CN102522329B - 一种半导体芯片的加工方法 - Google Patents
一种半导体芯片的加工方法 Download PDFInfo
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- CN102522329B CN102522329B CN201210004216.6A CN201210004216A CN102522329B CN 102522329 B CN102522329 B CN 102522329B CN 201210004216 A CN201210004216 A CN 201210004216A CN 102522329 B CN102522329 B CN 102522329B
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- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 238000006396 nitration reaction Methods 0.000 claims description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 229960000583 acetic acid Drugs 0.000 claims description 3
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- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
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CN201210004216.6A CN102522329B (zh) | 2012-01-09 | 2012-01-09 | 一种半导体芯片的加工方法 |
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CN201210004216.6A CN102522329B (zh) | 2012-01-09 | 2012-01-09 | 一种半导体芯片的加工方法 |
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CN102522329A CN102522329A (zh) | 2012-06-27 |
CN102522329B true CN102522329B (zh) | 2014-03-12 |
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CN201210004216.6A Expired - Fee Related CN102522329B (zh) | 2012-01-09 | 2012-01-09 | 一种半导体芯片的加工方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104112661A (zh) * | 2014-07-03 | 2014-10-22 | 扬州虹扬科技发展有限公司 | 一种切割的工艺处理方法 |
CN107733389B (zh) * | 2017-11-01 | 2020-12-01 | 深圳市深汕特别合作区应达利电子科技有限公司 | 一种石英晶体大片及利用其制造小型晶片的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1564331A (zh) * | 2004-04-05 | 2005-01-12 | 清华大学 | 一种GaN基发光二极管的制作方法 |
CN101030616A (zh) * | 2007-03-21 | 2007-09-05 | 山东华光光电子有限公司 | 一种高亮度发光二极管芯片的制备方法 |
US7579202B2 (en) * | 2007-12-21 | 2009-08-25 | Tekcore Co., Ltd. | Method for fabricating light emitting diode element |
CN101859852A (zh) * | 2010-05-13 | 2010-10-13 | 厦门市三安光电科技有限公司 | 提高铝镓铟磷系发光二极管产能的制作工艺 |
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2012
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1564331A (zh) * | 2004-04-05 | 2005-01-12 | 清华大学 | 一种GaN基发光二极管的制作方法 |
CN101030616A (zh) * | 2007-03-21 | 2007-09-05 | 山东华光光电子有限公司 | 一种高亮度发光二极管芯片的制备方法 |
US7579202B2 (en) * | 2007-12-21 | 2009-08-25 | Tekcore Co., Ltd. | Method for fabricating light emitting diode element |
CN101859852A (zh) * | 2010-05-13 | 2010-10-13 | 厦门市三安光电科技有限公司 | 提高铝镓铟磷系发光二极管产能的制作工艺 |
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Address after: 225321 south side of Chuangye Avenue, Xuzhuang street, Gaogang District, Taizhou City, Jiangsu Province Patentee after: Xue Lielong Address before: Five No. 225000 mountain road, Guangling District, Jiangsu, Yangzhou, 55 Patentee before: Xue Lielong |
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Effective date of registration: 20200323 Address after: 230000 Jinyang Road, Feidong Economic Development Zone, Hefei City, Anhui Province Patentee after: Hefei GCL integrated photoelectric technology Co.,Ltd. Address before: 225321 south side of Chuangye Avenue, Xuzhuang street, Gaogang District, Taizhou City, Jiangsu Province Patentee before: Xue Lielong |
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