner location places;
Drilling blind hole processing on PCB the first central layer, PCB the second central layer forms the blind hole that aperture is 1.0mm on PCB the first central layer, forms the blind hole that aperture is 0.6mm on PCB the second central layer;
PCB the first central layer is sunk to copper, panel plating processing, IC graphic making, PCB the second central layer is sunk to copper, panel plating processing, graphic making, and mill out the blind slot of a 40mm*30mm on PCB the second central layer, and make this blind slot penetrate whole PCB the second central layer;
Choose the prepreg that is of a size of 285mm*225mm, and open with above-mentioned blind slot correspondence position the window that a size is 40.3mm*30.3mm on this prepreg, and boring an aperture at the corner location place of this prepreg is 2.5mm Ping nail hole, a rivet hole that aperture is 3.2mm of the each brill in other three corner location places;
The first central layer and the second central layer are carried out to brown processing, again PCB the first central layer is placed on lower plate, and make the first core layer corner Ping nail hole and the corresponding coincidence in hole site of lower plate Shang Ping nail, then prepreg is covered on PCB the first central layer, make prepreg Shang Ping nail hole and PCB the first central layer Shang Ping nail corresponding coincidence in hole site, afterwards PCB the second central layer is placed on prepreg, make equally PCB the second central layer Shang Ping nail hole and the corresponding coincidence in hole of prepreg Shang Ping nail, and make blind slot on PCB the second central layer and the corresponding coincidence of window on prepreg, finally train wheel bridge is placed on PCB the second central layer, make PCB the second central layer Shang Ping nail hole and the corresponding coincidence in hole of train wheel bridge Shang Ping nail,
By train wheel bridge, lower plate, Ping nail, above-mentioned PCB the first core layer, prepreg, PCB the second central layer are carried out to riveter nail afterwards, take down train wheel bridge, lower plate Ji Ping nail, carry out again pressing and make pcb board, afterwards to this pcb board hole, operation is made after heavy copper, plate electricity, outer-layer circuit.
2. blind slot according to claim 1 contains the pcb board manufacture method of IC pin, it is characterized in that described PCB the first central layer is made up of pcb board L1 layer and pcb board L2 layer, and PCB the second central layer is made up of pcb board L3 layer and pcb board L4 layer.
3. blind slot according to claim 1 contains the pcb board manufacture method of IC pin, it is characterized in that the PCB of wanted pressing the first central layer, PCB the second central layer to fold in advance, and carry out upper Ping nail, and the pcb board after Shang Ping nail is put on lower plate, then cover train wheel bridge and carry out riveter nail, beat after rivet, Qu Chu Ping nail, train wheel bridge, lower plate, then carry out pressing.
4. blind slot according to claim 1 contains the pcb board manufacture method of IC pin, it is characterized in that described prepreg is for the prepreg that do not flow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110442661.6A CN102523690B (en) | 2011-12-26 | 2011-12-26 | Manufacturing method of PCB board with blind slot containing IC foot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110442661.6A CN102523690B (en) | 2011-12-26 | 2011-12-26 | Manufacturing method of PCB board with blind slot containing IC foot |
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| Publication Number | Publication Date |
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| CN102523690A CN102523690A (en) | 2012-06-27 |
| CN102523690B true CN102523690B (en) | 2014-08-06 |
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| CN201110442661.6A Active CN102523690B (en) | 2011-12-26 | 2011-12-26 | Manufacturing method of PCB board with blind slot containing IC foot |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102958290B (en) * | 2012-11-15 | 2015-10-28 | 广东生益科技股份有限公司 | Improve the pcb board manufacture method that the large copper face of pcb board warps |
| CN103847097A (en) * | 2012-11-30 | 2014-06-11 | 北大方正集团有限公司 | Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB |
| CN105307427A (en) * | 2015-10-21 | 2016-02-03 | 胜宏科技（惠州）股份有限公司 | Press fit structure for multilayer board with hollow inner layer and making method thereof |
| CN107041083B (en) * | 2017-04-27 | 2019-05-03 | 江门崇达电路技术有限公司 | A kind of riveting method of yin-yang copper core plate |
| CN109041447B (en) * | 2018-08-31 | 2024-04-09 | 广州兴森快捷电路科技有限公司 | Film coating method and rigid-flex printed circuit board |
| CN112216480A (en) * | 2020-09-08 | 2021-01-12 | 杭州铁城信息科技有限公司 | Transformer iron core fixed knot constructs and on-vehicle machine and DC/DC converter that charges thereof |
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| EP0376681A2 (en) * | 1988-12-28 | 1990-07-04 | Mitsui Petrochemical Industries, Ltd. | Release film composed of a laminate |
| CN101765343A (en) * | 2008-12-24 | 2010-06-30 | 华为技术有限公司 | Multi-layer printed circuit board and manufacturing method thereof |
| CN102006728A (en) * | 2010-11-09 | 2011-04-06 | 深圳崇达多层线路板有限公司 | Novel production method of board deep-recess line |
| CN202019499U (en) * | 2011-04-27 | 2011-10-26 | 深圳市崇达电路技术股份有限公司 | Riveting die for multilayer printed circuit board |
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2011
- 2011-12-26 CN CN201110442661.6A patent/CN102523690B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0376681A2 (en) * | 1988-12-28 | 1990-07-04 | Mitsui Petrochemical Industries, Ltd. | Release film composed of a laminate |
| CN101765343A (en) * | 2008-12-24 | 2010-06-30 | 华为技术有限公司 | Multi-layer printed circuit board and manufacturing method thereof |
| CN102006728A (en) * | 2010-11-09 | 2011-04-06 | 深圳崇达多层线路板有限公司 | Novel production method of board deep-recess line |
| CN202019499U (en) * | 2011-04-27 | 2011-10-26 | 深圳市崇达电路技术股份有限公司 | Riveting die for multilayer printed circuit board |
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| CN102523690A (en) | 2012-06-27 |
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Address after: Baoan District manhole Street Ho 518000 Shenzhen city Guangdong Province four West Industrial Park second building Patentee after: Shenzhen Xinghe circuit Limited by Share Ltd Address before: Baoan District manhole Street Ho 518000 Shenzhen city Guangdong Province four West Industrial Park second building Patentee before: Galaxy Circuit Co., Ltd. |
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Effective date of registration: 20190430 Address after: 364302 D01 block, Yan Qian industrial concentrated area, Longyan, Fujian. Co-patentee after: Shenzhen Xinghe circuit Limited by Share Ltd Patentee after: Xinghe circuit (Fujian) Co., Ltd. Address before: 518000 Shenzhen, Baoan District, Guangdong, four wells in the West China Industrial Park, second wells. Patentee before: Shenzhen Xinghe circuit Limited by Share Ltd |